首页 > 最新文献

IEEE Technology and Society Magazine最新文献

英文 中文
Introducing the Editorial Board—Part III 介绍编辑委员会--第三部分
IF 2.1 4区 工程技术 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2024-10-03 DOI: 10.1109/MTS.2024.3450543
Ketra Schmitt;Simon T. Powers;Pamela Tudge
{"title":"Introducing the Editorial Board—Part III","authors":"Ketra Schmitt;Simon T. Powers;Pamela Tudge","doi":"10.1109/MTS.2024.3450543","DOIUrl":"https://doi.org/10.1109/MTS.2024.3450543","url":null,"abstract":"","PeriodicalId":55016,"journal":{"name":"IEEE Technology and Society Magazine","volume":"43 3","pages":"19-21"},"PeriodicalIF":2.1,"publicationDate":"2024-10-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10704935","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142376894","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
The Northeast Corridor—David Alff (Chicago, IL, USA: Univ. Chicago Press, 2024, 283 pp.) 东北走廊--大卫-阿尔夫(美国伊利诺伊州芝加哥:芝加哥大学出版社,2024 年,283 页)
IF 2.1 4区 工程技术 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2024-10-03 DOI: 10.1109/MTS.2024.3425449
A. David Wunsch
Presents reviews for the following list of books, The Northeast Corridor—David Alff (Chicago, IL, USA: Univ. Chicago Press, 2024, 283 pp.).
为以下书单提供评论:《东北走廊--大卫-阿尔夫》(The Northeast Corridor-David Alff)(美国伊利诺伊州芝加哥:芝加哥大学出版社,2024 年,283 页)。
{"title":"The Northeast Corridor—David Alff (Chicago, IL, USA: Univ. Chicago Press, 2024, 283 pp.)","authors":"A. David Wunsch","doi":"10.1109/MTS.2024.3425449","DOIUrl":"https://doi.org/10.1109/MTS.2024.3425449","url":null,"abstract":"Presents reviews for the following list of books, The Northeast Corridor—David Alff (Chicago, IL, USA: Univ. Chicago Press, 2024, 283 pp.).","PeriodicalId":55016,"journal":{"name":"IEEE Technology and Society Magazine","volume":"43 3","pages":"40-42"},"PeriodicalIF":2.1,"publicationDate":"2024-10-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10704809","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142376884","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
IEEE Membership IEEE 会员
IF 2.1 4区 工程技术 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2024-10-03 DOI: 10.1109/MTS.2024.3465131
{"title":"IEEE Membership","authors":"","doi":"10.1109/MTS.2024.3465131","DOIUrl":"https://doi.org/10.1109/MTS.2024.3465131","url":null,"abstract":"","PeriodicalId":55016,"journal":{"name":"IEEE Technology and Society Magazine","volume":"43 3","pages":"18-18"},"PeriodicalIF":2.1,"publicationDate":"2024-10-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10704942","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142376893","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Call for Papers: IEEE ETHICS-2025 征集论文:IEEE ethics-2025
IF 2.1 4区 工程技术 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2024-10-03 DOI: 10.1109/MTS.2024.3457092
{"title":"Call for Papers: IEEE ETHICS-2025","authors":"","doi":"10.1109/MTS.2024.3457092","DOIUrl":"https://doi.org/10.1109/MTS.2024.3457092","url":null,"abstract":"","PeriodicalId":55016,"journal":{"name":"IEEE Technology and Society Magazine","volume":"43 3","pages":"C2-C2"},"PeriodicalIF":2.1,"publicationDate":"2024-10-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10704938","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142376519","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
The Ethics of Product Development—Houston, Do We Have a Problem? 产品开发的伦理--休斯顿,我们有问题吗?
IF 2.1 4区 工程技术 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2024-10-03 DOI: 10.1109/MTS.2024.3432132
Colin Ashruf
{"title":"The Ethics of Product Development—Houston, Do We Have a Problem?","authors":"Colin Ashruf","doi":"10.1109/MTS.2024.3432132","DOIUrl":"https://doi.org/10.1109/MTS.2024.3432132","url":null,"abstract":"","PeriodicalId":55016,"journal":{"name":"IEEE Technology and Society Magazine","volume":"43 3","pages":"31-36"},"PeriodicalIF":2.1,"publicationDate":"2024-10-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10704939","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142376615","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
IEEE Connects You to a Universe of Information! IEEE 将您与信息世界相连!
IF 2.1 4区 工程技术 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2024-10-03 DOI: 10.1109/MTS.2024.3465114
{"title":"IEEE Connects You to a Universe of Information!","authors":"","doi":"10.1109/MTS.2024.3465114","DOIUrl":"https://doi.org/10.1109/MTS.2024.3465114","url":null,"abstract":"","PeriodicalId":55016,"journal":{"name":"IEEE Technology and Society Magazine","volume":"43 3","pages":"36-36"},"PeriodicalIF":2.1,"publicationDate":"2024-10-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10704804","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142376629","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Food Security and Agriculture: Technology, Policy, Choices 粮食安全与农业:技术、政策、选择
IF 2.1 4区 工程技术 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2024-10-03 DOI: 10.1109/MTS.2024.3455388
Ketra Schmitt
{"title":"Food Security and Agriculture: Technology, Policy, Choices","authors":"Ketra Schmitt","doi":"10.1109/MTS.2024.3455388","DOIUrl":"https://doi.org/10.1109/MTS.2024.3455388","url":null,"abstract":"","PeriodicalId":55016,"journal":{"name":"IEEE Technology and Society Magazine","volume":"43 3","pages":"8-18"},"PeriodicalIF":2.1,"publicationDate":"2024-10-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10704934","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142376785","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Technology, Society, and Generational Interoperability—An Incredible July 2024 技术、社会和代际互操作性--不可思议的 2024 年 7 月
IF 2.1 4区 工程技术 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2024-10-03 DOI: 10.1109/MTS.2024.3455389
Luis Kun
{"title":"Technology, Society, and Generational Interoperability—An Incredible July 2024","authors":"Luis Kun","doi":"10.1109/MTS.2024.3455389","DOIUrl":"https://doi.org/10.1109/MTS.2024.3455389","url":null,"abstract":"","PeriodicalId":55016,"journal":{"name":"IEEE Technology and Society Magazine","volume":"43 3","pages":"4-7"},"PeriodicalIF":2.1,"publicationDate":"2024-10-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10704943","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142377019","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
TechRxiv TechRxiv
IF 2.1 4区 工程技术 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2024-10-03 DOI: 10.1109/MTS.2024.3468490
{"title":"TechRxiv","authors":"","doi":"10.1109/MTS.2024.3468490","DOIUrl":"https://doi.org/10.1109/MTS.2024.3468490","url":null,"abstract":"","PeriodicalId":55016,"journal":{"name":"IEEE Technology and Society Magazine","volume":"43 3","pages":"100-100"},"PeriodicalIF":2.1,"publicationDate":"2024-10-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10704812","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142376784","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
The Gap Between Policy and Implementation Has Roots in Academia: How Policy Schools Can Narrow the Gap 政策与执行之间的差距源于学术界:政策学院如何缩小差距
IF 2.1 4区 工程技术 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2024-10-03 DOI: 10.1109/MTS.2024.3410307
Evagelia Emily Tavoulareas
{"title":"The Gap Between Policy and Implementation Has Roots in Academia: How Policy Schools Can Narrow the Gap","authors":"Evagelia Emily Tavoulareas","doi":"10.1109/MTS.2024.3410307","DOIUrl":"https://doi.org/10.1109/MTS.2024.3410307","url":null,"abstract":"","PeriodicalId":55016,"journal":{"name":"IEEE Technology and Society Magazine","volume":"43 3","pages":"26-30"},"PeriodicalIF":2.1,"publicationDate":"2024-10-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10704946","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142376786","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
期刊
IEEE Technology and Society Magazine
全部 Acc. Chem. Res. ACS Applied Bio Materials ACS Appl. Electron. Mater. ACS Appl. Energy Mater. ACS Appl. Mater. Interfaces ACS Appl. Nano Mater. ACS Appl. Polym. Mater. ACS BIOMATER-SCI ENG ACS Catal. ACS Cent. Sci. ACS Chem. Biol. ACS Chemical Health & Safety ACS Chem. Neurosci. ACS Comb. Sci. ACS Earth Space Chem. ACS Energy Lett. ACS Infect. Dis. ACS Macro Lett. ACS Mater. Lett. ACS Med. Chem. Lett. ACS Nano ACS Omega ACS Photonics ACS Sens. ACS Sustainable Chem. Eng. ACS Synth. Biol. Anal. Chem. BIOCHEMISTRY-US Bioconjugate Chem. BIOMACROMOLECULES Chem. Res. Toxicol. Chem. Rev. Chem. Mater. CRYST GROWTH DES ENERG FUEL Environ. Sci. Technol. Environ. Sci. Technol. Lett. Eur. J. Inorg. Chem. IND ENG CHEM RES Inorg. Chem. J. Agric. Food. Chem. J. Chem. Eng. Data J. Chem. Educ. J. Chem. Inf. Model. J. Chem. Theory Comput. J. Med. Chem. J. Nat. Prod. J PROTEOME RES J. Am. Chem. Soc. LANGMUIR MACROMOLECULES Mol. Pharmaceutics Nano Lett. Org. Lett. ORG PROCESS RES DEV ORGANOMETALLICS J. Org. Chem. J. Phys. Chem. J. Phys. Chem. A J. Phys. Chem. B J. Phys. Chem. C J. Phys. Chem. Lett. Analyst Anal. Methods Biomater. Sci. Catal. Sci. Technol. Chem. Commun. Chem. Soc. Rev. CHEM EDUC RES PRACT CRYSTENGCOMM Dalton Trans. Energy Environ. Sci. ENVIRON SCI-NANO ENVIRON SCI-PROC IMP ENVIRON SCI-WAT RES Faraday Discuss. Food Funct. Green Chem. Inorg. Chem. Front. Integr. Biol. J. Anal. At. Spectrom. J. Mater. Chem. A J. Mater. Chem. B J. Mater. Chem. C Lab Chip Mater. Chem. Front. Mater. Horiz. MEDCHEMCOMM Metallomics Mol. Biosyst. Mol. Syst. Des. Eng. Nanoscale Nanoscale Horiz. Nat. Prod. Rep. New J. Chem. Org. Biomol. Chem. Org. Chem. Front. PHOTOCH PHOTOBIO SCI PCCP Polym. Chem.
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1