Pub Date : 2020-05-01DOI: 10.1177/2516598419880124
M. Datta
Abstract Electronic packaging is the methodology for connecting and interfacing the chip technology with a system and the physical world. The objective of packaging is to ensure that the devices and interconnections are packaged efficiently and reliably. Chip–package interconnection technologies currently used in the semiconductor industry include wire bonding, tape automated bonding and flip-chip solder bump connection. Among these interconnection techniques, the flip-chip bumping technology is commonly used in advanced electronic packages since this interconnection is an area array configuration so that the entire surface of the chip can be covered with bumps for the highest possible input/output (I/O) counts. The present article reviews the manufacturing processes for the fabrication of flip-chip bumps for chip–package interconnection. Various solder bumping technologies used in high-volume production include evaporation, solder paste screening and electroplating. Evaporation process produces highly reliable bumps, but it is extremely expensive and is limited to lead or lead-rich solders. Solder paste screening is cost-effective, but issues related to excessive void formation limits the process to low-end products. On the other hand, electrochemical fabrication of flip-chip bumps is an extremely selective and efficient process, which is extendible to finer pitch, larger wafers and a variety of solder compositions, including lead-free alloys. Electrochemically fabricated copper pillar bumps offer fine pitch capabilities with excellent electromigration performance. Due to these virtues, the copper pillar bumping technology is emerging as a lead-free bumping technology option for high-performance electronic packaging.
{"title":"Manufacturing processes for fabrication of flip-chip micro-bumps used in microelectronic packaging: An overview","authors":"M. Datta","doi":"10.1177/2516598419880124","DOIUrl":"https://doi.org/10.1177/2516598419880124","url":null,"abstract":"Abstract Electronic packaging is the methodology for connecting and interfacing the chip technology with a system and the physical world. The objective of packaging is to ensure that the devices and interconnections are packaged efficiently and reliably. Chip–package interconnection technologies currently used in the semiconductor industry include wire bonding, tape automated bonding and flip-chip solder bump connection. Among these interconnection techniques, the flip-chip bumping technology is commonly used in advanced electronic packages since this interconnection is an area array configuration so that the entire surface of the chip can be covered with bumps for the highest possible input/output (I/O) counts. The present article reviews the manufacturing processes for the fabrication of flip-chip bumps for chip–package interconnection. Various solder bumping technologies used in high-volume production include evaporation, solder paste screening and electroplating. Evaporation process produces highly reliable bumps, but it is extremely expensive and is limited to lead or lead-rich solders. Solder paste screening is cost-effective, but issues related to excessive void formation limits the process to low-end products. On the other hand, electrochemical fabrication of flip-chip bumps is an extremely selective and efficient process, which is extendible to finer pitch, larger wafers and a variety of solder compositions, including lead-free alloys. Electrochemically fabricated copper pillar bumps offer fine pitch capabilities with excellent electromigration performance. Due to these virtues, the copper pillar bumping technology is emerging as a lead-free bumping technology option for high-performance electronic packaging.","PeriodicalId":129806,"journal":{"name":"Journal of Micromanufacturing","volume":"14 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130263694","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2020-03-25DOI: 10.1177/2516598419896130
J. Bao, N. Hashemi, Jingshuai Guo, Nicole N. Hashemi
Abstract Humidity sensors can be used to monitor body sweat. Here, we studied a humidity sensor that comprised of a graphene layer between two electrodes. The operating principle is that the humidity sensor will respond when vapor reaches the graphene layer from the top. Based on the humidity diffusion, the sensor measures the relative humidity (RH) with different response times. Graphene is a material with high diffusivity and small thickness that can increase the sensitivity of a sensor. Based on the micro electro mechanical systems (MEMS) method, we modeled the humidity sensor using COMSOL Multiphysics® transport of diluted species software. Additionally, we used the concentration values from the simulations to determine the relationship between capacitance and relative humidity. The sensitivity was found to be 3.379 × 10−11 pF/%RH for the 4-layer graphene, 1.210 × 10−14 pF/%RH for the 8-layer graphene, and 3.597 × 10−11 pF/%RH for the 16-layer graphene sensor. The sensitivity of 4-layer graphene with gold sensor is 3.872 × 10−13 pF/%RH which is smaller than 4-layer graphene sensor, and graphene with gold nanoparticles shows better response time than 4-layer graphene sensor.
{"title":"Effects of graphene layer and gold nanoparticles on sensitivity of humidity sensors","authors":"J. Bao, N. Hashemi, Jingshuai Guo, Nicole N. Hashemi","doi":"10.1177/2516598419896130","DOIUrl":"https://doi.org/10.1177/2516598419896130","url":null,"abstract":"Abstract Humidity sensors can be used to monitor body sweat. Here, we studied a humidity sensor that comprised of a graphene layer between two electrodes. The operating principle is that the humidity sensor will respond when vapor reaches the graphene layer from the top. Based on the humidity diffusion, the sensor measures the relative humidity (RH) with different response times. Graphene is a material with high diffusivity and small thickness that can increase the sensitivity of a sensor. Based on the micro electro mechanical systems (MEMS) method, we modeled the humidity sensor using COMSOL Multiphysics® transport of diluted species software. Additionally, we used the concentration values from the simulations to determine the relationship between capacitance and relative humidity. The sensitivity was found to be 3.379 × 10−11 pF/%RH for the 4-layer graphene, 1.210 × 10−14 pF/%RH for the 8-layer graphene, and 3.597 × 10−11 pF/%RH for the 16-layer graphene sensor. The sensitivity of 4-layer graphene with gold sensor is 3.872 × 10−13 pF/%RH which is smaller than 4-layer graphene sensor, and graphene with gold nanoparticles shows better response time than 4-layer graphene sensor.","PeriodicalId":129806,"journal":{"name":"Journal of Micromanufacturing","volume":"117 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-03-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115653710","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2020-03-17DOI: 10.1177/2516598419896127
Rahul Seth, Saurav Halder, K. Chatterjee, S. Mandal, Nagahanumaiah
Abstract The paper presents design and development of a precision motion actuator, which can traverse required trajectory in the X–Y plane and can be used for micromachining applications using magnetic levitation based technology. A glass-reinforced epoxy laminate sheet with micromachined holes in the horizontal and vertical direction with copper wires placed vertically and horizontally was used for actuation of rare earth magnets wherein a pyrolytic graphite sheet was fixed over the copper wires. The diamagnetism of pyrolytic graphite sheet coupled with electromagnetic field generated because of the current passing through the copper wires led to levitation and actuation of the rare earth magnet over desired trajectory. COMSOL Multiphysics (COMSOL Inc., Burlington, Massachusetts, USA) simulation was conducted in order to simulate the forces generated by the developed actuator. Thereafter, the forces generated by the actuator with current flowing through the wires were measured using a dynamometer where the error was limited within 2%. An acrylic sheet was fixed over the actuator and laser micromachining was conducted with trajectories traversed by the actuator. Scanning electron microscope results of the machined samples confirmed that feature sizes in the range of 200–300 micron could be generated. This proves the potential of the developed actuator for micromachining applications.
{"title":"Magnetically levitated X–Y plane actuator for micromanufacturing","authors":"Rahul Seth, Saurav Halder, K. Chatterjee, S. Mandal, Nagahanumaiah","doi":"10.1177/2516598419896127","DOIUrl":"https://doi.org/10.1177/2516598419896127","url":null,"abstract":"Abstract The paper presents design and development of a precision motion actuator, which can traverse required trajectory in the X–Y plane and can be used for micromachining applications using magnetic levitation based technology. A glass-reinforced epoxy laminate sheet with micromachined holes in the horizontal and vertical direction with copper wires placed vertically and horizontally was used for actuation of rare earth magnets wherein a pyrolytic graphite sheet was fixed over the copper wires. The diamagnetism of pyrolytic graphite sheet coupled with electromagnetic field generated because of the current passing through the copper wires led to levitation and actuation of the rare earth magnet over desired trajectory. COMSOL Multiphysics (COMSOL Inc., Burlington, Massachusetts, USA) simulation was conducted in order to simulate the forces generated by the developed actuator. Thereafter, the forces generated by the actuator with current flowing through the wires were measured using a dynamometer where the error was limited within 2%. An acrylic sheet was fixed over the actuator and laser micromachining was conducted with trajectories traversed by the actuator. Scanning electron microscope results of the machined samples confirmed that feature sizes in the range of 200–300 micron could be generated. This proves the potential of the developed actuator for micromachining applications.","PeriodicalId":129806,"journal":{"name":"Journal of Micromanufacturing","volume":"85 14","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-03-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"113970418","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2020-03-17DOI: 10.1177/2516598419895837
R. Nadda, M. Babal, Nikhil Jalan, C. K. Nirala
Abstract The present work examines microhardness, tensile strength, and microstructure in microfriction stir welding (µ-FSW) of 0.5 mm thick AA 6061-T6 sheets. The capability of in-house developed work fixture and welding tools to attain nondamaged and continuous welds has been verified through multiple runs at different tool traverse speeds. On examination, it was found that by using the proposed work fixture, weld strength reached up to 57% as that of the base metal when performed at tool traversing speed of 150 mm min–1. The dynamic recrystallization during µ-FSW may lead to the formation of equiaxed grains in stir region and transition zone. The microstructure showed that the thermomechanically affected zone reduced with tool traversing speed.
本文研究了0.5 mm厚AA 6061-T6薄板的显微硬度、抗拉强度和显微组织。内部开发的工作夹具和焊接工具能够在不同的工具横移速度下进行多次运行，以实现无损伤和连续焊接。在检查中，发现通过使用所提出的工作夹具，当工具移动速度为150 mm min-1时，焊缝强度达到母材强度的57%。微搅拌搅拌过程中的动态再结晶可导致搅拌区和过渡区等轴晶的形成。显微组织表明，随刀具移动速度的增加，热机械影响区减小。
{"title":"Microfriction stir welding of AA 6061-T6 thin sheets using in-house developed fixture","authors":"R. Nadda, M. Babal, Nikhil Jalan, C. K. Nirala","doi":"10.1177/2516598419895837","DOIUrl":"https://doi.org/10.1177/2516598419895837","url":null,"abstract":"Abstract The present work examines microhardness, tensile strength, and microstructure in microfriction stir welding (µ-FSW) of 0.5 mm thick AA 6061-T6 sheets. The capability of in-house developed work fixture and welding tools to attain nondamaged and continuous welds has been verified through multiple runs at different tool traverse speeds. On examination, it was found that by using the proposed work fixture, weld strength reached up to 57% as that of the base metal when performed at tool traversing speed of 150 mm min–1. The dynamic recrystallization during µ-FSW may lead to the formation of equiaxed grains in stir region and transition zone. The microstructure showed that the thermomechanically affected zone reduced with tool traversing speed.","PeriodicalId":129806,"journal":{"name":"Journal of Micromanufacturing","volume":"15 Suppl 1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-03-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132877031","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2020-03-17DOI: 10.1177/2516598419895828
V. Jain, R. Balasubramaniam, R. Mote, M. Das, Anuj Sharma, Abhinav Kumar, Vivek Garg, B. Kamaliya
This article gives classification of micromanufacturing in general and micromachining processes in particular. For different micromachining processes, one can have different kinds of operations through which different features, shapes, accuracy, precision, and dimensions can be achieved. This article as Part I reports an overview of only three processes as diamond turn machining (a class of traditional micromachining processes), electrochemical micromachining, and focused-ion-beam micromachining (a class of advanced micromachining processes). About all these three processes, a brief introduction to the mechanisms of material removal is reported followed by the new developments in each process which are discussed independently. In various sections, some areas where research work needs to be done are identified and very briefly discussed.
{"title":"Micromachining: An overview (Part I)","authors":"V. Jain, R. Balasubramaniam, R. Mote, M. Das, Anuj Sharma, Abhinav Kumar, Vivek Garg, B. Kamaliya","doi":"10.1177/2516598419895828","DOIUrl":"https://doi.org/10.1177/2516598419895828","url":null,"abstract":"This article gives classification of micromanufacturing in general and micromachining processes in particular. For different micromachining processes, one can have different kinds of operations through which different features, shapes, accuracy, precision, and dimensions can be achieved. This article as Part I reports an overview of only three processes as diamond turn machining (a class of traditional micromachining processes), electrochemical micromachining, and focused-ion-beam micromachining (a class of advanced micromachining processes). About all these three processes, a brief introduction to the mechanisms of material removal is reported followed by the new developments in each process which are discussed independently. In various sections, some areas where research work needs to be done are identified and very briefly discussed.","PeriodicalId":129806,"journal":{"name":"Journal of Micromanufacturing","volume":"32 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-03-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125637610","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2020-01-21DOI: 10.1177/2516598419876158
A. Roushan, U. S. Rao, L. Vijayaraghavan
Abstract Mechanical micro-machining, in general, and micro-end-milling, in particular, has become a very good technique for fabricating 3D micro-features in a variety of materials. To optimize and control the process, prediction of the cutting force accurately is very important. In this work, a force prediction model is developed by a combination of analytical method and finite element (FE) simulations. The model predicts the cutting force components for micro-end-milling process successfully which is compared with experimental force signal obtained by using Al2024-T3 and AISI 4340 as workpiece materials. The predicted and experimental cutting forces are in very good agreement for both the amplitude and trend of the cutting force. The percentage deviation of the predicted force from the experimental force values for both feed force (Fx) and transverse force (Fy) is around 15% (except one case) for Al2024-T3. For the AISI 4340 material, the percentage deviation for Fx is around 25% and for Fy is approximately 10%. The methodology followed here is general in nature and it can be applied to any other machining process as well.
{"title":"Prediction of cutting force in micro-end-milling by a combination of analytical and FEM method","authors":"A. Roushan, U. S. Rao, L. Vijayaraghavan","doi":"10.1177/2516598419876158","DOIUrl":"https://doi.org/10.1177/2516598419876158","url":null,"abstract":"Abstract Mechanical micro-machining, in general, and micro-end-milling, in particular, has become a very good technique for fabricating 3D micro-features in a variety of materials. To optimize and control the process, prediction of the cutting force accurately is very important. In this work, a force prediction model is developed by a combination of analytical method and finite element (FE) simulations. The model predicts the cutting force components for micro-end-milling process successfully which is compared with experimental force signal obtained by using Al2024-T3 and AISI 4340 as workpiece materials. The predicted and experimental cutting forces are in very good agreement for both the amplitude and trend of the cutting force. The percentage deviation of the predicted force from the experimental force values for both feed force (Fx) and transverse force (Fy) is around 15% (except one case) for Al2024-T3. For the AISI 4340 material, the percentage deviation for Fx is around 25% and for Fy is approximately 10%. The methodology followed here is general in nature and it can be applied to any other machining process as well.","PeriodicalId":129806,"journal":{"name":"Journal of Micromanufacturing","volume":"38 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-01-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114951517","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2019-08-26DOI: 10.1177/2516598419855186
A. Kundu, D. K. Pratihar, A. Pal
Abstract Electron beam welding (EBW) is a well-established joining method in the field of manufacturing. If this technology is downscaled to a micro-level (i.e., micro-EBW (µ-EBW)), it will be able to solve a variety of problems. The necessity of adopting µ-EBW technology lies with the fact that it can be used from micro-mechanical fabrication to micro-electronics components joining, micro-electro-mechanical system (MEMS), medical instrument, etc. µ-EBW has some special properties like the possibility of obtaining exact focussing of the beam and conducting measurement up to micrometer level, accurate control of energy input, inertia-free manipulation, high-frequency oscillation movement and ability to work under high vacuum chamber. µ-EBW has several important applications like micro-joining and micro-fabrication, which is welding of dissimilar materials. This article deals with a review of the recent developments, significant applications, and advantages of µ-EBW, multiple modes of joining and also some new technologies such as scanning electron microscope, function generator, control software, etc. Finally, the current challenges of this emerging technology and the scopes for future studies have been presented in this article.
{"title":"A review on micro-electron beam welding with a modernized SEM: Process, applications, trends and future prospect","authors":"A. Kundu, D. K. Pratihar, A. Pal","doi":"10.1177/2516598419855186","DOIUrl":"https://doi.org/10.1177/2516598419855186","url":null,"abstract":"Abstract Electron beam welding (EBW) is a well-established joining method in the field of manufacturing. If this technology is downscaled to a micro-level (i.e., micro-EBW (µ-EBW)), it will be able to solve a variety of problems. The necessity of adopting µ-EBW technology lies with the fact that it can be used from micro-mechanical fabrication to micro-electronics components joining, micro-electro-mechanical system (MEMS), medical instrument, etc. µ-EBW has some special properties like the possibility of obtaining exact focussing of the beam and conducting measurement up to micrometer level, accurate control of energy input, inertia-free manipulation, high-frequency oscillation movement and ability to work under high vacuum chamber. µ-EBW has several important applications like micro-joining and micro-fabrication, which is welding of dissimilar materials. This article deals with a review of the recent developments, significant applications, and advantages of µ-EBW, multiple modes of joining and also some new technologies such as scanning electron microscope, function generator, control software, etc. Finally, the current challenges of this emerging technology and the scopes for future studies have been presented in this article.","PeriodicalId":129806,"journal":{"name":"Journal of Micromanufacturing","volume":"17 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-08-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132226335","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2019-08-06DOI: 10.1177/2516598419852208
K. Prashanth, D. Patel, V. Jain, J. Ramkumar
Abstract Electrochemical surface texturing is a complex process consisting of two-phase fluid dynamics, unsteady state heat transfer, mass transfer, electrochemistry, etc., between moving boundaries. There are no anode shape prediction models for surface texturing because of the complications involved in the process. The models available for electrochemical micromachining (ECMM) are incomplete because most of them ignore the influence of sludge and gas bubbles produced during the electrochemical dissolution. In this article, a modified anode shape prediction model considering the evolution of heat, sludge and H2 bubbles have been proposed for ECMM of micro-dimples. Comparison of simulated and experimental anode profiles reveals a satisfactory agreement between the two. In addition, a comparison has been made between the proposed model and the models, which do not consider the effect of generation of sludge and gas bubbles on the conductivity of the electrolyte.
{"title":"Numerical modelling of ECMM of micro-dimples considering the effect of 3-phase electrolyte","authors":"K. Prashanth, D. Patel, V. Jain, J. Ramkumar","doi":"10.1177/2516598419852208","DOIUrl":"https://doi.org/10.1177/2516598419852208","url":null,"abstract":"Abstract Electrochemical surface texturing is a complex process consisting of two-phase fluid dynamics, unsteady state heat transfer, mass transfer, electrochemistry, etc., between moving boundaries. There are no anode shape prediction models for surface texturing because of the complications involved in the process. The models available for electrochemical micromachining (ECMM) are incomplete because most of them ignore the influence of sludge and gas bubbles produced during the electrochemical dissolution. In this article, a modified anode shape prediction model considering the evolution of heat, sludge and H2 bubbles have been proposed for ECMM of micro-dimples. Comparison of simulated and experimental anode profiles reveals a satisfactory agreement between the two. In addition, a comparison has been made between the proposed model and the models, which do not consider the effect of generation of sludge and gas bubbles on the conductivity of the electrolyte.","PeriodicalId":129806,"journal":{"name":"Journal of Micromanufacturing","volume":"21 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-08-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124081672","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2019-07-10DOI: 10.1177/2516598419838660
J. Singh, S. Bhattacharya
Abstract Electrochemical micromachining (ECMM) has been mostly carried out in situations demanding precision, complexity in the shapes of final components and in case the surface integrity and performance are independent of the machining process. In this work, the following have been demonstrated: The first part of the work demonstrates the experimental setup for ECMM that is used to fabricate a micro-mixer on a printed circuit board (PCB) substrate by using a single point electrochemical machining tool with a tip diameter—150 µm. The method is able to show a promising route of fabrication where the circuit lines on a PCB substrate can be printed with high yield and processing speeds. The second part of the article points out that machining can be carried out on PCB substrates through electrochemical processes using a single point tool and a minimum feature size of 243 µm can be machined with a fine tolerance of 0.025 µm and roughness = 3.0459 µm~7.2404 µm. The third part of the article reports the geometrical parameters of a relatively complex geometry of a micro-mixer which is arrived at through a COMSOL based simulation platform that is fabricated using the mentioned manufacturing process. The process is further validated through the design of experiments, and fluid flow and mixing behaviour on the fabricated structure is evaluated through an epifluorescence microscope. The advantages that this technique may offer is in terms of achieving an overall low feature size in comparison to micro-milling and avoiding the complexities of lithography-driven processes to produce a process which has a much lower equipment dependency, is environmentally benign in comparison to the lithography driven techniques and is overall low in cost.
{"title":"Fabrication of micro-mixer on printed circuit board using electrochemical micromachining","authors":"J. Singh, S. Bhattacharya","doi":"10.1177/2516598419838660","DOIUrl":"https://doi.org/10.1177/2516598419838660","url":null,"abstract":"Abstract Electrochemical micromachining (ECMM) has been mostly carried out in situations demanding precision, complexity in the shapes of final components and in case the surface integrity and performance are independent of the machining process. In this work, the following have been demonstrated: The first part of the work demonstrates the experimental setup for ECMM that is used to fabricate a micro-mixer on a printed circuit board (PCB) substrate by using a single point electrochemical machining tool with a tip diameter—150 µm. The method is able to show a promising route of fabrication where the circuit lines on a PCB substrate can be printed with high yield and processing speeds. The second part of the article points out that machining can be carried out on PCB substrates through electrochemical processes using a single point tool and a minimum feature size of 243 µm can be machined with a fine tolerance of 0.025 µm and roughness = 3.0459 µm~7.2404 µm. The third part of the article reports the geometrical parameters of a relatively complex geometry of a micro-mixer which is arrived at through a COMSOL based simulation platform that is fabricated using the mentioned manufacturing process. The process is further validated through the design of experiments, and fluid flow and mixing behaviour on the fabricated structure is evaluated through an epifluorescence microscope. The advantages that this technique may offer is in terms of achieving an overall low feature size in comparison to micro-milling and avoiding the complexities of lithography-driven processes to produce a process which has a much lower equipment dependency, is environmentally benign in comparison to the lithography driven techniques and is overall low in cost.","PeriodicalId":129806,"journal":{"name":"Journal of Micromanufacturing","volume":"40 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-07-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127603479","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2019-06-17DOI: 10.1177/2516598419843688
Sanjay Kumar, Pulak Bhushan, Mohit Pandey, S. Bhattacharya
Abstract The recent success of additive manufacturing processes (also called, 3D printing) in the manufacturing sector has led to a shift in the focus from simple prototyping to real production-grade technology. The enhanced capabilities of 3D printing processes to build intricate geometric shapes with high precision and resolution have led to their increased use in fabrication of microelectromechanical systems (MEMS). The 3D printing technology has offered tremendous flexibility to users for fabricating custom-built components. Over the past few decades, different types of 3D printing technologies have been developed. This article provides a comprehensive review of the recent developments and significant achievements in most widely used 3D printing technologies for MEMS fabrication, their working methodology, advantages, limitations, and potential applications. Furthermore, some of the emerging hybrid 3D printing technologies are discussed, and the current challenges associated with the 3D printing processes are addressed. Finally, future directions for process improvements in 3D printing techniques are presented.
{"title":"Additive manufacturing as an emerging technology for fabrication of microelectromechanical systems (MEMS)","authors":"Sanjay Kumar, Pulak Bhushan, Mohit Pandey, S. Bhattacharya","doi":"10.1177/2516598419843688","DOIUrl":"https://doi.org/10.1177/2516598419843688","url":null,"abstract":"Abstract The recent success of additive manufacturing processes (also called, 3D printing) in the manufacturing sector has led to a shift in the focus from simple prototyping to real production-grade technology. The enhanced capabilities of 3D printing processes to build intricate geometric shapes with high precision and resolution have led to their increased use in fabrication of microelectromechanical systems (MEMS). The 3D printing technology has offered tremendous flexibility to users for fabricating custom-built components. Over the past few decades, different types of 3D printing technologies have been developed. This article provides a comprehensive review of the recent developments and significant achievements in most widely used 3D printing technologies for MEMS fabrication, their working methodology, advantages, limitations, and potential applications. Furthermore, some of the emerging hybrid 3D printing technologies are discussed, and the current challenges associated with the 3D printing processes are addressed. Finally, future directions for process improvements in 3D printing techniques are presented.","PeriodicalId":129806,"journal":{"name":"Journal of Micromanufacturing","volume":"31 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-06-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123909061","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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