Pub Date : 2025-04-22DOI: 10.1109/MAP.2025.3537958
Omkar H. Ramachandran;B. Shanker
To a large extent, particle-in-cell (PIC) methods have become the default means of understanding plasma physics. As a result, there are a spate of codes, public and otherwise, that are heavily used. Most of these codes fall under two categories: 1) they largely deal with electrostatic problems or 2) are 1D/2D. As a result, there is a paucity of benchmarking tests that can be used to validate codes and methods that are used to analyze 3D problems. This is especially true when designing methods that seek to break conventional analysis methods, like using unstructured meshes or implicit time-stepping schemes. This review seeks to address this need. We present a number of results that one can use to validate and benchmark 3D electromagnetic finite-element method PIC (EM-FEMPIC) codes for collisionless plasma and beam dynamics systems. Three test cases are presented in significant detail, including beam expansion due to static space-charge expansion, the acceleration of a relativistic bunch by an radio-frequency (RF)-accelerating structure, and benchmarks of accuracy and energy conservation of the particle push. The presented results are compared against either analytical data or those from other codes.
{"title":"Benchmarking-Charge-Conserving, Unconditionally Stable, Electromagnetic Finite-Element Particle-in-Cell Codes: Validating 3D nonlinear multiphysics simulations","authors":"Omkar H. Ramachandran;B. Shanker","doi":"10.1109/MAP.2025.3537958","DOIUrl":"https://doi.org/10.1109/MAP.2025.3537958","url":null,"abstract":"To a large extent, particle-in-cell (PIC) methods have become the default means of understanding plasma physics. As a result, there are a spate of codes, public and otherwise, that are heavily used. Most of these codes fall under two categories: 1) they largely deal with electrostatic problems or 2) are 1D/2D. As a result, there is a paucity of benchmarking tests that can be used to validate codes and methods that are used to analyze 3D problems. This is especially true when designing methods that seek to break conventional analysis methods, like using unstructured meshes or implicit time-stepping schemes. This review seeks to address this need. We present a number of results that one can use to validate and benchmark 3D electromagnetic finite-element method PIC (EM-FEMPIC) codes for collisionless plasma and beam dynamics systems. Three test cases are presented in significant detail, including beam expansion due to static space-charge expansion, the acceleration of a relativistic bunch by an radio-frequency (RF)-accelerating structure, and benchmarks of accuracy and energy conservation of the particle push. The presented results are compared against either analytical data or those from other codes.","PeriodicalId":13090,"journal":{"name":"IEEE Antennas and Propagation Magazine","volume":"67 2","pages":"76-86"},"PeriodicalIF":4.2,"publicationDate":"2025-04-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"143860928","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2025-04-22DOI: 10.1109/MAP.2025.3539165
{"title":"13th Asia-Pacific Conference on Antennas and Propagation - 13th Asia-Pacific Conference on Antennas and Propagation","authors":"","doi":"10.1109/MAP.2025.3539165","DOIUrl":"https://doi.org/10.1109/MAP.2025.3539165","url":null,"abstract":"","PeriodicalId":13090,"journal":{"name":"IEEE Antennas and Propagation Magazine","volume":"67 2","pages":"119-119"},"PeriodicalIF":4.2,"publicationDate":"2025-04-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10973142","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"143865310","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2025-04-22DOI: 10.1109/MAP.2025.3537415
Fred E. Gardiol
{"title":"[Hidden Word]","authors":"Fred E. Gardiol","doi":"10.1109/MAP.2025.3537415","DOIUrl":"https://doi.org/10.1109/MAP.2025.3537415","url":null,"abstract":"","PeriodicalId":13090,"journal":{"name":"IEEE Antennas and Propagation Magazine","volume":"67 2","pages":"150-150"},"PeriodicalIF":4.2,"publicationDate":"2025-04-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10973210","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"143865311","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2025-04-22DOI: 10.1109/MAP.2025.3537412
Heidi Barnes;Kemal Aygün;Michael J. Hill;Zhichao Zhang;Kaisheng Hu;Jonatan Aronsson;Pavel Paladhi;Jayaprakash Balachandran;Bobi Shi;Rohit Sharma;José E. Schutt-Ainé;Vladimir I. Okhmatovski
This article describes current initiatives to form benchmarks for the characterization of electronic packages. Four available benchmarks representing typical cases for signal integrity (SI) and power integrity (PI) analysis and varying in complexity from simple microstrip line to a full package model are intended to serve as standardized cases for testing the performance and accuracy of the modeling tools. While the benchmarks, consisting of CAD model files as well as simulated and measured network parameters, are publicly available and described in the accompanying manual, the emphasis in this article is on the description of challenges encountered in creating measured data, the development of modeling capabilities in the computational tools essential for accurate and expedient electromagnetic (EM) analysis of the benchmarks, and common practices going into matching of the simulated to the measured data. Ongoing efforts toward the standardization of densely packed interconnects for die-to-die interfacing on advanced packages, also known as heterogeneous integration (HI), are discussed in the context of the Open Compute Project (OCP). Emerging needs for benchmarking and standardization of test cases and training datasets for machine learning (ML)-assisted characterization of high-speed channels are also outlined.
{"title":"Benchmarking and Reproducibility in Computational and Experimental Characterization of Electronic Packages for Signal/Power Integrity: Four benchmarks serve as standardized cases","authors":"Heidi Barnes;Kemal Aygün;Michael J. Hill;Zhichao Zhang;Kaisheng Hu;Jonatan Aronsson;Pavel Paladhi;Jayaprakash Balachandran;Bobi Shi;Rohit Sharma;José E. Schutt-Ainé;Vladimir I. Okhmatovski","doi":"10.1109/MAP.2025.3537412","DOIUrl":"https://doi.org/10.1109/MAP.2025.3537412","url":null,"abstract":"This article describes current initiatives to form benchmarks for the characterization of electronic packages. Four available benchmarks representing typical cases for signal integrity (SI) and power integrity (PI) analysis and varying in complexity from simple microstrip line to a full package model are intended to serve as standardized cases for testing the performance and accuracy of the modeling tools. While the benchmarks, consisting of CAD model files as well as simulated and measured network parameters, are publicly available and described in the accompanying manual, the emphasis in this article is on the description of challenges encountered in creating measured data, the development of modeling capabilities in the computational tools essential for accurate and expedient electromagnetic (EM) analysis of the benchmarks, and common practices going into matching of the simulated to the measured data. Ongoing efforts toward the standardization of densely packed interconnects for die-to-die interfacing on advanced packages, also known as <italic>heterogeneous integration</i> (<italic>HI</i>), are discussed in the context of the Open Compute Project (OCP). Emerging needs for benchmarking and standardization of test cases and training datasets for machine learning (ML)-assisted characterization of high-speed channels are also outlined.","PeriodicalId":13090,"journal":{"name":"IEEE Antennas and Propagation Magazine","volume":"67 2","pages":"51-63"},"PeriodicalIF":4.2,"publicationDate":"2025-04-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"143860857","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2025-04-22DOI: 10.1109/MAP.2025.3537408
Frank Weinmann;Magnus Gustavsson;Åsa Andersson;Fredrik Laurén;Andrey V. Osipov;Johannes Bökler;Andrej Konforta;Victoria Gómez-Guillamón Buendía;Stefania Monni;David Poyatos Martínez;David Escot Bocanegra
The workshop “Radar Signatures & EM Benchmarks” has been established by the European Defence Agency (EDA) in 2017, with the aim of bringing together scientific experts in the field of electromagnetic scattering simulations, specifically in the context of radar signatures. The 3rd workshop was held in 2023, and a few months prior to the workshop, several test cases were published on the workshop’s webpage, which served as benchmarks to compare results obtained by different simulation codes. It turned out that such activities are extremely important for the community, both for the comparison of simulation results and evaluation of tools as well as for the interesting discussions among the leading experts in the field. This paper will provide insights into the workshop by presenting some of the recent test cases and showing some exemplary evaluation of the data computed by the participants.
{"title":"The European Defence Agency Workshop “Radar Signatures & EM Benchmarks”: A scientific forum for comparison and evaluation of electromagnetic simulations","authors":"Frank Weinmann;Magnus Gustavsson;Åsa Andersson;Fredrik Laurén;Andrey V. Osipov;Johannes Bökler;Andrej Konforta;Victoria Gómez-Guillamón Buendía;Stefania Monni;David Poyatos Martínez;David Escot Bocanegra","doi":"10.1109/MAP.2025.3537408","DOIUrl":"https://doi.org/10.1109/MAP.2025.3537408","url":null,"abstract":"The workshop “Radar Signatures & EM Benchmarks” has been established by the European Defence Agency (EDA) in 2017, with the aim of bringing together scientific experts in the field of electromagnetic scattering simulations, specifically in the context of radar signatures. The 3<sup>rd</sup> workshop was held in 2023, and a few months prior to the workshop, several test cases were published on the workshop’s webpage, which served as benchmarks to compare results obtained by different simulation codes. It turned out that such activities are extremely important for the community, both for the comparison of simulation results and evaluation of tools as well as for the interesting discussions among the leading experts in the field. This paper will provide insights into the workshop by presenting some of the recent test cases and showing some exemplary evaluation of the data computed by the participants.","PeriodicalId":13090,"journal":{"name":"IEEE Antennas and Propagation Magazine","volume":"67 2","pages":"43-50"},"PeriodicalIF":4.2,"publicationDate":"2025-04-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"143860999","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
The demand for millimeter-wave (mmWave) bands is growing due to the need for high-throughput communications, high-resolution sensing, and data-intensive applications such as massive Internet of Things (IoT), virtual reality, augmented reality, and metaverse platforms. Designing antennas for mmWave bands, unlike traditional microwave bands, requires multidimensional considerations such as antenna design methodologies, appropriate material selection, high-performance packaging technologies, and integration with surrounding circuitry. Antenna-in-package (AiP), which integrates transceiver (TRX) dies and antennas into a standard surface-mount package, effectively leverages advanced antenna engineering and heterogeneous integration processes. Codesigned with silicon integrated circuits (ICs) and built on the same silicon dies, antenna-on-chip (AoC) benefits significantly from frequency increases into the terahertz (THz) range. AoC takes advantage of silicon’s low surface roughness and monolithic integration to effectively incorporate antennas alongside peripheral ICs. Glass technology is emerging as a strong candidate for large-volume high-performance applications due to its low dielectric loss, similar thermal expansion coefficient to silicon, large-area panel/wafer size, and low surface roughness. Glass core AiP, which utilizes the low dielectric loss of glass, and antenna-on-display (AoD), which exploits the optical transparency of glass, are both promising concepts for 5G/6G mmWave applications. In this two-part article, we provide a comprehensive overview of antennas in packaging technologies in the mmWave band. In Part 1, we investigate design methodologies and features from different perspectives: material (organic or inorganic) and application [base station (BS) or user mobile terminal (UMT)]. We also review the historical development of multilayer antenna packaging. We then discuss the packaging integration of antenna arrays and radio-frequency ICs (RFICs), which are silicon-based phased-array systems. In Part 2, we focus on emerging techniques for antenna packaging, such as silicon, glass, and 3D integration.
{"title":"History and the Latest Progress in Antenna Packaging Technology: Part 1: Multilayer solutions","authors":"Seung Yoon Lee;Dongseop Lee;Yueping Zhang;Wonbin Hong;Nima Ghalichechian","doi":"10.1109/MAP.2025.3560852","DOIUrl":"https://doi.org/10.1109/MAP.2025.3560852","url":null,"abstract":"The demand for millimeter-wave (mmWave) bands is growing due to the need for high-throughput communications, high-resolution sensing, and data-intensive applications such as massive Internet of Things (IoT), virtual reality, augmented reality, and metaverse platforms. Designing antennas for mmWave bands, unlike traditional microwave bands, requires multidimensional considerations such as antenna design methodologies, appropriate material selection, high-performance packaging technologies, and integration with surrounding circuitry. Antenna-in-package (AiP), which integrates transceiver (TRX) dies and antennas into a standard surface-mount package, effectively leverages advanced antenna engineering and heterogeneous integration processes. Codesigned with silicon integrated circuits (ICs) and built on the same silicon dies, antenna-on-chip (AoC) benefits significantly from frequency increases into the terahertz (THz) range. AoC takes advantage of silicon’s low surface roughness and monolithic integration to effectively incorporate antennas alongside peripheral ICs. Glass technology is emerging as a strong candidate for large-volume high-performance applications due to its low dielectric loss, similar thermal expansion coefficient to silicon, large-area panel/wafer size, and low surface roughness. Glass core AiP, which utilizes the low dielectric loss of glass, and antenna-on-display (AoD), which exploits the optical transparency of glass, are both promising concepts for 5G/6G mmWave applications. In this two-part article, we provide a comprehensive overview of antennas in packaging technologies in the mmWave band. In Part 1, we investigate design methodologies and features from different perspectives: material (organic or inorganic) and application [base station (BS) or user mobile terminal (UMT)]. We also review the historical development of multilayer antenna packaging. We then discuss the packaging integration of antenna arrays and radio-frequency ICs (RFICs), which are silicon-based phased-array systems. In Part 2, we focus on emerging techniques for antenna packaging, such as silicon, glass, and 3D integration.","PeriodicalId":13090,"journal":{"name":"IEEE Antennas and Propagation Magazine","volume":"67 3","pages":"48-61"},"PeriodicalIF":4.2,"publicationDate":"2025-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"144536492","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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