{"title":"Class of 2024 IEEE Fellows Who Are Members of the Circuits and Systems Society [Society News]","authors":"","doi":"10.1109/mcas.2024.3415243","DOIUrl":"https://doi.org/10.1109/mcas.2024.3415243","url":null,"abstract":"Congratulations to the 2024 CAS Society Class of IEEE Fellows! Thank you for your many contributions to IEEE Circuits and Systems Society.","PeriodicalId":55038,"journal":{"name":"IEEE Circuits and Systems Magazine","volume":null,"pages":null},"PeriodicalIF":6.9,"publicationDate":"2024-08-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142225634","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2024-08-19DOI: 10.1109/mcas.2024.3376652
Ricardo Reis, Janier Arias
The IEEE CASS Tour Minas Gerais 2023 took place at the auditorium of the Engineering School of the Federal University of Minas Gerais (UFMG) on 4 December. The Federal University of Minas Gerais is one of the main public universities in Brazil, starting activities in 1927.
{"title":"IEEE CASS Tour Minas Gerais 2023 [CASS Conference Highlights]","authors":"Ricardo Reis, Janier Arias","doi":"10.1109/mcas.2024.3376652","DOIUrl":"https://doi.org/10.1109/mcas.2024.3376652","url":null,"abstract":"The IEEE CASS Tour Minas Gerais 2023 took place at the auditorium of the Engineering School of the Federal University of Minas Gerais (UFMG) on 4 December. The Federal University of Minas Gerais is one of the main public universities in Brazil, starting activities in 1927.","PeriodicalId":55038,"journal":{"name":"IEEE Circuits and Systems Magazine","volume":null,"pages":null},"PeriodicalIF":6.9,"publicationDate":"2024-08-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142225643","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2024-08-19DOI: 10.1109/mcas.2024.3376639
Ricardo Reis, Victor Grimblatt, Faruk Fonthal
The IEEE CASS Tour Colombia 2023 was held from 21 to 23 November, in two locations: Cartagena and Barranquilla. The CASS Tour Colombia organized in 2022, was held in Bogotá and Barranquilla (location of ANDESCON 2022) [1] .
{"title":"IEEE CASS Tour Colombia 2023 [CASS Conference Highlights]","authors":"Ricardo Reis, Victor Grimblatt, Faruk Fonthal","doi":"10.1109/mcas.2024.3376639","DOIUrl":"https://doi.org/10.1109/mcas.2024.3376639","url":null,"abstract":"The IEEE CASS Tour Colombia 2023 was held from 21 to 23 November, in two locations: Cartagena and Barranquilla. The CASS Tour Colombia organized in 2022, was held in Bogotá and Barranquilla (location of ANDESCON 2022) <xref ref-type=\"bibr\" r xmlns:mml=\"http://www.w3.org/1998/Math/MathML\" xmlns:xlink=\"http://www.w3.org/1999/xlink\">[1]</xref>\u0000.","PeriodicalId":55038,"journal":{"name":"IEEE Circuits and Systems Magazine","volume":null,"pages":null},"PeriodicalIF":6.9,"publicationDate":"2024-08-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142198891","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2024-08-19DOI: 10.1109/mcas.2024.3407009
{"title":"IEEE Circuits and Systems Magazine Publication Information","authors":"","doi":"10.1109/mcas.2024.3407009","DOIUrl":"https://doi.org/10.1109/mcas.2024.3407009","url":null,"abstract":"","PeriodicalId":55038,"journal":{"name":"IEEE Circuits and Systems Magazine","volume":null,"pages":null},"PeriodicalIF":6.9,"publicationDate":"2024-08-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142198890","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2024-08-19DOI: 10.1109/mcas.2024.3421469
{"title":"TechRxiv: Share Your Preprint Research With the World!","authors":"","doi":"10.1109/mcas.2024.3421469","DOIUrl":"https://doi.org/10.1109/mcas.2024.3421469","url":null,"abstract":"","PeriodicalId":55038,"journal":{"name":"IEEE Circuits and Systems Magazine","volume":null,"pages":null},"PeriodicalIF":6.9,"publicationDate":"2024-08-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142225642","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2024-08-19DOI: 10.1109/mcas.2024.3395580
Rajiv Joshi, Matthew Ziegler, Jin-Ping Han, Kaoutar El Maghraoui
The 6th IBM IEEE CAS/EDS AI Compute Symposium was held hybrid at the T. J. Watson Research Center on 28 November 2023. The event was extremely successful and well attended by over 2000 folks from all over the world (in-person and virtual). The symposium featured 8 distinguished speakers (7 from industry and 1 from academia), over 30 student in-person posters, best poster awards, and a panel discussion. The registration list spanned citizens of 53 countries. The theme of the symposium, “From Chips to Chiplets,” turned out to be an opportune and important topic for the current semiconductor industry direction. The symposium served as an educational as well as a brainstorming session for industry/academia/students across the world. The symposium covered a range of topics from emerging device technology, innovative circuits, chip and chiplet architecture, advanced packaging technologies, such as 2D to 3D packaging elements, and how these topics drive the rapid growth of AI and generative AI. Dr. Rajiv Joshi, General Chair and IEEE Life Fellow opened the symposium with welcoming remarks along with the goals and accomplishments of this symposium under the auspices of CAS and IBM.
第六届 IBM IEEE CAS/EDS 人工智能计算研讨会于 2023 年 11 月 28 日在 T. J. 沃森研究中心举行。来自世界各地的 2000 多人（现场和虚拟）参加了此次活动，活动非常成功。研讨会邀请了 8 位杰出的演讲者（7 位来自工业界，1 位来自学术界）、30 多位学生亲自展示海报、最佳海报奖和小组讨论。注册名单涵盖 53 个国家的公民。研讨会的主题是 "从芯片到芯片组"，这对当前半导体行业的发展方向来说是一个恰当而重要的主题。这次研讨会对全球的工业界、学术界和学生来说既是一次教育会议，也是一次头脑风暴会议。研讨会涵盖了一系列主题，包括新兴器件技术、创新电路、芯片和芯片组架构、先进封装技术（如从 2D 到 3D 封装元件），以及这些主题如何推动人工智能和生成式人工智能的快速发展。大会总主席、IEEE 终身会士 Rajiv Joshi 博士在开幕式上致欢迎辞，并介绍了由中科院和 IBM 赞助的本次研讨会的目标和成就。
{"title":"6th IBM IEEE CAS/EDS AI Compute Symposium (AICS’23) [CASS Conference Highlights]","authors":"Rajiv Joshi, Matthew Ziegler, Jin-Ping Han, Kaoutar El Maghraoui","doi":"10.1109/mcas.2024.3395580","DOIUrl":"https://doi.org/10.1109/mcas.2024.3395580","url":null,"abstract":"The 6th IBM IEEE CAS/EDS AI Compute Symposium was held hybrid at the T. J. Watson Research Center on 28 November 2023. The event was extremely successful and well attended by over 2000 folks from all over the world (in-person and virtual). The symposium featured 8 distinguished speakers (7 from industry and 1 from academia), over 30 student in-person posters, best poster awards, and a panel discussion. The registration list spanned citizens of 53 countries. The theme of the symposium, “From Chips to Chiplets,” turned out to be an opportune and important topic for the current semiconductor industry direction. The symposium served as an educational as well as a brainstorming session for industry/academia/students across the world. The symposium covered a range of topics from emerging device technology, innovative circuits, chip and chiplet architecture, advanced packaging technologies, such as 2D to 3D packaging elements, and how these topics drive the rapid growth of AI and generative AI. Dr. Rajiv Joshi, General Chair and IEEE Life Fellow opened the symposium with welcoming remarks along with the goals and accomplishments of this symposium under the auspices of CAS and IBM.","PeriodicalId":55038,"journal":{"name":"IEEE Circuits and Systems Magazine","volume":null,"pages":null},"PeriodicalIF":6.9,"publicationDate":"2024-08-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142225646","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2024-08-19DOI: 10.1109/mcas.2024.3421448
{"title":"Proceedings of the IEEE","authors":"","doi":"10.1109/mcas.2024.3421448","DOIUrl":"https://doi.org/10.1109/mcas.2024.3421448","url":null,"abstract":"","PeriodicalId":55038,"journal":{"name":"IEEE Circuits and Systems Magazine","volume":null,"pages":null},"PeriodicalIF":6.9,"publicationDate":"2024-08-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142198888","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2024-08-19DOI: 10.1109/mcas.2024.3353151
Pankaj Kumar Sharma, Rajeev Kumar Ranjan, Sung-Mo Kang
A compact MOSFET-C floating/grounded meminductor emulator (MIE) model is presented for high operating frequency and low power operation. The proposed MIE uses only 22 MOSFETs and two capacitors. Its performance is theoretically analyzed and rigorously verified using the Cadence Virtuoso software and hardware prototypes. The proposed MIE operates appropriately for a wide range of frequencies up to 5 MHz with $590 mu text{W}$ power consumption at a 180nm CMOS technology node and manifests important signature properties. The MIE layout area in 180 nm CMOS technology is $13107.5 mu text{m}^{2}$ . To analyze the effects of statistical variations in MIE elements, extensive Monte Carlo simulations have been performed to demonstrate the robustness of the proposed MIE. For experimental validation, hardware prototypes have been developed and tested successfully. An MIE-based adaptive learning neuromorphic circuit is presented to show that it can mimic the behavioral responses of amoeba under varying environments such as temperature.
{"title":"A Compact Electronically Tunable Meminductor Emulator Model and Its Application","authors":"Pankaj Kumar Sharma, Rajeev Kumar Ranjan, Sung-Mo Kang","doi":"10.1109/mcas.2024.3353151","DOIUrl":"https://doi.org/10.1109/mcas.2024.3353151","url":null,"abstract":"A compact MOSFET-C floating/grounded meminductor emulator (MIE) model is presented for high operating frequency and low power operation. The proposed MIE uses only 22 MOSFETs and two capacitors. Its performance is theoretically analyzed and rigorously verified using the Cadence Virtuoso software and hardware prototypes. The proposed MIE operates appropriately for a wide range of frequencies up to 5 MHz with <inline-formula xmlns:mml=\"http://www.w3.org/1998/Math/MathML\" xmlns:xlink=\"http://www.w3.org/1999/xlink\"> <tex-math notation=\"LaTeX\">$590 mu text{W}$ </tex-math></inline-formula> power consumption at a 180nm CMOS technology node and manifests important signature properties. The MIE layout area in 180 nm CMOS technology is <inline-formula xmlns:mml=\"http://www.w3.org/1998/Math/MathML\" xmlns:xlink=\"http://www.w3.org/1999/xlink\"> <tex-math notation=\"LaTeX\">$13107.5 mu text{m}^{2}$ </tex-math></inline-formula>\u0000. To analyze the effects of statistical variations in MIE elements, extensive Monte Carlo simulations have been performed to demonstrate the robustness of the proposed MIE. For experimental validation, hardware prototypes have been developed and tested successfully. An MIE-based adaptive learning neuromorphic circuit is presented to show that it can mimic the behavioral responses of amoeba under varying environments such as temperature.","PeriodicalId":55038,"journal":{"name":"IEEE Circuits and Systems Magazine","volume":null,"pages":null},"PeriodicalIF":6.9,"publicationDate":"2024-08-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142225632","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2024-08-19DOI: 10.1109/mcas.2024.3421449
{"title":"IEEE Foundation","authors":"","doi":"10.1109/mcas.2024.3421449","DOIUrl":"https://doi.org/10.1109/mcas.2024.3421449","url":null,"abstract":"","PeriodicalId":55038,"journal":{"name":"IEEE Circuits and Systems Magazine","volume":null,"pages":null},"PeriodicalIF":6.9,"publicationDate":"2024-08-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142225635","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2024-08-19DOI: 10.1109/mcas.2024.3358786
Valery Chebet, Allan Kipkirui Koech, Claude Omosa
CardioCare helps people with health setbacks like strokes by providing real-time heart monitoring through a wearable device and mobile app. An algorithm analyses data to determine emergencies. The wearable device sounds an alarm and sends notifications for ambulance dispatch or ideal travel routes to medical facilities. It also keeps a QR-coded medical history for proactive care and faster medical response.
CardioCare 通过可穿戴设备和移动应用程序提供实时心脏监测，帮助人们应对中风等健康问题。算法通过分析数据来确定紧急情况。可穿戴设备会发出警报，并为救护车调度或前往医疗机构的理想路线发送通知。它还能保存 QR 码病历，以提供主动护理和更快的医疗响应。
{"title":"CardioCare for Faster Medical Emergency Response [Innovations Corner]","authors":"Valery Chebet, Allan Kipkirui Koech, Claude Omosa","doi":"10.1109/mcas.2024.3358786","DOIUrl":"https://doi.org/10.1109/mcas.2024.3358786","url":null,"abstract":"CardioCare helps people with health setbacks like strokes by providing real-time heart monitoring through a wearable device and mobile app. An algorithm analyses data to determine emergencies. The wearable device sounds an alarm and sends notifications for ambulance dispatch or ideal travel routes to medical facilities. It also keeps a QR-coded medical history for proactive care and faster medical response.","PeriodicalId":55038,"journal":{"name":"IEEE Circuits and Systems Magazine","volume":null,"pages":null},"PeriodicalIF":6.9,"publicationDate":"2024-08-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142225644","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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