As the core carrier for achieving high-density interconnections in electronic devices, the quality of micro hole fabrication in printed circuit board (PCB) plays a crucial role in determining electrical performance and overall system reliability. Conventional micro drilling (CMD) often leads to defects such as burr formation, copper foil tearing, substrate delamination, and thermal damage, which severely restrict its applicability in high-precision fields. By integrating experimental measurements with finite element simulations, this study systematically verifies the pronounced advantages of ultrasonic-assisted micro-drilling (UAMD) in regulating the cutting process and enhancing machining performance in PCB micro-hole fabrication. Utilizing a self-developed high-frequency ultrasonic vibration spindle system, both CMD and UAMD processes were conducted to analyze the effects of spindle speed and feed rate on drilling thrust, hole entrance/exit morphology, inner wall integrity, chip formation, and tool wear. The experimental measurements are validated through comparison with simulation models. The results indicate that the high-frequency vibrations induced by UAMD markedly enhance cutting force stability and facilitate efficient chip removal. In comparison to CMD, UAMD achieved a maximum reduction of 19.1% in cutting force when drilling copper and 21.5% when drilling glass fiber reinforced polymer (GFRP), accompanied by a 14.8% decrease in the damage factor. Furthermore, tool wear was significantly reduced due to the reduction in heat accumulation. This study shows that UAMD optimizes cutting dynamics, reduces cutting forces, improves chip evacuation and hole-wall integrity, and enhances the consistency and overall quality of PCB micro-holes, providing theoretical and technical support for high-efficiency fabrication in advanced PCB manufacturing.
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