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Jurassic Park: The Lost World of Antennas [Historically Speaking] 《侏罗纪公园:失落的天线世界》
IF 4.2 4区 计算机科学 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2025-04-22 DOI: 10.1109/MAP.2025.3538259
Stefano Selleri;Trevor S. Bird
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引用次数: 0
Short Courses 短期课程
IF 4.2 4区 计算机科学 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2025-04-22 DOI: 10.1109/MAP.2025.3539111
Raymond P. Wasky
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引用次数: 0
Performance Benchmarking With the Austin RCS Benchmark Suite: Beyond empirical verification and validation 使用奥斯汀 RCS 基准套件进行性能基准测试:超越经验验证和确认
IF 4.2 4区 计算机科学 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2025-04-22 DOI: 10.1109/MAP.2025.3537557
Andrew Maicke;Jon T. Kelley;Ali E. Yilmaz
The realized performance (error–cost tradeoff) of three computational electromagnetic (CEM) methods, which use parallel algorithms on a supercomputer to predict the radar cross section (RCS) of complex targets, are quantified using the Austin RCS Benchmark Suite. The article demonstrates how modern benchmark suites can be used to evaluate CEM methods empirically and compare their performances objectively.

The Austin RCS Benchmark Suite [1], [2] has recently been populated with 20 carefully selected problem sets that span a wide range in six dimensions of computational difficulty [3].

利用Austin RCS Benchmark Suite,对在超级计算机上使用并行算法预测复杂目标雷达截面(RCS)的三种计算电磁(CEM)方法的实现性能(误差成本权衡)进行了量化。本文演示了如何使用现代基准套件对CEM方法进行经验评估并客观地比较它们的性能。Austin RCS基准测试套件[1],[2]最近填充了20个精心挑选的问题集,这些问题集在计算难度[3]的六个维度上跨越了广泛的范围。
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引用次数: 0
Benchmarking-Charge-Conserving, Unconditionally Stable, Electromagnetic Finite-Element Particle-in-Cell Codes: Validating 3D nonlinear multiphysics simulations 电荷守恒、无条件稳定的电磁有限元粒子内单元代码基准测试:验证三维非线性多物理场仿真
IF 4.2 4区 计算机科学 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2025-04-22 DOI: 10.1109/MAP.2025.3537958
Omkar H. Ramachandran;B. Shanker
To a large extent, particle-in-cell (PIC) methods have become the default means of understanding plasma physics. As a result, there are a spate of codes, public and otherwise, that are heavily used. Most of these codes fall under two categories: 1) they largely deal with electrostatic problems or 2) are 1D/2D. As a result, there is a paucity of benchmarking tests that can be used to validate codes and methods that are used to analyze 3D problems. This is especially true when designing methods that seek to break conventional analysis methods, like using unstructured meshes or implicit time-stepping schemes. This review seeks to address this need. We present a number of results that one can use to validate and benchmark 3D electromagnetic finite-element method PIC (EM-FEMPIC) codes for collisionless plasma and beam dynamics systems. Three test cases are presented in significant detail, including beam expansion due to static space-charge expansion, the acceleration of a relativistic bunch by an radio-frequency (RF)-accelerating structure, and benchmarks of accuracy and energy conservation of the particle push. The presented results are compared against either analytical data or those from other codes.
在很大程度上,粒子池(PIC)方法已经成为理解等离子体物理的默认手段。因此,有大量的代码,无论是公开的还是其他的,都被大量使用。这些代码大多分为两类:1)它们主要处理静电问题或2)是1D/2D。因此,缺乏可用于验证用于分析3D问题的代码和方法的基准测试。当设计方法试图打破传统的分析方法时尤其如此,比如使用非结构化网格或隐式时间步进方案。本次审查旨在解决这一需求。我们提出了一些结果,人们可以用来验证和基准三维电磁有限元方法PIC (EM-FEMPIC)代码,用于无碰撞等离子体和光束动力学系统。详细介绍了三种测试案例,包括静态空间电荷膨胀引起的光束膨胀、射频加速结构对相对论束的加速以及粒子推力的精度和能量守恒基准。给出的结果与分析数据或其他代码的结果进行了比较。
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引用次数: 0
IEEE Moving IEEE移动
IF 4.2 4区 计算机科学 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2025-04-22 DOI: 10.1109/MAP.2025.3552889
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引用次数: 0
13th Asia-Pacific Conference on Antennas and Propagation - 13th Asia-Pacific Conference on Antennas and Propagation 第十三届亚太天线与传播会议-第十三届亚太天线与传播会议
IF 4.2 4区 计算机科学 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2025-04-22 DOI: 10.1109/MAP.2025.3539165
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引用次数: 0
IEEE Proceeding IEEE进行
IF 4.2 4区 计算机科学 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2025-04-22 DOI: 10.1109/MAP.2025.3552888
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引用次数: 0
[Hidden Word] (隐藏的词)
IF 4.2 4区 计算机科学 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2025-04-22 DOI: 10.1109/MAP.2025.3537415
Fred E. Gardiol
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引用次数: 0
IEEE Foundation IEEE基金会
IF 4.2 4区 计算机科学 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2025-04-22 DOI: 10.1109/MAP.2025.3552886
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引用次数: 0
Benchmarking and Reproducibility in Computational and Experimental Characterization of Electronic Packages for Signal/Power Integrity: Four benchmarks serve as standardized cases 信号/电源完整性电子封装的计算和实验表征中的基准和可重复性:四个基准作为标准化案例
IF 4.2 4区 计算机科学 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2025-04-22 DOI: 10.1109/MAP.2025.3537412
Heidi Barnes;Kemal Aygün;Michael J. Hill;Zhichao Zhang;Kaisheng Hu;Jonatan Aronsson;Pavel Paladhi;Jayaprakash Balachandran;Bobi Shi;Rohit Sharma;José E. Schutt-Ainé;Vladimir I. Okhmatovski
This article describes current initiatives to form benchmarks for the characterization of electronic packages. Four available benchmarks representing typical cases for signal integrity (SI) and power integrity (PI) analysis and varying in complexity from simple microstrip line to a full package model are intended to serve as standardized cases for testing the performance and accuracy of the modeling tools. While the benchmarks, consisting of CAD model files as well as simulated and measured network parameters, are publicly available and described in the accompanying manual, the emphasis in this article is on the description of challenges encountered in creating measured data, the development of modeling capabilities in the computational tools essential for accurate and expedient electromagnetic (EM) analysis of the benchmarks, and common practices going into matching of the simulated to the measured data. Ongoing efforts toward the standardization of densely packed interconnects for die-to-die interfacing on advanced packages, also known as heterogeneous integration (HI), are discussed in the context of the Open Compute Project (OCP). Emerging needs for benchmarking and standardization of test cases and training datasets for machine learning (ML)-assisted characterization of high-speed channels are also outlined.
本文描述了目前形成电子封装特性基准的计划。四个可用基准代表信号完整性(SI)和功率完整性(PI)分析的典型案例,从简单的微带线到全封装模型的复杂程度各不相同,旨在作为测试建模工具的性能和准确性的标准化案例。虽然由CAD模型文件以及模拟和测量的网络参数组成的基准是公开可用的,并在附带的手册中进行了描述,但本文的重点是描述在创建测量数据时遇到的挑战,以及在计算工具中建模能力的发展,这些计算工具对于准确和方便的电磁(EM)分析基准至关重要。并对模拟数据与实测数据的匹配进行了探讨。在开放计算项目(OCP)的背景下,正在进行的针对高级封装上的模对模接口的密集封装互连的标准化工作,也称为异构集成(HI)。本文还概述了对机器学习(ML)辅助高速通道表征的测试用例和训练数据集的基准测试和标准化的新需求。
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引用次数: 0
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IEEE Antennas and Propagation Magazine
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