首页 > 最新文献

Journal of Electronic Testing-Theory and Applications最新文献

英文 中文
Investigation of Single Event Effects in a Resistive RAM Memory Array by Coupling TCAD and SPICE Simulations 基于TCAD和SPICE耦合仿真的阻性RAM存储阵列单事件效应研究
IF 0.9 4区 工程技术 Q4 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2023-05-25 DOI: 10.1007/s10836-023-06068-5
K. Coulié, H. Aziza, W. Rahajandraibe
{"title":"Investigation of Single Event Effects in a Resistive RAM Memory Array by Coupling TCAD and SPICE Simulations","authors":"K. Coulié, H. Aziza, W. Rahajandraibe","doi":"10.1007/s10836-023-06068-5","DOIUrl":"https://doi.org/10.1007/s10836-023-06068-5","url":null,"abstract":"","PeriodicalId":54841,"journal":{"name":"Journal of Electronic Testing-Theory and Applications","volume":"39 1","pages":"275 - 288"},"PeriodicalIF":0.9,"publicationDate":"2023-05-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"46602826","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
A Flexible Concurrent Testing Scheme for Non-Feedback and Feedback Bridging Faults in Integrated Circuits 集成电路中非反馈和反馈桥接故障的灵活并行测试方案
IF 0.9 4区 工程技术 Q4 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2023-05-24 DOI: 10.1007/s10836-023-06066-7
P. Biswal
{"title":"A Flexible Concurrent Testing Scheme for Non-Feedback and Feedback Bridging Faults in Integrated Circuits","authors":"P. Biswal","doi":"10.1007/s10836-023-06066-7","DOIUrl":"https://doi.org/10.1007/s10836-023-06066-7","url":null,"abstract":"","PeriodicalId":54841,"journal":{"name":"Journal of Electronic Testing-Theory and Applications","volume":"39 1","pages":"323 - 346"},"PeriodicalIF":0.9,"publicationDate":"2023-05-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"43673920","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
BISCC: A Novel Approach to Built In State Consistency Checking For Quick Volume Validation of Mixed-Signal/RF Systems BISCC:一种用于混合信号/RF系统快速容量验证的内置状态一致性检查新方法
IF 0.9 4区 工程技术 Q4 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2023-05-18 DOI: 10.1007/s10836-023-06062-x
Sabyasachi Deyati, B. Muldrey, A. Chatterjee
{"title":"BISCC: A Novel Approach to Built In State Consistency Checking For Quick Volume Validation of Mixed-Signal/RF Systems","authors":"Sabyasachi Deyati, B. Muldrey, A. Chatterjee","doi":"10.1007/s10836-023-06062-x","DOIUrl":"https://doi.org/10.1007/s10836-023-06062-x","url":null,"abstract":"","PeriodicalId":54841,"journal":{"name":"Journal of Electronic Testing-Theory and Applications","volume":"39 1","pages":"303 - 322"},"PeriodicalIF":0.9,"publicationDate":"2023-05-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"46808935","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Low Overhead and High Stability Radiation-Hardened Latch for Double/Triple Node Upsets 低开销和高稳定性辐射硬化闩锁双/三节点翻转
IF 0.9 4区 工程技术 Q4 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2023-05-09 DOI: 10.1007/s10836-023-06064-9
Zhengfeng Huang, Hao Wang, Dongxing Ma, Huaguo Liang, Yiming Ouyang, Aibin Yan
{"title":"Low Overhead and High Stability Radiation-Hardened Latch for Double/Triple Node Upsets","authors":"Zhengfeng Huang, Hao Wang, Dongxing Ma, Huaguo Liang, Yiming Ouyang, Aibin Yan","doi":"10.1007/s10836-023-06064-9","DOIUrl":"https://doi.org/10.1007/s10836-023-06064-9","url":null,"abstract":"","PeriodicalId":54841,"journal":{"name":"Journal of Electronic Testing-Theory and Applications","volume":" ","pages":"1-13"},"PeriodicalIF":0.9,"publicationDate":"2023-05-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"42484985","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Increased Detection of Hard-to-Detect Stuck-at Faults during Scan Shift 在扫描移位期间增加对难以检测到的卡在故障的检测
IF 0.9 4区 工程技术 Q4 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2023-04-01 DOI: 10.1007/s10836-023-06060-z
Hui Jiang, Fanchen Zhang, Jennifer Dworak, Kundan Nepal, T. Manikas
{"title":"Increased Detection of Hard-to-Detect Stuck-at Faults during Scan Shift","authors":"Hui Jiang, Fanchen Zhang, Jennifer Dworak, Kundan Nepal, T. Manikas","doi":"10.1007/s10836-023-06060-z","DOIUrl":"https://doi.org/10.1007/s10836-023-06060-z","url":null,"abstract":"","PeriodicalId":54841,"journal":{"name":"Journal of Electronic Testing-Theory and Applications","volume":"1 1","pages":"1-17"},"PeriodicalIF":0.9,"publicationDate":"2023-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"42953175","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Cost-Effective Path Delay Defect Testing Using Voltage/Temperature Analysis Based on Pattern Permutation 基于模式排列的电压/温度分析的成本有效路径延迟缺陷测试
IF 0.9 4区 工程技术 Q4 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2023-04-01 DOI: 10.1007/s10836-023-06057-8
Tai Song, Zhengfeng Huang, Xiaohui Guo, Krstić Miloš
{"title":"Cost-Effective Path Delay Defect Testing Using Voltage/Temperature Analysis Based on Pattern Permutation","authors":"Tai Song, Zhengfeng Huang, Xiaohui Guo, Krstić Miloš","doi":"10.1007/s10836-023-06057-8","DOIUrl":"https://doi.org/10.1007/s10836-023-06057-8","url":null,"abstract":"","PeriodicalId":54841,"journal":{"name":"Journal of Electronic Testing-Theory and Applications","volume":" ","pages":"1-17"},"PeriodicalIF":0.9,"publicationDate":"2023-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"44248689","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Design of INV/BUFF Logic Locking For Enhancing the Hardware Security 提高硬件安全性的INV/BUFF逻辑锁设计
IF 0.9 4区 工程技术 Q4 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2023-04-01 DOI: 10.1007/s10836-023-06061-y
R. Naveenkumar, N. M. Sivamangai, A. Napolean, S. Priya, S. Ashika
{"title":"Design of INV/BUFF Logic Locking For Enhancing the Hardware Security","authors":"R. Naveenkumar, N. M. Sivamangai, A. Napolean, S. Priya, S. Ashika","doi":"10.1007/s10836-023-06061-y","DOIUrl":"https://doi.org/10.1007/s10836-023-06061-y","url":null,"abstract":"","PeriodicalId":54841,"journal":{"name":"Journal of Electronic Testing-Theory and Applications","volume":"1 1","pages":"1-13"},"PeriodicalIF":0.9,"publicationDate":"2023-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"41591934","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Hardware Trojan Detection Method Based on Dual Discriminator Assisted Conditional Generation Adversarial Network 基于双鉴别器辅助条件生成对抗网络的硬件木马检测方法
IF 0.9 4区 工程技术 Q4 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2023-04-01 DOI: 10.1007/s10836-023-06054-x
Wenjing Tang, Jing Su, Yuchan Gao
{"title":"Hardware Trojan Detection Method Based on Dual Discriminator Assisted Conditional Generation Adversarial Network","authors":"Wenjing Tang, Jing Su, Yuchan Gao","doi":"10.1007/s10836-023-06054-x","DOIUrl":"https://doi.org/10.1007/s10836-023-06054-x","url":null,"abstract":"","PeriodicalId":54841,"journal":{"name":"Journal of Electronic Testing-Theory and Applications","volume":"1 1","pages":"1-12"},"PeriodicalIF":0.9,"publicationDate":"2023-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"43034721","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Light Emission Tracking and Measurements for Analog Circuits Fault Diagnosis in Automotive Applications 光发射跟踪与测量在汽车模拟电路故障诊断中的应用
IF 0.9 4区 工程技术 Q4 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2023-03-28 DOI: 10.1007/s10836-023-06059-6
T. Melis, E. Simeu, E. Auvray, L. Saury
{"title":"Light Emission Tracking and Measurements for Analog Circuits Fault Diagnosis in Automotive Applications","authors":"T. Melis, E. Simeu, E. Auvray, L. Saury","doi":"10.1007/s10836-023-06059-6","DOIUrl":"https://doi.org/10.1007/s10836-023-06059-6","url":null,"abstract":"","PeriodicalId":54841,"journal":{"name":"Journal of Electronic Testing-Theory and Applications","volume":" ","pages":"1-17"},"PeriodicalIF":0.9,"publicationDate":"2023-03-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"43918555","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
On the Use of the Indirect Test Strategy for Lifetime Performance Monitoring of RF Circuits 间接测试策略在射频电路寿命性能监测中的应用研究
IF 0.9 4区 工程技术 Q4 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2023-03-27 DOI: 10.1007/s10836-023-06058-7
H. El Badawi, F. Azais, S. Bernard, M. Comte, V. Kerzérho, F. Lefèvre
{"title":"On the Use of the Indirect Test Strategy for Lifetime Performance Monitoring of RF Circuits","authors":"H. El Badawi, F. Azais, S. Bernard, M. Comte, V. Kerzérho, F. Lefèvre","doi":"10.1007/s10836-023-06058-7","DOIUrl":"https://doi.org/10.1007/s10836-023-06058-7","url":null,"abstract":"","PeriodicalId":54841,"journal":{"name":"Journal of Electronic Testing-Theory and Applications","volume":"1 1","pages":"1-16"},"PeriodicalIF":0.9,"publicationDate":"2023-03-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"45827531","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
期刊
Journal of Electronic Testing-Theory and Applications
全部 Acc. Chem. Res. ACS Applied Bio Materials ACS Appl. Electron. Mater. ACS Appl. Energy Mater. ACS Appl. Mater. Interfaces ACS Appl. Nano Mater. ACS Appl. Polym. Mater. ACS BIOMATER-SCI ENG ACS Catal. ACS Cent. Sci. ACS Chem. Biol. ACS Chemical Health & Safety ACS Chem. Neurosci. ACS Comb. Sci. ACS Earth Space Chem. ACS Energy Lett. ACS Infect. Dis. ACS Macro Lett. ACS Mater. Lett. ACS Med. Chem. Lett. ACS Nano ACS Omega ACS Photonics ACS Sens. ACS Sustainable Chem. Eng. ACS Synth. Biol. Anal. Chem. BIOCHEMISTRY-US Bioconjugate Chem. BIOMACROMOLECULES Chem. Res. Toxicol. Chem. Rev. Chem. Mater. CRYST GROWTH DES ENERG FUEL Environ. Sci. Technol. Environ. Sci. Technol. Lett. Eur. J. Inorg. Chem. IND ENG CHEM RES Inorg. Chem. J. Agric. Food. Chem. J. Chem. Eng. Data J. Chem. Educ. J. Chem. Inf. Model. J. Chem. Theory Comput. J. Med. Chem. J. Nat. Prod. J PROTEOME RES J. Am. Chem. Soc. LANGMUIR MACROMOLECULES Mol. Pharmaceutics Nano Lett. Org. Lett. ORG PROCESS RES DEV ORGANOMETALLICS J. Org. Chem. J. Phys. Chem. J. Phys. Chem. A J. Phys. Chem. B J. Phys. Chem. C J. Phys. Chem. Lett. Analyst Anal. Methods Biomater. Sci. Catal. Sci. Technol. Chem. Commun. Chem. Soc. Rev. CHEM EDUC RES PRACT CRYSTENGCOMM Dalton Trans. Energy Environ. Sci. ENVIRON SCI-NANO ENVIRON SCI-PROC IMP ENVIRON SCI-WAT RES Faraday Discuss. Food Funct. Green Chem. Inorg. Chem. Front. Integr. Biol. J. Anal. At. Spectrom. J. Mater. Chem. A J. Mater. Chem. B J. Mater. Chem. C Lab Chip Mater. Chem. Front. Mater. Horiz. MEDCHEMCOMM Metallomics Mol. Biosyst. Mol. Syst. Des. Eng. Nanoscale Nanoscale Horiz. Nat. Prod. Rep. New J. Chem. Org. Biomol. Chem. Org. Chem. Front. PHOTOCH PHOTOBIO SCI PCCP Polym. Chem.
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1