Pub Date : 2012-11-12DOI: 10.1109/ISEMC.2012.6350922
Wei-Jiang Zhao, Hark-Byeong Park, Matthias H. Y. Tan, H. Park, E. Liu, Eakhwan Song, E. Li
A general and flexible approach is presented for predicting far-field radiated emissions from a device using phaseless magnetic near-field scan data, which is based on the replacement of the actual radiating sources by an equivalent set of electric currents over a planar surface near the device. These equivalent currents used to predict the far-field radiated emissions are determined from near-field scan data by solving two independent nonlinear inverse problems with a global optimization algorithm. Numerical examples are presented to demonstrate the validity and capability of the presented approach.
{"title":"Far-field prediction from amplitude-only near-field measurements using equivalent electric currents","authors":"Wei-Jiang Zhao, Hark-Byeong Park, Matthias H. Y. Tan, H. Park, E. Liu, Eakhwan Song, E. Li","doi":"10.1109/ISEMC.2012.6350922","DOIUrl":"https://doi.org/10.1109/ISEMC.2012.6350922","url":null,"abstract":"A general and flexible approach is presented for predicting far-field radiated emissions from a device using phaseless magnetic near-field scan data, which is based on the replacement of the actual radiating sources by an equivalent set of electric currents over a planar surface near the device. These equivalent currents used to predict the far-field radiated emissions are determined from near-field scan data by solving two independent nonlinear inverse problems with a global optimization algorithm. Numerical examples are presented to demonstrate the validity and capability of the presented approach.","PeriodicalId":197346,"journal":{"name":"2012 IEEE International Symposium on Electromagnetic Compatibility","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2012-11-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129404220","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2012-11-12DOI: 10.1109/ISEMC.2012.6351675
Kai Xiao, J. Hock, B. Bissonette, X. Ye
In a computer system design, printed-circuit board (PCB) and package designers may unknowingly ignore critical high-Q resonate phenomena. This is often associated with structures that are not direct part of the intended signaling path and/or not actively included in a typical signal integrity analysis. An example of the detrimental resonance impact due to an improperly terminated “no-connect” pin reveals a new class of problems associated with multi-gigabit signaling.
{"title":"Unintended passive resonant structures in interconnect designs for multi-gigabit signaling","authors":"Kai Xiao, J. Hock, B. Bissonette, X. Ye","doi":"10.1109/ISEMC.2012.6351675","DOIUrl":"https://doi.org/10.1109/ISEMC.2012.6351675","url":null,"abstract":"In a computer system design, printed-circuit board (PCB) and package designers may unknowingly ignore critical high-Q resonate phenomena. This is often associated with structures that are not direct part of the intended signaling path and/or not actively included in a typical signal integrity analysis. An example of the detrimental resonance impact due to an improperly terminated “no-connect” pin reveals a new class of problems associated with multi-gigabit signaling.","PeriodicalId":197346,"journal":{"name":"2012 IEEE International Symposium on Electromagnetic Compatibility","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2012-11-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123532257","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2012-11-12DOI: 10.1109/ISEMC.2012.6351787
C. Ye, Kai Xiao, M. Johnston, Ricardo U. Chavez Cuadras, X. Ye
A measurement based methodology is introduced to evaluate die-to-die link performance for high-speed IOs. The die-to-die link is from TX silicon pad to RX pad and incorporates all the storage IO interconnect components. A BERT scope is used as the TX buffer driving signal into a bare chipset package at the bumps with adjustable TX jitter, Vswing, de-emphasis, etc. An oscilloscope is used as the RX buffer receiving signal at the hard disk drive pad with scope built-in features such as DFE and CTLE. This methodology can be used to evaluate link die-die to performance before silicon tape out, to de-couple system issues between silicon and interconnect, to provide input for new spec development, to correlate simulation and measurement and to explore solution space envelope. This method does not call for a specially designed test vehicles. Test examples are introduced for a 6Gbps link to demonstrate the methodology and to evaluate the interconnect healthiness.
{"title":"Evaluating high-speed link performance using direct end-to-end measurement","authors":"C. Ye, Kai Xiao, M. Johnston, Ricardo U. Chavez Cuadras, X. Ye","doi":"10.1109/ISEMC.2012.6351787","DOIUrl":"https://doi.org/10.1109/ISEMC.2012.6351787","url":null,"abstract":"A measurement based methodology is introduced to evaluate die-to-die link performance for high-speed IOs. The die-to-die link is from TX silicon pad to RX pad and incorporates all the storage IO interconnect components. A BERT scope is used as the TX buffer driving signal into a bare chipset package at the bumps with adjustable TX jitter, Vswing, de-emphasis, etc. An oscilloscope is used as the RX buffer receiving signal at the hard disk drive pad with scope built-in features such as DFE and CTLE. This methodology can be used to evaluate link die-die to performance before silicon tape out, to de-couple system issues between silicon and interconnect, to provide input for new spec development, to correlate simulation and measurement and to explore solution space envelope. This method does not call for a specially designed test vehicles. Test examples are introduced for a 6Gbps link to demonstrate the methodology and to evaluate the interconnect healthiness.","PeriodicalId":197346,"journal":{"name":"2012 IEEE International Symposium on Electromagnetic Compatibility","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2012-11-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125091701","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2012-11-12DOI: 10.1109/ISEMC.2012.6350931
H. Ottke, C. Hammerschmidt
With increased demand in the radio spectrum, there have been multiple recent campaigns to quantify spectrum occupancy through measurements. These measurements can pose many challenges, one of which is created by impulsive noise. Below 500 MHz, impulse noise can be particularly prominent and mimic narrowband LMR emissions during measurements that use common swept spectrum measurement techniques. This paper discusses methods to properly measure the intentionally radiated signals in the environment while minimizing measurement of unintentional emissions and describes processing algorithms that may be used to assist in distinguishing between LMR emissions and impulsive noise.
{"title":"Specialized algorithms for spectrum surveys","authors":"H. Ottke, C. Hammerschmidt","doi":"10.1109/ISEMC.2012.6350931","DOIUrl":"https://doi.org/10.1109/ISEMC.2012.6350931","url":null,"abstract":"With increased demand in the radio spectrum, there have been multiple recent campaigns to quantify spectrum occupancy through measurements. These measurements can pose many challenges, one of which is created by impulsive noise. Below 500 MHz, impulse noise can be particularly prominent and mimic narrowband LMR emissions during measurements that use common swept spectrum measurement techniques. This paper discusses methods to properly measure the intentionally radiated signals in the environment while minimizing measurement of unintentional emissions and describes processing algorithms that may be used to assist in distinguishing between LMR emissions and impulsive noise.","PeriodicalId":197346,"journal":{"name":"2012 IEEE International Symposium on Electromagnetic Compatibility","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2012-11-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127925738","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2012-11-12DOI: 10.1109/ISEMC.2012.6351806
A. Krause, L. Nguyen, C. Tuan, J. Bonsell, Bing Chen, J. D. Blasey, J. P. Zemotel, H. McNerney, F. J. Metzger
Conductive concrete mixture was originally developed for surface de-icing purposes but can be designed to perform as an electromagnetic shield. Testing procedures have been developed to measure the attenuation provided by conductive concrete without the cost and labor of building a large structure. This paper provides a description of the design, testing methods, and results obtained from the development of conductive concrete as an electromagnetic shielding material.
{"title":"Conductive concrete as an electromagnetic shield","authors":"A. Krause, L. Nguyen, C. Tuan, J. Bonsell, Bing Chen, J. D. Blasey, J. P. Zemotel, H. McNerney, F. J. Metzger","doi":"10.1109/ISEMC.2012.6351806","DOIUrl":"https://doi.org/10.1109/ISEMC.2012.6351806","url":null,"abstract":"Conductive concrete mixture was originally developed for surface de-icing purposes but can be designed to perform as an electromagnetic shield. Testing procedures have been developed to measure the attenuation provided by conductive concrete without the cost and labor of building a large structure. This paper provides a description of the design, testing methods, and results obtained from the development of conductive concrete as an electromagnetic shielding material.","PeriodicalId":197346,"journal":{"name":"2012 IEEE International Symposium on Electromagnetic Compatibility","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2012-11-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128044127","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2012-11-12DOI: 10.1109/ISEMC.2012.6351649
M. R. Johnson, E. Coffey
Feature Selection Validation has now become an IEEE Standard, and is gaining popularity in the Computational Electromagnetic Community. As with any new approach it presents new and unique challenges to the user. This paper explores the use of Feature Selection Validation for evaluating far-field patterns in several examples and discusses some practical limitation discovered. One important conclusion that must be drawn is that context remains the most important aspect of evaluating results with the Feature Selection Validation process.
{"title":"Using FSV with far-field patterns","authors":"M. R. Johnson, E. Coffey","doi":"10.1109/ISEMC.2012.6351649","DOIUrl":"https://doi.org/10.1109/ISEMC.2012.6351649","url":null,"abstract":"Feature Selection Validation has now become an IEEE Standard, and is gaining popularity in the Computational Electromagnetic Community. As with any new approach it presents new and unique challenges to the user. This paper explores the use of Feature Selection Validation for evaluating far-field patterns in several examples and discusses some practical limitation discovered. One important conclusion that must be drawn is that context remains the most important aspect of evaluating results with the Feature Selection Validation process.","PeriodicalId":197346,"journal":{"name":"2012 IEEE International Symposium on Electromagnetic Compatibility","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2012-11-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129841855","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2012-11-12DOI: 10.1109/ISEMC.2012.6351804
C. McCreary, B. Lail
Aircraft manufacturers are increasingly choosing to use Carbon Composite material for the design of their airframes due to its obvious advantage of reducing the weight of the aircraft. However, a disadvantage of this decision is the large increase in the lightning indirect effect levels to which avionics equipment are exposed. The typical method of protecting avionic interfaces from these transients is to clamp the transient using a suppression device such as: metal oxide varistors (MOV), transient voltage suppressors (TVS), or gas discharge tubes (GDT). Higher transient levels typically results in larger components, but aircraft manufacturers demand that the avionics equipment does not increase in physical size. This presents a major challenge to avionics manufacturers. This paper presents some techniques used to meet this challenge.
{"title":"Lightning transient suppression circuit design for avionics equipment","authors":"C. McCreary, B. Lail","doi":"10.1109/ISEMC.2012.6351804","DOIUrl":"https://doi.org/10.1109/ISEMC.2012.6351804","url":null,"abstract":"Aircraft manufacturers are increasingly choosing to use Carbon Composite material for the design of their airframes due to its obvious advantage of reducing the weight of the aircraft. However, a disadvantage of this decision is the large increase in the lightning indirect effect levels to which avionics equipment are exposed. The typical method of protecting avionic interfaces from these transients is to clamp the transient using a suppression device such as: metal oxide varistors (MOV), transient voltage suppressors (TVS), or gas discharge tubes (GDT). Higher transient levels typically results in larger components, but aircraft manufacturers demand that the avionics equipment does not increase in physical size. This presents a major challenge to avionics manufacturers. This paper presents some techniques used to meet this challenge.","PeriodicalId":197346,"journal":{"name":"2012 IEEE International Symposium on Electromagnetic Compatibility","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2012-11-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129270178","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2012-11-12DOI: 10.1109/ISEMC.2012.6351802
Yang Guo, Xiaoling Yang, Wenhua Yu, W. Yin
We present an effective simulation technique for large antenna array using parallel FDTD method in this paper. One of the important issues in the simulation of antenna array is the coupling consideration between the antenna elements. The full wave simulation can take the coupling of the antenna elements into account; however, it is either beyond the ability of computer resources or not reasonable simulation time. We introduce an effective simulation method to consider the coupling effect through the multiple simulations of a small local region. The parallel FDTD method has been successfully applied to solve the various EMC and other electromagnetic phenomena. There are two important issues in the simulation of large phase antenna array using parallel FDTD method: (1) each phase distribution requires an independent simulation that losses the wideband feature of FDTD method; and (2) for a very large antenna array, the parallel FDTD algorithm running on a powerful computer cluster cannot solve the most practical phased array problems today. Here, we use the concept of characteristic basis function of an antenna array to efficiently simulate one large antenna array. In this method, we only need to simulate a small array as a basis function with different excitation patterns. The solution to the original array can be obtained by summarizing the basis function weighted by the element factor.
{"title":"An effective simulation technique for large phased arrays using parallel FDTD method","authors":"Yang Guo, Xiaoling Yang, Wenhua Yu, W. Yin","doi":"10.1109/ISEMC.2012.6351802","DOIUrl":"https://doi.org/10.1109/ISEMC.2012.6351802","url":null,"abstract":"We present an effective simulation technique for large antenna array using parallel FDTD method in this paper. One of the important issues in the simulation of antenna array is the coupling consideration between the antenna elements. The full wave simulation can take the coupling of the antenna elements into account; however, it is either beyond the ability of computer resources or not reasonable simulation time. We introduce an effective simulation method to consider the coupling effect through the multiple simulations of a small local region. The parallel FDTD method has been successfully applied to solve the various EMC and other electromagnetic phenomena. There are two important issues in the simulation of large phase antenna array using parallel FDTD method: (1) each phase distribution requires an independent simulation that losses the wideband feature of FDTD method; and (2) for a very large antenna array, the parallel FDTD algorithm running on a powerful computer cluster cannot solve the most practical phased array problems today. Here, we use the concept of characteristic basis function of an antenna array to efficiently simulate one large antenna array. In this method, we only need to simulate a small array as a basis function with different excitation patterns. The solution to the original array can be obtained by summarizing the basis function weighted by the element factor.","PeriodicalId":197346,"journal":{"name":"2012 IEEE International Symposium on Electromagnetic Compatibility","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2012-11-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116990433","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2012-11-12DOI: 10.1109/ISEMC.2012.6351755
Dazhao Liu, Siming Pan, B. Achkir, J. Fan
A fast method to calculate the admittance matrix of Through Silicon Vias (TSVs) is proposed in this paper. The silicon dioxide layers are equivalently modelled using the bound charge on the conductor surfaces as well as on the dielectric interface between the silicon dioxide and the silicon regions. Unknown surface densities of both the free and bound charge are expanded using the axial harmonics. Galerkin's method is then applied to obtain the capacitance and conductance matrices. The proposed method is validated with a full-wave 2D cross-sectional analysis tool for a typical TSV pair structure. Comparisons with popular closed-form expressions are also discussed.
{"title":"Fast admittance computation for TSV arrays","authors":"Dazhao Liu, Siming Pan, B. Achkir, J. Fan","doi":"10.1109/ISEMC.2012.6351755","DOIUrl":"https://doi.org/10.1109/ISEMC.2012.6351755","url":null,"abstract":"A fast method to calculate the admittance matrix of Through Silicon Vias (TSVs) is proposed in this paper. The silicon dioxide layers are equivalently modelled using the bound charge on the conductor surfaces as well as on the dielectric interface between the silicon dioxide and the silicon regions. Unknown surface densities of both the free and bound charge are expanded using the axial harmonics. Galerkin's method is then applied to obtain the capacitance and conductance matrices. The proposed method is validated with a full-wave 2D cross-sectional analysis tool for a typical TSV pair structure. Comparisons with popular closed-form expressions are also discussed.","PeriodicalId":197346,"journal":{"name":"2012 IEEE International Symposium on Electromagnetic Compatibility","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2012-11-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121135385","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2012-11-12DOI: 10.1109/ISEMC.2012.6351832
D. Hartman, G. Claußen, D. VanHouten
Carbon enhanced reinforcements (CER) for multifunctional composite design were recently developed using technology where carbon nanostructures (CNS) are synthesized on the surface of glass fibers in a continuous, in-line, production scalable process. The hybrid reinforcement results in a highly conductive multifunctional capability in thermoset and thermoplastic resins that enables excellent electromagnetic interference (EMI) shielding performance. This paper discusses the development and industrialization of the carbon nanostructure-glass fiber hybrid pelletized in thermoplastic masterbatches of polycarbonate-acrylonitrile-butadiene-styrene (PC/ABS), polyamide-6,6 (PA-6,6), polycarbonate (PC), and polypropylene (PP). It reviews the electrical, thermal and mechanical properties of the compounds for engineered solutions in injection molded electromagnetic compatability (EMC) applications.
{"title":"Carbon nanostructure enhanced reinforcements in electromagnetic compatibility applications","authors":"D. Hartman, G. Claußen, D. VanHouten","doi":"10.1109/ISEMC.2012.6351832","DOIUrl":"https://doi.org/10.1109/ISEMC.2012.6351832","url":null,"abstract":"Carbon enhanced reinforcements (CER) for multifunctional composite design were recently developed using technology where carbon nanostructures (CNS) are synthesized on the surface of glass fibers in a continuous, in-line, production scalable process. The hybrid reinforcement results in a highly conductive multifunctional capability in thermoset and thermoplastic resins that enables excellent electromagnetic interference (EMI) shielding performance. This paper discusses the development and industrialization of the carbon nanostructure-glass fiber hybrid pelletized in thermoplastic masterbatches of polycarbonate-acrylonitrile-butadiene-styrene (PC/ABS), polyamide-6,6 (PA-6,6), polycarbonate (PC), and polypropylene (PP). It reviews the electrical, thermal and mechanical properties of the compounds for engineered solutions in injection molded electromagnetic compatability (EMC) applications.","PeriodicalId":197346,"journal":{"name":"2012 IEEE International Symposium on Electromagnetic Compatibility","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2012-11-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122543996","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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