Pub Date : 2007-05-13DOI: 10.1109/SPI.2007.4512233
K. Srinivasan, E. Engin, M. Swaminathan
Transient simulation using Laguerre polynomials is an unconditionally stable method, where the time-step is not limited by the fine resolution of the model. In this paper, a circuit model of the 3D FDTD grid for transient simulation using Laguerre polynomials has been derived. The circuit model enables FDTD simulation with Laguerre polynomials using the Spice MNA engine. In addition, circuit models help reduce the number of unknowns to be solved without the use of long cumbersome equations. Prior work suffer from the drawback of being able to simulate only for a certain time-duration. A method by which this limitation can be removed and accurate simulation can be carried out for all time has been outlined in this paper.
{"title":"Fast FDTD simulation of multiscale 3D models using laguerre-MNA","authors":"K. Srinivasan, E. Engin, M. Swaminathan","doi":"10.1109/SPI.2007.4512233","DOIUrl":"https://doi.org/10.1109/SPI.2007.4512233","url":null,"abstract":"Transient simulation using Laguerre polynomials is an unconditionally stable method, where the time-step is not limited by the fine resolution of the model. In this paper, a circuit model of the 3D FDTD grid for transient simulation using Laguerre polynomials has been derived. The circuit model enables FDTD simulation with Laguerre polynomials using the Spice MNA engine. In addition, circuit models help reduce the number of unknowns to be solved without the use of long cumbersome equations. Prior work suffer from the drawback of being able to simulate only for a certain time-duration. A method by which this limitation can be removed and accurate simulation can be carried out for all time has been outlined in this paper.","PeriodicalId":206352,"journal":{"name":"2007 IEEE Workshop on Signal Propagation on Interconnects","volume":"14 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2007-05-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133117960","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2007-05-13DOI: 10.1109/SPI.2007.4512203
Michael Sotman, Alexey Kostinsky, Genadiy Zobin, Intel Israel
The paper describes novel methodology for high frequency link/bus validation. For the first time the entire interconnect length range is covered. Frequency shmoo emulates PCB length change. The discovered resonance behavior correlates perfectly with theoretical prediction.
{"title":"Interconnect length impact investigation by measurements","authors":"Michael Sotman, Alexey Kostinsky, Genadiy Zobin, Intel Israel","doi":"10.1109/SPI.2007.4512203","DOIUrl":"https://doi.org/10.1109/SPI.2007.4512203","url":null,"abstract":"The paper describes novel methodology for high frequency link/bus validation. For the first time the entire interconnect length range is covered. Frequency shmoo emulates PCB length change. The discovered resonance behavior correlates perfectly with theoretical prediction.","PeriodicalId":206352,"journal":{"name":"2007 IEEE Workshop on Signal Propagation on Interconnects","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2007-05-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130957231","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2007-05-13DOI: 10.1109/SPI.2007.4512224
Y. Bouri, L. Koné, J. Razafiarivelo, D. Baudry, S. Baranowski, B. Démoulin
The paper deals with methodology to analyze electromagnetic (EM) leakages from connectors shielding due to the presence of apertures and slots. Some experimental and numerical results will be proposed to evaluate the electromagnetic coupling between connector apertures and a PCB trace line in terms of current and voltage induced on the line.
{"title":"Characterization of electromagnetic leakages throughout the connector shell","authors":"Y. Bouri, L. Koné, J. Razafiarivelo, D. Baudry, S. Baranowski, B. Démoulin","doi":"10.1109/SPI.2007.4512224","DOIUrl":"https://doi.org/10.1109/SPI.2007.4512224","url":null,"abstract":"The paper deals with methodology to analyze electromagnetic (EM) leakages from connectors shielding due to the presence of apertures and slots. Some experimental and numerical results will be proposed to evaluate the electromagnetic coupling between connector apertures and a PCB trace line in terms of current and voltage induced on the line.","PeriodicalId":206352,"journal":{"name":"2007 IEEE Workshop on Signal Propagation on Interconnects","volume":"2 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2007-05-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115721388","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2007-05-13DOI: 10.1109/SPI.2007.4512239
P. Pulici, G. Candela, G. Campardo, G. Vanalli, P. Stoppino, A. Losavio, T. Lessio, M. Dellutri, D. Guarnaccia, F. Lo Iacono
The PoP (Package on Package) design procedure is described in this paper, focusing principally on the constraints and the system characteristics. The PoP structure is more and more diffused because it increases the customer flexibility and the final yield by means of a separate testing of Top and Bottom devices. In this paper, a Top PoP design, composed by two stacked memory dice (a NOR Flash and a SDRAM), is described pointing out the electrical package impact. The memory PoP has to be accessed up to 250 Mb/s. Such a frequency involves the package to be designed basing on some rules and evaluating its electrical impact by means of a signal integrity flow.
本文描述了PoP (Package on Package)设计过程，主要侧重于约束条件和系统特性。PoP结构越来越普及，因为它通过对顶部和底部设备进行单独测试来增加客户的灵活性和最终成品率。本文描述了一种由两个堆叠存储器(NOR闪存和SDRAM)组成的Top PoP设计，指出了电气封装的影响。内存PoP的访问速度必须达到250 Mb/s。这样的频率涉及到要根据一些规则设计的封装，并通过信号完整性流来评估其电气影响。
{"title":"Interconnection effects in Package on Package design","authors":"P. Pulici, G. Candela, G. Campardo, G. Vanalli, P. Stoppino, A. Losavio, T. Lessio, M. Dellutri, D. Guarnaccia, F. Lo Iacono","doi":"10.1109/SPI.2007.4512239","DOIUrl":"https://doi.org/10.1109/SPI.2007.4512239","url":null,"abstract":"The PoP (Package on Package) design procedure is described in this paper, focusing principally on the constraints and the system characteristics. The PoP structure is more and more diffused because it increases the customer flexibility and the final yield by means of a separate testing of Top and Bottom devices. In this paper, a Top PoP design, composed by two stacked memory dice (a NOR Flash and a SDRAM), is described pointing out the electrical package impact. The memory PoP has to be accessed up to 250 Mb/s. Such a frequency involves the package to be designed basing on some rules and evaluating its electrical impact by means of a signal integrity flow.","PeriodicalId":206352,"journal":{"name":"2007 IEEE Workshop on Signal Propagation on Interconnects","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2007-05-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116109101","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2007-05-13DOI: 10.1109/SPI.2007.4512198
D. Goren, S. Shlafman, B. Sheinman, W. Woods, J. Rascoe
Silicon technology on-chip single and coupled coplanar transmission lines have been measured on wafer up to 50 GHz. De-embedding was performed using various methods including the L-2L technique [1,2] by measuring two transmission lines of original and double length. A novel approach has been used for the measurement of the coupled structures using conventional two port VNA. Results are investigated both in S-parameter format and in gamma-Zo format, and compared with EM solver and the parametric IBM coplanar T-line device models discussed elsewhere [3,4] which are available in IBM CMOS and SiGe technology design kits. A comparison with RC model shows the limits of RC model validity, in frequency domain.
{"title":"Silicon-chip single and coupled coplanar transmission line measurements and model verification up to 50GHz","authors":"D. Goren, S. Shlafman, B. Sheinman, W. Woods, J. Rascoe","doi":"10.1109/SPI.2007.4512198","DOIUrl":"https://doi.org/10.1109/SPI.2007.4512198","url":null,"abstract":"Silicon technology on-chip single and coupled coplanar transmission lines have been measured on wafer up to 50 GHz. De-embedding was performed using various methods including the L-2L technique [1,2] by measuring two transmission lines of original and double length. A novel approach has been used for the measurement of the coupled structures using conventional two port VNA. Results are investigated both in S-parameter format and in gamma-Zo format, and compared with EM solver and the parametric IBM coplanar T-line device models discussed elsewhere [3,4] which are available in IBM CMOS and SiGe technology design kits. A comparison with RC model shows the limits of RC model validity, in frequency domain.","PeriodicalId":206352,"journal":{"name":"2007 IEEE Workshop on Signal Propagation on Interconnects","volume":"9 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2007-05-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122491573","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2007-05-13DOI: 10.1109/SPI.2007.4512222
L. Shan, M. Ritter, A. Haridass, R. Weekly, D. Becker, E. Klink
Voids on reference planes are commonly seen in organic chip packages and printed circuit boards. In this paper, the effects of these voids on the signal integrity of a high-density data bus will be studied. A generic FCPBGA chip package is used to illustrate the signal integrity concerns and perform sensitivity analysis on the key mechanisms including void size, adjacent plane interactions, and adjacent signal line interactions. The results show that proper design can mitigate the signal integrity impact of reference plane voids.
{"title":"Signal propagation over perforated reference planes","authors":"L. Shan, M. Ritter, A. Haridass, R. Weekly, D. Becker, E. Klink","doi":"10.1109/SPI.2007.4512222","DOIUrl":"https://doi.org/10.1109/SPI.2007.4512222","url":null,"abstract":"Voids on reference planes are commonly seen in organic chip packages and printed circuit boards. In this paper, the effects of these voids on the signal integrity of a high-density data bus will be studied. A generic FCPBGA chip package is used to illustrate the signal integrity concerns and perform sensitivity analysis on the key mechanisms including void size, adjacent plane interactions, and adjacent signal line interactions. The results show that proper design can mitigate the signal integrity impact of reference plane voids.","PeriodicalId":206352,"journal":{"name":"2007 IEEE Workshop on Signal Propagation on Interconnects","volume":"42 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2007-05-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122721504","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2007-05-13DOI: 10.1109/SPI.2007.4512246
E. Gad, M. Nakhla, R. Achar, Yinghong Zhou
This paper presents an outline of a new integration method and describes the results of its application in simulating electric circuits in the time-domain. The proposed method does not suffer from the stability vs. order limitation of classical linear multistep methods. Hence, it enables using arbitrarily high- order approximations to the circuit waveforms while maintaining the stability over the entire left side of the complex-plane (A-stability).
{"title":"An absolutely-stable arbitrarily high-order implicit numerical integration method and its application to the time-domain simulation of interconnect circuits","authors":"E. Gad, M. Nakhla, R. Achar, Yinghong Zhou","doi":"10.1109/SPI.2007.4512246","DOIUrl":"https://doi.org/10.1109/SPI.2007.4512246","url":null,"abstract":"This paper presents an outline of a new integration method and describes the results of its application in simulating electric circuits in the time-domain. The proposed method does not suffer from the stability vs. order limitation of classical linear multistep methods. Hence, it enables using arbitrarily high- order approximations to the circuit waveforms while maintaining the stability over the entire left side of the complex-plane (A-stability).","PeriodicalId":206352,"journal":{"name":"2007 IEEE Workshop on Signal Propagation on Interconnects","volume":"29 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2007-05-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131771399","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1900-01-01DOI: 10.1109/spi.2007.4512240
{"title":"Poster session A modeling and analysis of interconnects","authors":"","doi":"10.1109/spi.2007.4512240","DOIUrl":"https://doi.org/10.1109/spi.2007.4512240","url":null,"abstract":"","PeriodicalId":206352,"journal":{"name":"2007 IEEE Workshop on Signal Propagation on Interconnects","volume":"13 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114537916","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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