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2016 IEEE International Solid-State Circuits Conference (ISSCC)最新文献

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Brain-Inspired technologies: Towards chips that think? 大脑启发技术:走向会思考的芯片?
Pub Date : 2018-02-01 DOI: 10.1109/ISSCC.2018.8310165
B. D. Salvo
The advent of the Internet-of-Things has introduced a new paradigm that supports a decentralized and hierarchical communication architecture, where a great deal of analytics processing occurs at the edge and at the end-devices instead of in the Cloud. To map the embedded-systems requirements, we present a holistic research approach to the development of low-power architectures inspired by the human brain, where process development and integration, circuit design, system architecture, and learning algorithms are simultaneously optimized. This paper is organized as follows: We begin with a survey of recent research on the human brain and a historical perspective of cognitive neuroscience. Then, artificial intelligence is introduced, and the challenges of Deep Learning systems (in terms of power requirements) are addressed. The key reasons to distribute intelligence over the whole network are discussed. To emphasize the need for low-power solutions, a quantitative benchmark of existing specialized edge platforms that can execute machine-learning algorithms on conventional embedded hardware is presented. The primary focus of this paper will be on the implementation of optimized neuromorphic hardware as a highly promising solution for future ultra-low-power cognitive systems. We show that emerging technologies (such as advanced CMOS, 3D technologies, emerging resistive memories, and Silicon photonics), coupled with novel brain-inspired paradigms, such as spike-coding and spike-time-dependent-plasticity, have extraordinary potential to provide intelligent features in hardware, approaching the way knowledge is created and processed in the human brain. Finally, we conclude with our vision of the enabled future disruptive applications and a discussion of the main challenges which should be tackled to exploit the full potential of brain-inspired technologies.
物联网的出现引入了一种新的范例,它支持分散和分层的通信架构,其中大量的分析处理发生在边缘和终端设备上,而不是在云中。为了映射嵌入式系统需求,我们提出了一种受人脑启发的低功耗架构开发的整体研究方法,其中过程开发和集成,电路设计,系统架构和学习算法同时优化。本文的组织如下:我们首先概述了人类大脑的最新研究和认知神经科学的历史观点。然后,介绍了人工智能,并解决了深度学习系统的挑战(在功率要求方面)。讨论了在全网范围内分布智能的关键原因。为了强调对低功耗解决方案的需求,提出了可以在传统嵌入式硬件上执行机器学习算法的现有专用边缘平台的定量基准。本文的主要重点将放在优化的神经形态硬件的实现上,作为未来超低功耗认知系统的一个非常有前途的解决方案。我们展示了新兴技术(如先进的CMOS, 3D技术,新兴的电阻式存储器和硅光子学),加上新的大脑启发范例,如尖峰编码和尖峰时间依赖的可塑性,具有非凡的潜力,可以在硬件中提供智能功能,接近人类大脑中创造和处理知识的方式。最后,我们总结了我们对未来颠覆性应用的愿景,并讨论了应该解决的主要挑战,以充分利用大脑启发技术的潜力。
{"title":"Brain-Inspired technologies: Towards chips that think?","authors":"B. D. Salvo","doi":"10.1109/ISSCC.2018.8310165","DOIUrl":"https://doi.org/10.1109/ISSCC.2018.8310165","url":null,"abstract":"The advent of the Internet-of-Things has introduced a new paradigm that supports a decentralized and hierarchical communication architecture, where a great deal of analytics processing occurs at the edge and at the end-devices instead of in the Cloud. To map the embedded-systems requirements, we present a holistic research approach to the development of low-power architectures inspired by the human brain, where process development and integration, circuit design, system architecture, and learning algorithms are simultaneously optimized. This paper is organized as follows: We begin with a survey of recent research on the human brain and a historical perspective of cognitive neuroscience. Then, artificial intelligence is introduced, and the challenges of Deep Learning systems (in terms of power requirements) are addressed. The key reasons to distribute intelligence over the whole network are discussed. To emphasize the need for low-power solutions, a quantitative benchmark of existing specialized edge platforms that can execute machine-learning algorithms on conventional embedded hardware is presented. The primary focus of this paper will be on the implementation of optimized neuromorphic hardware as a highly promising solution for future ultra-low-power cognitive systems. We show that emerging technologies (such as advanced CMOS, 3D technologies, emerging resistive memories, and Silicon photonics), coupled with novel brain-inspired paradigms, such as spike-coding and spike-time-dependent-plasticity, have extraordinary potential to provide intelligent features in hardware, approaching the way knowledge is created and processed in the human brain. Finally, we conclude with our vision of the enabled future disruptive applications and a discussion of the main challenges which should be tackled to exploit the full potential of brain-inspired technologies.","PeriodicalId":6511,"journal":{"name":"2016 IEEE International Solid-State Circuits Conference (ISSCC)","volume":"57 1","pages":"12-18"},"PeriodicalIF":0.0,"publicationDate":"2018-02-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"84802807","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 19
Session 16 overview: Advanced optical and wireline techniques: Wireline subcommittee 第16部分概述:先进的光学和有线技术:有线小组委员会
Pub Date : 2018-02-01 DOI: 10.1109/ISSCC.2018.8310284
A. Emami-Neyestanak, A. Joy, F. O’Mahony
Electrical and optical links continue to provide challenges that cannot be overcome by process technology advances alone. The ingenuity of the designer is a major contribution, and this is clearly demonstrated by the papers in this session. The first is an invited paper that reviews state-ofthe-art optical interconnects in scalable, high-density standards-based switching fabrics for networking systems and cloud computing. The second paper describes the first electrical domain solution to the non-linear dispersion for both transient and adiabatic chirp of directly modulated lasers. This is followed by a paper that describes the first optical burst-mode receiver with rapid power on/off functionality for a data-rate of 56Gb/s and a power efficiency of 2.2pJ/b in always-on mode.
电气和光学链路继续提供仅靠工艺技术进步无法克服的挑战。设计师的聪明才智是一个主要的贡献,这在本次会议的论文中得到了清楚的证明。第一篇是一篇特邀论文,回顾了用于网络系统和云计算的可扩展的、基于高密度标准的交换结构中的最先进的光互连。第二篇论文描述了直接调制激光器瞬态啁啾和绝热啁啾非线性色散的第一个电域解。随后的一篇论文描述了第一个具有快速开/关功能的光突发模式接收器,数据速率为56Gb/s,在常亮模式下的功率效率为2.2pJ/b。
{"title":"Session 16 overview: Advanced optical and wireline techniques: Wireline subcommittee","authors":"A. Emami-Neyestanak, A. Joy, F. O’Mahony","doi":"10.1109/ISSCC.2018.8310284","DOIUrl":"https://doi.org/10.1109/ISSCC.2018.8310284","url":null,"abstract":"Electrical and optical links continue to provide challenges that cannot be overcome by process technology advances alone. The ingenuity of the designer is a major contribution, and this is clearly demonstrated by the papers in this session. The first is an invited paper that reviews state-ofthe-art optical interconnects in scalable, high-density standards-based switching fabrics for networking systems and cloud computing. The second paper describes the first electrical domain solution to the non-linear dispersion for both transient and adiabatic chirp of directly modulated lasers. This is followed by a paper that describes the first optical burst-mode receiver with rapid power on/off functionality for a data-rate of 56Gb/s and a power efficiency of 2.2pJ/b in always-on mode.","PeriodicalId":6511,"journal":{"name":"2016 IEEE International Solid-State Circuits Conference (ISSCC)","volume":"14 1","pages":"262-263"},"PeriodicalIF":0.0,"publicationDate":"2018-02-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"81757699","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Session 19 overview: Sensors and interfaces: Analog subcommittee 第19届会议概述:传感器和接口:模拟小组委员会
Pub Date : 2018-02-01 DOI: 10.1109/ISSCC.2018.8310311
M. Law, Taeik Kim, K. Makinwa
This session highlights the advances in state-of-the-art temperature, current, physical and chemical sensors. Three energy-efficient CMOS temperature sensors with the best figures of merit down to 34fJ·K2 are reported. Two current sensors (Papers 19.4 and 19.5) are presented, one demonstrating a high room-temperature gain accuracy with a ±4A input range, while the other shows a 160dB DR biosensor readout with 7ppm INL. An energy-efficient pressure-sensing system (Paper 19.6) and a high-resolution readout IC (Paper 19.7) are also reported. An energy-efficient CO2 sensor achieving 2x better resolution (94ppm) and >10x lower energy consumption (12mJ/meas) than the prior art is also described (Paper 19.8).
本次会议重点介绍了最先进的温度、电流、物理和化学传感器的进展。报道了三种高能效CMOS温度传感器,其最佳性能值可达34fJ·K2。介绍了两种电流传感器(论文19.4和19.5),其中一种显示了±4A输入范围下的高室温增益精度,而另一种显示了160dB DR生物传感器读数,INL为7ppm。还报道了一种节能的压力传感系统(论文19.6)和高分辨率读出IC(论文19.7)。还描述了一种节能的CO2传感器,其分辨率比现有技术提高2倍(94ppm),能耗(12mJ/平均值)降低>10倍(论文19.8)。
{"title":"Session 19 overview: Sensors and interfaces: Analog subcommittee","authors":"M. Law, Taeik Kim, K. Makinwa","doi":"10.1109/ISSCC.2018.8310311","DOIUrl":"https://doi.org/10.1109/ISSCC.2018.8310311","url":null,"abstract":"This session highlights the advances in state-of-the-art temperature, current, physical and chemical sensors. Three energy-efficient CMOS temperature sensors with the best figures of merit down to 34fJ·K2 are reported. Two current sensors (Papers 19.4 and 19.5) are presented, one demonstrating a high room-temperature gain accuracy with a ±4A input range, while the other shows a 160dB DR biosensor readout with 7ppm INL. An energy-efficient pressure-sensing system (Paper 19.6) and a high-resolution readout IC (Paper 19.7) are also reported. An energy-efficient CO2 sensor achieving 2x better resolution (94ppm) and >10x lower energy consumption (12mJ/meas) than the prior art is also described (Paper 19.8).","PeriodicalId":6511,"journal":{"name":"2016 IEEE International Solid-State Circuits Conference (ISSCC)","volume":"49 1","pages":"316-317"},"PeriodicalIF":0.0,"publicationDate":"2018-02-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"90509138","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Session 2 overview: Processors: Digital architectures and systems subcommittee 第二部分概述:处理器:数字架构和系统小组委员会
Pub Date : 2018-02-01 DOI: 10.1109/ISSCC.2018.8310169
T. Burd, M. Khellah, Byeong-Gyu Nam
Continued growth in cloud-to-edge applications is driving innovations in digital processors. The first two papers of this session cover next-generation server-class processors. This is followed by an energy-efficient 14nm graphics processor. An SoC configurable with 1–4 chips on an MCM to service multiple markets is described next. The last three papers demonstrate the first implementation of the datagram transport layer security (DTLS) protocol in hardware, an MSP430-compatible microcontroller with dual-mode enabling minimum-power and minimum-energy, and a net-zero-energy (NZE) smart mote SiP for IoT applications.
云到边缘应用的持续增长正在推动数字处理器的创新。本次会议的前两篇论文涉及下一代服务器级处理器。其次是节能的14nm图形处理器。下面将介绍在MCM上可配置1-4个芯片的SoC,以服务于多个市场。最后三篇论文展示了数据报传输层安全(DTLS)协议在硬件中的首次实现,一个兼容msp430的微控制器,具有双模式,可实现最低功耗和最低能耗,以及一个用于物联网应用的净零能耗(NZE)智能远程SiP。
{"title":"Session 2 overview: Processors: Digital architectures and systems subcommittee","authors":"T. Burd, M. Khellah, Byeong-Gyu Nam","doi":"10.1109/ISSCC.2018.8310169","DOIUrl":"https://doi.org/10.1109/ISSCC.2018.8310169","url":null,"abstract":"Continued growth in cloud-to-edge applications is driving innovations in digital processors. The first two papers of this session cover next-generation server-class processors. This is followed by an energy-efficient 14nm graphics processor. An SoC configurable with 1–4 chips on an MCM to service multiple markets is described next. The last three papers demonstrate the first implementation of the datagram transport layer security (DTLS) protocol in hardware, an MSP430-compatible microcontroller with dual-mode enabling minimum-power and minimum-energy, and a net-zero-energy (NZE) smart mote SiP for IoT applications.","PeriodicalId":6511,"journal":{"name":"2016 IEEE International Solid-State Circuits Conference (ISSCC)","volume":"14 1","pages":"32-33"},"PeriodicalIF":0.0,"publicationDate":"2018-02-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"86727991","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Session 29 overview: Advanced biomedical systems: IMMD subcommittee 第29届会议概述:先进生物医学系统:imd小组委员会
Pub Date : 2018-02-01 DOI: 10.1109/ISSCC.2018.8310382
P. Mohseni, N. V. Helleputte, M. Ikeda
Advances in biomedical circuits and systems are essential technology drivers in addressing critical societal needs to increase the effectiveness and lower the cost of healthcare. This session highlights the latest advances in implantable, high-density, and wearable systems for neural recording, optogenetics, multimodal cell interfacing, and heart-rate monitoring.
生物医学电路和系统的进步是解决提高医疗效率和降低医疗成本的关键社会需求的基本技术驱动因素。本次会议重点介绍了用于神经记录、光遗传学、多模态细胞接口和心率监测的可植入、高密度和可穿戴系统的最新进展。
{"title":"Session 29 overview: Advanced biomedical systems: IMMD subcommittee","authors":"P. Mohseni, N. V. Helleputte, M. Ikeda","doi":"10.1109/ISSCC.2018.8310382","DOIUrl":"https://doi.org/10.1109/ISSCC.2018.8310382","url":null,"abstract":"Advances in biomedical circuits and systems are essential technology drivers in addressing critical societal needs to increase the effectiveness and lower the cost of healthcare. This session highlights the latest advances in implantable, high-density, and wearable systems for neural recording, optogenetics, multimodal cell interfacing, and heart-rate monitoring.","PeriodicalId":6511,"journal":{"name":"2016 IEEE International Solid-State Circuits Conference (ISSCC)","volume":"74 1","pages":"458-459"},"PeriodicalIF":0.0,"publicationDate":"2018-02-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"76195584","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Session 27 overview: Power-converter techniques: Power management subcommittee 第27部分概述:电源转换器技术:电源管理小组委员会
Pub Date : 2018-02-01 DOI: 10.1109/ISSCC.2018.8310363
M. Takamiya, Yen Hsun Hsu, A. Thomsen
The session on Power Converter Techniques presents improvements of power density, power efficiency and power dissipation in switched-capacitor, hybrid, linear and inductor-based DC-DC converters and power modulators. The first paper addresses the fully integrated fine-grained rational buck-boost converter with switched capacitor. The next four papers present innovative ideas in inductor-based DC-DC converters including capacitor-assisted hybrid DC-DC converters. This is followed by two high-frequency HPUE-capable envelope-tracking power modulators. An LDO is also presented that achieves good transient response under Hi-Lo-Hi transient stimulus. Finally, the last paper introduces the on-chip resonant-gate-drive SC converter for near-threshold computing.
功率变换器技术部分介绍了开关电容、混合、线性和电感型DC-DC变换器和功率调制器在功率密度、功率效率和功耗方面的改进。第一篇论文讨论了带开关电容的全集成细粒度有理降压变换器。接下来的四篇论文介绍了基于电感的DC-DC变换器的创新思想,包括电容辅助混合DC-DC变换器。接下来是两个高频hpue包络跟踪功率调制器。提出了一种在Hi-Lo-Hi瞬态刺激下具有良好瞬态响应的LDO。最后介绍了用于近阈值计算的片上谐振栅驱动SC变换器。
{"title":"Session 27 overview: Power-converter techniques: Power management subcommittee","authors":"M. Takamiya, Yen Hsun Hsu, A. Thomsen","doi":"10.1109/ISSCC.2018.8310363","DOIUrl":"https://doi.org/10.1109/ISSCC.2018.8310363","url":null,"abstract":"The session on Power Converter Techniques presents improvements of power density, power efficiency and power dissipation in switched-capacitor, hybrid, linear and inductor-based DC-DC converters and power modulators. The first paper addresses the fully integrated fine-grained rational buck-boost converter with switched capacitor. The next four papers present innovative ideas in inductor-based DC-DC converters including capacitor-assisted hybrid DC-DC converters. This is followed by two high-frequency HPUE-capable envelope-tracking power modulators. An LDO is also presented that achieves good transient response under Hi-Lo-Hi transient stimulus. Finally, the last paper introduces the on-chip resonant-gate-drive SC converter for near-threshold computing.","PeriodicalId":6511,"journal":{"name":"2016 IEEE International Solid-State Circuits Conference (ISSCC)","volume":"11 1","pages":"420-421"},"PeriodicalIF":0.0,"publicationDate":"2018-02-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"87069330","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Session 25 overview: Clock generation for high-speed links: Wireline subcommittee 第25次会议概述:高速链路时钟生成:有线小组委员会
Pub Date : 2018-02-01 DOI: 10.1109/ISSCC.2018.8310347
R. Nonis, P. Hanumolu, F. O’Mahony
Clock generation circuits are ubiquitous building blocks in all electronic systems and are the fundamental performance limiters in many of them. This session covers the latest advances in clock generation for high-speed links. The first paper addresses a precision quadrature generator in the latest CMOS process, making use of injection-locking techniques. The second paper presents a technique for generating high-frequency reference clocks by quadrupling the frequency of commonly used, low-cost, crystal oscillators. The third paper demonstrates a fractional PLL that uses reference clock dithering and calibrated dither cancellation in the feedback loop to effectively attenuate fractional spurs. And the final paper describes a digital ring PLL that uses a fast phase correction method and proportional pulse calibration to reduce jitter.
时钟产生电路是所有电子系统中普遍存在的组成部分,也是许多电子系统的基本性能限制因素。本次会议涵盖了高速链路时钟生成的最新进展。第一篇论文在最新的CMOS工艺中利用注入锁定技术解决了精密正交发生器。第二篇论文提出了一种通过将常用的低成本晶体振荡器的频率提高四倍来产生高频参考时钟的技术。第三篇论文演示了一个分数阶锁相环,它在反馈回路中使用参考时钟抖动和校准抖动抵消来有效地衰减分数阶杂散。最后介绍了一种采用快速相位校正方法和比例脉冲校准来减少抖动的数字环锁相环。
{"title":"Session 25 overview: Clock generation for high-speed links: Wireline subcommittee","authors":"R. Nonis, P. Hanumolu, F. O’Mahony","doi":"10.1109/ISSCC.2018.8310347","DOIUrl":"https://doi.org/10.1109/ISSCC.2018.8310347","url":null,"abstract":"Clock generation circuits are ubiquitous building blocks in all electronic systems and are the fundamental performance limiters in many of them. This session covers the latest advances in clock generation for high-speed links. The first paper addresses a precision quadrature generator in the latest CMOS process, making use of injection-locking techniques. The second paper presents a technique for generating high-frequency reference clocks by quadrupling the frequency of commonly used, low-cost, crystal oscillators. The third paper demonstrates a fractional PLL that uses reference clock dithering and calibrated dither cancellation in the feedback loop to effectively attenuate fractional spurs. And the final paper describes a digital ring PLL that uses a fast phase correction method and proportional pulse calibration to reduce jitter.","PeriodicalId":6511,"journal":{"name":"2016 IEEE International Solid-State Circuits Conference (ISSCC)","volume":"90 1","pages":"388-389"},"PeriodicalIF":0.0,"publicationDate":"2018-02-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"91029493","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Session 22 overview: Gigahertz data converters: Data converter subcommittee 第22部分概述:千兆赫数据转换器:数据转换器小组委员会
Pub Date : 2018-02-01 DOI: 10.1109/ISSCC.2018.8310331
K. Doris, Jan J. Westra, U. Moon
Extensive calibrations, the use of FinFET technology and architectural innovations continue to push the bandwidth and dynamic range envelopes of high-speed data converters. This session covers gigahertz data converters with resolutions from 8b up to 16b and sampling rates up to 72GS/s.
广泛的校准,FinFET技术的使用和架构创新继续推动高速数据转换器的带宽和动态范围。本次会议将介绍分辨率从8b到16b的千兆赫数据转换器,采样率高达72GS/s。
{"title":"Session 22 overview: Gigahertz data converters: Data converter subcommittee","authors":"K. Doris, Jan J. Westra, U. Moon","doi":"10.1109/ISSCC.2018.8310331","DOIUrl":"https://doi.org/10.1109/ISSCC.2018.8310331","url":null,"abstract":"Extensive calibrations, the use of FinFET technology and architectural innovations continue to push the bandwidth and dynamic range envelopes of high-speed data converters. This session covers gigahertz data converters with resolutions from 8b up to 16b and sampling rates up to 72GS/s.","PeriodicalId":6511,"journal":{"name":"2016 IEEE International Solid-State Circuits Conference (ISSCC)","volume":"82 1","pages":"356-357"},"PeriodicalIF":0.0,"publicationDate":"2018-02-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"84347416","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Session 9 overview: Wireless transceivers and techniques: Wireless subcommittee 第9部分概述:无线收发器和技术:无线小组委员会
Pub Date : 2018-02-01 DOI: 10.1109/ISSCC.2018.8310231
A. Wong, Xin He, S. Pellerano
Wireless technologies continue to penetrate and support a wide range of application areas. This session includes state-of-the-art wireless transceivers for car radar, synthetic-aperture imaging radar, RF-to-bits cellular base stations, and 60GHz dual polarization MIMO. Furthermore, wireless techniques to enhance performance are presented, including a full duplex self-interference-cancellation FDD transceiver, an automatic tracking 3flo suppression notch filter technique for LTE HPUE and a high-efficiency outphasing PA using a triaxial balun combiner.
无线技术不断渗透并支持广泛的应用领域。本次会议包括用于汽车雷达、合成孔径成像雷达、射频到比特蜂窝基站和60GHz双极化MIMO的最先进无线收发器。此外,还介绍了提高性能的无线技术,包括全双工自干扰消除FDD收发器,用于LTE HPUE的自动跟踪3flo抑制陷波滤波器技术以及使用三轴平衡合成器的高效失相PA。
{"title":"Session 9 overview: Wireless transceivers and techniques: Wireless subcommittee","authors":"A. Wong, Xin He, S. Pellerano","doi":"10.1109/ISSCC.2018.8310231","DOIUrl":"https://doi.org/10.1109/ISSCC.2018.8310231","url":null,"abstract":"Wireless technologies continue to penetrate and support a wide range of application areas. This session includes state-of-the-art wireless transceivers for car radar, synthetic-aperture imaging radar, RF-to-bits cellular base stations, and 60GHz dual polarization MIMO. Furthermore, wireless techniques to enhance performance are presented, including a full duplex self-interference-cancellation FDD transceiver, an automatic tracking 3flo suppression notch filter technique for LTE HPUE and a high-efficiency outphasing PA using a triaxial balun combiner.","PeriodicalId":6511,"journal":{"name":"2016 IEEE International Solid-State Circuits Conference (ISSCC)","volume":"9 1","pages":"156-157"},"PeriodicalIF":0.0,"publicationDate":"2018-02-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"81514723","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Session 21 overview: Extending silicon and its applications: Technology directions subcommittee 第21场概述:扩展硅及其应用:技术方向小组委员会
Pub Date : 2018-02-01 DOI: 10.1109/ISSCC.2018.8310324
Jan Genoe, F. Gianesello, M. Nagata
This session includes six papers from the Technology Directions subcommittee at ISSCC 2018. The first two papers present advances in mixed signal processing for machine learning, the third paper describe a 32GHz mechanical resonator achieved for the first time in 14nm FinFET technology, the fourth paper reviews a 10Gb/s Si Photonics transceiver targeting 1Tb/s/mm2 die-to-die communication, the fifth paper describes an innovative sensor to detect laser fault injection attack on a cryptographic core in order to avoid any information exposure and the final paper presents an injection-locked VCO array targeting ESR application.
本次会议包括来自ISSCC 2018技术方向小组委员会的六篇论文。前两篇论文介绍了用于机器学习的混合信号处理的进展,第三篇论文描述了在14nm FinFET技术中首次实现的32GHz机械谐振器,第四篇论文回顾了10Gb/s Si Photonics收发器,目标是1Tb/s/mm2 die-to-die通信。第五篇论文描述了一种创新的传感器,用于检测加密核心上的激光故障注入攻击,以避免任何信息泄露;最后一篇论文提出了一种针对ESR应用的注入锁定VCO阵列。
{"title":"Session 21 overview: Extending silicon and its applications: Technology directions subcommittee","authors":"Jan Genoe, F. Gianesello, M. Nagata","doi":"10.1109/ISSCC.2018.8310324","DOIUrl":"https://doi.org/10.1109/ISSCC.2018.8310324","url":null,"abstract":"This session includes six papers from the Technology Directions subcommittee at ISSCC 2018. The first two papers present advances in mixed signal processing for machine learning, the third paper describe a 32GHz mechanical resonator achieved for the first time in 14nm FinFET technology, the fourth paper reviews a 10Gb/s Si Photonics transceiver targeting 1Tb/s/mm2 die-to-die communication, the fifth paper describes an innovative sensor to detect laser fault injection attack on a cryptographic core in order to avoid any information exposure and the final paper presents an injection-locked VCO array targeting ESR application.","PeriodicalId":6511,"journal":{"name":"2016 IEEE International Solid-State Circuits Conference (ISSCC)","volume":"15 1","pages":"342-343"},"PeriodicalIF":0.0,"publicationDate":"2018-02-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"74173076","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
期刊
2016 IEEE International Solid-State Circuits Conference (ISSCC)
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