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2016 IEEE International Solid-State Circuits Conference (ISSCC)最新文献

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Session 22 Overview: Terahertz for Communication and Sensing Wireless Subcommittee 第22次会议概述:太赫兹用于通信和传感无线小组委员会
Pub Date : 2021-02-13 DOI: 10.1109/ISSCC42613.2021.9366039
Q. Gu, Byung-Wook Min, M. Tabesh
{"title":"Session 22 Overview: Terahertz for Communication and Sensing Wireless Subcommittee","authors":"Q. Gu, Byung-Wook Min, M. Tabesh","doi":"10.1109/ISSCC42613.2021.9366039","DOIUrl":"https://doi.org/10.1109/ISSCC42613.2021.9366039","url":null,"abstract":"","PeriodicalId":6511,"journal":{"name":"2016 IEEE International Solid-State Circuits Conference (ISSCC)","volume":"43 1","pages":"312-313"},"PeriodicalIF":0.0,"publicationDate":"2021-02-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"87367163","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Session 25 Overview: DRAM Memory Subcommittee 会议25概述:DRAM内存小组委员会
Pub Date : 2021-02-13 DOI: 10.1109/ISSCC42613.2021.9365948
Dong-Uk Lee, Bor-Doou Rong, Kyu-Hyoun Kim
First devices for the new DRAM standards LPDDR5 and DDR5 are implementing improvements in bandwidth and power efficiency. The new devices will have a huge impact on a very wide range of applications, from IoT applications and smartphones to server and workstation applications. A new proposal for managed LRDIMM promises to reduce cost and power, and to provide capacities up to 512GB. For next generation DRAM interfaces a PAM-3 transceiver with 27Gb/s/pin on the base of 3 bits per 2 symbols is presented. -generation LPDDR5 the maximum bandwidth as WCK clocking and non-target ODT (NT-ODT). power consumption using techniques such as dynamic voltage frequency scaling (DVFS), and a deep-sleep mode (DSM). presents a DDR5 SDRAM to overcome bandwidth, power and capacity limitations of DDR4. This paper presents a 16Gb 6.4Gb/s/pin DDR5 SDRAM with a phase-rotator-based DLL, write-level training, and RX/TX with the enhanced DFE/FFE. The energy efficiency is improved by more than 30% with 1.1V/1.8V VDD and VPP. a 3bit/2UI 1.03pJ/bit PAM-3 single-ended TRX. An 27Gb/s PAM-3 symbol is generated with an output driver voltage of 0.6V and a 1/3-rate forwarded clock frequency of 9GHz. The RX adopts a 1-tap tri-level DFE, which has the same complexity as for NRZ signaling to equalize the PAM-3 signal. Fabricated in a 28nm CMOS technology, the proposed PAM-3 TRX can be utilized for the next generation memory interface with low power. (ODP) structured (media) and ODP structure of for cost minimization, pre-CMD scheme for reduction. Dies per wafer increase of compared to conventional DRAM with same process and same capacity was achieved. DIMM power consumption is
首批采用新DRAM标准LPDDR5和DDR5的设备正在实现带宽和功率效率方面的改进。这些新设备将对广泛的应用产生巨大影响,从物联网应用和智能手机到服务器和工作站应用。一项关于管理LRDIMM的新提议承诺降低成本和功耗,并提供高达512GB的容量。对于下一代DRAM接口,提出了一种基于每2个符号3比特的27Gb/s/引脚的PAM-3收发器。LPDDR5的最大带宽作为WCK时钟和非目标ODT (NT-ODT)。使用动态电压频率缩放(DVFS)和深度睡眠模式(DSM)等技术来降低功耗。提出了一种克服DDR4带宽、功率和容量限制的DDR5 SDRAM。本文提出了一个16Gb 6.4Gb/s/引脚的DDR5 SDRAM,具有基于相位旋转器的DLL,写级训练和RX/TX,具有增强的DFE/FFE。采用1.1V/1.8V VDD和VPP,能效提高30%以上。一个3bit/2UI 1.03pJ/bit PAM-3单端TRX。生成一个27Gb/s的PAM-3符号,输出驱动电压为0.6V, 1/3速率转发时钟频率为9GHz。RX采用1分接三电平DFE,其复杂度与NRZ信令相同,用于均衡PAM-3信号。PAM-3 TRX采用28nm CMOS工艺制造,可用于下一代低功耗存储器接口。(ODP)结构(介质)和ODP结构的成本最小化,预cmd方案的减少。与传统DRAM相比,在相同工艺和相同容量的情况下,每片芯片的芯片数增加了。DIMM功耗为
{"title":"Session 25 Overview: DRAM Memory Subcommittee","authors":"Dong-Uk Lee, Bor-Doou Rong, Kyu-Hyoun Kim","doi":"10.1109/ISSCC42613.2021.9365948","DOIUrl":"https://doi.org/10.1109/ISSCC42613.2021.9365948","url":null,"abstract":"First devices for the new DRAM standards LPDDR5 and DDR5 are implementing improvements in bandwidth and power efficiency. The new devices will have a huge impact on a very wide range of applications, from IoT applications and smartphones to server and workstation applications. A new proposal for managed LRDIMM promises to reduce cost and power, and to provide capacities up to 512GB. For next generation DRAM interfaces a PAM-3 transceiver with 27Gb/s/pin on the base of 3 bits per 2 symbols is presented. -generation LPDDR5 the maximum bandwidth as WCK clocking and non-target ODT (NT-ODT). power consumption using techniques such as dynamic voltage frequency scaling (DVFS), and a deep-sleep mode (DSM). presents a DDR5 SDRAM to overcome bandwidth, power and capacity limitations of DDR4. This paper presents a 16Gb 6.4Gb/s/pin DDR5 SDRAM with a phase-rotator-based DLL, write-level training, and RX/TX with the enhanced DFE/FFE. The energy efficiency is improved by more than 30% with 1.1V/1.8V VDD and VPP. a 3bit/2UI 1.03pJ/bit PAM-3 single-ended TRX. An 27Gb/s PAM-3 symbol is generated with an output driver voltage of 0.6V and a 1/3-rate forwarded clock frequency of 9GHz. The RX adopts a 1-tap tri-level DFE, which has the same complexity as for NRZ signaling to equalize the PAM-3 signal. Fabricated in a 28nm CMOS technology, the proposed PAM-3 TRX can be utilized for the next generation memory interface with low power. (ODP) structured (media) and ODP structure of for cost minimization, pre-CMD scheme for reduction. Dies per wafer increase of compared to conventional DRAM with same process and same capacity was achieved. DIMM power consumption is","PeriodicalId":6511,"journal":{"name":"2016 IEEE International Solid-State Circuits Conference (ISSCC)","volume":"26 1","pages":"342-343"},"PeriodicalIF":0.0,"publicationDate":"2021-02-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"75713565","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Session 11 Overview: Advanced Wireline Links and Techniques Wireline Subcommittee 会议11概述:先进的有线链路和技术有线小组委员会
Pub Date : 2021-02-13 DOI: 10.1109/ISSCC42613.2021.9365823
M. Chen, Wei-Zen Chen, A. Amirkhany
{"title":"Session 11 Overview: Advanced Wireline Links and Techniques Wireline Subcommittee","authors":"M. Chen, Wei-Zen Chen, A. Amirkhany","doi":"10.1109/ISSCC42613.2021.9365823","DOIUrl":"https://doi.org/10.1109/ISSCC42613.2021.9365823","url":null,"abstract":"","PeriodicalId":6511,"journal":{"name":"2016 IEEE International Solid-State Circuits Conference (ISSCC)","volume":"16 1","pages":"178-179"},"PeriodicalIF":0.0,"publicationDate":"2021-02-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"83491952","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Session 33 Overview: High-Voltage, GaN and Wireless Power Power Management Subcommittee 第33场概述:高压、氮化镓和无线电源电源管理小组委员会
Pub Date : 2021-01-01 DOI: 10.1109/ISSCC42613.2021.9365994
Min Chen, B. Wicht, K. Miyaji
{"title":"Session 33 Overview: High-Voltage, GaN and Wireless Power Power Management Subcommittee","authors":"Min Chen, B. Wicht, K. Miyaji","doi":"10.1109/ISSCC42613.2021.9365994","DOIUrl":"https://doi.org/10.1109/ISSCC42613.2021.9365994","url":null,"abstract":"","PeriodicalId":6511,"journal":{"name":"2016 IEEE International Solid-State Circuits Conference (ISSCC)","volume":"1 1","pages":"458-459"},"PeriodicalIF":0.0,"publicationDate":"2021-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"84487763","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Session 28 Overview: Biomedical Systems Imagers, Medical, Mems and Displays Subcommittee 概述:生物医学系统成像仪,医疗,微机电系统和显示小组委员会
Pub Date : 2021-01-01 DOI: 10.1109/ISSCC42613.2021.9365805
Joonsung Bae, Jennifer Lloyd, C. Hoof
{"title":"Session 28 Overview: Biomedical Systems Imagers, Medical, Mems and Displays Subcommittee","authors":"Joonsung Bae, Jennifer Lloyd, C. Hoof","doi":"10.1109/ISSCC42613.2021.9365805","DOIUrl":"https://doi.org/10.1109/ISSCC42613.2021.9365805","url":null,"abstract":"","PeriodicalId":6511,"journal":{"name":"2016 IEEE International Solid-State Circuits Conference (ISSCC)","volume":"26 1","pages":"384-385"},"PeriodicalIF":0.0,"publicationDate":"2021-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"84810000","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Session 36 Overview: Hardware Security Digital Architectures and Systems Subcommittee 第三十六场概述:硬件安全数字架构和系统小组委员会
Pub Date : 2021-01-01 DOI: 10.1109/ISSCC42613.2021.9365930
H. Shinohara, M. Alioto, I. Verbauwhede
{"title":"Session 36 Overview: Hardware Security Digital Architectures and Systems Subcommittee","authors":"H. Shinohara, M. Alioto, I. Verbauwhede","doi":"10.1109/ISSCC42613.2021.9365930","DOIUrl":"https://doi.org/10.1109/ISSCC42613.2021.9365930","url":null,"abstract":"","PeriodicalId":6511,"journal":{"name":"2016 IEEE International Solid-State Circuits Conference (ISSCC)","volume":"9 1","pages":"496-497"},"PeriodicalIF":0.0,"publicationDate":"2021-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"78902143","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
SE1: What Technologies Will Shape the Future of Computing? SE1:哪些技术将塑造计算的未来?
Pub Date : 2021-01-01 DOI: 10.1109/ISSCC42613.2021.9366007
H. Mair, S. Shiratake, Eric Karl, T. Burd, Jonathan Chang, Debbie Marr, S. Naffziger, H. Corporaal, K. Takeuchi, Naresh R Shanbhag
{"title":"SE1: What Technologies Will Shape the Future of Computing?","authors":"H. Mair, S. Shiratake, Eric Karl, T. Burd, Jonathan Chang, Debbie Marr, S. Naffziger, H. Corporaal, K. Takeuchi, Naresh R Shanbhag","doi":"10.1109/ISSCC42613.2021.9366007","DOIUrl":"https://doi.org/10.1109/ISSCC42613.2021.9366007","url":null,"abstract":"","PeriodicalId":6511,"journal":{"name":"2016 IEEE International Solid-State Circuits Conference (ISSCC)","volume":"52 1","pages":"537-538"},"PeriodicalIF":0.0,"publicationDate":"2021-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"86479702","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Session 16 Overview: Computation in Memory Memory Subcommittee 第16部分概述:内存中的计算
Pub Date : 2021-01-01 DOI: 10.1109/ISSCC42613.2021.9365967
Meng-Fan Chang, Ruji Huang, Seung-Jun Bae
{"title":"Session 16 Overview: Computation in Memory Memory Subcommittee","authors":"Meng-Fan Chang, Ruji Huang, Seung-Jun Bae","doi":"10.1109/ISSCC42613.2021.9365967","DOIUrl":"https://doi.org/10.1109/ISSCC42613.2021.9365967","url":null,"abstract":"","PeriodicalId":6511,"journal":{"name":"2016 IEEE International Solid-State Circuits Conference (ISSCC)","volume":"23 1","pages":"244-245"},"PeriodicalIF":0.0,"publicationDate":"2021-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"90438465","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Session 30 Overview: Non-Volatile Memories Memory Subcommittee 第30次会议概述:非易失性存储器
Pub Date : 2021-01-01 DOI: 10.1109/ISSCC42613.2021.9365847
Y. Taito, V. Moschiano, S. Shiratake
{"title":"Session 30 Overview: Non-Volatile Memories Memory Subcommittee","authors":"Y. Taito, V. Moschiano, S. Shiratake","doi":"10.1109/ISSCC42613.2021.9365847","DOIUrl":"https://doi.org/10.1109/ISSCC42613.2021.9365847","url":null,"abstract":"","PeriodicalId":6511,"journal":{"name":"2016 IEEE International Solid-State Circuits Conference (ISSCC)","volume":"23 1","pages":"420-421"},"PeriodicalIF":0.0,"publicationDate":"2021-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"84563968","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Session 2 Overview: Highlighted Chip Releases: 5G and Radar Systems Invited Papers 第二部分概述:重点芯片发布:5G和雷达系统
Pub Date : 2021-01-01 DOI: 10.1109/ISSCC42613.2021.9365799
T. Georgantas, Y. Baeyens, Alice Wang
{"title":"Session 2 Overview: Highlighted Chip Releases: 5G and Radar Systems Invited Papers","authors":"T. Georgantas, Y. Baeyens, Alice Wang","doi":"10.1109/ISSCC42613.2021.9365799","DOIUrl":"https://doi.org/10.1109/ISSCC42613.2021.9365799","url":null,"abstract":"","PeriodicalId":6511,"journal":{"name":"2016 IEEE International Solid-State Circuits Conference (ISSCC)","volume":"36 1","pages":"36-37"},"PeriodicalIF":0.0,"publicationDate":"2021-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"85145504","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
期刊
2016 IEEE International Solid-State Circuits Conference (ISSCC)
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