Pub Date : 2024-02-25DOI: 10.1177/25165984241228083
Abhishek Sharma, Vishal S. Sharma, Shaman Gupta, Rakesh Chandmal Sharma, S. Palli, Neeraj Sharma
Nowadays, the COVID-19 pandemic spreads all over the world. Every community is helping in the pandemic situation. All communities, like material scientists, medical practitioners, engineers, and healthcare professionals, are collaborating with each other to fight against the pandemic situation. Therefore, manufacturing engineers also play a role in COVID-19. There are a number of medical devices or protection equipment that can be developed by additive manufacturing (AM) to fulfill the shortage of supply. In the present research, an attempt has been made to review the different medical components developed by AM processes. The government’s regulations for different components (development and testing) are also discussed. The challenges associated with the products developed by AM processes are explained. The safety of the developed products is the prime responsibility of manufacturing engineers. This will definitely give the engineers direction to fight against the pandemic situation.
如今，COVID-19 大流行病已蔓延到世界各地。每个社区都在帮助应对疫情。材料科学家、医生、工程师和医疗保健专业人员等所有群体都在相互协作，共同对抗大流行病。因此，制造工程师在 COVID-19 中也发挥着作用。有许多医疗器械或防护设备可以通过增材制造（AM）来开发，以解决供应短缺的问题。在本研究中，我们尝试回顾了利用增材制造工艺开发的不同医疗组件。还讨论了政府对不同组件（开发和测试）的规定。还解释了与 AM 工艺开发的产品相关的挑战。所开发产品的安全性是制造工程师的首要责任。这必将为工程师提供对抗大流行病的方向。
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This research article presents an atomistic study on the cyclic nanoindentation of an equimolar-ratio Co–Mn–Fe–Cr–Ni high-entropy alloy (HEA) using molecular dynamics simulation. The study investigated the effects of indentation depth on the cyclic load versus the indentation depth of the HEA. The results showed that the cyclic response exhibits a pronounced shift towards plasticity with pile-up formation instead of sinking behavior at higher indentation depths. Within the realm of molecular dynamics simulations, the simulated hardness value reached up to 16 GPa for the initial indentation cycle. A steep drop in the load–displacement curve was observed during the elastic–plastic transition, signifying substantial strain softening of the substrate. It was found that the densely clustered stacking faults undergo a reverse transition during cyclic loading, contributing to the backpropagation phase responsible for elastic recovery despite subsequent strain hardening. The study provides important insights into the underlying mechanisms governing the cyclic mechanical behavior of HEAs to guide their improved micromanufacturing.
本文利用分子动力学模拟对等摩尔比 Co-Mn-Fe-Cr-Ni 高熵合金（HEA）的循环纳米压痕进行了原子研究。研究调查了压痕深度对 HEA 循环载荷与压痕深度的影响。结果表明，在压痕深度较高时，循环响应表现出明显的塑性转变，形成堆积而不是下沉行为。在分子动力学模拟领域，初始压入循环的模拟硬度值高达 16 GPa。在弹性-塑性转换过程中，观察到载荷-位移曲线急剧下降，这表明基底发生了大量应变软化。研究发现，在循环加载过程中，密集成群的堆叠断层会发生反向转变，从而导致反向传播阶段，尽管随后发生了应变硬化，但仍能实现弹性恢复。这项研究为了解 HEA 循环机械行为的基本机制提供了重要启示，从而为改进 HEA 的微制造提供指导。
{"title":"Strain softening observed during nanoindentation of equimolar-ratio Co–Mn– Fe–Cr–Ni high entropy alloy","authors":"Ayush Owhal, Vinod Belwanshi, Tribeni Roy, Saurav Goel","doi":"10.1177/25165984241228094","DOIUrl":"https://doi.org/10.1177/25165984241228094","url":null,"abstract":"This research article presents an atomistic study on the cyclic nanoindentation of an equimolar-ratio Co–Mn–Fe–Cr–Ni high-entropy alloy (HEA) using molecular dynamics simulation. The study investigated the effects of indentation depth on the cyclic load versus the indentation depth of the HEA. The results showed that the cyclic response exhibits a pronounced shift towards plasticity with pile-up formation instead of sinking behavior at higher indentation depths. Within the realm of molecular dynamics simulations, the simulated hardness value reached up to 16 GPa for the initial indentation cycle. A steep drop in the load–displacement curve was observed during the elastic–plastic transition, signifying substantial strain softening of the substrate. It was found that the densely clustered stacking faults undergo a reverse transition during cyclic loading, contributing to the backpropagation phase responsible for elastic recovery despite subsequent strain hardening. The study provides important insights into the underlying mechanisms governing the cyclic mechanical behavior of HEAs to guide their improved micromanufacturing.","PeriodicalId":129806,"journal":{"name":"Journal of Micromanufacturing","volume":"29 9","pages":""},"PeriodicalIF":0.0,"publicationDate":"2024-02-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"140437268","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2024-02-22DOI: 10.1177/25165984241228087
D. Patil
Apart from transmission through the respiratory droplet, the surface contact route is another major mode of viral transmission. The recent pandemic is neither the first nor the last; hence, it is a big challenge for a surface engineer to combat the transmission of microbes and viruses through the contact route. In this topical review, we have comprehensively summarized the possible techniques of surface modification for making surfaces antiviral and the respective antiviral mechanisms. Will the anti-biofouling, superhydrophobic, structured surfaces be enough to roll down viruses with water droplets? If so, there could be critical dimensions of nanostructures that need to be fabricated using a precise micro-nano manufacturing method, and the same has been discussed in this review. The surface structuring using functional nanomaterials (copper and copper alloy, gold nanoparticles, silver nanoparticles, titanium dioxide, zinc dioxide, etc.) against different types of viruses and viruses belonging to the coronavirus family has been compared in detail with their merits and demerits. Finally, we foresee that among these surface modification techniques, the nanospike structures combined with an antiviral coating could be the most effective way to combat the transmission of viruses (e.g., COVID-19) through the contact route.
{"title":"Surface modification using nanostructures and nanocoating to combat the spread of bacteria and viruses: Recent development\u2028and challenges","authors":"D. Patil","doi":"10.1177/25165984241228087","DOIUrl":"https://doi.org/10.1177/25165984241228087","url":null,"abstract":"Apart from transmission through the respiratory droplet, the surface contact route is another major mode of viral transmission. The recent pandemic is neither the first nor the last; hence, it is a big challenge for a surface engineer to combat the transmission of microbes and viruses through the contact route. In this topical review, we have comprehensively summarized the possible techniques of surface modification for making surfaces antiviral and the respective antiviral mechanisms. Will the anti-biofouling, superhydrophobic, structured surfaces be enough to roll down viruses with water droplets? If so, there could be critical dimensions of nanostructures that need to be fabricated using a precise micro-nano manufacturing method, and the same has been discussed in this review. The surface structuring using functional nanomaterials (copper and copper alloy, gold nanoparticles, silver nanoparticles, titanium dioxide, zinc dioxide, etc.) against different types of viruses and viruses belonging to the coronavirus family has been compared in detail with their merits and demerits. Finally, we foresee that among these surface modification techniques, the nanospike structures combined with an antiviral coating could be the most effective way to combat the transmission of viruses (e.g., COVID-19) through the contact route.","PeriodicalId":129806,"journal":{"name":"Journal of Micromanufacturing","volume":"54 1","pages":""},"PeriodicalIF":0.0,"publicationDate":"2024-02-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"140439448","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2024-02-12DOI: 10.1177/25165984241228414
Debashish Gogoi, Amit Kumar, Sangjukta Devi, Manjesh Kumar, Anuj Sharma
Additive manufacturing (AM) is an emerging technology that has significant geometric and material capabilities, because of which it is being used in different fields such as aerospace, healthcare, automotive, architecture, and construction. This process takes the digital data for the three-dimensional model to be made and adds materials accordingly in a layer-by-layer manner. Therefore, the understanding of materials at the atomic level may help in getting optimized output in the AM process, and it can have a significant impact on the final products. Molecular dynamics (MD) studies the dynamic behavior of molecules and materials at the atomic and molecular scales. The main objective of this review article is to briefly discuss how MD simulations may be utilized to examine AM processes. This review also covers the potential benefits of using MD to characterize AM processes, the current literature on using MD to simulate AM processes, the primary obstacles and limitations of MD simulations, and the methodologies utilized in AM simulations using MD. Finally, this article concludes with an in-depth discussion and outlines future research potentials.
快速成型制造（AM）是一项新兴技术，具有强大的几何和材料能力，因此被广泛应用于航空航天、医疗保健、汽车、建筑和建造等不同领域。该工艺采用数字化数据制作三维模型，并逐层添加相应的材料。因此，从原子层面了解材料有助于在 AM 过程中获得最佳产出，并对最终产品产生重大影响。分子动力学（MD）研究分子和材料在原子和分子尺度上的动态行为。本综述文章的主要目的是简要讨论如何利用 MD 模拟来检查 AM 工艺。这篇综述文章还涵盖了使用 MD 表征 AM 过程的潜在好处、使用 MD 模拟 AM 过程的现有文献、MD 模拟的主要障碍和限制，以及使用 MD 模拟 AM 的方法。最后，本文进行了深入讨论，并概述了未来的研究潜力。
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Pub Date : 2024-02-12DOI: 10.1177/25165984241228414
Debashish Gogoi, Amit Kumar, Sangjukta Devi, Manjesh Kumar, Anuj Sharma
Additive manufacturing (AM) is an emerging technology that has significant geometric and material capabilities, because of which it is being used in different fields such as aerospace, healthcare, automotive, architecture, and construction. This process takes the digital data for the three-dimensional model to be made and adds materials accordingly in a layer-by-layer manner. Therefore, the understanding of materials at the atomic level may help in getting optimized output in the AM process, and it can have a significant impact on the final products. Molecular dynamics (MD) studies the dynamic behavior of molecules and materials at the atomic and molecular scales. The main objective of this review article is to briefly discuss how MD simulations may be utilized to examine AM processes. This review also covers the potential benefits of using MD to characterize AM processes, the current literature on using MD to simulate AM processes, the primary obstacles and limitations of MD simulations, and the methodologies utilized in AM simulations using MD. Finally, this article concludes with an in-depth discussion and outlines future research potentials.
快速成型制造（AM）是一项新兴技术，具有强大的几何和材料能力，因此被广泛应用于航空航天、医疗保健、汽车、建筑和建造等不同领域。该工艺采用数字化数据制作三维模型，并逐层添加相应的材料。因此，从原子层面了解材料有助于在 AM 过程中获得最佳产出，并对最终产品产生重大影响。分子动力学（MD）研究分子和材料在原子和分子尺度上的动态行为。本综述文章的主要目的是简要讨论如何利用 MD 模拟来检查 AM 工艺。这篇综述文章还涵盖了使用 MD 表征 AM 过程的潜在好处、使用 MD 模拟 AM 过程的现有文献、MD 模拟的主要障碍和限制，以及使用 MD 模拟 AM 的方法。最后，本文进行了深入讨论，并概述了未来的研究潜力。
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Pub Date : 2024-02-07DOI: 10.1177/25165984231215886
Prasenjit Sharma, S. Purushothaman, Meenu Sachdeva, M. S. Srinivas, N. Venkaiah, J. Ramkumar, Mamilla Ravi Shankar
The unique material properties of Nitinol have led to its extensive use in the biomedical field and microdevices. However, the machining of Nitinol remains a challenge due to its exceptional mechanical properties. This led to the use of a non-conventional machining process, of which laser machining proved to be most suitable and promising due to its versatility. To understand the process, the sample was irradiated by a laser beam over a straight line. An analytical model attempts to understand the process and predict the minimum process parameters necessary to conduct the machining process. The results are compared experimentally, wherein the influence of laser power and scan speed over the surface morphology, hardness, and groove dimensions are studied in detail. The optimum process signature was 90 W of laser fluence with a 100 mm/s scanning speed.
镍钛诺具有独特的材料特性，因此被广泛应用于生物医学领域和微型设备中。然而，由于镍钛诺具有特殊的机械性能，其加工仍然是一项挑战。这就需要使用非常规加工工艺，其中激光加工因其多功能性而被证明是最合适和最有前途的。为了了解加工过程，我们用激光束对样品进行直线照射。分析模型试图了解加工过程，并预测加工过程所需的最小加工参数。实验结果进行了比较，详细研究了激光功率和扫描速度对表面形态、硬度和沟槽尺寸的影响。最佳加工参数为 90 W 的激光能量和 100 mm/s 的扫描速度。
{"title":"Experimental study and modeling of laser micro texturing of Nitinol","authors":"Prasenjit Sharma, S. Purushothaman, Meenu Sachdeva, M. S. Srinivas, N. Venkaiah, J. Ramkumar, Mamilla Ravi Shankar","doi":"10.1177/25165984231215886","DOIUrl":"https://doi.org/10.1177/25165984231215886","url":null,"abstract":"The unique material properties of Nitinol have led to its extensive use in the biomedical field and microdevices. However, the machining of Nitinol remains a challenge due to its exceptional mechanical properties. This led to the use of a non-conventional machining process, of which laser machining proved to be most suitable and promising due to its versatility. To understand the process, the sample was irradiated by a laser beam over a straight line. An analytical model attempts to understand the process and predict the minimum process parameters necessary to conduct the machining process. The results are compared experimentally, wherein the influence of laser power and scan speed over the surface morphology, hardness, and groove dimensions are studied in detail. The optimum process signature was 90 W of laser fluence with a 100 mm/s scanning speed.","PeriodicalId":129806,"journal":{"name":"Journal of Micromanufacturing","volume":"23 7","pages":""},"PeriodicalIF":0.0,"publicationDate":"2024-02-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"139797253","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2024-02-07DOI: 10.1177/25165984231215886
Prasenjit Sharma, S. Purushothaman, Meenu Sachdeva, M. S. Srinivas, N. Venkaiah, J. Ramkumar, Mamilla Ravi Shankar
The unique material properties of Nitinol have led to its extensive use in the biomedical field and microdevices. However, the machining of Nitinol remains a challenge due to its exceptional mechanical properties. This led to the use of a non-conventional machining process, of which laser machining proved to be most suitable and promising due to its versatility. To understand the process, the sample was irradiated by a laser beam over a straight line. An analytical model attempts to understand the process and predict the minimum process parameters necessary to conduct the machining process. The results are compared experimentally, wherein the influence of laser power and scan speed over the surface morphology, hardness, and groove dimensions are studied in detail. The optimum process signature was 90 W of laser fluence with a 100 mm/s scanning speed.
镍钛诺具有独特的材料特性，因此被广泛应用于生物医学领域和微型设备中。然而，由于镍钛诺具有特殊的机械性能，其加工仍然是一项挑战。这就需要使用非常规加工工艺，其中激光加工因其多功能性而被证明是最合适和最有前途的。为了了解加工过程，我们用激光束对样品进行直线照射。分析模型试图了解加工过程，并预测加工过程所需的最小加工参数。实验结果进行了比较，详细研究了激光功率和扫描速度对表面形态、硬度和沟槽尺寸的影响。最佳加工参数为 90 W 的激光能量和 100 mm/s 的扫描速度。
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Pub Date : 2024-02-07DOI: 10.1177/25165984231218836
Amit Dodmani, Ayush Owhal, Vinod Mishra, Tribeni Roy
With advancements in the semiconductor industry, it is required to have angstrom level surface finish on silicon wafers which is achieved by nano-polishing. However, side burr is formed due to material pile-up from material removal due to abrasive which becomes detrimental to achieving the high surface finish. This study employs molecular dynamics simulations to explore the mechanism underlying side burr formation during nano-polishing of mono-crystalline silicon (Si)-wafer. The study utilizes a diamond nano-abrasive grit to scratch the surface of the Si-wafer and investigates the formation of pile-ups during the steady-state process. It was observed that increasing the depth of cut by four times led to a 6.3-fold increase in the number of amorphous atoms, indicating greater bond breakage in the direction of scratching. As a result, the cutting force exceeds the thrust force at larger depths of the cut. The correlation between the side burr height and the depth of cut is also studied. Results show that the side burr height ratio increases with the depth of cut, indicating a higher sensitivity of side burr height to the depth of cut. The study suggests that to achieve a ductile mode of material removal and minimize the height of the side burr during nano-polishing of Si-wafers, it is crucial to maintain the depth of cut at or below half (≤0.5) of the abrasive radius and ensure an average friction coefficient below 0.6. The outcome of this study can be useful for the actual manufacturing of miniaturized sensors, actuators, and microsystems for microelectromechanical system devices where a high surface finish is crucial.
{"title":"Study of side burr formation in steady-state nano-polishing of Si-wafer using molecular dynamics simulation","authors":"Amit Dodmani, Ayush Owhal, Vinod Mishra, Tribeni Roy","doi":"10.1177/25165984231218836","DOIUrl":"https://doi.org/10.1177/25165984231218836","url":null,"abstract":"With advancements in the semiconductor industry, it is required to have angstrom level surface finish on silicon wafers which is achieved by nano-polishing. However, side burr is formed due to material pile-up from material removal due to abrasive which becomes detrimental to achieving the high surface finish. This study employs molecular dynamics simulations to explore the mechanism underlying side burr formation during nano-polishing of mono-crystalline silicon (Si)-wafer. The study utilizes a diamond nano-abrasive grit to scratch the surface of the Si-wafer and investigates the formation of pile-ups during the steady-state process. It was observed that increasing the depth of cut by four times led to a 6.3-fold increase in the number of amorphous atoms, indicating greater bond breakage in the direction of scratching. As a result, the cutting force exceeds the thrust force at larger depths of the cut. The correlation between the side burr height and the depth of cut is also studied. Results show that the side burr height ratio increases with the depth of cut, indicating a higher sensitivity of side burr height to the depth of cut. The study suggests that to achieve a ductile mode of material removal and minimize the height of the side burr during nano-polishing of Si-wafers, it is crucial to maintain the depth of cut at or below half (≤0.5) of the abrasive radius and ensure an average friction coefficient below 0.6. The outcome of this study can be useful for the actual manufacturing of miniaturized sensors, actuators, and microsystems for microelectromechanical system devices where a high surface finish is crucial.","PeriodicalId":129806,"journal":{"name":"Journal of Micromanufacturing","volume":"63 3-4","pages":""},"PeriodicalIF":0.0,"publicationDate":"2024-02-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"139855428","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2024-02-07DOI: 10.1177/25165984231218836
Amit Dodmani, Ayush Owhal, Vinod Mishra, Tribeni Roy
With advancements in the semiconductor industry, it is required to have angstrom level surface finish on silicon wafers which is achieved by nano-polishing. However, side burr is formed due to material pile-up from material removal due to abrasive which becomes detrimental to achieving the high surface finish. This study employs molecular dynamics simulations to explore the mechanism underlying side burr formation during nano-polishing of mono-crystalline silicon (Si)-wafer. The study utilizes a diamond nano-abrasive grit to scratch the surface of the Si-wafer and investigates the formation of pile-ups during the steady-state process. It was observed that increasing the depth of cut by four times led to a 6.3-fold increase in the number of amorphous atoms, indicating greater bond breakage in the direction of scratching. As a result, the cutting force exceeds the thrust force at larger depths of the cut. The correlation between the side burr height and the depth of cut is also studied. Results show that the side burr height ratio increases with the depth of cut, indicating a higher sensitivity of side burr height to the depth of cut. The study suggests that to achieve a ductile mode of material removal and minimize the height of the side burr during nano-polishing of Si-wafers, it is crucial to maintain the depth of cut at or below half (≤0.5) of the abrasive radius and ensure an average friction coefficient below 0.6. The outcome of this study can be useful for the actual manufacturing of miniaturized sensors, actuators, and microsystems for microelectromechanical system devices where a high surface finish is crucial.
{"title":"Study of side burr formation in steady-state nano-polishing of Si-wafer using molecular dynamics simulation","authors":"Amit Dodmani, Ayush Owhal, Vinod Mishra, Tribeni Roy","doi":"10.1177/25165984231218836","DOIUrl":"https://doi.org/10.1177/25165984231218836","url":null,"abstract":"With advancements in the semiconductor industry, it is required to have angstrom level surface finish on silicon wafers which is achieved by nano-polishing. However, side burr is formed due to material pile-up from material removal due to abrasive which becomes detrimental to achieving the high surface finish. This study employs molecular dynamics simulations to explore the mechanism underlying side burr formation during nano-polishing of mono-crystalline silicon (Si)-wafer. The study utilizes a diamond nano-abrasive grit to scratch the surface of the Si-wafer and investigates the formation of pile-ups during the steady-state process. It was observed that increasing the depth of cut by four times led to a 6.3-fold increase in the number of amorphous atoms, indicating greater bond breakage in the direction of scratching. As a result, the cutting force exceeds the thrust force at larger depths of the cut. The correlation between the side burr height and the depth of cut is also studied. Results show that the side burr height ratio increases with the depth of cut, indicating a higher sensitivity of side burr height to the depth of cut. The study suggests that to achieve a ductile mode of material removal and minimize the height of the side burr during nano-polishing of Si-wafers, it is crucial to maintain the depth of cut at or below half (≤0.5) of the abrasive radius and ensure an average friction coefficient below 0.6. The outcome of this study can be useful for the actual manufacturing of miniaturized sensors, actuators, and microsystems for microelectromechanical system devices where a high surface finish is crucial.","PeriodicalId":129806,"journal":{"name":"Journal of Micromanufacturing","volume":"25 10","pages":""},"PeriodicalIF":0.0,"publicationDate":"2024-02-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"139795676","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2024-02-06DOI: 10.1177/25165984241228088
Neel Kamal Gupta, P. K. Rakesh, Vikas Rastogi, Inderdeep Singh
Additive manufacturing has been a revolution in the last decade and has led to a number of product innovations. Rapid prototyping (RP) has significantly reduced the product development cycle time and RP techniques are now replacing many conventional plastic processing techniques where production volume is not an issue. In order to ascertain the utility of additive manufacturing techniques for the development of fully functional parts, it’s important to establish the optimal set of process parameters for achieving maximum mechanical performance. In the current experimental investigation, the dogbone-shaped parts of acrylonitrile butadiene styrene (ABS) were fabricated by the fused deposition modeling (FDM) process. The process parameters were optimized for dogbone-shaped specimens fabricated by the FDM process. Among the parameters, it has been found that orientation and infill density are the most dominant factors affecting the tensile strength of FDM parts printed with ABS material.
{"title":"Process parametric optimization of fused deposition modeling for manufacturing of acrylonitrile butadiene styrene parts","authors":"Neel Kamal Gupta, P. K. Rakesh, Vikas Rastogi, Inderdeep Singh","doi":"10.1177/25165984241228088","DOIUrl":"https://doi.org/10.1177/25165984241228088","url":null,"abstract":"Additive manufacturing has been a revolution in the last decade and has led to a number of product innovations. Rapid prototyping (RP) has significantly reduced the product development cycle time and RP techniques are now replacing many conventional plastic processing techniques where production volume is not an issue. In order to ascertain the utility of additive manufacturing techniques for the development of fully functional parts, it’s important to establish the optimal set of process parameters for achieving maximum mechanical performance. In the current experimental investigation, the dogbone-shaped parts of acrylonitrile butadiene styrene (ABS) were fabricated by the fused deposition modeling (FDM) process. The process parameters were optimized for dogbone-shaped specimens fabricated by the FDM process. Among the parameters, it has been found that orientation and infill density are the most dominant factors affecting the tensile strength of FDM parts printed with ABS material.","PeriodicalId":129806,"journal":{"name":"Journal of Micromanufacturing","volume":"94 1","pages":""},"PeriodicalIF":0.0,"publicationDate":"2024-02-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"139861645","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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