Gold Bulletin最新文献

Nanoparticles are very important materials for implementing nanotechnology in diverse areas and are abundant in nature as living organisms operate at a nanoscale. As nanoparticles exhibit interesting size- and shape-dependent physical and chemical properties, the synthesis of uniform nanoparticles with controlled sizes and shapes is of great importance. Nanoparticles are the end products of a wide variety of physical, chemical and biological processes, some of which are novel and radically different and others of which are quite commonplace. The ability to produce nanoparticles with specific shapes and controlled sizes could result in interesting new applications that can potentially be utilized in areas such as optics, electronics and the biomedical field. In the present study, we have demonstrated the ability of the thermophilic bacterium Thermus scotoductus SA-01 to synthesize gold nanoparticles and determined the effect of the physico-chemical parameters on particle synthesis. Furthermore, a protein purified from this bacterium is shown to be capable of reducing HAuCl₄ to form elemental nanoparticles in vitro. The protein was purified to homogeneity and identified through N-terminal sequencing as an ABC transporter, peptide-binding protein. It is speculated that this protein reduces Au(III) through an electron shuttle mechanism involving a cysteine disulphide bridge. Through manipulation of physico-chemical parameters, it was possible to vary nanoparticles in terms of number, shape and size. This is the first report of a transporter protein from a thermophile with the ability to produce nanoparticles in vitro thus expanding the limited knowledge around biological gold nanoparticle synthesis.

The isothermal phase diagram of Au–Al–Pd at 500?°C was constructed using diffusion couples and equilibrated bulk alloys. Electron microprobe analyses were used to determine the phase compositions and phase relationships. Thirteen three-phase equilibria and two ternary phases (T₁ and T₂) were identified in this study. Phase T₁ contained 37?at% Au, 26?at% Pd, and 37?at% Al. Phase T₂ contained 44?at% Au, 24?at% Pd, and 32?at% Al. The Au solubility in the Al₃Pd₂, AlPd, and AlPd₂ phases were 6, 15, and 34?at%, respectively. The Pd solubility in the AuAl₂, Au₂Al, Au₈Al₃, and Au₄Al phases were 5, 10, 13, and 3?at%, respectively.

The etching of gold is a key enabling technology in the fabrication of many microdevices and is widely used in the electronic, optoelectronic and microelectromechanical systems (MEMS) industries. In this review, we examine some of the available methods for patterning gold thin films using dry and wet etching techniques. Dry methods which utilise reactive ion etching (RIE) have a number of important advantages over other methods, but the low volatility of gold etch products has made the development of suitable processes problematic. More recently, the adoption of high-density plasma reactors with optimised chlorine-based chemistries has allowed improved processes to be developed, and etching in hydrogen plasmas also shows promise. Wet etching methods for gold have also been critically reviewed. Traditionally, iodine- and cyanide-based etch processes have been used, but in the last decade, a number of alternative etchants have been studied. Of particular interest is the recent development of a range of novel non-aqueous-based gold etchants, and the suitability of these etchants for microfabrication is assessed.

In this work, the morphological and structural evolution of gold nanodots deposited on Si substrates has been monitored for 2.4?×?10³?h. Gold nanodots on Si are of great scientific interest because they can be used in numerous ways, for example as subwavelength antennas in plasmonics, as electrical contacts in nanometric devices, or as catalysts for the formation of quasi-1dimensional nanostructures. Their characteristics have been studied in a very large number of papers in literature, and among the several aspects, it is known that continuous Au films peculiarly interact with Si by interdiffusion even at room temperature. It would be expected that also small nanostructures could undergo to an interdiffusion and consequent modifications of their structure and shape after aging. Despite the cruciality of this topic, no literature papers have been found showing a detailed morphological and structural characterization of aged Au nanodots. Au nanoparticles have been deposited by sputtering on Si and stored in air at temperature between 20 and 23?°C and humidity of about 45?%, simulating the standard storage conditions of most of the fabrication labs. The morphological and structural characterizations have been performed by bright field transmission electron microscopy (TEM). A specific procedure has been used in order to avoid any modification of the material during the specimen preparation for the TEM analysis. A digital processing of the TEM images has allowed to get a large statistical analysis on the particles size distribution. Two different types of nanoparticles are found after the deposition: pure gold crystalline nanodots on the Si surface and gold amorphous nanoclusters interdiffused into the Si subsurface regions. While the nanodots preserve both morphology and structure all over the time, the amorphous agglomerates show an evolution during aging in morphology, structure, and chemical phase.

In this study, the electrochemical behaviour of commercially available gold spheres and rods stabilised by carboxylic acid and cetyl trimethyl ammonium bromide (CTAB) moieties, respectively, are investigated. The cyclic voltammetric behaviour in acidic electrolyte is distinctly different with the nanorods exhibiting unusual oxidative behaviour due to an electrodissolution process. The nanospheres exhibited responses typical of a highly defective surface which significantly impacted on electrocatalytic activity. A repetitive potential cycling cleaning procedure was also investigated which did not improve the activity of the nanorods and resulted in deactivating the gold spheres due to decreasing the level of surface defects.

We performed a systematic investigation of the Ti–xAu (x?=?5, 10, 15, 20, and 40?wt%) alloys to assess the effect of addition of element Au on the microstructure, mechanical properties, and corrosion behavior of commercially pure titanium (cp-Ti). The phase and microstructure were characterized using X-ray diffraction (XRD), optical microscopy, scanning electron microscopy (SEM), and transmission electron microscopy (TEM). The results indicated that the Ti–xAu alloys containing up to 15?wt% Au showed a hexagonal close-packed α-Ti structure, whereas the Ti–xAu alloys containing more than 20?wt% Au were mainly composed of the α-Ti phase and Ti₃Au intermetallic phase. We also investigated the effect of alloying element Au on the mechanical properties (including Vickers hardness and modulus) and corrosion behavior of Ti–xAu binary alloys. The addition of gold to Ti improved its hardness. Electrochemical results showed that the Ti–xAu alloys exhibited improved corrosion resistance than cp-Ti.

This paper discusses the microstructure evolution of copper (Cu) and gold (Au) ball bonds after various extended reliability stresses such as biased highly accelerated temperature and humidity test (HAST), unbiased highly accelerated temperature and humidity test (UHAST), temperature cycling (TC), and high temperature storage life (HTSL) in BGA package. Objective of this study is to study the microstructure evolution and changes after long hours and long cycles of component reliability stressing and its predicted failure mechanisms and to determine the long-term reliability comparison with combination of bonding wires in HAST, UHAST, and TC. Secondary electron microscopy (SEM) and energy dispersive X-ray (EDX) have been carried out to understand the respective microstructure of failed samples in HAST, UHAST, TC, and HTSL long-term reliability failures. Respective failure mechanisms of copper and gold ball bonds carrion under HAST and UHAST, ball bond lifting in TC and HTSL have been analyzed and proposed. The evolution of surface morphology, including copper and gold ball bond micro cracking, gold ball bond Kirkendall microvoiding and intermetallic compound (IMC) formation, was studied in FBGA package with copper and gold ball bonds during various reliability stresses. Biased HAST, UHAST, TC, and HTSL mechanisms were proposed to explain the observed morphological changes and the resulting ball bond wear out modes after extended reliability stresses. Weibull reliability analyses have been established to compare the performance of copper and gold ball bonds under humid and dry environmental tests.

In manufacturing three-dimensional SiC power modules, the Al electrode of SiC power devices should be soldered to the substrate. However, the Al electrode is difficult to be bonded by a solder due to the naturally formed aluminum oxide on it. In this paper, we describe an effective approach for soldering the non-wettable Al electrode by fabricating a Au-stud bump in the Al electrode together with a Au-20?wt% Sn or Au-12?wt% Ge solder. The soldering initiated at the Au bump and spreaded on the Al electrode. The soldering featured as reactive wetting, realized by the reaction of liquid Au in the Au-base solder and the Al electrode. The activation energy of the Au-20?wt% Sn soldering the Al electrode was Q?=?159?kJ/mol. A continuous Au₄Al layer formed at the Au-20?wt% Sn bond interface. The shear strength exceeded 60?MPa, ～1 order magnitude higher than the required shear strength. For the bond with Au-12?wt% Ge solder on the Al electrode with a Au bump, the liquid Au-12?wt% Ge solder reacted with the solid Al electrode and formed a Au-Ge-Al solid solution after solidification. The shear strength of the Au-12?wt% Ge solder on the Al electrode with a Au bump was beyond 50?MPa. Little electrical characteristics of the SiC-SBD changed after the Al electrode was bonded to a circuit substrate using this technology.

Surface-enhanced Raman spectroscopy (SERS) has enormous potential for a range of applications where high sensitivity needs to be combined with good discrimination between molecular targets. However, the SERS technique has trouble finding its industrial development, as was the case with the surface plasmon resonance technology. The main reason is the difficulty to produce stable, reproducible, and highly efficient substrates for quantitative measurements. In this paper, we report a method to obtain two-dimensional regular nanopatterns of gold nanoparticles (AuNPs). The resulting patterns were evaluated by SERS. Our bottom-up strategy was divided into two steps: (a) nanopatterning of the substrate by e-beam lithography and (b) electrostatic adsorption of AuNPs on functionalized substrates. This approach enabled us to highlight the optimal conditions to obtain monolayer, rows, or ring of AuNPs, with homogeneous distribution and high density (800 AuNPs/μm²). The nanostructure distributions on the substrates were displayed by scanning electron microscopy and atomic force microscopy images. Optical properties of our nanostructures were characterized by visible extinction spectra and by the measured enhancements of Raman scattering. Finally, we tried to demonstrate experimentally that, to observe a significant enhancement of SERS, the gold diffusers must be extremely closer. If electron beam lithography is a very attractive technique to perform reproducible SERS substrates, the realization of pattern needs a very high resolution, with distances between nanostructures probably of less than 20?nm.