In this study we investigate the effects of two industrial lignins, Kraft (KL) and hydroxymethylated lignin (HL), on the physicochemical properties of urea-formaldehyde (UF) adhesives and the performance of bonded particleboards. KL and HL were used to partially replace up to 15 wt% of UF adhesives, increasing viscosity beyond industrial requirements but enhancing internal bond strength. The curing peak temperature decreased from 84.3 °C (UF) to 83.3 °C (UF–5 % HL), while the heat of curing rose from 86.8 J/g to 107.5 J/g, confirming enhanced reactivity over KL. Mechanical performance improved notably, with the best results obtained for panels containing 10 wt% KL and 5 wt% HL, showing MOE, MOR, and IB increases of 38.4 %, 12.3 %, and 30.3 %, respectively, relative to control panels. Formaldehyde emissions were significantly reduced from 0.174 ppm for neat UF to 0.094 ppm for UF–15 % KL, approaching the Canadian regulatory limit. Despite viscosity challenges associated with both lignins, these findings highlight its potential as a bio-based UF adhesive modifier, offering enhanced performance and reduced formaldehyde emissions. Further optimization is required to lower HL's molecular weight and ensure industrial feasibility. This research provides a pathway for lignin valorization in sustainable wood composites, advancing eco-friendly alternatives for the forest products industry.
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