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可搬型超高真空試料搬送導入装置の開発とその応用;可搬型超高真空試料搬送導入装置の開発とその応用;Development of a Portable Ultrahigh-Vacuum Sample Transfer Vessel and Its Application 便携式超高真空样品输送导入设备的开发及其应用;便携式超高真空样品输送导入设备的开发及其应用;Development of a Portable Ultrahigh-Vacuum Sample Transfer Vessel and Its Application
Pub Date : 2017-01-01 DOI: 10.3131/JVSJ2.60.139
Eiichi Kobayashi, Shukichi Tanaka, Toshihiro Okajima
Development of a Portable Ultrahigh-Vacuum Sample Transfer Vessel and Its Application Eiichi KOBAYASHI1, Shukichi TANAKA2 and Toshihiro OKAJIMA1 1Kyushu Synchrotron Light Research Center, 87 Yayoigaoka, Tosu-shi, Saga 8410005, Japan 2AdvancedICT Research Institute, National Institute of Information and Communications Technology, 5882 Iwaoka, Iwaoka-cho, Nishi-ku, Kobe-shi, Hyogo 6512492, Japan
开发便携式超高真空样品转让船舶及其应用本片小林1,Shukichi田中2和Toshihiro OKAJIMA1九州同步光研究中心87 Yayoigaoka Tosu-shi,传奇8410005,日本2先进ICT研究所、国家信息和通信技术研究所,588年2 Iwaoka Iwaoka-cho, Nishi-ku, Kobe-shi,兵库县6512492,日本
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引用次数: 0
Development of Titanium Micro Mold Manufacturing Technology for the Microfluidic Chip by Plasma Etching 等离子体刻蚀微流控芯片钛微模具制造技术的发展
Pub Date : 2017-01-01 DOI: 10.3131/JVSJ2.60.145
T. Hitobo, Masahiro Shiroki, H. Nabesawa, T. Asaji, T. Abe
Development of Titanium Micro Mold Manufacturing Technology for the Micro‰uidic Chip by Plasma Etching Takeshi HITOBO1, Masahiro SHIROKI2, Hirofumi NABESAWA3, Toyohisa ASAJI4 and Takashi ABE5 1Tateyama Machine Co., Ltd., 30 Shimonoban, Toyama-shi, Toyama 9301305, Japan 2Richell Corp., 515 shoin, Nakaniikawagun Kamiichimachi, Toyama-shi, Toyama 9300357, Japan 3Toyama Industrial Technology Center, 383 Takata, Toyama-shi, Toyama 9300866, Japan 4National Institute of Technology, Toyama College, 13 Hongomachi, Toyama-shi, Toyama 9398045, Japan 5Graduate School of Science and Technology, Niigata University, 8050 Ikarashininocho, Nishi-ku, Niigata-shi, Niigata 9502181, Japan
钛微模具制造技术的发展微‰uidic芯片通过等离子体蚀刻武HITOBO1,Masahiro SHIROKI2,Hirofumi NABESAWA3 Toyohisa ASAJI4和安倍隆51 tateyama机械有限公司,有限公司,30 Shimonoban Toyama-shi,富山930年1305年日本2 richell Corp .) 515年松阴,Nakaniikawagun Kamiichimachi, Toyama-shi,富山930年0357年日本3富山工业技术中心,383的中国人,Toyama-shi,富山930年0866年日本4技术研究所富山学院,富山市弘町13号,富山9398045,日本5新泻大学科学技术研究生院,新泻市西西区Ikarashininocho 8050,新泻市9502181
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引用次数: 0
Bonding of Dissimilar Semiconductor Materials for Energy-Harvesting and Energy-Saving Devices 不同半导体材料在能量收集和节能器件中的键合
Pub Date : 2017-01-01 DOI: 10.3131/jvsj2.60.421
N. Shigekawa
Research activities on surface activated bonding (SAB) of dissimilar semiconductor materials for targeting advanced energy-harvesting and energy-saving devices are reviewed. The structural and electrical properties of interfaces fabricated using the SAB technologies are examined. The change in the interface characteristics due to annealing after bonding is highlighted. The characteristics of SAB-based hybrid multi-junction solar cells, SiC/Si junctions as prototypes of wide bandgap/narrow bandgap hetero structures, and single-crystal diamond/Si junctions for integrating diamond and Si devices in the future are discussed.
综述了面向先进能量收集和节能器件的不同半导体材料表面活化键合(SAB)的研究进展。研究了采用SAB技术制备的界面的结构和电学性能。强调了结合后退火引起的界面特性的变化。讨论了基于saba的混合多结太阳能电池的特点,SiC/Si结作为宽带隙/窄带隙异质结构的原型,以及未来集成金刚石和硅器件的单晶金刚石/Si结。
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引用次数: 0
Fabrication method for nanocluster superatoms with high-power impulse magnetron sputtering 高功率脉冲磁控溅射制备纳米簇超原子的方法
Pub Date : 2017-01-01 DOI: 10.3131/JVSJ2.60.352
H. Tsunoyama, M. Tona, K. Tsukamoto, A. Nakajima
Fabrication Method for Nanocluster Superatoms with High-Power Impulse Magnetron Sputtering Hironori TSUNOYAMA1,2, Masahide TONA3, Keizo TSUKAMOTO3 and Atsushi NAKAJIMA1,2,4 1Faculty of Science and Technology, Keio University, 3141 Hiyoshi, Kohoku-ku, Yokohama-shi, Kanagawa 2238522, Japan 2Nakajima Designer Nanocluster Assembly Project, ERATO, Japan Science and Technology Agency, 321 Sakado, Takatsu-ku, Kawasaki-shi, Kanagawa 2130012, Japan 3Ayabo Corporation, 1 Fukamacho Hosogute, Anjo-shi, Aichi 4460052, Japan 4Keio Institute of Pure and Applied Science (KiPAS), Keio University, 3141 Hiyoshi, Kohoku-ku, Yokohama-shi, Kanagawa 2238522, Japan
和高功率脉冲磁控溅射制备方法,纳米Superatoms Hironori TSUNOYAMA1,2,Masahide TONA3,三冢本3和Atsushi1,只是2,41学院科技、庆应义塾大学,3141 Hiyoshi Kohoku-ku, Yokohama-shi,神奈川223年至8522年,日本2及其设计师纳米组装项目,埃拉托,日本科学技术振兴机构,321的款单被装,Takatsu-ku, Kawasaki-shi,神奈川213年至0012年,日本3 ayabo公司,1日本爱知县安州市Fukamacho Hosogute 44600524庆应义塾大学纯粹与应用科学研究所(KiPAS), 3141神奈川县横滨市kohokku -ku - Hiyoshi 2238522
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引用次数: 1
Development of a Hyperthermal State-selected Molecular Oxygen Beam and Its Application to the Study of O 2 Adsorption on Pt(111) 高温选态分子氧束的研制及其在Pt(111)上o2吸附研究中的应用
Pub Date : 2017-01-01 DOI: 10.3131/jvsj2.60.307
M. Kurahashi, H. Ueta
A single spin-rotational state-selected [(J,M)=(2,2)] O2 beam allows us to conduct a spinand alignment -controlled O2 chemisorption experiment. We have recently expanded its available translational energy range to 0.10.9 eV. In this study, the beam has been used for the analysis of O2 chemisorption on Pt(111). Although this system has been investigated intensively due to its technological importance, the origin of the low O2 sticking probability and its unusual energy dependence has remained unclear. The present results indicate that, at low translational energy (E0) conditions, direct activated chemisorption occurs only when the O2 axis is nearly parallel to the surface. At high energy conditions (E0>0.5 eV), however, the sticking probability for the parallel O2 decreases with E0 while that of the perpendicular O2 increases, accounting for the nearly energy-independent O2 sticking probability determined previously by a randomly oriented O2 beam.
单自旋-旋转状态选择[(J,M)=(2,2)]的O2束使我们能够进行自旋和取向控制的O2化学吸附实验。我们最近将其可用的平移能量范围扩大到0.10.9 eV。在本研究中,该光束被用于分析Pt(111)上的O2化学吸附。尽管由于其技术重要性,该系统已被深入研究,但低氧粘附概率的起源及其不寻常的能量依赖性仍不清楚。目前的结果表明,在低平动能(E0)条件下,直接活化的化学吸附只发生在O2轴几乎与表面平行的情况下。在高能量条件下(E0>0.5 eV),平行O2的粘附概率随E0的增大而减小,而垂直O2的粘附概率随E0的增大而增大,这就解释了之前随机定向O2束确定的几乎与能量无关的O2粘附概率。
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引用次数: 0
The 14th International Symposium on Sputtering and Plasma Processes (ISSP2017) 第十四届溅射与等离子体工艺国际研讨会(ISSP2017)
Pub Date : 2017-01-01 DOI: 10.3131/jvsj2.60.517
Y. Yamada
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引用次数: 0
International Vacuum Congress (IVC-20)の会議報告電子材料・プロセス(EMP)/先進半導体とディスプレイデバイス(ASDD)/真空科学技術(VST) International Vacuum Congress (IVC-20)会议报告电子材料与工艺(EMP)/先进半导体与显示器件(ASDD)/真空科学技术(VST)
Pub Date : 2017-01-01 DOI: 10.3131/JVSJ2.60.26
肇 吉田
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引用次数: 0
Comparison of Plasma Ion Deposition Processes at Industrial Scale 工业规模等离子体离子沉积工艺的比较
Pub Date : 2017-01-01 DOI: 10.3131/JVSJ2.60.362
Satoshi Hirota, R. Cremer, Tetsuya Takahashi
A relatively new industrial sputtering technology based on High Power Impulse Magnetron Sputtering (HiPIMS) is demonstrated. HiPIMS is a magnetron discharge process like conventional dc magnetron sputtering (DCMS). However, momentarily input power is approximately ten times higher in magnitude. In this study HiPIMS discharge is characterized by Optical Emission Spectroscopy (OES), and compared with DCMS and cathodic arc (CA). The result shows that the HiPIMS provides the high ionization degree of the sputtered metal species. The degree of Ti ionization is found to be increased as the pulse frequency of HiPIMS is decreased, which enables to adjust the sputter plasma properties ranging from lowmetal ionization to highmetal ionization by controlling the pulse frequency. This expands an opportunity to tailor the properties of sputtered thin ˆlms.
介绍了一种基于大功率脉冲磁控溅射的新型工业溅射技术。HiPIMS是一种与传统直流磁控溅射(DCMS)类似的磁控放电过程。然而,瞬时输入功率大约是其量级的十倍。本研究利用光学发射光谱(OES)对HiPIMS放电进行了表征,并与DCMS和阴极电弧(CA)进行了比较。结果表明,HiPIMS提供了高电离度的溅射金属。随着HiPIMS脉冲频率的降低,Ti的电离程度增加,从而可以通过控制脉冲频率来调节溅射等离子体的特性,从低金属电离到高金属电离。这为定制溅射薄膜的特性提供了机会。
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引用次数: 0
International Vacuum Congress (IVC-20)の会議報告Vacuum Science and Technology/Surface Science/Applied Surface Science報告 国际真空大会(IVC-20)真空科学与技术/表面科学/应用表面科学
Pub Date : 2017-01-01 DOI: 10.3131/JVSJ2.60.70
孝範 越川
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引用次数: 0
吸引プラズマエッチング法を用いたSiO 2 ダイアフラム構造作製技術の開発;吸引プラズマエッチング法を用いたSiO 2 ダイアフラム構造作製技術の開発;Development of Simple Fabrication Method of SiO 2 Diaphragm Using Inward Plasma Etching 利用吸引等离子体蚀刻法开发SiO二代溢出结构制备技术;利用吸引等离子体蚀刻法开发SiO二代溢出结构制备技术;Development of Simple Fabrication Method of SiO 2 Diaphragm Using Inward Plasma Etching
Pub Date : 2017-01-01 DOI: 10.3131/JVSJ2.60.148
Ryo Kanou, Hiroshi Suga, Shun'ichiro Shimbori, Satoshi Takahashi, Toshitaka Kubo, Atsushi Ando, Tetsuo Shimizu, Junko Miyawaki
Development of Simple Fabrication Method of SiO2 Diaphragm Using Inward Plasma Etching Ryo KANOU1,3, Hiroshi SUGA1, Shun'ichiro SHIMBORI2, Satoshi TAKAHASHI2, Toshitaka KUBO3, Atsushi ANDO3, Tetsuo SHIMIZU3 and Jun MIYAWAKI3 1Department of Engineering, Chiba Institute of Technology, 2171 Tsudanuma, Narashino-shi, Chiba 2750016, Japan 2Sanyu Co., Ltd., 2434 Ishinazaka-cho, Hitachi-shi, Ibaraki 3191225, Japan 3National Institute of Advanced Industrial Science and Technology, 111 Higashi, Tsukuba-shi, Ibaraki 3058565, Japan
开发简单的二氧化硅膜的制造方法使用内等离子体蚀刻坂KANOU1,3 Hiroshi日本须贺1,避开'ichiro SHIMBORI2,Satoshi高桥2,Toshitaka katada KUBO3 Atsushi安藤3,Tetsuo清水3和6月MIYAWAKI31部工程,千叶技术研究所、2171 Tsudanuma, Narashino-shi,千叶275年至0016年,日本2常玉原籍有限公司,有限公司,2434 Ishinazaka-cho Hitachi-shi,茨城县319年至1225年,日本3国家先进工业科学技术研究所111东,筑波市,茨城市3058565
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Journal of The Vacuum Society of Japan
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