首页 > 最新文献

IEEE Technology and Society Magazine最新文献

英文 中文
2025 Index IEEE Technology and Society Magazine 2025索引IEEE技术与社会杂志
IF 1.9 4区 工程技术 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2025-12-19 DOI: 10.1109/MTS.2025.3646906
{"title":"2025 Index IEEE Technology and Society Magazine","authors":"","doi":"10.1109/MTS.2025.3646906","DOIUrl":"https://doi.org/10.1109/MTS.2025.3646906","url":null,"abstract":"","PeriodicalId":55016,"journal":{"name":"IEEE Technology and Society Magazine","volume":"44 4","pages":"1-12"},"PeriodicalIF":1.9,"publicationDate":"2025-12-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11306341","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"145778288","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
The Driving Machine: A Design History of the Car—Witold Rybczynski (New York, NY, USA: W. W. Norton and Company, 2024, pp. xviii + 235) 驾驶机器:汽车的设计历史——维托尔德·雷伯钦斯基(纽约,NY, USA: w.w. Norton and Company, 2024, pp. xviii + 235)
IF 1.9 4区 工程技术 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2025-12-18 DOI: 10.1109/MTS.2025.3594382
David N. Lucsko
Presents reviews for the following list of books, The Driving Machine: A Design History of the Car—Witold Rybczynski (New York, NY, USA: W. W. Norton and Company, 2024, pp. xviii + 235).
《驾驶机器:汽车的设计历史》(美国纽约:w.w. Norton and Company, 2024, pp. xviii + 235)。
{"title":"The Driving Machine: A Design History of the Car—Witold Rybczynski (New York, NY, USA: W. W. Norton and Company, 2024, pp. xviii + 235)","authors":"David N. Lucsko","doi":"10.1109/MTS.2025.3594382","DOIUrl":"https://doi.org/10.1109/MTS.2025.3594382","url":null,"abstract":"Presents reviews for the following list of books, The Driving Machine: A Design History of the Car—Witold Rybczynski (New York, NY, USA: W. W. Norton and Company, 2024, pp. xviii + 235).","PeriodicalId":55016,"journal":{"name":"IEEE Technology and Society Magazine","volume":"44 4","pages":"35-37"},"PeriodicalIF":1.9,"publicationDate":"2025-12-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11303552","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"145772019","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Human Activity Recognition: Innovations, Impacts, and Implications for Society 人类活动识别:创新、影响和对社会的影响
IF 1.9 4区 工程技术 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2025-12-18 DOI: 10.1109/MTS.2025.3627977
Bilal Ahmed Reshi;Vijay Kumar
The rapid development of emerging technologies has elevated human activity recognition (HAR) into a field with unprecedented capabilities for monitoring and understanding human behaviors across diverse contexts. Powered by machine learning algorithms and extensive datasets from wearables, smartphones, and smart environments, HAR systems now achieve high accuracy in recognizing and predicting activities. Beyond technical progress, however, the integration of HAR into everyday life raises critical sociocultural, ethical, and privacy concerns. While HAR supports healthcare interventions, elderly care, safety monitoring, and quality-of-life improvements, it also introduces risks of data misuse, algorithmic discrimination, and pervasive surveillance. These challenges highlight the need for transparent, fair, and accountable implementation strategies. Our review highlights three main findings: 1) HAR technologies demonstrate strong potential in domains such as healthcare, safety, and smart environments; 2) ethical risks—particularly privacy, surveillance, and fairness—remain pressing concerns; and 3) responsible deployment requires updated regulatory frameworks and collaboration among researchers, policymakers, and practitioners. This article presents a holistic perspective that bridges technical innovations with societal, ethical, and policy dimensions. Unlike prior HAR surveys focused mainly on algorithms or applications, our work emphasizes the dual role of HAR, as both a technological innovation and a societal challenge, offering a multidimensional guide for future development.
新兴技术的快速发展将人类活动识别(HAR)提升到一个具有前所未有的能力的领域,可以监测和理解不同环境下的人类行为。在机器学习算法和来自可穿戴设备、智能手机和智能环境的广泛数据集的支持下,HAR系统现在在识别和预测活动方面实现了高精度。然而,除了技术进步之外,HAR融入日常生活引发了关键的社会文化、伦理和隐私问题。虽然HAR支持医疗保健干预、老年人护理、安全监测和生活质量改善,但它也带来了数据滥用、算法歧视和普遍监控的风险。这些挑战凸显了制定透明、公平和负责任的实施战略的必要性。我们的回顾突出了三个主要发现:1)HAR技术在医疗保健、安全和智能环境等领域显示出强大的潜力;2)道德风险——尤其是隐私、监控和公平——仍然是紧迫的问题;3)负责任的部署需要更新监管框架和研究人员、政策制定者和实践者之间的合作。这篇文章提出了一个整体的观点,将技术创新与社会、伦理和政策维度联系起来。与之前的HAR调查主要关注算法或应用不同,我们的工作强调HAR的双重作用,既是技术创新也是社会挑战,为未来的发展提供了多维指导。
{"title":"Human Activity Recognition: Innovations, Impacts, and Implications for Society","authors":"Bilal Ahmed Reshi;Vijay Kumar","doi":"10.1109/MTS.2025.3627977","DOIUrl":"https://doi.org/10.1109/MTS.2025.3627977","url":null,"abstract":"The rapid development of emerging technologies has elevated human activity recognition (HAR) into a field with unprecedented capabilities for monitoring and understanding human behaviors across diverse contexts. Powered by machine learning algorithms and extensive datasets from wearables, smartphones, and smart environments, HAR systems now achieve high accuracy in recognizing and predicting activities. Beyond technical progress, however, the integration of HAR into everyday life raises critical sociocultural, ethical, and privacy concerns. While HAR supports healthcare interventions, elderly care, safety monitoring, and quality-of-life improvements, it also introduces risks of data misuse, algorithmic discrimination, and pervasive surveillance. These challenges highlight the need for transparent, fair, and accountable implementation strategies. Our review highlights three main findings: 1) HAR technologies demonstrate strong potential in domains such as healthcare, safety, and smart environments; 2) ethical risks—particularly privacy, surveillance, and fairness—remain pressing concerns; and 3) responsible deployment requires updated regulatory frameworks and collaboration among researchers, policymakers, and practitioners. This article presents a holistic perspective that bridges technical innovations with societal, ethical, and policy dimensions. Unlike prior HAR surveys focused mainly on algorithms or applications, our work emphasizes the dual role of HAR, as both a technological innovation and a societal challenge, offering a multidimensional guide for future development.","PeriodicalId":55016,"journal":{"name":"IEEE Technology and Society Magazine","volume":"44 4","pages":"22-34"},"PeriodicalIF":1.9,"publicationDate":"2025-12-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11303539","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"145772055","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
IEEE Technology and Society Magazine Publication Information IEEE技术与社会杂志出版信息
IF 1.9 4区 工程技术 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2025-12-18 DOI: 10.1109/MTS.2025.3629954
{"title":"IEEE Technology and Society Magazine Publication Information","authors":"","doi":"10.1109/MTS.2025.3629954","DOIUrl":"https://doi.org/10.1109/MTS.2025.3629954","url":null,"abstract":"","PeriodicalId":55016,"journal":{"name":"IEEE Technology and Society Magazine","volume":"44 4","pages":"1-1"},"PeriodicalIF":1.9,"publicationDate":"2025-12-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11303450","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"145772049","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
We Want to Hear From You! 我们想听到你的声音!
IF 1.9 4区 工程技术 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2025-12-18 DOI: 10.1109/MTS.2025.3633786
{"title":"We Want to Hear From You!","authors":"","doi":"10.1109/MTS.2025.3633786","DOIUrl":"https://doi.org/10.1109/MTS.2025.3633786","url":null,"abstract":"","PeriodicalId":55016,"journal":{"name":"IEEE Technology and Society Magazine","volume":"44 4","pages":"52-52"},"PeriodicalIF":1.9,"publicationDate":"2025-12-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11303449","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"145772070","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
IEEE SSIT IEEE SSIT
IF 1.9 4区 工程技术 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2025-12-18 DOI: 10.1109/MTS.2025.3629958
{"title":"IEEE SSIT","authors":"","doi":"10.1109/MTS.2025.3629958","DOIUrl":"https://doi.org/10.1109/MTS.2025.3629958","url":null,"abstract":"","PeriodicalId":55016,"journal":{"name":"IEEE Technology and Society Magazine","volume":"44 4","pages":"C4-C4"},"PeriodicalIF":1.9,"publicationDate":"2025-12-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11303535","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"145772076","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
The New Lunar Society: An Enlightenment Guide to the Next Industrial Revolution—David A. Mindell (Cambridge, MA, USA: MIT Press, 2025, 288 pp.) 《新月社:下一次工业革命的启蒙指南》,大卫·a·明德尔著(美国马萨诸塞州剑桥:麻省理工学院出版社,2025年,288页)
IF 1.9 4区 工程技术 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2025-12-18 DOI: 10.1109/MTS.2025.3625684
Eric P. Wenaas
Presents reviews for the following list of books, The New Lunar Society: An Enlightenment Guide to the Next Industrial Revolution—David A. Mindell (Cambridge, MA, USA: MIT Press, 2025, 288 pp.).
为以下书籍列表提供评论:《新月社:下一次工业革命的启蒙指南》——大卫·a·明德尔(剑桥,马萨诸塞州,美国:麻省理工学院出版社,2025年,288页)。
{"title":"The New Lunar Society: An Enlightenment Guide to the Next Industrial Revolution—David A. Mindell (Cambridge, MA, USA: MIT Press, 2025, 288 pp.)","authors":"Eric P. Wenaas","doi":"10.1109/MTS.2025.3625684","DOIUrl":"https://doi.org/10.1109/MTS.2025.3625684","url":null,"abstract":"Presents reviews for the following list of books, The New Lunar Society: An Enlightenment Guide to the Next Industrial Revolution—David A. Mindell (Cambridge, MA, USA: MIT Press, 2025, 288 pp.).","PeriodicalId":55016,"journal":{"name":"IEEE Technology and Society Magazine","volume":"44 4","pages":"41-43"},"PeriodicalIF":1.9,"publicationDate":"2025-12-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11303554","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"145772066","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
2026 International Conference on Sustainable AI for Social Impact and Global Development (SASIGD) 2026可持续人工智能促进社会影响和全球发展国际会议(SASIGD)
IF 1.9 4区 工程技术 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2025-12-18 DOI: 10.1109/MTS.2025.3629952
{"title":"2026 International Conference on Sustainable AI for Social Impact and Global Development (SASIGD)","authors":"","doi":"10.1109/MTS.2025.3629952","DOIUrl":"https://doi.org/10.1109/MTS.2025.3629952","url":null,"abstract":"","PeriodicalId":55016,"journal":{"name":"IEEE Technology and Society Magazine","volume":"44 4","pages":"C3-C3"},"PeriodicalIF":1.9,"publicationDate":"2025-12-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11303443","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"145772043","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Evidence, Austerity, and the Public Good 证据、紧缩和公共利益
IF 1.9 4区 工程技术 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2025-12-18 DOI: 10.1109/MTS.2025.3626891
Ketra Schmitt
{"title":"Evidence, Austerity, and the Public Good","authors":"Ketra Schmitt","doi":"10.1109/MTS.2025.3626891","DOIUrl":"https://doi.org/10.1109/MTS.2025.3626891","url":null,"abstract":"","PeriodicalId":55016,"journal":{"name":"IEEE Technology and Society Magazine","volume":"44 4","pages":"6-8"},"PeriodicalIF":1.9,"publicationDate":"2025-12-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11303533","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"145772046","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Expanding Our Reach: Amplifying SSIT’s Societal Mission 扩大我们的影响力:扩大SSIT的社会使命
IF 1.9 4区 工程技术 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2025-12-18 DOI: 10.1109/MTS.2025.3625685
Murty Polavarapu
{"title":"Expanding Our Reach: Amplifying SSIT’s Societal Mission","authors":"Murty Polavarapu","doi":"10.1109/MTS.2025.3625685","DOIUrl":"https://doi.org/10.1109/MTS.2025.3625685","url":null,"abstract":"","PeriodicalId":55016,"journal":{"name":"IEEE Technology and Society Magazine","volume":"44 4","pages":"4-5"},"PeriodicalIF":1.9,"publicationDate":"2025-12-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11303451","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"145772060","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
期刊
IEEE Technology and Society Magazine
全部 Acc. Chem. Res. ACS Applied Bio Materials ACS Appl. Electron. Mater. ACS Appl. Energy Mater. ACS Appl. Mater. Interfaces ACS Appl. Nano Mater. ACS Appl. Polym. Mater. ACS BIOMATER-SCI ENG ACS Catal. ACS Cent. Sci. ACS Chem. Biol. ACS Chemical Health & Safety ACS Chem. Neurosci. ACS Comb. Sci. ACS Earth Space Chem. ACS Energy Lett. ACS Infect. Dis. ACS Macro Lett. ACS Mater. Lett. ACS Med. Chem. Lett. ACS Nano ACS Omega ACS Photonics ACS Sens. ACS Sustainable Chem. Eng. ACS Synth. Biol. Anal. Chem. BIOCHEMISTRY-US Bioconjugate Chem. BIOMACROMOLECULES Chem. Res. Toxicol. Chem. Rev. Chem. Mater. CRYST GROWTH DES ENERG FUEL Environ. Sci. Technol. Environ. Sci. Technol. Lett. Eur. J. Inorg. Chem. IND ENG CHEM RES Inorg. Chem. J. Agric. Food. Chem. J. Chem. Eng. Data J. Chem. Educ. J. Chem. Inf. Model. J. Chem. Theory Comput. J. Med. Chem. J. Nat. Prod. J PROTEOME RES J. Am. Chem. Soc. LANGMUIR MACROMOLECULES Mol. Pharmaceutics Nano Lett. Org. Lett. ORG PROCESS RES DEV ORGANOMETALLICS J. Org. Chem. J. Phys. Chem. J. Phys. Chem. A J. Phys. Chem. B J. Phys. Chem. C J. Phys. Chem. Lett. Analyst Anal. Methods Biomater. Sci. Catal. Sci. Technol. Chem. Commun. Chem. Soc. Rev. CHEM EDUC RES PRACT CRYSTENGCOMM Dalton Trans. Energy Environ. Sci. ENVIRON SCI-NANO ENVIRON SCI-PROC IMP ENVIRON SCI-WAT RES Faraday Discuss. Food Funct. Green Chem. Inorg. Chem. Front. Integr. Biol. J. Anal. At. Spectrom. J. Mater. Chem. A J. Mater. Chem. B J. Mater. Chem. C Lab Chip Mater. Chem. Front. Mater. Horiz. MEDCHEMCOMM Metallomics Mol. Biosyst. Mol. Syst. Des. Eng. Nanoscale Nanoscale Horiz. Nat. Prod. Rep. New J. Chem. Org. Biomol. Chem. Org. Chem. Front. PHOTOCH PHOTOBIO SCI PCCP Polym. Chem.
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:604180095
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1