Pub Date : 2016-09-01DOI: 10.1109/THERMINIC.2016.7748650
L. Codecasa, V. d’Alessandro, A. Magnani, N. Rinaldi
In this paper it is shown how parametric dynamic compact thermal models can be exploited for the calibration of detailed thermal models of electronic components and packages. A constrained least square fit of the thermal response of a parametric dynamic compact thermal model, having as parameters the material thermal properties and geometrical details to be calibrated, onto the measured temperature response is performed. Numerical results show that the use of parametric dynamic compact thermal models instead of detailed compact thermal models, in conjunction with an optimization algorithm solving the constrained least square problem, can reduce the computational time for calibration by more than two orders of magnitude.
{"title":"Calibration of detailed thermal models by parametric dynamic compact thermal models","authors":"L. Codecasa, V. d’Alessandro, A. Magnani, N. Rinaldi","doi":"10.1109/THERMINIC.2016.7748650","DOIUrl":"https://doi.org/10.1109/THERMINIC.2016.7748650","url":null,"abstract":"In this paper it is shown how parametric dynamic compact thermal models can be exploited for the calibration of detailed thermal models of electronic components and packages. A constrained least square fit of the thermal response of a parametric dynamic compact thermal model, having as parameters the material thermal properties and geometrical details to be calibrated, onto the measured temperature response is performed. Numerical results show that the use of parametric dynamic compact thermal models instead of detailed compact thermal models, in conjunction with an optimization algorithm solving the constrained least square problem, can reduce the computational time for calibration by more than two orders of magnitude.","PeriodicalId":143150,"journal":{"name":"2016 22nd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2016-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116494012","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2016-09-01DOI: 10.1109/THERMINIC.2016.7749067
G. Kocsis, F. Márkus
On nanoscale, many transport characteristics of the matter differ from the macroscopic ones as quantum effects play role in the propagation of charge and heat carriers. Extensive research had been conducted to reveal the distinct transport behaviour for charge carriers, however, novel investigations have shown that heat carriers (i.e. phonons) are also subject to new transport phenomena. In the study, we estimated possible propagation modes for the dual phase lag model proposed by Anderson and Tamma with additional boundary effects on propagation of heat carriers in a nanoscale silicon layer. Furthermore, if the heat conductivity coefficient's dependence of size (via Knudsen-number) is taken into consideration then the A-T model predicts new ballistic transport mode along the well-known diffusive behaviour. We were able to confirm the existence of new transport modes for heat carriers in nanoscale systems theoretically. The results are not only important from a physical perspective but can be a ground for several technical developments where heating and cooling of the material is crucial (e.g. microprocessors).
{"title":"Dynamical phase transitions on nanoscale","authors":"G. Kocsis, F. Márkus","doi":"10.1109/THERMINIC.2016.7749067","DOIUrl":"https://doi.org/10.1109/THERMINIC.2016.7749067","url":null,"abstract":"On nanoscale, many transport characteristics of the matter differ from the macroscopic ones as quantum effects play role in the propagation of charge and heat carriers. Extensive research had been conducted to reveal the distinct transport behaviour for charge carriers, however, novel investigations have shown that heat carriers (i.e. phonons) are also subject to new transport phenomena. In the study, we estimated possible propagation modes for the dual phase lag model proposed by Anderson and Tamma with additional boundary effects on propagation of heat carriers in a nanoscale silicon layer. Furthermore, if the heat conductivity coefficient's dependence of size (via Knudsen-number) is taken into consideration then the A-T model predicts new ballistic transport mode along the well-known diffusive behaviour. We were able to confirm the existence of new transport modes for heat carriers in nanoscale systems theoretically. The results are not only important from a physical perspective but can be a ground for several technical developments where heating and cooling of the material is crucial (e.g. microprocessors).","PeriodicalId":143150,"journal":{"name":"2016 22nd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2016-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127974086","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2016-09-01DOI: 10.1109/THERMINIC.2016.7748649
C. Tonry, C. Bailey
With the need for increasing efficiencies in power electronics combined with the trend for smaller device, optimisation of power electronic systems is needed. This paper considers the steps needed to model inductors for such optimisation techniques. The use of multi-domain methods to combine smaller component models into a larger system model is the first step for such virtual prototyping. For the modelling of the electrical performance of components, Partial Element Equivalent Circuit (PEEC) models have been used. Standard PEEC techniques, however, are not able to model magnetic components. The extension of these methods to incorporate magnetic materials allows for the modelling of inductors using these techniques. Model Order Reduction (MOR) techniques applied to the system matrices produced by PEEC allow for solving transient models quickly without loss of model fidelity. With all three of these techniques, combined rapid virtual prototyping of systems including inductors is possible.
{"title":"Model order reduction in inductors for rapid virtual prototyping in power electronics","authors":"C. Tonry, C. Bailey","doi":"10.1109/THERMINIC.2016.7748649","DOIUrl":"https://doi.org/10.1109/THERMINIC.2016.7748649","url":null,"abstract":"With the need for increasing efficiencies in power electronics combined with the trend for smaller device, optimisation of power electronic systems is needed. This paper considers the steps needed to model inductors for such optimisation techniques. The use of multi-domain methods to combine smaller component models into a larger system model is the first step for such virtual prototyping. For the modelling of the electrical performance of components, Partial Element Equivalent Circuit (PEEC) models have been used. Standard PEEC techniques, however, are not able to model magnetic components. The extension of these methods to incorporate magnetic materials allows for the modelling of inductors using these techniques. Model Order Reduction (MOR) techniques applied to the system matrices produced by PEEC allow for solving transient models quickly without loss of model fidelity. With all three of these techniques, combined rapid virtual prototyping of systems including inductors is possible.","PeriodicalId":143150,"journal":{"name":"2016 22nd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2016-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128662318","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2016-09-01DOI: 10.1109/THERMINIC.2016.7749060
K. Petrosyants, Sergey V. Lebedev, L. Sambursky, V. G. Stakhin, I. Kharitonov
In this work, results of electrical measurements and their analysis are demonstrated for a small-scale 180-nm SOI CMOS technology in the extended temperature range (up to 300°C). Comparison with high temperature electrical characteristics of 0.5 μm technology is drawn. Modified model for SOI MOSFETs, based on BSIMSOI model is developed and model parameters are extracted for SPICE simulation of IC blocks. Results of subsequent SPICE simulation of analog and digital circuit blocks characteristics are presented. The potential feasibility of using small-scale SOI CMOS technology (180-nm) for extended temperature range integrated circuits (ICs) is demonstrated.
{"title":"Temperature characterization of small-scale SOI MOSFETs in the extended range (to 300°C)","authors":"K. Petrosyants, Sergey V. Lebedev, L. Sambursky, V. G. Stakhin, I. Kharitonov","doi":"10.1109/THERMINIC.2016.7749060","DOIUrl":"https://doi.org/10.1109/THERMINIC.2016.7749060","url":null,"abstract":"In this work, results of electrical measurements and their analysis are demonstrated for a small-scale 180-nm SOI CMOS technology in the extended temperature range (up to 300°C). Comparison with high temperature electrical characteristics of 0.5 μm technology is drawn. Modified model for SOI MOSFETs, based on BSIMSOI model is developed and model parameters are extracted for SPICE simulation of IC blocks. Results of subsequent SPICE simulation of analog and digital circuit blocks characteristics are presented. The potential feasibility of using small-scale SOI CMOS technology (180-nm) for extended temperature range integrated circuits (ICs) is demonstrated.","PeriodicalId":143150,"journal":{"name":"2016 22nd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2016-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126259207","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2016-09-01DOI: 10.1109/THERMINIC.2016.7749061
T. Torzewicz, A. Samson, T. Raszkowski, M. Janicki, M. Zubert, A. Napieralski
This paper discusses the problem of heat transfer coefficient variation in air cooled hybrid circuits. The investigations are based on a practical example of a circuit containing a bipolar transistor heat source. Its temperature is measured using the base-emitter junction. Additionally, infrared measurements of circuit surface temperature are taken. The measurements are carried out in a wind tunnel for different values of dissipated power and with variable cooling air speed. The measurement results are analysed allowing the assessment of heat transfer coefficient variation with surface temperature and cooling air velocity. Based on the analyses, compact thermal models are generated for the circuit allowing fast and accurate simulation of circuit temperature in various cooling conditions.
{"title":"Investigation of heat transfer coefficient variation in air cooled hybrid electronic circuits","authors":"T. Torzewicz, A. Samson, T. Raszkowski, M. Janicki, M. Zubert, A. Napieralski","doi":"10.1109/THERMINIC.2016.7749061","DOIUrl":"https://doi.org/10.1109/THERMINIC.2016.7749061","url":null,"abstract":"This paper discusses the problem of heat transfer coefficient variation in air cooled hybrid circuits. The investigations are based on a practical example of a circuit containing a bipolar transistor heat source. Its temperature is measured using the base-emitter junction. Additionally, infrared measurements of circuit surface temperature are taken. The measurements are carried out in a wind tunnel for different values of dissipated power and with variable cooling air speed. The measurement results are analysed allowing the assessment of heat transfer coefficient variation with surface temperature and cooling air velocity. Based on the analyses, compact thermal models are generated for the circuit allowing fast and accurate simulation of circuit temperature in various cooling conditions.","PeriodicalId":143150,"journal":{"name":"2016 22nd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2016-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126665801","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2016-09-01DOI: 10.1109/THERMINIC.2016.7749046
Fang Yake, Wang Gang, Xiaodan Chen, Wong Voon Hon, Xing Fu, Vass Andras
Due to the increased functionality and increasing power load capabilities, the thermal design of communication device applications is becoming more and more crucial in today's handheld device industry. Based on the thermal transient measurement principle, a series of thermal tests can be taken to help thermal engineers better understand the thermal impedance characteristics of high-performance multi-core SoC chips and their packages widely used in communication device applications. The main topic of this article is to share an effective test method for multi-core SoC chip embedded with capacitors in a PoP package. Beside the experimental results the detailed numerical model of the dedicated chips and packages is created in FloTHERM and calibrated against the measurement results.
{"title":"Detailed analysis of IC packages using thermal transient testing and CFD modelling for communication device applications","authors":"Fang Yake, Wang Gang, Xiaodan Chen, Wong Voon Hon, Xing Fu, Vass Andras","doi":"10.1109/THERMINIC.2016.7749046","DOIUrl":"https://doi.org/10.1109/THERMINIC.2016.7749046","url":null,"abstract":"Due to the increased functionality and increasing power load capabilities, the thermal design of communication device applications is becoming more and more crucial in today's handheld device industry. Based on the thermal transient measurement principle, a series of thermal tests can be taken to help thermal engineers better understand the thermal impedance characteristics of high-performance multi-core SoC chips and their packages widely used in communication device applications. The main topic of this article is to share an effective test method for multi-core SoC chip embedded with capacitors in a PoP package. Beside the experimental results the detailed numerical model of the dedicated chips and packages is created in FloTHERM and calibrated against the measurement results.","PeriodicalId":143150,"journal":{"name":"2016 22nd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2016-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134452888","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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