Pub Date : 2023-01-01DOI: 10.1109/MCAS.2023.3234727
F. Terraneo, A. Leva, W. Fornaciari, David Atienza Alonso
The power density in modern Integrated Circuits (ICs) is tremendous. For example, Multi-Processor Systems-on-Chip (MPSoCs) nowadays undergo temperature swings of 40 degrees in 100 milliseconds or less, with rapidly emerging and vanishing sub-millimeter hot spots. As such, not only a simulation-based cooling assessment is vital, but one has to simulate the on-chip thermal phenomena jointly with the heat dissipation system - historically, a challenge. In recent years, however, the idea of coupling traditional 3D chip simulators with heat dissipation models written in Equation-Based Modeling (EBM) languages has proven to be a game changer. EBM languages allow one to compose a model by assembling components described in terms of Differential and Algebraic Equations (DAE) and have the simulation code generated automatically. In this article, we take a tutorial viewpoint on the matter just sketched, to put the reader in the position of exploiting the above technology. We also present the first nucleus of a model library for cooling systems, that we release as free software for the scientific and engineering community.
{"title":"Modeling and Simulation Challenges and Solutions in Cooling Systems for Nanoscale Integrated Circuits[Feature]","authors":"F. Terraneo, A. Leva, W. Fornaciari, David Atienza Alonso","doi":"10.1109/MCAS.2023.3234727","DOIUrl":"https://doi.org/10.1109/MCAS.2023.3234727","url":null,"abstract":"The power density in modern Integrated Circuits (ICs) is tremendous. For example, Multi-Processor Systems-on-Chip (MPSoCs) nowadays undergo temperature swings of 40 degrees in 100 milliseconds or less, with rapidly emerging and vanishing sub-millimeter hot spots. As such, not only a simulation-based cooling assessment is vital, but one has to simulate the on-chip thermal phenomena jointly with the heat dissipation system - historically, a challenge. In recent years, however, the idea of coupling traditional 3D chip simulators with heat dissipation models written in Equation-Based Modeling (EBM) languages has proven to be a game changer. EBM languages allow one to compose a model by assembling components described in terms of Differential and Algebraic Equations (DAE) and have the simulation code generated automatically. In this article, we take a tutorial viewpoint on the matter just sketched, to put the reader in the position of exploiting the above technology. We also present the first nucleus of a model library for cooling systems, that we release as free software for the scientific and engineering community.","PeriodicalId":55038,"journal":{"name":"IEEE Circuits and Systems Magazine","volume":"23 1","pages":"36-56"},"PeriodicalIF":6.9,"publicationDate":"2023-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"62548453","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2023-01-01DOI: 10.1109/mcas.2023.3234731
{"title":"Women in Circuits and Systems (WiCAS) and Young Professionals (YP) at PRIME-SMACD 2022 [CAS in the World]","authors":"","doi":"10.1109/mcas.2023.3234731","DOIUrl":"https://doi.org/10.1109/mcas.2023.3234731","url":null,"abstract":"","PeriodicalId":55038,"journal":{"name":"IEEE Circuits and Systems Magazine","volume":"48 1","pages":""},"PeriodicalIF":6.9,"publicationDate":"2023-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"62548569","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2023-01-01DOI: 10.1109/mcas.2023.3313826
{"title":"IEEE App","authors":"","doi":"10.1109/mcas.2023.3313826","DOIUrl":"https://doi.org/10.1109/mcas.2023.3313826","url":null,"abstract":"","PeriodicalId":55038,"journal":{"name":"IEEE Circuits and Systems Magazine","volume":"47 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"136302058","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2023-01-01DOI: 10.1109/mcas.2023.3302394
Ricardo Reis, Ramiro Taco
The IEEE CASS Tour Ecuador 2023 was organized in February 22 and 23, visiting two cities, Cuenca and Guayaquil, the week before LASCAS 2023 that was held in Quito, Ecuador. The tour included technical talks, as well a special talk about the IEEE CASS and opportunities provided by the society. The main goal of the CASS Tour is to motivate professionals and students in Ecuador to become active members of the society, as well to motivate professionals and students to organize new CASS Chapters and CASS Student Chapters.
{"title":"IEEE CASS Tour Ecuador 2023","authors":"Ricardo Reis, Ramiro Taco","doi":"10.1109/mcas.2023.3302394","DOIUrl":"https://doi.org/10.1109/mcas.2023.3302394","url":null,"abstract":"The IEEE CASS Tour Ecuador 2023 was organized in February 22 and 23, visiting two cities, Cuenca and Guayaquil, the week before LASCAS 2023 that was held in Quito, Ecuador. The tour included technical talks, as well a special talk about the IEEE CASS and opportunities provided by the society. The main goal of the CASS Tour is to motivate professionals and students in Ecuador to become active members of the society, as well to motivate professionals and students to organize new CASS Chapters and CASS Student Chapters.","PeriodicalId":55038,"journal":{"name":"IEEE Circuits and Systems Magazine","volume":"11 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"136304149","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2023-01-01DOI: 10.1109/mcas.2023.3234728
W. Mathis, Emeritus
{"title":"Heinrich Hertz [Pioneers in CAS]","authors":"W. Mathis, Emeritus","doi":"10.1109/mcas.2023.3234728","DOIUrl":"https://doi.org/10.1109/mcas.2023.3234728","url":null,"abstract":"","PeriodicalId":55038,"journal":{"name":"IEEE Circuits and Systems Magazine","volume":"1 1","pages":""},"PeriodicalIF":6.9,"publicationDate":"2023-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"62548462","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2023-01-01DOI: 10.1109/mcas.2023.3302393
Ricardo Reis
The IEEE IoT Technical Community (TC) is an IEEE’s important, multi-disciplinary, cross-platform initiative. It has a lead society, the ComSoc, four major societies, including IEEE CASS, and seven participating societies. The IEEE World Forum on IoT and the IEEE IoT Magazine are significant activities of the IEEE IoT TC.
{"title":"IEEE IoT Technical Community and IEEE CASS [CAS in the World]","authors":"Ricardo Reis","doi":"10.1109/mcas.2023.3302393","DOIUrl":"https://doi.org/10.1109/mcas.2023.3302393","url":null,"abstract":"The IEEE IoT Technical Community (TC) is an IEEE’s important, multi-disciplinary, cross-platform initiative. It has a lead society, the ComSoc, four major societies, including IEEE CASS, and seven participating societies. The IEEE World Forum on IoT and the IEEE IoT Magazine are significant activities of the IEEE IoT TC.","PeriodicalId":55038,"journal":{"name":"IEEE Circuits and Systems Magazine","volume":"2 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"136301643","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2023-01-01DOI: 10.1109/mcas.2023.3302181
Gene Frantz
In May of 2023, Fan Chen, the associate editor of IEEE CAS-M, had a wonderful opportunity to interview Gene Frantz, an innovative thinker and the Father of DSP by many in the industry 1 . During this interview this interview, Gene shared numerous historic stories in DSP, his incredibly inspiring life journey, and offered valuable suggestions for the younger generation. We have compiled this interview into eight thought-provoking questions, hoping that our CAS readers will both enjoy and benefit from it.
{"title":"An Interview With Gene Frantz, Innovative Thinker and Father of DSP [Interview]","authors":"Gene Frantz","doi":"10.1109/mcas.2023.3302181","DOIUrl":"https://doi.org/10.1109/mcas.2023.3302181","url":null,"abstract":"<fig orientation=\"portrait\" position=\"float\" xmlns:mml=\"http://www.w3.org/1998/Math/MathML\" xmlns:xlink=\"http://www.w3.org/1999/xlink\"> <graphic orientation=\"portrait\" position=\"float\" xlink:href=\"frant-3302181.tif\"/> </fig> In May of 2023, Fan Chen, the associate editor of IEEE CAS-M, had a wonderful opportunity to interview Gene Frantz, an innovative thinker and the Father of DSP by many in the industry <xref ref-type=\"fn\" rid=\"fn1\" xmlns:mml=\"http://www.w3.org/1998/Math/MathML\" xmlns:xlink=\"http://www.w3.org/1999/xlink\">1</xref> . During this interview this interview, Gene shared numerous historic stories in DSP, his incredibly inspiring life journey, and offered valuable suggestions for the younger generation. We have compiled this interview into eight thought-provoking questions, hoping that our CAS readers will both enjoy and benefit from it.","PeriodicalId":55038,"journal":{"name":"IEEE Circuits and Systems Magazine","volume":"15 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"136302847","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2023-01-01DOI: 10.1109/mcas.2023.3302182
Ji Lin, Ligeng Zhu, Wei-Ming Chen, Wei-Chen Wang, Song Han
Tiny machine learning (TinyML) is a new frontier of machine learning. By squeezing deep learning models into billions of IoT devices and microcontrollers (MCUs), we expand the scope of applications and enable ubiquitous intelligence. However, TinyML is challenging due to the hardware constraints: the tiny memory resource is difficult hold deep learning models designed for cloud and mobile platforms. There is also limited compiler and inference engine support for bare-metal devices. Therefore, we need to co-design the algorithm and system stack to enable TinyML. In this review, we will first discuss the definition, challenges, and applications of TinyML. We then survey the recent progress in TinyML and deep learning on MCUs. Next, we will introduce MCUNet, showing how we can achieve ImageNet-scale AI applications on IoT devices with system-algorithm co-design. We will further extend the solution from inference to training and introduce tiny on-device training techniques. Finally, we present future directions in this area. Today’s “large” model might be tomorrow’s “tiny” model. The scope of TinyML should evolve and adapt over time.
{"title":"Tiny Machine Learning: Progress and Futures [Feature]","authors":"Ji Lin, Ligeng Zhu, Wei-Ming Chen, Wei-Chen Wang, Song Han","doi":"10.1109/mcas.2023.3302182","DOIUrl":"https://doi.org/10.1109/mcas.2023.3302182","url":null,"abstract":"Tiny machine learning (TinyML) is a new frontier of machine learning. By squeezing deep learning models into billions of IoT devices and microcontrollers (MCUs), we expand the scope of applications and enable ubiquitous intelligence. However, TinyML is challenging due to the hardware constraints: the tiny memory resource is difficult hold deep learning models designed for cloud and mobile platforms. There is also limited compiler and inference engine support for bare-metal devices. Therefore, we need to co-design the algorithm and system stack to enable TinyML. In this review, we will first discuss the definition, challenges, and applications of TinyML. We then survey the recent progress in TinyML and deep learning on MCUs. Next, we will introduce MCUNet, showing how we can achieve ImageNet-scale AI applications on IoT devices with system-algorithm co-design. We will further extend the solution from inference to training and introduce tiny on-device training techniques. Finally, we present future directions in this area. Today’s “large” model might be tomorrow’s “tiny” model. The scope of TinyML should evolve and adapt over time.","PeriodicalId":55038,"journal":{"name":"IEEE Circuits and Systems Magazine","volume":"11 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"136303583","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2023-01-01DOI: 10.1109/mcas.2023.3272088
S. Kang
{"title":"An Interview with Professor Sung-Mo Steve Kang [Interview]","authors":"S. Kang","doi":"10.1109/mcas.2023.3272088","DOIUrl":"https://doi.org/10.1109/mcas.2023.3272088","url":null,"abstract":"","PeriodicalId":55038,"journal":{"name":"IEEE Circuits and Systems Magazine","volume":"1 1","pages":""},"PeriodicalIF":6.9,"publicationDate":"2023-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"62548427","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2023-01-01DOI: 10.1109/mcas.2023.3267939
F. Olivera, R. Reis
{"title":"IEEE CASS Rio de Janeiro Tour 2022 [Education]","authors":"F. Olivera, R. Reis","doi":"10.1109/mcas.2023.3267939","DOIUrl":"https://doi.org/10.1109/mcas.2023.3267939","url":null,"abstract":"","PeriodicalId":55038,"journal":{"name":"IEEE Circuits and Systems Magazine","volume":"1 1","pages":""},"PeriodicalIF":6.9,"publicationDate":"2023-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"62548376","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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