Pub Date : 2012-11-12DOI: 10.1109/ISEMC.2012.6350920
F. Grassi, G. Spadacini, S. Pignari
This work deals with human exposure of workers to electromagnetic fields generated by manual arc-welding processes, and focuses on the comparison between current ICNIRP basic restrictions (2010), defined as internal electric field values, and previous ICNIRP basic restrictions (1998), still in force in the EU till the Directive 2004/40/EC will be revised, defined in terms of induced current density. To this aim, numerical simulation is used to mimic the exposure setup defined in Standard EN 50444, in the severe case of Tungsten Inert Gas (TIG) welding involving square-wave currents. It is shown that application of the new ICNIRP Guidelines leads to a significant reduction of the exposure index.
{"title":"Human exposure in arc-welding processes: Current versus previous ICNIRP basic restrictions","authors":"F. Grassi, G. Spadacini, S. Pignari","doi":"10.1109/ISEMC.2012.6350920","DOIUrl":"https://doi.org/10.1109/ISEMC.2012.6350920","url":null,"abstract":"This work deals with human exposure of workers to electromagnetic fields generated by manual arc-welding processes, and focuses on the comparison between current ICNIRP basic restrictions (2010), defined as internal electric field values, and previous ICNIRP basic restrictions (1998), still in force in the EU till the Directive 2004/40/EC will be revised, defined in terms of induced current density. To this aim, numerical simulation is used to mimic the exposure setup defined in Standard EN 50444, in the severe case of Tungsten Inert Gas (TIG) welding involving square-wave currents. It is shown that application of the new ICNIRP Guidelines leads to a significant reduction of the exposure index.","PeriodicalId":197346,"journal":{"name":"2012 IEEE International Symposium on Electromagnetic Compatibility","volume":"11 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-11-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128973048","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2012-11-12DOI: 10.1109/ISEMC.2012.6351677
Jian-Yao Zhao, W. Yin, Ming-da Zhu, W. Luo
One adaptive method, based on time-domain E-PMCHW (Poggio, Miller, Chang, Harrington and Wu) integral equation, is presented for predicting transient scattering and radiation responses of some composite structures made of perfectly conducting (PEC) and dielectric materials. Both PEC and dielectric parts are described by the electric field integral equations (EFIE) and the PMCHW ones, respectively, with a set of time domain E-PMCHW equations derived. The common RWG and line basis functions are used to expand surface and wire currents, respectively. The derived equations are then solved by marching-on-in-order (MOO) procedure, where an alternative overall stopping criterion is used in an adaptive way. Some typical numerical results are given to demonstrate its accuracy in capturing transient scattering and radiation responses of some typical composites in the presence of an intentional electromagnetic pulse (IEMP).
提出了一种基于时域E-PMCHW (Poggio, Miller, Chang, Harrington and Wu)积分方程的自适应方法，用于预测某些完美导电材料与介电材料构成的复合结构的瞬态散射和辐射响应。分别用电场积分方程(EFIE)和PMCHW方程来描述电场和介电部分，并推导出一组时域E-PMCHW方程。常用的RWG和线基函数分别用于扩展表面电流和导线电流。然后，采用自适应方式采用备选总体停止准则的顺序行进(MOO)方法求解导出的方程。给出了一些典型的数值结果，证明了该方法能够准确地捕捉一些典型复合材料在意图电磁脉冲(IEMP)作用下的瞬态散射和辐射响应。
{"title":"Time domain E-PMCHW integral equation solved by adaptive marching-on-in-order procedure for predicting transient responses of some composite structures","authors":"Jian-Yao Zhao, W. Yin, Ming-da Zhu, W. Luo","doi":"10.1109/ISEMC.2012.6351677","DOIUrl":"https://doi.org/10.1109/ISEMC.2012.6351677","url":null,"abstract":"One adaptive method, based on time-domain E-PMCHW (Poggio, Miller, Chang, Harrington and Wu) integral equation, is presented for predicting transient scattering and radiation responses of some composite structures made of perfectly conducting (PEC) and dielectric materials. Both PEC and dielectric parts are described by the electric field integral equations (EFIE) and the PMCHW ones, respectively, with a set of time domain E-PMCHW equations derived. The common RWG and line basis functions are used to expand surface and wire currents, respectively. The derived equations are then solved by marching-on-in-order (MOO) procedure, where an alternative overall stopping criterion is used in an adaptive way. Some typical numerical results are given to demonstrate its accuracy in capturing transient scattering and radiation responses of some typical composites in the presence of an intentional electromagnetic pulse (IEMP).","PeriodicalId":197346,"journal":{"name":"2012 IEEE International Symposium on Electromagnetic Compatibility","volume":"133 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-11-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127026465","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2012-11-12DOI: 10.1109/ISEMC.2012.6351829
E. Savage, W. Radasky
In this paper we present an overview of the IEMI threat, discuss an assessment approach, and present mitigation options. Because it is often dominant, we concentrate on cable coupling of radiated RF (radio frequency) power as the means of IEMI attack. We separate an IEMI attack into various parts, and introduce an efficient approach for assessing the IEMI vulnerability of a facility. We then present some methods to mitigate IEMI attacks, especially for network cable coupling. Finally, we review ongoing worldwide IEMI efforts.
{"title":"Overview of the threat of IEMI (intentional electromagnetic interference)","authors":"E. Savage, W. Radasky","doi":"10.1109/ISEMC.2012.6351829","DOIUrl":"https://doi.org/10.1109/ISEMC.2012.6351829","url":null,"abstract":"In this paper we present an overview of the IEMI threat, discuss an assessment approach, and present mitigation options. Because it is often dominant, we concentrate on cable coupling of radiated RF (radio frequency) power as the means of IEMI attack. We separate an IEMI attack into various parts, and introduce an efficient approach for assessing the IEMI vulnerability of a facility. We then present some methods to mitigate IEMI attacks, especially for network cable coupling. Finally, we review ongoing worldwide IEMI efforts.","PeriodicalId":197346,"journal":{"name":"2012 IEEE International Symposium on Electromagnetic Compatibility","volume":"2 3","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-11-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114121913","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2012-11-12DOI: 10.1109/ISEMC.2012.6351813
B. Rautio, Qiang Long, A. Agrawal, M. E. El Sabbagh
In this work, we present a novel methodology for geometric rasterization of arbitrary 3D planar geometries, and apply it to perform electromagnetic simulation based calibration for accurate high-frequency measurements of Graphene conductivity. The conductivity measurements may find application in the area of high-frequency Graphene-based circuits, specifically that of interconnects. Preliminary experimental and simulation results are shown and discussed.
{"title":"Simulation geometry rasterization for applications toward graphene interconnect characterization","authors":"B. Rautio, Qiang Long, A. Agrawal, M. E. El Sabbagh","doi":"10.1109/ISEMC.2012.6351813","DOIUrl":"https://doi.org/10.1109/ISEMC.2012.6351813","url":null,"abstract":"In this work, we present a novel methodology for geometric rasterization of arbitrary 3D planar geometries, and apply it to perform electromagnetic simulation based calibration for accurate high-frequency measurements of Graphene conductivity. The conductivity measurements may find application in the area of high-frequency Graphene-based circuits, specifically that of interconnects. Preliminary experimental and simulation results are shown and discussed.","PeriodicalId":197346,"journal":{"name":"2012 IEEE International Symposium on Electromagnetic Compatibility","volume":"128 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-11-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122316316","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2012-11-12DOI: 10.1109/ISEMC.2012.6351798
K. Armstrong
Where electronic equipment must function so as to maintain very low risk levels for safety, financial, or other reasons, it is not sufficient to only test it for immunity to electromagnetic (EM) disturbances, whatever the test levels used. However, where EM immunity tests are used as a part of such equipment's verification or validation, for their results to be meaningful for the achievement of low risks, it is necessary to increase the test levels significantly above the levels of EM disturbances that could occur in the operational environment(s). This paper describes a number of reasons for increasing immunity test levels, gives some guidance on by how much, and discusses the problems that this approach can encounter.
{"title":"Testing for immunity to simultaneous disturbances and similar issues for risk managing EMC","authors":"K. Armstrong","doi":"10.1109/ISEMC.2012.6351798","DOIUrl":"https://doi.org/10.1109/ISEMC.2012.6351798","url":null,"abstract":"Where electronic equipment must function so as to maintain very low risk levels for safety, financial, or other reasons, it is not sufficient to only test it for immunity to electromagnetic (EM) disturbances, whatever the test levels used. However, where EM immunity tests are used as a part of such equipment's verification or validation, for their results to be meaningful for the achievement of low risks, it is necessary to increase the test levels significantly above the levels of EM disturbances that could occur in the operational environment(s). This paper describes a number of reasons for increasing immunity test levels, gives some guidance on by how much, and discusses the problems that this approach can encounter.","PeriodicalId":197346,"journal":{"name":"2012 IEEE International Symposium on Electromagnetic Compatibility","volume":"3 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-11-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129230006","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2012-11-12DOI: 10.1109/ISEMC.2012.6351690
F. Nakamoto, T. Uchida, C. Miyazaki, N. Oka, K. Misu
We studied a CMC model with a one-turn toroidal core, which is easily used in 3D field simulators. The calculation model of a CMC differs from the actual shape, so we need to correct the CMC's characteristics. When we calculated the noise-suppressing effect of the CMC, we used relative permeability, which differs from the actual value, to approximate the actual characteristics of a CMC. From the comparison of calculated results with measurement results, the calculated results were comparable to the measurement results. We confirmed the validity of our model.
{"title":"A simplified model of a common mode choke coil for 3D field simulators","authors":"F. Nakamoto, T. Uchida, C. Miyazaki, N. Oka, K. Misu","doi":"10.1109/ISEMC.2012.6351690","DOIUrl":"https://doi.org/10.1109/ISEMC.2012.6351690","url":null,"abstract":"We studied a CMC model with a one-turn toroidal core, which is easily used in 3D field simulators. The calculation model of a CMC differs from the actual shape, so we need to correct the CMC's characteristics. When we calculated the noise-suppressing effect of the CMC, we used relative permeability, which differs from the actual value, to approximate the actual characteristics of a CMC. From the comparison of calculated results with measurement results, the calculated results were comparable to the measurement results. We confirmed the validity of our model.","PeriodicalId":197346,"journal":{"name":"2012 IEEE International Symposium on Electromagnetic Compatibility","volume":"36 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-11-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116719826","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2012-11-12DOI: 10.1109/ISEMC.2012.6351650
Ji Zhang, Jianmin Zhang, J. Lim, K. Qiu, R. Brooks, B. Chen
In modern high performance networking systems, high-speed channels are among the most concerns due to the channel loss, discontinuities and crosstalk as data rate reaches 15 Gbps (Gigabit per second) and above through backplane. Full-wave modeling and system level simulations are widely used to estimate the performance for high-speed channels. Due to the variations and uncertainties associated with the simulation and manufacturing, correlation between simulation and measurement is often used to gain confidence on the channel performance prediction. In this paper, a high-speed channel including the portion inside a high-end ASIC (Application-Specific Integrated Circuit) package and the portion on a PCB (Printed Circuit Board) are investigated. The FSV (Feature Selection Validation) method is used to correlate the channel simulation and measurement, and quantitative conclusions between modeling and measurement are given for the studied channels.
{"title":"Using FSV in high-speed channel characterization and correlation","authors":"Ji Zhang, Jianmin Zhang, J. Lim, K. Qiu, R. Brooks, B. Chen","doi":"10.1109/ISEMC.2012.6351650","DOIUrl":"https://doi.org/10.1109/ISEMC.2012.6351650","url":null,"abstract":"In modern high performance networking systems, high-speed channels are among the most concerns due to the channel loss, discontinuities and crosstalk as data rate reaches 15 Gbps (Gigabit per second) and above through backplane. Full-wave modeling and system level simulations are widely used to estimate the performance for high-speed channels. Due to the variations and uncertainties associated with the simulation and manufacturing, correlation between simulation and measurement is often used to gain confidence on the channel performance prediction. In this paper, a high-speed channel including the portion inside a high-end ASIC (Application-Specific Integrated Circuit) package and the portion on a PCB (Printed Circuit Board) are investigated. The FSV (Feature Selection Validation) method is used to correlate the channel simulation and measurement, and quantitative conclusions between modeling and measurement are given for the studied channels.","PeriodicalId":197346,"journal":{"name":"2012 IEEE International Symposium on Electromagnetic Compatibility","volume":"6 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-11-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115263827","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2012-11-12DOI: 10.1109/ISEMC.2012.6351647
A. Sugiura, M. Alexander, D. Knight, K. Fujii
The International Special Committee on Radio Interference (CISPR) has included in the draft standard CISPR 16-1-6, the equivalent capacitance substitution method (ECSM) for the calibration of monopole antennas below 30 MHz. To provide background information on the ECSM for CISPR 16-1-6 currently discussed, the present paper investigates the principle and uncertainty analysis of the ECSM in detail.
{"title":"Equivalent capacitance substitution method for monopole antenna calibration","authors":"A. Sugiura, M. Alexander, D. Knight, K. Fujii","doi":"10.1109/ISEMC.2012.6351647","DOIUrl":"https://doi.org/10.1109/ISEMC.2012.6351647","url":null,"abstract":"The International Special Committee on Radio Interference (CISPR) has included in the draft standard CISPR 16-1-6, the equivalent capacitance substitution method (ECSM) for the calibration of monopole antennas below 30 MHz. To provide background information on the ECSM for CISPR 16-1-6 currently discussed, the present paper investigates the principle and uncertainty analysis of the ECSM in detail.","PeriodicalId":197346,"journal":{"name":"2012 IEEE International Symposium on Electromagnetic Compatibility","volume":"35 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-11-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115293023","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2012-11-12DOI: 10.1109/ISEMC.2012.6351673
C. Hwang, Kiyeong Kim, J. Pak, Joungho Kim
An on-chip electromagnetic bandgap (EBG) structure is applied to protect a delay-locked loop (DLL) from simultaneous switching noise (SSN) coupling. The fabricated on-chip EBG structure has a low cut-off frequency of approximately 1 GHz. An accumulation-mode MOS capacitor is used to achieve a high layout efficiency for the MOS capacitor and therefore a large value of capacitance for the same layout area. The on-chip EBG structure is embedded in the middle of an on-chip power distribution network in which the DLL and an inverter chain acting as a noise source are connected. The measured results showed that the jitter at the DLL clock output is severely increased by the coupled SSN from the inverter chain. However, the operation of the inverter chain did not affect the jitter when the DLL was protected by the on-chip EBG structure.
{"title":"Protection of a delay-locked loop from simultaneous switching noise coupling using an on-chip electromagnetic bandgap structure","authors":"C. Hwang, Kiyeong Kim, J. Pak, Joungho Kim","doi":"10.1109/ISEMC.2012.6351673","DOIUrl":"https://doi.org/10.1109/ISEMC.2012.6351673","url":null,"abstract":"An on-chip electromagnetic bandgap (EBG) structure is applied to protect a delay-locked loop (DLL) from simultaneous switching noise (SSN) coupling. The fabricated on-chip EBG structure has a low cut-off frequency of approximately 1 GHz. An accumulation-mode MOS capacitor is used to achieve a high layout efficiency for the MOS capacitor and therefore a large value of capacitance for the same layout area. The on-chip EBG structure is embedded in the middle of an on-chip power distribution network in which the DLL and an inverter chain acting as a noise source are connected. The measured results showed that the jitter at the DLL clock output is severely increased by the coupled SSN from the inverter chain. However, the operation of the inverter chain did not affect the jitter when the DLL was protected by the on-chip EBG structure.","PeriodicalId":197346,"journal":{"name":"2012 IEEE International Symposium on Electromagnetic Compatibility","volume":"6 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-11-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114929380","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2012-11-12DOI: 10.1109/ISEMC.2012.6351645
V. Khilkevich, D. Pommerenke, Li Gang, Xu Shuai
Measuring common mode currents on differential microstrip transmission lines is a complicated task, because the common mode current, being the parasitic mode, is usually much weaker than the intended differential current. Hence, the measurement technique has to provide sufficient rejection of the differential mode. The probe described in this paper uses a shielded loop probe combined with a metallic screen to enhance the differential mode rejection of the current probe. The proposed techniques were tested on a test board at frequencies up to 6 GHz.
{"title":"An inductive probe for the measurement of common mode currents on differential traces","authors":"V. Khilkevich, D. Pommerenke, Li Gang, Xu Shuai","doi":"10.1109/ISEMC.2012.6351645","DOIUrl":"https://doi.org/10.1109/ISEMC.2012.6351645","url":null,"abstract":"Measuring common mode currents on differential microstrip transmission lines is a complicated task, because the common mode current, being the parasitic mode, is usually much weaker than the intended differential current. Hence, the measurement technique has to provide sufficient rejection of the differential mode. The probe described in this paper uses a shielded loop probe combined with a metallic screen to enhance the differential mode rejection of the current probe. The proposed techniques were tested on a test board at frequencies up to 6 GHz.","PeriodicalId":197346,"journal":{"name":"2012 IEEE International Symposium on Electromagnetic Compatibility","volume":"14 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-11-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127067520","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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