Pub Date : 2016-09-01DOI: 10.1109/THERMINIC.2016.7749052
K. Górecki, Przemysław Ptak
This paper is devoted to modelling LED lamps with the use of SPICE software with thermal phenomena taken into account. The electrothermal models of components of such lamps: the LED module and the power supply are proposed. The elaborated model of the lamp makes it possible to calculate optical and electrical quantities characterizing properties of the lamp and additionally, the internal temperatures of components of such lamps. The correctness of the elaborated model was verified experimentally for the selected types of LED lamps. A good agreement between the results of calculations and measurements was obtained.
{"title":"Modelling LED lamps with thermal phenomena taken into account","authors":"K. Górecki, Przemysław Ptak","doi":"10.1109/THERMINIC.2016.7749052","DOIUrl":"https://doi.org/10.1109/THERMINIC.2016.7749052","url":null,"abstract":"This paper is devoted to modelling LED lamps with the use of SPICE software with thermal phenomena taken into account. The electrothermal models of components of such lamps: the LED module and the power supply are proposed. The elaborated model of the lamp makes it possible to calculate optical and electrical quantities characterizing properties of the lamp and additionally, the internal temperatures of components of such lamps. The correctness of the elaborated model was verified experimentally for the selected types of LED lamps. A good agreement between the results of calculations and measurements was obtained.","PeriodicalId":143150,"journal":{"name":"2016 22nd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)","volume":"40 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127408459","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2016-09-01DOI: 10.1109/THERMINIC.2016.7749049
G. Farkas, M. Bein, L. Gaal
Recent research has already proved that the characteristics of LED systems can be analyzed creating multi-domain models with tightly coupled electrical, thermal and optical operation. Transient models of the electric and thermal effects have been already successfully established but experimental verification of the dynamic optical behavior was neglected as fast radiometric and photometric measurements have not been available. The present paper outlines two measurement techniques which extend the methodology towards radiometric transients, calibrated by isothermal results. It proposes adequate instrumentation and highlights metrology problems through a measurement example.
{"title":"Multi domain modelling of power LEDs based on measured isothermal and transient I-V-L characteristics","authors":"G. Farkas, M. Bein, L. Gaal","doi":"10.1109/THERMINIC.2016.7749049","DOIUrl":"https://doi.org/10.1109/THERMINIC.2016.7749049","url":null,"abstract":"Recent research has already proved that the characteristics of LED systems can be analyzed creating multi-domain models with tightly coupled electrical, thermal and optical operation. Transient models of the electric and thermal effects have been already successfully established but experimental verification of the dynamic optical behavior was neglected as fast radiometric and photometric measurements have not been available. The present paper outlines two measurement techniques which extend the methodology towards radiometric transients, calibrated by isothermal results. It proposes adequate instrumentation and highlights metrology problems through a measurement example.","PeriodicalId":143150,"journal":{"name":"2016 22nd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)","volume":"47 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114852348","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2016-09-01DOI: 10.1109/THERMINIC.2016.7749045
M. Rosenfeld
The aim of the present study is to extend air-cooling capabilities. A method of generating an unsteady vortical flow within small annular channels is introduced and studied numerically. The addition of an orifice at the entrance to the channel generates a propagating train of vortex rings that induces the continuous eruption of hot air from the wall region into the core flow. The overall effect is significant transverse convection even in laminar flows and enhancement of heat transfer. The effect of the orifice diameter is studied in detail. The method is very appealing for extending cooling capabilities of heat-sinks based on air, but it works similarly well for single phase flow of liquid. An increase of almost two-fold in the heat dissipation relative to a standard microchannel can be obtained. Heat dissipation of 8watt/cm2 per contact area can be anticipated using a single layer of the proposed air-based orificed-microchannel.
{"title":"Heat transfer enhancement in micro-scale air flows","authors":"M. Rosenfeld","doi":"10.1109/THERMINIC.2016.7749045","DOIUrl":"https://doi.org/10.1109/THERMINIC.2016.7749045","url":null,"abstract":"The aim of the present study is to extend air-cooling capabilities. A method of generating an unsteady vortical flow within small annular channels is introduced and studied numerically. The addition of an orifice at the entrance to the channel generates a propagating train of vortex rings that induces the continuous eruption of hot air from the wall region into the core flow. The overall effect is significant transverse convection even in laminar flows and enhancement of heat transfer. The effect of the orifice diameter is studied in detail. The method is very appealing for extending cooling capabilities of heat-sinks based on air, but it works similarly well for single phase flow of liquid. An increase of almost two-fold in the heat dissipation relative to a standard microchannel can be obtained. Heat dissipation of 8watt/cm2 per contact area can be anticipated using a single layer of the proposed air-based orificed-microchannel.","PeriodicalId":143150,"journal":{"name":"2016 22nd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)","volume":"105 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132936745","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2016-09-01DOI: 10.1109/THERMINIC.2016.7749036
E. Guen, D. Renahy, M. Massoud, J. Bluet, P. Chapuis, S. Gomés
This work analyses the heat transfer between various scanning thermal microscopy (SThM) probes and samples. In order to perform quantitative measurements with SThM techniques, we have developed well-established and reproducible calibration methodologies. We present here two approaches of the SThM measurement: one to measure thermal conductivity of solid materials with a Wollaston SThM microprobe and a second one to evaluate phase transition temperatures of polymeric materials with a silicon low-doped nanoprobe. Based on the comparison of experimental data and modeling results, we have estimated the local resolution of the microprobe to be associated to a radius of 300 nm. Concerning the nanoprobe, we have demonstrated the strong dependence of measurement on sample topography and roughness.
{"title":"Calibration methodologies for scanning thermal microscopy","authors":"E. Guen, D. Renahy, M. Massoud, J. Bluet, P. Chapuis, S. Gomés","doi":"10.1109/THERMINIC.2016.7749036","DOIUrl":"https://doi.org/10.1109/THERMINIC.2016.7749036","url":null,"abstract":"This work analyses the heat transfer between various scanning thermal microscopy (SThM) probes and samples. In order to perform quantitative measurements with SThM techniques, we have developed well-established and reproducible calibration methodologies. We present here two approaches of the SThM measurement: one to measure thermal conductivity of solid materials with a Wollaston SThM microprobe and a second one to evaluate phase transition temperatures of polymeric materials with a silicon low-doped nanoprobe. Based on the comparison of experimental data and modeling results, we have estimated the local resolution of the microprobe to be associated to a radius of 300 nm. Concerning the nanoprobe, we have demonstrated the strong dependence of measurement on sample topography and roughness.","PeriodicalId":143150,"journal":{"name":"2016 22nd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)","volume":"12 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129050945","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2016-09-01DOI: 10.1109/THERMINIC.2016.7748642
A. Roy, F. Ender, M. Azadmehr, K. Aasmundtveit
Carbon nanotubes (CNTs) exhibit many remarkable mechanical, electrical and thermal properties, which can be exploited in various smart sensing applications by integrating them in a standard CMOS process. However, such integration process is challenging since CMOS process is not suitable for high temperature application required for local CNT synthesis. This work involves designing power efficient CMOS compatible micro-heaters that can generate CNT growth temperature while maintaining CMOS compatible temperature in the microsystem. One metal interconnect layer and a polysilicon layer available in AMS 0.18 μm CMOS technology have been used to design the micro-heaters. This paper proposes and compares four optimal micro-heater designs alongside their thermal & thermomechanical analysis using ANSYS. The promising results are expected to lead the way for successful implementation of carbon nanotube based sensors in a commercial CMOS process.
{"title":"Optimal thermal design of CMOS for direct integration of carbon nanotubes","authors":"A. Roy, F. Ender, M. Azadmehr, K. Aasmundtveit","doi":"10.1109/THERMINIC.2016.7748642","DOIUrl":"https://doi.org/10.1109/THERMINIC.2016.7748642","url":null,"abstract":"Carbon nanotubes (CNTs) exhibit many remarkable mechanical, electrical and thermal properties, which can be exploited in various smart sensing applications by integrating them in a standard CMOS process. However, such integration process is challenging since CMOS process is not suitable for high temperature application required for local CNT synthesis. This work involves designing power efficient CMOS compatible micro-heaters that can generate CNT growth temperature while maintaining CMOS compatible temperature in the microsystem. One metal interconnect layer and a polysilicon layer available in AMS 0.18 μm CMOS technology have been used to design the micro-heaters. This paper proposes and compares four optimal micro-heater designs alongside their thermal & thermomechanical analysis using ANSYS. The promising results are expected to lead the way for successful implementation of carbon nanotube based sensors in a commercial CMOS process.","PeriodicalId":143150,"journal":{"name":"2016 22nd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)","volume":"21 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123645050","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2016-09-01DOI: 10.1109/THERMINIC.2016.7749074
Zhigang Na
Electrolytic capacitors are widely used in electric circuits, and their durability is an important contributor for the entire lifespan of an electric device. In order to devise an adequate cooling solution to prevent the electrolytic capacitor from overheating or even burning, the thermal designer needs to completely understand the capacitor's thermal characteristics. In this study, the conductivity of electrolytic capacitor is calculated referring to capacitor's structure and material. Then, capacitor's heat exchange model is set up and all boundary conditions of this model are identified, capacitor's thermal behavior is studied by varying each boundary condition one by one. Furthermore, best point for capacitor temperature measurement is determined in this study. All outcomes of this study are helpful for capacitor's thermal solution design and verification.
{"title":"A study of electrolytic capacitor's thermal conductivity, behavior and measurement","authors":"Zhigang Na","doi":"10.1109/THERMINIC.2016.7749074","DOIUrl":"https://doi.org/10.1109/THERMINIC.2016.7749074","url":null,"abstract":"Electrolytic capacitors are widely used in electric circuits, and their durability is an important contributor for the entire lifespan of an electric device. In order to devise an adequate cooling solution to prevent the electrolytic capacitor from overheating or even burning, the thermal designer needs to completely understand the capacitor's thermal characteristics. In this study, the conductivity of electrolytic capacitor is calculated referring to capacitor's structure and material. Then, capacitor's heat exchange model is set up and all boundary conditions of this model are identified, capacitor's thermal behavior is studied by varying each boundary condition one by one. Furthermore, best point for capacitor temperature measurement is determined in this study. All outcomes of this study are helpful for capacitor's thermal solution design and verification.","PeriodicalId":143150,"journal":{"name":"2016 22nd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)","volume":"81 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114884631","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2016-09-01DOI: 10.1109/THERMINIC.2016.7748651
E. Monier-Vinard, V. Bissuel, B. Rogié, N. Laraqi, O. Daniel, Marie-Cécile Kotelon
Board-level simulation has to consider, at the earliest stage of the conception, the impact of the vicinity of numerous high and medium powered devices. In 1996, the concept of Compact Thermal Model was defined, by the European consortium DELPHI to minimize the computation times, from days to minutes. A CTM resumes an electronic component as a simple cuboid form and a network of resistors that links a single temperature-sensitive node to major surfaces of heat extraction. Unfortunately the DELPHI method is restricted to steady-state model for mono-chip component. More complex issues such as multi-chip module or transient thermal model remain today for worldwide companies a non-trivial challenge. Our latest improvements made to generate steady-state multi-source CTM for System-In-Package devices showed that the number of boundary-condition scenarios is quite prohibitive when several nodes need to be monitored. The present work investigates the use of fractional factorial experiment, such as N-variables Doehlert design. The objective of this study is to define the lowest number of numerical simulations while keeping the highest accuracy level of the derived Boundary-Condition-Independent thermal network.
{"title":"Evolution of the DELPHI compact thermal modelling method: An investigation on the boundary conditions scenarios","authors":"E. Monier-Vinard, V. Bissuel, B. Rogié, N. Laraqi, O. Daniel, Marie-Cécile Kotelon","doi":"10.1109/THERMINIC.2016.7748651","DOIUrl":"https://doi.org/10.1109/THERMINIC.2016.7748651","url":null,"abstract":"Board-level simulation has to consider, at the earliest stage of the conception, the impact of the vicinity of numerous high and medium powered devices. In 1996, the concept of Compact Thermal Model was defined, by the European consortium DELPHI to minimize the computation times, from days to minutes. A CTM resumes an electronic component as a simple cuboid form and a network of resistors that links a single temperature-sensitive node to major surfaces of heat extraction. Unfortunately the DELPHI method is restricted to steady-state model for mono-chip component. More complex issues such as multi-chip module or transient thermal model remain today for worldwide companies a non-trivial challenge. Our latest improvements made to generate steady-state multi-source CTM for System-In-Package devices showed that the number of boundary-condition scenarios is quite prohibitive when several nodes need to be monitored. The present work investigates the use of fractional factorial experiment, such as N-variables Doehlert design. The objective of this study is to define the lowest number of numerical simulations while keeping the highest accuracy level of the derived Boundary-Condition-Independent thermal network.","PeriodicalId":143150,"journal":{"name":"2016 22nd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)","volume":"63 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129573462","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2016-09-01DOI: 10.1109/THERMINIC.2016.7749033
P. Zając, C. Maj, A. Napieralski
Liquid microchannel cooling of 3D ICs is a very attractive idea which could help solving the problem of ever-increasing power dissipation due to its good cooling efficiency and potential scalability. However, this cooling method has some very different properties than the well-understood forced air convection. In particular, its cooling efficiency with respect to power variations in the chip is still not completely analysed. Therefore, in this paper a thorough study of microchannel cooling efficiency as a function of intra- and interlayer power consumption variation is presented. We use a finite element method analysis to run a coupled thermo-fluidic simulation of a dedicated 3D chip model. We show that the placement of chip units with respect to microchannels can significantly influence the peak chip temperature. In particular, for a 3D chip including Intel's i7-6950X 10-core processor, a temperature difference of nearly 9°C was observed.
{"title":"Analysis of the impact of power distribution on the efficiency of microchannel cooling in 3D ICs","authors":"P. Zając, C. Maj, A. Napieralski","doi":"10.1109/THERMINIC.2016.7749033","DOIUrl":"https://doi.org/10.1109/THERMINIC.2016.7749033","url":null,"abstract":"Liquid microchannel cooling of 3D ICs is a very attractive idea which could help solving the problem of ever-increasing power dissipation due to its good cooling efficiency and potential scalability. However, this cooling method has some very different properties than the well-understood forced air convection. In particular, its cooling efficiency with respect to power variations in the chip is still not completely analysed. Therefore, in this paper a thorough study of microchannel cooling efficiency as a function of intra- and interlayer power consumption variation is presented. We use a finite element method analysis to run a coupled thermo-fluidic simulation of a dedicated 3D chip model. We show that the placement of chip units with respect to microchannels can significantly influence the peak chip temperature. In particular, for a 3D chip including Intel's i7-6950X 10-core processor, a temperature difference of nearly 9°C was observed.","PeriodicalId":143150,"journal":{"name":"2016 22nd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)","volume":"126 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127397221","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2016-09-01DOI: 10.1109/THERMINIC.2016.7749064
B. Ma, C. Kim, Kun-hyung Lee, W. Suh, K. Lee
In order to reduce the cost of the LED packages and to minimize the thermal budget, the chip-on-board (COB) packages and the chip-scale package (CSP) LEDs, based on flip-chip die bonding process, have been developed. Although the flip-chip die bonding process for the COB and the CSP LEDs is useful to decrease the thermal resistance, a precise process control for minimizing voids in solder joint and an in-line inspection for bonding quality check are needed for reliability. We proposed a simple in-line void inspection method based on the thermal transient response of LED junction temperature. In order to carry out the feasibility test, we made three LED package groups showing different solder void qualities. By measuring voltages at two points in time domain, we could distinguish the LED packages showing a poor solder void quality.
{"title":"Investigation on solder voids in flip-chip light-emitting diodes using thermal transient response","authors":"B. Ma, C. Kim, Kun-hyung Lee, W. Suh, K. Lee","doi":"10.1109/THERMINIC.2016.7749064","DOIUrl":"https://doi.org/10.1109/THERMINIC.2016.7749064","url":null,"abstract":"In order to reduce the cost of the LED packages and to minimize the thermal budget, the chip-on-board (COB) packages and the chip-scale package (CSP) LEDs, based on flip-chip die bonding process, have been developed. Although the flip-chip die bonding process for the COB and the CSP LEDs is useful to decrease the thermal resistance, a precise process control for minimizing voids in solder joint and an in-line inspection for bonding quality check are needed for reliability. We proposed a simple in-line void inspection method based on the thermal transient response of LED junction temperature. In order to carry out the feasibility test, we made three LED package groups showing different solder void qualities. By measuring voltages at two points in time domain, we could distinguish the LED packages showing a poor solder void quality.","PeriodicalId":143150,"journal":{"name":"2016 22nd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)","volume":"14 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131977301","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2016-09-01DOI: 10.1109/THERMINIC.2016.7749050
T. Renaudin, J. Joly, B. Hamon, B. Tothe
Since the start of the Ledification of lighting systems, the multi-physic “optical, electrical, thermal” characterization of LED light sources is a critical task in Philips Lighting. Dedicated teams are responsible for determining multi-physic models and design-in rules of LED modules which will be later integrated in luminaires (lighting systems). Recent works have focus on generating more and more accurate LED Module mutli-physics models. These models have been used to predict and guaranty the performance, reliability and safety of the developed luminaires. In this paper, recent results regarding multi-physics models are exposed. The evolution of the test methods and equipment is discussed highlighting the major challenges in the definition of “boundary independent” LED modules models. In addition, an inter laboratory comparison has been conducted on T3ster equipment. The comparison outcomes have been gathered to provide a non-exhaustive, but useful identification of discrepancies root causes and sources of uncertainty. In this paper some guidelines will be provided to limit them.
{"title":"LED module multi-physic approach","authors":"T. Renaudin, J. Joly, B. Hamon, B. Tothe","doi":"10.1109/THERMINIC.2016.7749050","DOIUrl":"https://doi.org/10.1109/THERMINIC.2016.7749050","url":null,"abstract":"Since the start of the Ledification of lighting systems, the multi-physic “optical, electrical, thermal” characterization of LED light sources is a critical task in Philips Lighting. Dedicated teams are responsible for determining multi-physic models and design-in rules of LED modules which will be later integrated in luminaires (lighting systems). Recent works have focus on generating more and more accurate LED Module mutli-physics models. These models have been used to predict and guaranty the performance, reliability and safety of the developed luminaires. In this paper, recent results regarding multi-physics models are exposed. The evolution of the test methods and equipment is discussed highlighting the major challenges in the definition of “boundary independent” LED modules models. In addition, an inter laboratory comparison has been conducted on T3ster equipment. The comparison outcomes have been gathered to provide a non-exhaustive, but useful identification of discrepancies root causes and sources of uncertainty. In this paper some guidelines will be provided to limit them.","PeriodicalId":143150,"journal":{"name":"2016 22nd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)","volume":"400 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133499093","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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