Background: The normal grinding force is generally larger than the tangential one during the conventional grinding processes. Consequently, several machining issues are caused, such as low material removal rate, high grinding temperature, and poor surface integrity. To overcome the constraints associated with the conventional grinding methods, a novel “high-shear and low-pressure” flexible grinding wheel is utilized. A thorough investigation on the influence of machining parameters on the high-shear and low-pressure grinding performance from a microscopic perspective is focused. Objective: The effect of the impacting angle and speed on the grinding force, grinding force ratio, and fiber deformation displacement is explored at the microscopic level. Method: An impact model was established using ABAQUS software to explore and analyze the interaction results of micro convex peaks with the abrasive layer under different processing conditions. Result: It was found that the normal grinding force F_n increased with both impact angle and speed. Similarly, the tangential grinding force F_t is enhanced with increasing speed. However, its magnitude is reduced with impact angle. The grinding force ratio is primarily affected by the impact angle, which displays a declining trend. The maximum fabric deformation displacement reaches 72.4 nm at an angle of 60° and at a speed of 9 m/s. Conclusion: The maximum fabric deformation displacement reaches 72.4 nm at an angle of 60° and a velocity of 9 m/s.
{"title":"Effects of the Impacting Velocity and Angle on the Grinding Force, Force Ratio and Deformation Behavior During High-shear and Low-pressure Grinding","authors":"Guoyu Zhang, Yebing Tian, Sohini Chowdhury, Jinling Wang, Bing Liu, Jinguo Han, Zenghua Fan","doi":"10.2174/0118764029255495231020063843","DOIUrl":"https://doi.org/10.2174/0118764029255495231020063843","url":null,"abstract":"Background: The normal grinding force is generally larger than the tangential one during the conventional grinding processes. Consequently, several machining issues are caused, such as low material removal rate, high grinding temperature, and poor surface integrity. To overcome the constraints associated with the conventional grinding methods, a novel “high-shear and low-pressure” flexible grinding wheel is utilized. A thorough investigation on the influence of machining parameters on the high-shear and low-pressure grinding performance from a microscopic perspective is focused. Objective: The effect of the impacting angle and speed on the grinding force, grinding force ratio, and fiber deformation displacement is explored at the microscopic level. Method: An impact model was established using ABAQUS software to explore and analyze the interaction results of micro convex peaks with the abrasive layer under different processing conditions. Result: It was found that the normal grinding force F_n increased with both impact angle and speed. Similarly, the tangential grinding force F_t is enhanced with increasing speed. However, its magnitude is reduced with impact angle. The grinding force ratio is primarily affected by the impact angle, which displays a declining trend. The maximum fabric deformation displacement reaches 72.4 nm at an angle of 60° and at a speed of 9 m/s. Conclusion: The maximum fabric deformation displacement reaches 72.4 nm at an angle of 60° and a velocity of 9 m/s.","PeriodicalId":18543,"journal":{"name":"Micro and Nanosystems","volume":" 11","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-11-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"135242233","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2023-11-03DOI: 10.2174/0118764029270767231025052434
Garima Thakur, Harsh Sohal, Shruti Jain
Background: The technique of approximation allows for a trade-off between accuracy, speed, area use, and power usage. It is essential in applications that can withstand errors because even a modest accuracy loss can have a significant impact on the result. Method: In this research, a novel approximate adder and the suggested 3:2 and 4:2 compressors are used to create a power-efficient approximation multiplier. In order to reduce the partial product while keeping a fair level of accuracy, approximate compressors are used. Result: The suggested approximate multiplier performs better in terms of LUTs, area, memory usage, and power consumption when compared to state-of-the-art work. Conclusion: The proposed approximate multiplier is applied to two sets of images for image blending to validate the results. PSNR values of 25.49 dB and 24.7 dB were attained for set 1 and set 2, respectively.
{"title":"Implementation of a Robust Framework for Low Power Approximate Multiplier Using Novel 3:2 and 4:2 Compressor for Image Processing Applications","authors":"Garima Thakur, Harsh Sohal, Shruti Jain","doi":"10.2174/0118764029270767231025052434","DOIUrl":"https://doi.org/10.2174/0118764029270767231025052434","url":null,"abstract":"Background: The technique of approximation allows for a trade-off between accuracy, speed, area use, and power usage. It is essential in applications that can withstand errors because even a modest accuracy loss can have a significant impact on the result. Method: In this research, a novel approximate adder and the suggested 3:2 and 4:2 compressors are used to create a power-efficient approximation multiplier. In order to reduce the partial product while keeping a fair level of accuracy, approximate compressors are used. Result: The suggested approximate multiplier performs better in terms of LUTs, area, memory usage, and power consumption when compared to state-of-the-art work. Conclusion: The proposed approximate multiplier is applied to two sets of images for image blending to validate the results. PSNR values of 25.49 dB and 24.7 dB were attained for set 1 and set 2, respectively.","PeriodicalId":18543,"journal":{"name":"Micro and Nanosystems","volume":"31 11","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-11-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"135873024","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2023-11-02DOI: 10.2174/0118764029258388231023053916
Asmae Tafraouti, Pascal Kleimann, Yasmina Layouni
Introduction: This paper aims to fabricate the high aspect ratio tungsten micro-tools with diameters up to 80µm by electrochemical etching. This process is simple and easy to develop, but it requires a deep study to achieve the fabrication of micro-tools with a diameter of 5 µm. Methods: In this work, we studied the effect of the pulsed signal parameters used during the electrochemical etching. The parameters studied are VON and TOFF (The applied voltage and the rest phase, respectively). Results: The experiments show that VON = 0.5V leads to satisfactory results (validation of the reproducibility, homogeneous etching, and fabrication of micro-tools with a diameter of 80µm with an initial tungsten wire diameter of 250µm) by applying an etching charge of 13 C. Voltages VON = 0.1V and VON = 1V does not ensure homogeneous etching. A rest phase TOFF = 3s allows obtaining microtools with a diameter of 80µm in 7 min. For a rest phase of TOFF = 9s, the etching takes 20 min and the micro-tool diameter is almost the same. Conclusion: The results of this study will be used in the manufacture of cylindrical micro-tools with a high aspect ratio Fc > 100.
{"title":"Manufacturing of Tungsten Micro-tools by Electrochemical Etching: Study of the Electrical Parameters","authors":"Asmae Tafraouti, Pascal Kleimann, Yasmina Layouni","doi":"10.2174/0118764029258388231023053916","DOIUrl":"https://doi.org/10.2174/0118764029258388231023053916","url":null,"abstract":"Introduction: This paper aims to fabricate the high aspect ratio tungsten micro-tools with diameters up to 80µm by electrochemical etching. This process is simple and easy to develop, but it requires a deep study to achieve the fabrication of micro-tools with a diameter of 5 µm. Methods: In this work, we studied the effect of the pulsed signal parameters used during the electrochemical etching. The parameters studied are VON and TOFF (The applied voltage and the rest phase, respectively). Results: The experiments show that VON = 0.5V leads to satisfactory results (validation of the reproducibility, homogeneous etching, and fabrication of micro-tools with a diameter of 80µm with an initial tungsten wire diameter of 250µm) by applying an etching charge of 13 C. Voltages VON = 0.1V and VON = 1V does not ensure homogeneous etching. A rest phase TOFF = 3s allows obtaining microtools with a diameter of 80µm in 7 min. For a rest phase of TOFF = 9s, the etching takes 20 min and the micro-tool diameter is almost the same. Conclusion: The results of this study will be used in the manufacture of cylindrical micro-tools with a high aspect ratio Fc > 100.","PeriodicalId":18543,"journal":{"name":"Micro and Nanosystems","volume":"7 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-11-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"135974639","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2023-08-17DOI: 10.2174/1876402915666230817164516
P. Sarma, P. K. Patowari
The present time has witnessed a never-before-heard interest in and applications of microfluidic devices and systems. In microfluidic systems, fluid flows and is manipulated in microchannels. Mixing is one of the most important criteria for a majority of microfluidic systems, whose laminar nature hinders the efficiency of micromixing. The interface between the flowing fluid and the inner wall surface of the microchannel greatly influences the behaviour of fluidic flow in microfluidics. Many researchers have tried to pattern the surface, introduce obstacles to flow, and include micro- or nano-protruded structures to enhance the mixing efficiency by manipulating the microchannel flow. New and rapid advances in MEMS and micro/nanofabrication technologies have enabled researchers to experiment with increasingly complex designs, enabling rapid transformation and dissemination of new knowledge in the field of microfluidics. Here, we report the fluid flow characteristics, mixing, and associated phenomena about microfluidic systems. Microfluidic systems and components such as microreactors, micromixers, and microchannels are reviewed in this work. We review active and passive micromixers, with a primary focus on widely used passive micromixers. Various microchannel geometries and their features, mixing efficiencies, numerical analysis, and fabrication methods are reviewed. Applications as well as possible future trends and advancements in this field, are included too. It is expected to make the reader curious and more familiar with the interesting field of microfluidics.
{"title":"A review on fluid flow and mixing in microchannel and their design and manufacture for microfluidic applications","authors":"P. Sarma, P. K. Patowari","doi":"10.2174/1876402915666230817164516","DOIUrl":"https://doi.org/10.2174/1876402915666230817164516","url":null,"abstract":"\u0000\u0000The present time has witnessed a never-before-heard interest in and applications of microfluidic devices and systems. In microfluidic systems, fluid flows and is manipulated in microchannels. Mixing is one of the most important criteria for a majority of microfluidic systems, whose laminar nature hinders the efficiency of micromixing. The interface between the flowing fluid and the inner wall surface of the microchannel greatly influences the behaviour of fluidic flow in microfluidics. Many researchers have tried to pattern the surface, introduce obstacles to flow, and include micro- or nano-protruded structures to enhance the mixing efficiency by manipulating the microchannel flow. New and rapid advances in MEMS and micro/nanofabrication technologies have enabled researchers to experiment with increasingly complex designs, enabling rapid transformation and dissemination of new knowledge in the field of microfluidics. Here, we report the fluid flow characteristics, mixing, and associated phenomena about microfluidic systems. Microfluidic systems and components such as microreactors, micromixers, and microchannels are reviewed in this work. We review active and passive micromixers, with a primary focus on widely used passive micromixers. Various microchannel geometries and their features, mixing efficiencies, numerical analysis, and fabrication methods are reviewed. Applications as well as possible future trends and advancements in this field, are included too. It is expected to make the reader curious and more familiar with the interesting field of microfluidics.\u0000","PeriodicalId":18543,"journal":{"name":"Micro and Nanosystems","volume":" ","pages":""},"PeriodicalIF":0.0,"publicationDate":"2023-08-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"46837058","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2023-07-31DOI: 10.2174/1876402915666230731124513
S. Łuczak, Maciej Zams, Paweł Pieńczuk
Thermal drifts of MEMS sensors are one of their biggest shortcomings. However, experimental studies may offer a solution while striving for the reduction of related errors. The aim was to determine the thermal drifts of MEMS accelerometers associated with the offset voltage and the scale factor and then to propose a way of reducing the resultant errors. Four commercial dual-axis MEMS accelerometers (two pieces of ADXL 202E and two pieces of ADXL 203 by Analog Devices Inc.) with analog outputs were experimentally tested with respect to their thermal instability, employing two computer-controlled test rigs that provided a stable orientation of the accelerometers. It was found that the thermal drifts of the offset voltage generated by the tested accelerometers were considerable, resulting in respective errors of about 14 mg (ADXL 202E) or 7 mg (ADXL 203), whereas catalog values of drifts of the scale factor were much lower. The determined values are smaller than their counterparts specified in the relevant manufacturer datasheets; significant differences exist between the tested pieces of the two accelerometers (40% or 78%) as well as between the two sensitive axes of a single accelerometer (84% or 80%), this can be taken into consideration while striving for a higher accuracy of an acceleration measurement.
{"title":"Thermal Instability of Commercial Dual-Axis MEMS Accelerometers","authors":"S. Łuczak, Maciej Zams, Paweł Pieńczuk","doi":"10.2174/1876402915666230731124513","DOIUrl":"https://doi.org/10.2174/1876402915666230731124513","url":null,"abstract":"\u0000\u0000Thermal drifts of MEMS sensors are one of their biggest shortcomings. However, experimental studies may offer a solution while striving for the reduction of related errors.\u0000\u0000\u0000\u0000The aim was to determine the thermal drifts of MEMS accelerometers associated with the offset voltage and the scale factor and then to propose a way of reducing the resultant errors.\u0000\u0000\u0000\u0000Four commercial dual-axis MEMS accelerometers (two pieces of ADXL 202E and two pieces of ADXL 203 by Analog Devices Inc.) with analog outputs were experimentally tested with respect to their thermal instability, employing two computer-controlled test rigs that provided a stable orientation of the accelerometers.\u0000\u0000\u0000\u0000It was found that the thermal drifts of the offset voltage generated by the tested accelerometers were considerable, resulting in respective errors of about 14 mg (ADXL 202E) or 7 mg (ADXL 203), whereas catalog values of drifts of the scale factor were much lower.\u0000\u0000\u0000\u0000The determined values are smaller than their counterparts specified in the relevant manufacturer datasheets; significant differences exist between the tested pieces of the two accelerometers (40% or 78%) as well as between the two sensitive axes of a single accelerometer (84% or 80%), this can be taken into consideration while striving for a higher accuracy of an acceleration measurement.\u0000","PeriodicalId":18543,"journal":{"name":"Micro and Nanosystems","volume":" ","pages":""},"PeriodicalIF":0.0,"publicationDate":"2023-07-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"44024643","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2023-06-06DOI: 10.2174/1876402915666230606120945
A. Tafraouti, Y. Layouni, P.K leimann
Micro-Electrical Discharge Machining (μEDM) is a technique for non-contact machining of conductive or semiconductor materials. It is mainly adapted to machining hard materials. Its principle is based on the creation of electrical discharges between the micro tool and the workpiece, which are immersed in a dielectric It is a complementary process to mechanical or laser micromachining techniques or microelectronics (RIE, DRIE, LIGA). These methods can reach a resolution of 50 nm, but their main drawback is that they are mainly dedicated to silicon. The µEDM process depends on several physical, geometrical, and/or electrical parameters that need to be optimized in order to achieve a resolution lower than 5µm in a reproducible way. The objective of this paper is to study the effect of the applied voltage and the micro-tool diameter on the machining performances (removed volume, lateral gap, machining depth, and crater shape). The optimal parameters were used during drilling holes. An applied voltage of was used as an optimal parameter. . Concerning the diameter of the micro tool, we propose to use large diameter wires (Φ=250µm; Φ=125µm) during the roughing phase for machining complex structures and small diameter micro tools (Φ=80µm; Φ=40µm; Φ=20µm) during the finishing phase
{"title":"Study on the Electrical and Geometrical Parameters of Micro Electrical Discharge Machining","authors":"A. Tafraouti, Y. Layouni, P.K leimann","doi":"10.2174/1876402915666230606120945","DOIUrl":"https://doi.org/10.2174/1876402915666230606120945","url":null,"abstract":"\u0000\u0000Micro-Electrical Discharge Machining (μEDM) is a technique for non-contact machining of conductive or semiconductor materials. It is mainly adapted to machining hard materials. Its principle is based on the creation of electrical discharges between the micro tool and the workpiece, which are immersed in a dielectric\u0000\u0000\u0000\u0000It is a complementary process to mechanical or laser micromachining techniques or microelectronics (RIE, DRIE, LIGA). These methods can reach a resolution of 50 nm, but their main drawback is that they are mainly dedicated to silicon. The µEDM process depends on several physical, geometrical, and/or electrical parameters that need to be optimized in order to achieve a resolution lower than 5µm in a reproducible way. The objective of this paper is to study the effect of the applied voltage and the micro-tool diameter on the machining performances (removed volume, lateral gap, machining depth, and crater shape).\u0000\u0000\u0000\u0000The optimal parameters were used during drilling holes. An applied voltage of was used as an optimal parameter. .\u0000\u0000\u0000\u0000Concerning the diameter of the micro tool, we propose to use large diameter wires (Φ=250µm; Φ=125µm) during the roughing phase for machining complex structures and small diameter micro tools (Φ=80µm; Φ=40µm; Φ=20µm) during the finishing phase\u0000","PeriodicalId":18543,"journal":{"name":"Micro and Nanosystems","volume":" ","pages":""},"PeriodicalIF":0.0,"publicationDate":"2023-06-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"46383706","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2023-06-02DOI: 10.2174/1876402915666230602094033
T. Saleh, Mam Razib, M. Rana, S. Islam, Asan G. A. Muthalif
A new method of modelling surface roughness of the resultant structure from various parameters in the microforming of CNT forests has been developed. One of the top-down microforming methods of CNT forests is called micromechanical bending (M2B). The method uses a high-speed rotating spindle to compact and flatten the surface of CNT forests. It results in the surface structure becoming smoother and increased reflectance of the surface. The reason for this phenomenon is the porosity that decreases by bending CNTs, hence preventing light from passing through. Moreover, the surface roughness is also significantly reduced. However, a study has yet to be conducted to estimate the theoretical value of surface roughness from the identified parameters. This research aims to develop an approach to model the surface roughness of resultant surface from a set of parameters in a micropatterning method Experiments were conducted using a CNC machine to pattern onto CNT Forests using specific parameters, such as 1000, 1500, and 2000 rpm (spindle speed) with feed rates of 1, 5 and 10 mm/min. The step size was kept fixed at 1 µm for each level of the patterning pass. It was found that the periodic pattern of trochoidal mark was engraved on the surface, contributing to the value of measured surface roughness. The results were compared with the theoretical value from the calculation of surface roughness using trochoidal motion with the assumption of the grain sizes of 0.2 µm, 0.3 µm, and 0.4 µm. The actual value of surface roughness was measured using the XE-AFM machine. The grain of 0.2 µm produced the same experimental trend with the theoretical value at rotational speeds of 1000, 1500, and 2000 rpm. However, the theoretical result was shifted downward because the surface could return to the original position due to the elastic properties of the CNTs, hence reducing the surface roughness. The best-fit result was reported for the grain of 0.4 µm, rotational speed of 2000 rpm, and speed rate of 1 mm/min, showing less than 1% difference. Experimentally and theoretically, a good agreement and comparable results proved the effectiveness of the proposed estimating method.
{"title":"Surface roughness modelling of the micromechanically patterned CNT forests","authors":"T. Saleh, Mam Razib, M. Rana, S. Islam, Asan G. A. Muthalif","doi":"10.2174/1876402915666230602094033","DOIUrl":"https://doi.org/10.2174/1876402915666230602094033","url":null,"abstract":"\u0000\u0000A new method of modelling surface roughness of the resultant structure from various parameters in the microforming of CNT forests has been developed. One of the top-down microforming methods of CNT forests is called micromechanical bending (M2B). The method uses a high-speed rotating spindle to compact and flatten the surface of CNT forests. It results in the surface structure becoming smoother and increased reflectance of the surface. The reason for this phenomenon is the porosity that decreases by bending CNTs, hence preventing light from passing through. Moreover, the surface roughness is also significantly reduced. However, a study has yet to be conducted to estimate the theoretical value of surface roughness from the identified parameters.\u0000\u0000\u0000\u0000This research aims to develop an approach to model the surface roughness of resultant surface from a set of parameters in a micropatterning method\u0000\u0000\u0000\u0000Experiments were conducted using a CNC machine to pattern onto CNT Forests using specific parameters, such as 1000, 1500, and 2000 rpm (spindle speed) with feed rates of 1, 5 and 10 mm/min. The step size was kept fixed at 1 µm for each level of the patterning pass. It was found that the periodic pattern of trochoidal mark was engraved on the surface, contributing to the value of measured surface roughness.\u0000\u0000\u0000\u0000The results were compared with the theoretical value from the calculation of surface roughness using trochoidal motion with the assumption of the grain sizes of 0.2 µm, 0.3 µm, and 0.4 µm. The actual value of surface roughness was measured using the XE-AFM machine. The grain of 0.2 µm produced the same experimental trend with the theoretical value at rotational speeds of 1000, 1500, and 2000 rpm. However, the theoretical result was shifted downward because the surface could return to the original position due to the elastic properties of the CNTs, hence reducing the surface roughness. The best-fit result was reported for the grain of 0.4 µm, rotational speed of 2000 rpm, and speed rate of 1 mm/min, showing less than 1% difference.\u0000\u0000\u0000\u0000Experimentally and theoretically, a good agreement and comparable results proved the effectiveness of the proposed estimating method.\u0000","PeriodicalId":18543,"journal":{"name":"Micro and Nanosystems","volume":" ","pages":""},"PeriodicalIF":0.0,"publicationDate":"2023-06-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"42835019","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2023-05-18DOI: 10.2174/1876402915666230518122506
M. Rädle, Gururaj Fattepur, R. Vaidyanathan, R. Guttal
Nature-inspired designs, which have evolved from proven strategies of nature, have been a constant source of inspiration for designers and engineers to solve real-life problems. Current bionic design methods are theoretical and are discordant with the design engineering workflow. A proposed methodology suggests suitable bionic forms for a given design space. This procedure consists of the following stages: bionic representation, relation, emulation, engineering specifications, design verification, optimisation (BREED), and finally, realisation. This methodology aims to function as a systematic problem-solving approach to retrieve structural inspirations from nature and mimic its form The inspiration and validation phases of the bionic structure are represented as a V-model. The designer can leverage this framework to develop novel bionic design concepts.
{"title":"A Problem-solving Bionic Design Methodology For Structural Applications (BREED)","authors":"M. Rädle, Gururaj Fattepur, R. Vaidyanathan, R. Guttal","doi":"10.2174/1876402915666230518122506","DOIUrl":"https://doi.org/10.2174/1876402915666230518122506","url":null,"abstract":"\u0000\u0000Nature-inspired designs, which have evolved from proven strategies of nature, have been a constant source of inspiration for designers and engineers to solve real-life problems.\u0000\u0000\u0000\u0000Current bionic design methods are theoretical and are discordant with the design engineering workflow. A proposed methodology suggests suitable bionic forms for a given design space. This procedure consists of the following stages: bionic representation, relation, emulation, engineering specifications, design verification, optimisation (BREED), and finally, realisation.\u0000\u0000\u0000\u0000This methodology aims to function as a systematic problem-solving approach to retrieve structural inspirations from nature and mimic its form\u0000\u0000\u0000\u0000The inspiration and validation phases of the bionic structure are represented as a V-model. The designer can leverage this framework to develop novel bionic design concepts.\u0000","PeriodicalId":18543,"journal":{"name":"Micro and Nanosystems","volume":" ","pages":""},"PeriodicalIF":0.0,"publicationDate":"2023-05-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"49597942","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2023-05-18DOI: 10.2174/1876402915666230518121949
Smriti Ojha, Sudhanshu Mishra
Lipid nanocarriers (NLCs) have undergone significant research over the past two decades to determine how well they target drugs to important parts of the human body, such as the central nervous system (CNS), the heart region, tumor cells, etc. The objective of this review paper was to review and critically summarize recent progress in NLC for targeting CNS. The structure, classification, elements, and numerous preparation techniques have been carefully outlined in this paper, along with their benefits and drawbacks, as demonstrated by several research investigations. This review focuses on recent developments in NLCs for brain targeting of bioactives with special attention to their surface modifications, formulation aspects, pharmacokinetic behavior, and effectiveness for treating a variety of brain disorders. Poorly water-soluble bioactive substances’ physicochemical properties and behavior, such as aqueous dispersibility and oral bioavailability, can be greatly improved using lipid nanocarriers. Due to the brain's complicated structure and numerous protective systems, drug distribution to the brain has remained a difficult problem for scientists. The employment of an appropriate nanocarrier technology and an alternate drug delivery method, such as nose-to-brain drug delivery, could overcome the problem of brain targeting and increase the therapeutic effectiveness of CNS-acting medications. The pharmaceutical business has recently transformed various innovative drug delivery methods that address the drawbacks of conventional drug delivery systems and offer a good benefit-to-risk ratio.
{"title":"Nanostructured lipid carriers for targeting Central nervous system: Recent Advancements","authors":"Smriti Ojha, Sudhanshu Mishra","doi":"10.2174/1876402915666230518121949","DOIUrl":"https://doi.org/10.2174/1876402915666230518121949","url":null,"abstract":"\u0000\u0000Lipid nanocarriers (NLCs) have undergone significant research over the past two decades to determine how well they target drugs to important parts of the human body, such as the central nervous system (CNS), the heart region, tumor cells, etc.\u0000\u0000\u0000\u0000The objective of this review paper was to review and critically summarize recent progress in NLC for targeting CNS.\u0000\u0000\u0000\u0000The structure, classification, elements, and numerous preparation techniques have been carefully outlined in this paper, along with their benefits and drawbacks, as demonstrated by several research investigations.\u0000\u0000\u0000\u0000This review focuses on recent developments in NLCs for brain targeting of bioactives with special attention to their surface modifications, formulation aspects, pharmacokinetic behavior, and effectiveness for treating a variety of brain disorders.\u0000\u0000\u0000\u0000Poorly water-soluble bioactive substances’ physicochemical properties and behavior, such as aqueous dispersibility and oral bioavailability, can be greatly improved using lipid nanocarriers. Due to the brain's complicated structure and numerous protective systems, drug distribution to the brain has remained a difficult problem for scientists. The employment of an appropriate nanocarrier technology and an alternate drug delivery method, such as nose-to-brain drug delivery, could overcome the problem of brain targeting and increase the therapeutic effectiveness of CNS-acting medications. The pharmaceutical business has recently transformed various innovative drug delivery methods that address the drawbacks of conventional drug delivery systems and offer a good benefit-to-risk ratio.\u0000","PeriodicalId":18543,"journal":{"name":"Micro and Nanosystems","volume":" ","pages":""},"PeriodicalIF":0.0,"publicationDate":"2023-05-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"42598839","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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