Pub Date : 2024-05-15DOI: 10.1109/mcas.2024.3392990
{"title":"IEEE Access","authors":"","doi":"10.1109/mcas.2024.3392990","DOIUrl":"https://doi.org/10.1109/mcas.2024.3392990","url":null,"abstract":"","PeriodicalId":55038,"journal":{"name":"IEEE Circuits and Systems Magazine","volume":null,"pages":null},"PeriodicalIF":6.9,"publicationDate":"2024-05-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141064198","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2024-05-15DOI: 10.1109/mcas.2024.3373289
{"title":"IEEE Circuits and Systems Magazine Publication Information","authors":"","doi":"10.1109/mcas.2024.3373289","DOIUrl":"https://doi.org/10.1109/mcas.2024.3373289","url":null,"abstract":"","PeriodicalId":55038,"journal":{"name":"IEEE Circuits and Systems Magazine","volume":null,"pages":null},"PeriodicalIF":6.9,"publicationDate":"2024-05-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141058905","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2024-05-15DOI: 10.1109/mcas.2024.3373556
Debendra Das Sharma
The Peripheral Component Interconnect Express (PCI-Express or PCle) architecture has been the ubiquitous backbone interconnect in the evolving computing landscape for more than two decades. This paper delves into the multiple innovations driving the backward-compatible evolution of PCle for seven generations, doubling bandwidth every generation, while delivering power-efficient and cost-effective performance. Compute Express Link (CXL) overlays coherency and memory protocols on top of PCle for heterogeneous computing, addressing the memory wall, resource pooling and sharing across servers, and distributed computing using load-store based messaging. The die-todie industry-standard, Universal Chiplet Interconnect Express $^{TM}$ (UCle), offers orders of magnitude improvement in bandwidth density, power efficiency, and latency for PCle and CXL protocols on-package and pod-level connectivity with co-packaged optics. We foresee PCle will continue to evolve over the next few decades to serve future computing needs. It will do so by embracing alternate media while backward-compatible frequency scaling with copper will continue and protocol enhancements will enable non-tree fabric topologies.
{"title":"PCI-Express: Evolution of a Ubiquitous Load-Store Interconnect Over Two Decades and the Path Forward for the Next Two Decades","authors":"Debendra Das Sharma","doi":"10.1109/mcas.2024.3373556","DOIUrl":"https://doi.org/10.1109/mcas.2024.3373556","url":null,"abstract":"The Peripheral Component Interconnect Express (PCI-Express or PCle) architecture has been the ubiquitous backbone interconnect in the evolving computing landscape for more than two decades. This paper delves into the multiple innovations driving the backward-compatible evolution of PCle for seven generations, doubling bandwidth every generation, while delivering power-efficient and cost-effective performance. Compute Express Link (CXL) overlays coherency and memory protocols on top of PCle for heterogeneous computing, addressing the memory wall, resource pooling and sharing across servers, and distributed computing using load-store based messaging. The die-todie industry-standard, Universal Chiplet Interconnect Express <inline-formula xmlns:mml=\"http://www.w3.org/1998/Math/MathML\" xmlns:xlink=\"http://www.w3.org/1999/xlink\"> <tex-math notation=\"LaTeX\">$^{TM}$ </tex-math></inline-formula> (UCle), offers orders of magnitude improvement in bandwidth density, power efficiency, and latency for PCle and CXL protocols on-package and pod-level connectivity with co-packaged optics. We foresee PCle will continue to evolve over the next few decades to serve future computing needs. It will do so by embracing alternate media while backward-compatible frequency scaling with copper will continue and protocol enhancements will enable non-tree fabric topologies.","PeriodicalId":55038,"journal":{"name":"IEEE Circuits and Systems Magazine","volume":null,"pages":null},"PeriodicalIF":6.9,"publicationDate":"2024-05-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141064165","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2024-05-15DOI: 10.1109/mcas.2024.3370495
Luigi Fortuna, Arturo Buscarino
The impact of Circuits and Systems, and in particular Cellular Nonlinear Networks (CNNs), on the scientific community of the Etna Valley is briefly remarked. These topics have been the key-point activities that established a permanent link among various researchers, increasing the scientific and industrial relevance of the Etna Valley site in many Circuits and Systems related research areas.
{"title":"The Impact of Circuits and Systems on the Etna Valley Site [CAS Regional Report]","authors":"Luigi Fortuna, Arturo Buscarino","doi":"10.1109/mcas.2024.3370495","DOIUrl":"https://doi.org/10.1109/mcas.2024.3370495","url":null,"abstract":"The impact of Circuits and Systems, and in particular Cellular Nonlinear Networks (CNNs), on the scientific community of the Etna Valley is briefly remarked. These topics have been the key-point activities that established a permanent link among various researchers, increasing the scientific and industrial relevance of the Etna Valley site in many Circuits and Systems related research areas.","PeriodicalId":55038,"journal":{"name":"IEEE Circuits and Systems Magazine","volume":null,"pages":null},"PeriodicalIF":6.9,"publicationDate":"2024-05-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141058910","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2024-05-15DOI: 10.1109/mcas.2024.3384522
Keshab K. Parhi, Hai Li, Krishnan Kailas, Harish Krishnaswamy, Massimo Alioto, Maciej Ogorzalek
IEEE Circuits and Systems (CAS) Society (CASS) celebrates the 75th Anniversary of the Society in 2024. This is a major celebration for CASS after the Golden Jubilee celebration in 1999. This special Issue of the IEEE Circuits and Systems Magazine is one of many celebrations and events planned this year by and for CASS members. The Celebrations not only reflect upon the history of our Society from multiple angles but also look forward to the future. The planning for this Special Issue started in July 2023 when Gabriele Manganaro, VP-Publications of IEEE CASS, tasked the incoming Editor-in-Chief (KP) to plan for the Special Issue. A Call for White Papers was issued to the CASS membership on 20 July 2023. The authors were asked to provide historical progress over the last 25 years and point out future directions for the next 25 years. We received numerous White Papers in September 2023, and were able to invite only few authors to submit Full Papers. Authors of Invited White Papers submitted their Full papers in second half of December 2023. All reviews were completed by March 2024. Before providing an overview of the papers in this Special Issue, we begin by thanking all the authors who took the time to submit the White Papers (whether Invited or not) and the Full papers. We are very grateful to all the reviewers who provided reviews in short notice due to the time constraints to publish the Special Issue.
{"title":"Editorial: Special Issue for the 75th Anniversary of the IEEE Circuits and Systems Society [Editorial]","authors":"Keshab K. Parhi, Hai Li, Krishnan Kailas, Harish Krishnaswamy, Massimo Alioto, Maciej Ogorzalek","doi":"10.1109/mcas.2024.3384522","DOIUrl":"https://doi.org/10.1109/mcas.2024.3384522","url":null,"abstract":"IEEE Circuits and Systems (CAS) Society (CASS) celebrates the 75th Anniversary of the Society in 2024. This is a major celebration for CASS after the Golden Jubilee celebration in 1999. This special Issue of the IEEE Circuits and Systems Magazine is one of many celebrations and events planned this year by and for CASS members. The Celebrations not only reflect upon the history of our Society from multiple angles but also look forward to the future. The planning for this Special Issue started in July 2023 when Gabriele Manganaro, VP-Publications of IEEE CASS, tasked the incoming Editor-in-Chief (KP) to plan for the Special Issue. A Call for White Papers was issued to the CASS membership on 20 July 2023. The authors were asked to provide historical progress over the last 25 years and point out future directions for the next 25 years. We received numerous White Papers in September 2023, and were able to invite only few authors to submit Full Papers. Authors of Invited White Papers submitted their Full papers in second half of December 2023. All reviews were completed by March 2024. Before providing an overview of the papers in this Special Issue, we begin by thanking all the authors who took the time to submit the White Papers (whether Invited or not) and the Full papers. We are very grateful to all the reviewers who provided reviews in short notice due to the time constraints to publish the Special Issue.","PeriodicalId":55038,"journal":{"name":"IEEE Circuits and Systems Magazine","volume":null,"pages":null},"PeriodicalIF":6.9,"publicationDate":"2024-05-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141058970","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2024-05-15DOI: 10.1109/mcas.2024.3383808
Sudipto Chakraborty, Rajiv V. Joshi
This article will review recent progress in cryogenic CMOS designs for future scaled quantum computing applications. After introducing the scaling challenges associated with qubit control and readout electronics operating at room temperature, approaches taken to date to cryogenic control electronics design will be discussed, focusing on the most recent relevant publications. Elements of ultra-low power circuit and system design approaches for cryogenic controllers in scaled CMOS nodes (40nm to 14nm) will be reviewed, including a discussion of current state-of-the art cryogenic controller performance and power efficiency. Note that leading designs, when operated as transmon qubit state controllers, have achieved gate error rates in the range of 10-4 to 10-3 achieving spurious free dynamic range (SFDR) of ~40dB while consuming 4-23mW of power per qubit under active control, with power efficiency strongly driven by the complexity of the digital processor integrated in the controller design. These demonstrations, while significant, are just the first steps toward achieving the performance, efficiency, and scalability that will be required for future systems. This review article will discuss fundamental tradeoffs in CMOS cryogenic designs in order to address the needs of future scaled quantum computing systems.
{"title":"Cryogenic CMOS Design for Qubit Control: Present Status, Challenges, and Future Directions [Feature]","authors":"Sudipto Chakraborty, Rajiv V. Joshi","doi":"10.1109/mcas.2024.3383808","DOIUrl":"https://doi.org/10.1109/mcas.2024.3383808","url":null,"abstract":"This article will review recent progress in cryogenic CMOS designs for future scaled quantum computing applications. After introducing the scaling challenges associated with qubit control and readout electronics operating at room temperature, approaches taken to date to cryogenic control electronics design will be discussed, focusing on the most recent relevant publications. Elements of ultra-low power circuit and system design approaches for cryogenic controllers in scaled CMOS nodes (40nm to 14nm) will be reviewed, including a discussion of current state-of-the art cryogenic controller performance and power efficiency. Note that leading designs, when operated as transmon qubit state controllers, have achieved gate error rates in the range of 10-4 to 10-3 achieving spurious free dynamic range (SFDR) of ~40dB while consuming 4-23mW of power per qubit under active control, with power efficiency strongly driven by the complexity of the digital processor integrated in the controller design. These demonstrations, while significant, are just the first steps toward achieving the performance, efficiency, and scalability that will be required for future systems. This review article will discuss fundamental tradeoffs in CMOS cryogenic designs in order to address the needs of future scaled quantum computing systems.","PeriodicalId":55038,"journal":{"name":"IEEE Circuits and Systems Magazine","volume":null,"pages":null},"PeriodicalIF":6.9,"publicationDate":"2024-05-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141058916","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2024-03-07DOI: 10.1109/mcas.2024.3349665
Fan Chen, Lei Jiang, Hausi Müller, Philip Richerme, Cheng Chu, Zhenxiao Fu, Min Yang
Quantum computing (QC) demonstrates substantial theoretical promise in addressing classically intractable problems. Recent investments and advancements across QC system stacks, including hardware, software, and algorithms, underscore a pivotal shift from theoretical exploration to the practical realization of applications. Despite this progress, the prevailing emphasis has predominantly centered on performance enhancement, often overlooking security considerations. In response to this gap, our article presents a comprehensive tutorial and survey aimed at identifying and categorizing vulnerabilities inherent in quantum computing systems. Beginning with an overview encompassing essential principles, ecosystem components, and unique attributes in the quantum computing system stack, we also provide a summary of development resources to facilitate efficient initiation in this domain. Building on this foundational knowledge, we introduce a taxonomy of QC security organized by victim layer and security attack objectives. Utilizing this taxonomy as a guiding framework, the article delivers an extensive survey of the latest advancements in QC security, with the overarching goal of equipping the reader with a comprehensive understanding of quantum computing system principles and an informed awareness of diverse and dynamic QC security threats. The intention is to benefit both industry stakeholders and research communities, ultimately aiming to proactively identify and mitigate security concerns within QC systems, thereby establishing a robust foundation for secure quantum computing environments.
{"title":"NISQ Quantum Computing: A Security-Centric Tutorial and Survey [Feature]","authors":"Fan Chen, Lei Jiang, Hausi Müller, Philip Richerme, Cheng Chu, Zhenxiao Fu, Min Yang","doi":"10.1109/mcas.2024.3349665","DOIUrl":"https://doi.org/10.1109/mcas.2024.3349665","url":null,"abstract":"Quantum computing (QC) demonstrates substantial theoretical promise in addressing classically intractable problems. Recent investments and advancements across QC system stacks, including hardware, software, and algorithms, underscore a pivotal shift from theoretical exploration to the practical realization of applications. Despite this progress, the prevailing emphasis has predominantly centered on performance enhancement, often overlooking security considerations. In response to this gap, our article presents a comprehensive tutorial and survey aimed at identifying and categorizing vulnerabilities inherent in quantum computing systems. Beginning with an overview encompassing essential principles, ecosystem components, and unique attributes in the quantum computing system stack, we also provide a summary of development resources to facilitate efficient initiation in this domain. Building on this foundational knowledge, we introduce a taxonomy of QC security organized by victim layer and security attack objectives. Utilizing this taxonomy as a guiding framework, the article delivers an extensive survey of the latest advancements in QC security, with the overarching goal of equipping the reader with a comprehensive understanding of quantum computing system principles and an informed awareness of diverse and dynamic QC security threats. The intention is to benefit both industry stakeholders and research communities, ultimately aiming to proactively identify and mitigate security concerns within QC systems, thereby establishing a robust foundation for secure quantum computing environments.","PeriodicalId":55038,"journal":{"name":"IEEE Circuits and Systems Magazine","volume":null,"pages":null},"PeriodicalIF":6.9,"publicationDate":"2024-03-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"140071602","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Nowadays, artificial intelligence (AI) technology with large models plays an increasingly important role in both academia and industry. It also brings a rapidly increasing demand for the computing power of the hardware. As the computing demand for AI continues to grow, the growth of hardware computing power has failed to keep up. This has become a significant factor restricting the development of AI. The augmentation of hardware computing power is mainly propelled by the escalation of transistor density and chip area. However, the former is impeded by the termination of the Moore’s Law and Dennard scaling, and the latter is significantly restricted by the challenge of disrupting the legacy fabrication equipment and process. In recent years, advanced packaging technologies that have gradually matured are increasingly used to implement bigger chips that integrate multiple chiplets, while still providing interconnections with chip-level density and bandwidth. This technique points out a new path of continuing the increase of computing power while leveraging the current fabrication process without significant disruption. Enabled by this technique, a chip can extend to a size of wafer-scale (over 10,000 mm $^{2}$ ), provisioning orders of magnitude more computing capabilities (several POPS within just one monolithic chip) and die-to-die bandwidth density (over 15 GB/s/mm) than regular chips, and emerges a new Wafer-scale Computing paradigm. Compared to conventional high-performance computing paradigms such as multi-accelerator and datacenter-scale computing, Wafer-scale Computing shows remarkable advantages in communication bandwidth, integration density, and programmability potential. Not surprisingly, disruptive Wafer-scale Computing also brings unprecedented design challenges for hardware architecture, design- $backslash $ system- technology co-optimization, power and cooling systems, and compiler tool chain. At present, there are no comprehensive surveys summarizing the current state and design insights of Wafer-scale Computing. This article aims to take the first step to help academia and industry review existing wafer-scale chips and essential technologies in a one-stop manner. So that people can conveniently grasp the basic knowledge and key points, understand the achievements and shortcomings of existing research, and contribute to this promising research direction.
如今，具有大型模型的人工智能（AI）技术在学术界和工业界发挥着越来越重要的作用。这也带来了对硬件计算能力的快速增长需求。随着人工智能计算需求的不断增长，硬件计算能力的增长却跟不上。这已成为制约人工智能发展的重要因素。硬件计算能力的提升主要得益于晶体管密度和芯片面积的增加。然而，前者受制于摩尔定律和 Dennard Scaling 的终结，后者则受制于颠覆传统制造设备和工艺的挑战。近年来，逐渐成熟的先进封装技术越来越多地用于实现集成多个芯片的更大芯片，同时仍然提供芯片级密度和带宽的互连。这种技术为继续提高计算能力指明了一条新的道路，同时还能充分利用当前的制造工艺，而不会造成重大干扰。在这种技术的支持下，芯片可以扩展到晶圆级尺寸（超过 10,000 mm $^{2}$），提供比普通芯片更多数量级的计算能力（仅在一个单片芯片内就有多个 POPS）和芯片到芯片的带宽密度（超过 15 GB/s/mm），并出现了一种新的晶圆级计算范例。与多加速器和数据中心级计算等传统高性能计算范式相比，晶圆级计算在通信带宽、集成密度和可编程潜力方面具有显著优势。毫不奇怪，颠覆性的晶圆级计算也为硬件架构、设计、系统技术协同优化、电源和冷却系统以及编译器工具链带来了前所未有的设计挑战。目前，还没有全面总结晶圆级计算现状和设计见解的调查报告。本文旨在迈出第一步，帮助学术界和产业界一站式回顾现有的晶圆级芯片和基本技术。这样，人们就能方便地掌握基本知识和要点，了解现有研究的成就和不足，并为这一前景广阔的研究方向贡献力量。
{"title":"Wafer-Scale Computing: Advancements, Challenges, and Future Perspectives [Feature]","authors":"Yang Hu, Xinhan Lin, Huizheng Wang, Zhen He, Xingmao Yu, Jiahao Zhang, Qize Yang, Zheng Xu, Sihan Guan, Jiahao Fang, Haoran Shang, Xinru Tang, Xu Dai, Shaojun Wei, Shouyi Yin","doi":"10.1109/mcas.2024.3349669","DOIUrl":"https://doi.org/10.1109/mcas.2024.3349669","url":null,"abstract":"Nowadays, artificial intelligence (AI) technology with large models plays an increasingly important role in both academia and industry. It also brings a rapidly increasing demand for the computing power of the hardware. As the computing demand for AI continues to grow, the growth of hardware computing power has failed to keep up. This has become a significant factor restricting the development of AI. The augmentation of hardware computing power is mainly propelled by the escalation of transistor density and chip area. However, the former is impeded by the termination of the Moore’s Law and Dennard scaling, and the latter is significantly restricted by the challenge of disrupting the legacy fabrication equipment and process. In recent years, advanced packaging technologies that have gradually matured are increasingly used to implement bigger chips that integrate multiple chiplets, while still providing interconnections with chip-level density and bandwidth. This technique points out a new path of continuing the increase of computing power while leveraging the current fabrication process without significant disruption. Enabled by this technique, a chip can extend to a size of wafer-scale (over 10,000 mm\u0000<inline-formula xmlns:mml=\"http://www.w3.org/1998/Math/MathML\" xmlns:xlink=\"http://www.w3.org/1999/xlink\"> <tex-math notation=\"LaTeX\">$^{2}$ </tex-math></inline-formula>\u0000), provisioning orders of magnitude more computing capabilities (several POPS within just one monolithic chip) and die-to-die bandwidth density (over 15 GB/s/mm) than regular chips, and emerges a new Wafer-scale Computing paradigm. Compared to conventional high-performance computing paradigms such as multi-accelerator and datacenter-scale computing, Wafer-scale Computing shows remarkable advantages in communication bandwidth, integration density, and programmability potential. Not surprisingly, disruptive Wafer-scale Computing also brings unprecedented design challenges for hardware architecture, design- <inline-formula xmlns:mml=\"http://www.w3.org/1998/Math/MathML\" xmlns:xlink=\"http://www.w3.org/1999/xlink\"> <tex-math notation=\"LaTeX\">$backslash $ </tex-math></inline-formula>\u0000system- technology co-optimization, power and cooling systems, and compiler tool chain. At present, there are no comprehensive surveys summarizing the current state and design insights of Wafer-scale Computing. This article aims to take the first step to help academia and industry review existing wafer-scale chips and essential technologies in a one-stop manner. So that people can conveniently grasp the basic knowledge and key points, understand the achievements and shortcomings of existing research, and contribute to this promising research direction.","PeriodicalId":55038,"journal":{"name":"IEEE Circuits and Systems Magazine","volume":null,"pages":null},"PeriodicalIF":6.9,"publicationDate":"2024-03-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"140071599","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2024-03-05DOI: 10.1109/mcas.2024.3361108
{"title":"IEEE Proceedings","authors":"","doi":"10.1109/mcas.2024.3361108","DOIUrl":"https://doi.org/10.1109/mcas.2024.3361108","url":null,"abstract":"","PeriodicalId":55038,"journal":{"name":"IEEE Circuits and Systems Magazine","volume":null,"pages":null},"PeriodicalIF":6.9,"publicationDate":"2024-03-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"140044894","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2024-03-05DOI: 10.1109/mcas.2024.3349670
Ricardo Reis
{"title":"IEEE Council on EDA and IEEE CASS [CAS in the World]","authors":"Ricardo Reis","doi":"10.1109/mcas.2024.3349670","DOIUrl":"https://doi.org/10.1109/mcas.2024.3349670","url":null,"abstract":"","PeriodicalId":55038,"journal":{"name":"IEEE Circuits and Systems Magazine","volume":null,"pages":null},"PeriodicalIF":6.9,"publicationDate":"2024-03-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"140044907","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
京公网安备 11010802042870号
京ICP备2023020795号-1
扫码关注我们
求助内容：
应助结果提醒方式：