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Digest of Papers 1991 VLSI Test Symposium 'Chip-to-System Test Concerns for the 90's最新文献

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The advantages of boundary-scan testing 边界扫描测试的优点
S. L. Dingle, Luke D. Lacroix, Peter A. Twombly
Boundary scan has been used extensively by IBM in custom logic, standard cell, and gate array logic chips. Actual implementations of boundary-scan methods used in testing these chips are discussed. The benefits of this approach are reviewed, and an economic analysis of the cost savings attributable to boundary scan are presented.<>
边界扫描已被IBM广泛应用于自定义逻辑、标准单元和门阵列逻辑芯片。讨论了用于测试这些芯片的边界扫描方法的实际实现。回顾了这种方法的好处,并对边界扫描节省的成本进行了经济分析。
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引用次数: 2
Linear microcircuit fault modeling and detection 线性微电路故障建模与检测
B. R. Epstein, Steven R. Miller, M. Czigler, David R. Gray
Classical discrimination analysis and neural network techniques are used to detect and classify possible faults in linear microcircuits. The success rates of simulated fault detection and classification are described for various types of analog and mixed-mode circuits.<>
采用经典判别分析和神经网络技术对线性微电路中的可能故障进行检测和分类。描述了各种类型的模拟电路和混合电路的模拟故障检测和分类的成功率。
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引用次数: 5
Aspects on integration of high-speed multiplexers and demultiplexers in VLSI test systems VLSI测试系统中高速复用器与解复用器集成的若干问题
M. Chowanetz, C. Kuntzsch, W. Wolz
The authors describe hardware and software solutions for the design of a high-speed tester channel. Using gallium-arsenide circuitry for the merging of tester pin waveforms, cycle periods of less than 1 ns have been achieved. Hardware design alternatives are discussed, and a scheme for the automatic generation of tester-readable pattern description files is introduced. The conversion algorithms that allow for this generation are described.<>
介绍了高速测试通道设计的硬件和软件解决方案。采用砷化镓电路合并测试引脚波形,实现了小于1ns的周期。讨论了硬件设计方案,并介绍了一种自动生成测试人员可读模式描述文件的方案。本文描述了允许这种生成的转换算法。
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引用次数: 0
Probabilistic measures of fault equivalence in mixed-signal systems 混合信号系统故障等价的概率测度
M. Soma
A study of fault equivalence in mixed analogue-digital circuits and systems is presented, emphasizing both the theoretical analysis of the equivalence concept as well as experimental results from three classes of circuits: sample-and-hold, digital-to-analog converter, and analog-to-digital converter. While fault equivalence is well understood in digital fault models, the concept is still quite new for analog fault models. The concept is also valid within the context of mixed-signal fault models, but the equivalence has to be defined in the frequency domain and in some cases, has to be approached from a probabilistic perspective. The experimental results include fault effects due to the classic digital stuck-at-fault models as well as analog faults such as out-of-specification performance, nonlinearity, etc. For each class of circuit, extensive simulation is conducted to study the fault behavior and experimental measurements are carried out to verify these behaviors as well as to confirm the validity of equivalence definition. The major application of this study is in test generation and fault diagnosis, similar to the application of digital equivalent faults in defining test vectors for equivalence classes.<>
本文对模拟-数字混合电路和系统中的故障等效进行了研究,重点介绍了等效概念的理论分析以及采样-保持、数模转换器和模数转换器三类电路的实验结果。虽然故障等价在数字故障模型中得到了很好的理解,但在模拟故障模型中仍然是一个相当新的概念。这个概念在混合信号故障模型中也是有效的,但是等效性必须在频域中定义,并且在某些情况下,必须从概率的角度来处理。实验结果既包括经典数字故障卡滞模型引起的故障效应,也包括模拟故障如超规范性能、非线性等。对于每一类电路,我们都进行了大量的仿真来研究其故障行为,并进行了实验测量来验证这些行为以及确认等效定义的有效性。本研究的主要应用是测试生成和故障诊断,类似于数字等效故障在等效类测试向量定义中的应用
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引用次数: 8
Interconnect verification of multichip modules using boundary scan 使用边界扫描的多芯片模块互连验证
David S. Karpenske
Certainly one of the key factors in the manufacture of multichip modules (MCM) is the verification and fault diagnosis of an MCM's structural interconnects. High performance MCM products, which are clearly an expensive technology, will incur additional costs unless appropriate diagnostic tools are made available for fast failure analysis during production test. Boundary scan implementation is key in making these tools feasible.<>
当然,多芯片模块(MCM)结构互连的验证和故障诊断是制造MCM的关键因素之一。高性能MCM产品显然是一项昂贵的技术,除非在生产测试期间提供适当的诊断工具进行快速故障分析,否则将产生额外的成本。边界扫描的实现是使这些工具可行的关键。
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引用次数: 3
On polynomial-time testable classes of combinational circuits 组合电路的多项式时间可测试类
N. Rao, S. Toida
The problem of test generation for detecting stuck-at faults in combinational circuits is computationally intractable. Consequently, the identification of classes of circuits that support polynomial-time test generation algorithms is very important from testing and design viewpoints. The authors discuss several classes of polynomially-time testable circuits. First, they consider the existing polynomial classes obtained by using decompositions of the circuits. Another type of decomposition is proposed, based on fanout-reconvergent pairs, which also lead to classes of polynomial-time testable circuits. Then, the authors present the classes of polynomial-time testable circuits that are formed by the Boolean formulae belonging to the classes of weakly positive, weakly negative, bijunctive and affine.<>
组合电路中卡滞故障检测的测试生成问题在计算上是一个棘手的问题。因此,从测试和设计的角度来看,识别支持多项式时间测试生成算法的电路类别非常重要。讨论了几类多项式时间可测试电路。首先,他们考虑了通过电路分解得到的现有多项式类。提出了另一种基于扇出-再收敛对的分解方法,这也导致了多项式时间可测试电路的分类。然后,作者给出了由布尔公式构成的多项式时间可测试电路的类,这些布尔公式属于弱正、弱负、双取和仿射类。
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引用次数: 2
High accelerated lifetime test methods and procedures for VLSI microcircuit interconnection line certification VLSI微电路互连线认证的高加速寿命测试方法和程序
E. Weis, E. Kinsbron, G. Chanoch, M. Snyder
As an outcome of the advances in integrated circuit fabrication technology, electromigration has become a major reliability concern in silicon VLSI circuits. This paper represents an innovative testing approach, that allows a substantial reduction in the electromigration test times of metal thin films, and can be implemented as an in-line process electromigration monitor.<>
由于集成电路制造技术的进步,电迁移已经成为硅VLSI电路可靠性的主要问题。本文代表了一种创新的测试方法,可以大大减少金属薄膜的电迁移测试时间,并且可以作为在线过程电迁移监视器实现
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引用次数: 1
An adaptive device impedance matching circuit 一种自适应器件阻抗匹配电路
M. C. Kohalmy
Test engineers have been frustrated in their efforts to perform accurate functional testing of high speed VLSI devices on commercial ATE because of the impedance mismatch between the device and the ATE pin electronics. This mismatch between the low device output impedance and high ATE test station impedance causes signal reflections ('ringing') that interfere with testing. This paper will describe a circuit that effectively eliminates the problem of signal reflections. In contrast to earlier proposed solutions, this circuit is simple to understand and use.<>
由于器件和ATE引脚电子器件之间的阻抗不匹配,测试工程师在商用ATE上对高速VLSI器件进行精确功能测试的努力一直感到沮丧。低设备输出阻抗和高ATE测试站阻抗之间的不匹配导致干扰测试的信号反射(“振铃”)。本文将描述一种有效消除信号反射问题的电路。与先前提出的解决方案相比,该电路易于理解和使用。
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引用次数: 0
Distributed self-diagnosis of VLSI mesh array processors VLSI网格阵列处理器的分布式自诊断
M. Cutler, S. Su, Mingshien Wang
A distributed self-diagnosis algorithm for VLSI mesh arrays with small clusters of faults is presented. It allows only fault-free cells to make decisions and to propagate diagnosis results. Its time complexity is constant with respect to the number of processors. The diagnosability is proportional to the array size.<>
针对超大规模集成电路网格阵列的小簇故障,提出了一种分布式自诊断算法。它只允许无故障的细胞做出决定并传播诊断结果。它的时间复杂度相对于处理器的数量是恒定的。可诊断性与阵列大小成正比。
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引用次数: 1
A statistical model for fault coverage analysis 故障覆盖分析的统计模型
C. Chen, N. Soong
The authors present a statistical model for the evaluation of test coverage for both single-stuck-at and multiple-stuck-at faults. The model parameters are the node fault complexity and test frequency. For multiple fault detection, the model is applied to calculate the defect level of a production test.<>
作者提出了一个评估单卡故障和多卡故障测试覆盖率的统计模型。模型参数为节点故障复杂度和测试频率。对于多故障检测,应用该模型计算生产测试的缺陷等级。
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引用次数: 1
期刊
Digest of Papers 1991 VLSI Test Symposium 'Chip-to-System Test Concerns for the 90's
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