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Digest of Papers 1991 VLSI Test Symposium 'Chip-to-System Test Concerns for the 90's最新文献

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Test pattern generation for current testable faults in static CMOS circuits 静态CMOS电路中电流可测试故障的测试模式生成
F. Ferguson, T. Larrabee
Many manufacturing defects in static CMOS circuits are not detected by tests generated using the traditional single stuck-at fault model. May of these defects may be detected as increased propagation time or as excessive quiescent power supply current (IDDQ). In this paper the authors consider the probable manufacturing defects and compare the costs of detecting them by the resulting excess IDDQ versus the cost of traditional testing methods.<>
静态CMOS电路中的许多制造缺陷无法通过传统的单卡故障模型生成的测试来检测。这些缺陷可能被检测为增加的传播时间或过多的静态电源电流(IDDQ)。在本文中,作者考虑了可能的制造缺陷,并比较了通过由此产生的过量IDDQ检测它们的成本与传统测试方法的成本
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引用次数: 5
Circuit-level classification and testability analysis for CMOS faults CMOS故障的电路级分类与可测试性分析
S. Midkiff, S. Bollinger
The authors examine tests for short and open faults in CMOS circuits considering both IDDQ and logic observation test methods. Short and open faults are classified according to a topological classification that considers the type of fault, fault location, and affected transistor structure. The testability of each fault classification is considered for both optimistic and pessimistic assumptions. Circuit-level simulation is used to illustrate the classification.<>
作者研究了CMOS电路中短路和开路故障的测试,同时考虑了IDDQ和逻辑观察测试方法。短路和开路故障根据拓扑分类进行分类,该分类考虑了故障类型、故障位置和受影响的晶体管结构。每种故障分类的可测试性考虑了乐观和悲观两种假设。电路级仿真用于说明该分类。
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引用次数: 7
Automated diagnosis of VLSI failures VLSI故障的自动诊断
P. Ryan, S. Rawat, W. Fuchs
Fault dictionaries are examined as a tool for automated diagnosis of VLSI failures. A compressed fault dictionary format and diagnosis algorithms are presented. Both combinational and sequential circuits are considered. Dictionaries are created, for example ISCAS circuits and simulated errors diagnosed.<>
故障字典是一种自动诊断VLSI故障的工具。给出了一种压缩的故障字典格式和诊断算法。组合电路和顺序电路都被考虑。字典被创建,例如ISCAS电路和模拟错误诊断
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引用次数: 12
Efficient test generation for built-in self-test boundary-scan template 有效的测试生成内置自检边界扫描模板
P. Nagvajara, M. Karpovsky, L. Levitin
An analysis and design of a pseudorandom pattern generator, (PRPG), based on a linear recurrence, for built-in self-test (BIST) boundary scan design is presented. The authors present for the case when r>or=s, a design of an s-stage PRPG capable of producing 2/sup s/-1 distinct r-bit patterns within 2/sup s/-1 clock pulses independent of the hardware realization of the PRPG. For the case when r>
提出了一种基于线性递归的伪随机模式发生器(PRPG),用于内置自检(BIST)边界扫描设计。针对r>或=s的情况,设计了一种s级PRPG,该PRPG能够在2/sup /-1时钟脉冲内产生2/sup /-1不同的r位模式,而不依赖于PRPG的硬件实现。对于r>的情况
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引用次数: 0
Enhancement of resolution in supply current based testing for large ICs 提高大型集成电路供电电流测试的分辨率
Y. Malaiya, A. Jayasumana, C. Tong, S. Menon
Current drawn by a static CMOS VLSI integrated circuit during quiescent periods is extremely small and is normally of the order of nanoamperes. However, it is remarkably susceptible to a number of failure modes. Many faults present in such ICs cause the quiescent power-supply current (IDDQ) to increase by several orders of magnitude. Some of these faults may not manifest as logical faults, and would not be detected by traditional IC test techniques. In large ICs, it may be hard to distinguish between larger IDDQ due to defects and elevated IDDQ due to normal parameter variations. A statistical characterisation of the problem is presented. This can be used to determine the optimal size of partitions. A new information compression scheme is presented which can significantly enhance resolution.<>
静态CMOS VLSI集成电路在静态期间所产生的电流非常小,通常为纳安培数量级。然而,它非常容易受到许多失效模式的影响。这种集成电路中存在的许多故障导致静态电源电流(IDDQ)增加几个数量级。其中一些故障可能不会表现为逻辑故障,并且无法通过传统的IC测试技术检测到。在大型集成电路中,可能很难区分由于缺陷导致的较大IDDQ和由于正常参数变化导致的较高IDDQ。提出了这个问题的统计特征。这可以用来确定分区的最佳大小。提出了一种新的信息压缩方案,可以显著提高分辨率。
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引用次数: 30
Recent progress in synthesis for testability 可测试性合成的最新进展
S. Devadas, K. Keutzer, Abhijit Ghosh
Describes recent work involving the automatic synthesis of VLSI circuits with testability considerations. The first put of this paper explores the potential for logic synthesis to allow designers to more comprehensively test circuits while simultaneously diminishing the need for fault simulation and automatic test pattern generation. Logic optimization procedures can be used to produce circuits that are completely testable for single stuck-at faults. Testing for faults such as multiple stuck-at faults, gate delay faults and path delay faults is a greater challenge, but logic synthesis and optimization procedures can produce circuits that have high degrees of testability under these models as well. For each of these fault models test vectors can be produced as a by-product of the synthesis process and vector minimization algorithms can be used in the place of fault simulation to reduce the size of the test vector sets. The second part of the paper considers the difficult problem of synthesizing sequential circuits with high degrees of single stuck-at fault coverage without incurring the area and performance penalty of scan registers. Initial results at combining synthesis for testability approaches with register-transfer level automatic test-pattern generation to produce vector sets that give complete single stuck-at fault coverage without the use of scan.<>
描述了最近的工作,涉及自动合成VLSI电路与可测试性的考虑。本文的第一部分探讨了逻辑综合的潜力,使设计人员能够更全面地测试电路,同时减少对故障模拟和自动测试模式生成的需求。逻辑优化程序可用于生产可完全测试单个卡在故障的电路。对多重卡滞故障、门延迟故障和路径延迟故障等故障的测试是一个更大的挑战,但逻辑综合和优化程序也可以在这些模型下产生具有高度可测试性的电路。对于每一种故障模型,都可以作为综合过程的副产品产生测试向量,并且可以在故障模拟中使用向量最小化算法来减少测试向量集的大小。论文的第二部分考虑了在不产生扫描寄存器的面积和性能损失的情况下,合成具有高度单卡故障覆盖率的顺序电路的难题。将可测试性方法的合成与寄存器传输级自动测试模式生成相结合,产生矢量集,从而在不使用扫描的情况下提供完整的单卡故障覆盖。
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引用次数: 2
Use of CrossCheck test technology in practical applications 在实际应用中使用CrossCheck测试技术
S. Chandra, T. Gheewala, H. Sucar, G. Swan
The CrossCheck technique is beginning to gain acceptance as an effective low-cost solution to the ASIC testability problem. The technique provides massive observability by embedding test circuitry into the ASIC device. This allows highly accurate defect modeling and simulation with less computational resources than conventional techniques. This paper describes CrossCheck test technology and present results on its application to real-life designs. All these designs are sequential in nature with multiple, gated and asynchronous clocks. Bridging, comprehensive (opens and shorts) as well as conventional stuck-at I/O fault coverage, and CPU time and memory requirements are presented.<>
交叉检查技术作为ASIC可测试性问题的有效低成本解决方案开始获得认可。该技术通过将测试电路嵌入到ASIC器件中,提供了大量的可观察性。这允许使用比传统技术更少的计算资源进行高度精确的缺陷建模和仿真。本文介绍了CrossCheck测试技术及其在实际设计中的应用结果。所有这些设计本质上都是顺序的,具有多个门控和异步时钟。桥接,全面(打开和短路),以及传统的卡在I/O故障覆盖,以及CPU时间和内存需求
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引用次数: 1
VLSI procurement and qualification: NASA/GSFC experience, issues and concerns 超大规模集成电路采购和认证:NASA/GSFC经验,问题和关注
Ashok K. Sharma
Describes the VLSI parts quality and reliability issued for NASA space flight use, particularly from a NASA/Goddard Space Flight Center (GSFC) perspective. A case history of four chip set gate arrays planned for use on a high speed flight data recorder, qualification effort based on MIL-M-38510 requirements, is discussed.<>
描述了超大规模集成电路部件的质量和可靠性发布的NASA太空飞行使用,特别是从NASA/戈达德太空飞行中心(GSFC)的角度。讨论了计划用于高速飞行数据记录仪的四个芯片组门阵列的历史,以及基于MIL-M-38510要求的鉴定工作。
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引用次数: 0
Enhanced fault modeling for DRAM test and analysis 增强了对DRAM测试和分析的故障建模
H.-D. Oberle, M. Maue, P. Muhmenthaler
For typical physical DRAM cell array defects, logical fault models are derived. These models completely and unambiguously describe all coupling faults and pattern sensitivities. Thus, test patterns are developed for production tests and fault analyses with high fault coverage.<>
针对典型的物理DRAM单元阵列缺陷,导出了逻辑故障模型。这些模型完整而明确地描述了所有耦合错误和模式敏感性。因此,为具有高故障覆盖率的生产测试和故障分析开发了测试模式
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引用次数: 27
Testing of VLSI CMOS System/390 processor at card and system level VLSI CMOS System/390处理器在卡级和系统级的测试
W. Hartmann, C. Starke
The authors describe the design for testability (DFT) and testing methodology for the S/390 processor being part of IBM's low-end ES/9000 systems. The design incorporates built-in pseudo-random pattern self test and the boundary scan technique. Self test permits the migration of tests generated for the component level to higher-level packages such as printed circuit boards and the system. Consequently, the expense for testing of higher-level packages has been drastically reduced and the card test equipment can be simplified. In addition, the applied strategy offers economical diagnostic capability.<>
作者描述了作为IBM低端ES/9000系统一部分的S/390处理器的可测试性设计(DFT)和测试方法。该设计结合了内置的伪随机模式自检和边界扫描技术。自测允许将为组件级别生成的测试迁移到更高级别的封装(如印刷电路板和系统)。因此,测试高级封装的费用已大大减少,卡测试设备可以简化。此外,该应用策略提供了经济的诊断能力。
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引用次数: 0
期刊
Digest of Papers 1991 VLSI Test Symposium 'Chip-to-System Test Concerns for the 90's
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