Pub Date : 2007-05-13DOI: 10.1109/SPI.2007.4512243
J. Niehof, H. Janssen, W. Schilders
Next-generation nano-scale RFIC designs have an unprecedented complexity and performance that will inevitably lead to costly re-spins and loss of market opportunities. In order to cope with this, the aim of the European Framework 6 CHAMELEON RF project is to develop methodologies and prototype tools for a comprehensive and highly accurate analysis of complete functional IC blocks. These blocks will operate at RF frequencies of up to 60 GHz. In order to achieve these goals, efficient and accurate models of the interconnect, integrated inductors, the substrate and devices, together with their mutual interactions, need to be developed. At SPI 2007 the results achieved in the modeling and methodology research will be presented.
{"title":"Modeling of electromagnetic effects in complete RF blocks","authors":"J. Niehof, H. Janssen, W. Schilders","doi":"10.1109/SPI.2007.4512243","DOIUrl":"https://doi.org/10.1109/SPI.2007.4512243","url":null,"abstract":"Next-generation nano-scale RFIC designs have an unprecedented complexity and performance that will inevitably lead to costly re-spins and loss of market opportunities. In order to cope with this, the aim of the European Framework 6 CHAMELEON RF project is to develop methodologies and prototype tools for a comprehensive and highly accurate analysis of complete functional IC blocks. These blocks will operate at RF frequencies of up to 60 GHz. In order to achieve these goals, efficient and accurate models of the interconnect, integrated inductors, the substrate and devices, together with their mutual interactions, need to be developed. At SPI 2007 the results achieved in the modeling and methodology research will be presented.","PeriodicalId":206352,"journal":{"name":"2007 IEEE Workshop on Signal Propagation on Interconnects","volume":"69 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2007-05-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124595575","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2007-05-13DOI: 10.1109/SPI.2007.4512221
T. Winkel, A. Deutsch, G. Katopis, G. Kopcsay, W. Dyckman, B. Chamberlin, C. Surovic, H. Liu, C. Baks
Special test vehicles have been built for first and low loss second level packages including product related test line structures. The characteristic transmission line parameters were measured in the time and in the frequency domain in a wide frequency range. Advantages and limitations of the different methods are discussed by comparing the obtained results.
{"title":"Determination of transmission line parameters in time- and frequency domain for product related packaging structures","authors":"T. Winkel, A. Deutsch, G. Katopis, G. Kopcsay, W. Dyckman, B. Chamberlin, C. Surovic, H. Liu, C. Baks","doi":"10.1109/SPI.2007.4512221","DOIUrl":"https://doi.org/10.1109/SPI.2007.4512221","url":null,"abstract":"Special test vehicles have been built for first and low loss second level packages including product related test line structures. The characteristic transmission line parameters were measured in the time and in the frequency domain in a wide frequency range. Advantages and limitations of the different methods are discussed by comparing the obtained results.","PeriodicalId":206352,"journal":{"name":"2007 IEEE Workshop on Signal Propagation on Interconnects","volume":"32 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2007-05-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127275172","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2007-05-13DOI: 10.1109/SPI.2007.4512196
B. Ravelo, A. Pérennec, M. Le Roy
In this paper, we propose a technique to compensate the propagation delay and losses in VLSI interconnects by using negative group delay (NGD) active circuits. This study uses the RLC models of interconnect lines currently considered in VLSI circuits. The circuit proposed here is based on a cell consisting of a Field Effect Transistor (FET) in parallel with a series RL passive network. We also describe the synthesis method to achieve simultaneousely a significant negative group delay and gain. Simulations allow us to first verify the performance of the NGD circuit and also show a restoration of the distorted signal shape as well as a reduction of propagation delay.
{"title":"Equalization of interconnect propagation delay with negative group delay active circuits","authors":"B. Ravelo, A. Pérennec, M. Le Roy","doi":"10.1109/SPI.2007.4512196","DOIUrl":"https://doi.org/10.1109/SPI.2007.4512196","url":null,"abstract":"In this paper, we propose a technique to compensate the propagation delay and losses in VLSI interconnects by using negative group delay (NGD) active circuits. This study uses the RLC models of interconnect lines currently considered in VLSI circuits. The circuit proposed here is based on a cell consisting of a Field Effect Transistor (FET) in parallel with a series RL passive network. We also describe the synthesis method to achieve simultaneousely a significant negative group delay and gain. Simulations allow us to first verify the performance of the NGD circuit and also show a restoration of the distorted signal shape as well as a reduction of propagation delay.","PeriodicalId":206352,"journal":{"name":"2007 IEEE Workshop on Signal Propagation on Interconnects","volume":"35 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2007-05-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132253044","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2007-05-13DOI: 10.1109/SPI.2007.4512206
B. Gustavsen, C. Heitz
This paper introduces a new approach for rational macromodeling of multiport devices that ensures high accuracy with arbitrary terminal conditions. This is achieved by reformulating the vector fitting technique to focus on eigenpairs rather than matrix elements. By choosing the least squares weighting equal to the inverse of the eigenvalue magnitude is achieved that the eigenvalues are fitted with a relative accuracy criterion. The procedure is shown to give a major improvement in accuracy for cases with a large eigenvalue spread. Also is shown how to utilize the impedance characteristics of the adjacent network in the fitting process.
{"title":"Rational modeling of multiport systems by modal vector fitting","authors":"B. Gustavsen, C. Heitz","doi":"10.1109/SPI.2007.4512206","DOIUrl":"https://doi.org/10.1109/SPI.2007.4512206","url":null,"abstract":"This paper introduces a new approach for rational macromodeling of multiport devices that ensures high accuracy with arbitrary terminal conditions. This is achieved by reformulating the vector fitting technique to focus on eigenpairs rather than matrix elements. By choosing the least squares weighting equal to the inverse of the eigenvalue magnitude is achieved that the eigenvalues are fitted with a relative accuracy criterion. The procedure is shown to give a major improvement in accuracy for cases with a large eigenvalue spread. Also is shown how to utilize the impedance characteristics of the adjacent network in the fitting process.","PeriodicalId":206352,"journal":{"name":"2007 IEEE Workshop on Signal Propagation on Interconnects","volume":"275 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2007-05-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124237325","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2007-05-13DOI: 10.1109/SPI.2007.4512226
M. Wojnowski, M. Engl, R. Weigel
For accurate RLCG-parameter extraction the measured S-parameter matrix needs to be converted to the Z-matrix. However, there exist three different definitions of S-parameters and consequently three different formulas of converting S-matrix into Z-matrix. In this article, we present an overview of existing S-parameters definitions and examine the uncertainties associated with the S-matrix to Z-matrix transformations. Further, we introduce an error estimator describing the inaccuracy one makes performing the incorrect transformation. We compare de-embedded measurement results of an inductor manufactured in Si-based MCM-D technology. We show that using wrong transformation can easily lead to erroneous or even catastrophic results.
{"title":"Considerations on impedance matrix determination for accurate passive device characterization","authors":"M. Wojnowski, M. Engl, R. Weigel","doi":"10.1109/SPI.2007.4512226","DOIUrl":"https://doi.org/10.1109/SPI.2007.4512226","url":null,"abstract":"For accurate RLCG-parameter extraction the measured S-parameter matrix needs to be converted to the Z-matrix. However, there exist three different definitions of S-parameters and consequently three different formulas of converting S-matrix into Z-matrix. In this article, we present an overview of existing S-parameters definitions and examine the uncertainties associated with the S-matrix to Z-matrix transformations. Further, we introduce an error estimator describing the inaccuracy one makes performing the incorrect transformation. We compare de-embedded measurement results of an inductor manufactured in Si-based MCM-D technology. We show that using wrong transformation can easily lead to erroneous or even catastrophic results.","PeriodicalId":206352,"journal":{"name":"2007 IEEE Workshop on Signal Propagation on Interconnects","volume":"30 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2007-05-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123221289","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2007-05-13DOI: 10.1109/SPI.2007.4512208
L. Knockaert, D. De Zutter
In this contribution we discuss the translation-invariant interpolation of frequency domain functions by means of a well-conditioned Gaussian-modulated pole kernel which generates exclusively stable poles. For the implementation we use an adaptive interpolation process which is a variant of a recently introduced adaptive residual subsampling method. It is shown that the interpolation process with the Gaussian-modulated pole kernel also provides an excellent pre-processing interface when used in conjunction with the popular vector fitting algorithm. This results in a composite algorithm, performing the sampling and modelling of the given frequency function in a fully automatic way.
{"title":"Well-conditioned adaptive interpolation by a gaussian-modulated pole kernel with applications to vector fitting","authors":"L. Knockaert, D. De Zutter","doi":"10.1109/SPI.2007.4512208","DOIUrl":"https://doi.org/10.1109/SPI.2007.4512208","url":null,"abstract":"In this contribution we discuss the translation-invariant interpolation of frequency domain functions by means of a well-conditioned Gaussian-modulated pole kernel which generates exclusively stable poles. For the implementation we use an adaptive interpolation process which is a variant of a recently introduced adaptive residual subsampling method. It is shown that the interpolation process with the Gaussian-modulated pole kernel also provides an excellent pre-processing interface when used in conjunction with the popular vector fitting algorithm. This results in a composite algorithm, performing the sampling and modelling of the given frequency function in a fully automatic way.","PeriodicalId":206352,"journal":{"name":"2007 IEEE Workshop on Signal Propagation on Interconnects","volume":"55 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2007-05-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124060945","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2007-05-13DOI: 10.1109/SPI.2007.4512220
Y. Quéré, T. Gouguec, P. Martin, D. L. Berre, F. Huret
This paper addresses high-speed interconnects in high density systems (systems on chip (SoC) in package (SiP) ...). These lines (of microstrip or coplanar type) often have an underlayer of orthogonal metal grids which can affect transmission characteristics. We subsequently present a characterization through S-parameter measurements and electromagnetic simulations. Two kinds of grid are studied; grounded (CC) and floating grid (CO). In both cases, transmission zeroes appear. The position of these transmission zeroes in the frequency domain depends mainly on the grid length and, of course, on the grid charge CC or CO. In order to easily estimate it, we propose a simple equivalent circuit model which we validate by measurements and electromagnetic simulations. We then determine a set of expressions based on this model enabling us to analytically pinpoint the location transmission zero in the frequency domain, valid for any underlayer of orthogonal metal lines or grids.
{"title":"Frequency domain analysis of transmission zeroes on high-speed interconnects in the presence of an orthogonal metal grid underlayer","authors":"Y. Quéré, T. Gouguec, P. Martin, D. L. Berre, F. Huret","doi":"10.1109/SPI.2007.4512220","DOIUrl":"https://doi.org/10.1109/SPI.2007.4512220","url":null,"abstract":"This paper addresses high-speed interconnects in high density systems (systems on chip (SoC) in package (SiP) ...). These lines (of microstrip or coplanar type) often have an underlayer of orthogonal metal grids which can affect transmission characteristics. We subsequently present a characterization through S-parameter measurements and electromagnetic simulations. Two kinds of grid are studied; grounded (CC) and floating grid (CO). In both cases, transmission zeroes appear. The position of these transmission zeroes in the frequency domain depends mainly on the grid length and, of course, on the grid charge CC or CO. In order to easily estimate it, we propose a simple equivalent circuit model which we validate by measurements and electromagnetic simulations. We then determine a set of expressions based on this model enabling us to analytically pinpoint the location transmission zero in the frequency domain, valid for any underlayer of orthogonal metal lines or grids.","PeriodicalId":206352,"journal":{"name":"2007 IEEE Workshop on Signal Propagation on Interconnects","volume":"5 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2007-05-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129580568","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2007-05-13DOI: 10.1109/SPI.2007.4512234
C. Schuster, G. Selli, Y. Kwark, M. Ritter, J. Drewniak
Vias in printed circuit boards and chip packages are known to have significant detrimental impact on signal and power integrity in high-speed communication systems. Recently, concise equivalent circuit models for vias in multilayer configurations have been explored by the authors. The models accurately reflect the important physical properties of vias, since the topology utilized has a one-to-one correlation to the geometrical structure and the dimensions of the via. In this paper, the proposed physics-based via models are extended to include the interaction between two signal vias and a signal via plus a reference (ground) via. The models were then compared to experimental data obtained from several structures laid out on a 16-layer printed circuit board. The measurements performed using a 4-port vector network analyzer and the high performance recessed probe launching technique evidenced good correlation to 20 GHz and beyond.
{"title":"Progress in representation and validation of physics-based via models","authors":"C. Schuster, G. Selli, Y. Kwark, M. Ritter, J. Drewniak","doi":"10.1109/SPI.2007.4512234","DOIUrl":"https://doi.org/10.1109/SPI.2007.4512234","url":null,"abstract":"Vias in printed circuit boards and chip packages are known to have significant detrimental impact on signal and power integrity in high-speed communication systems. Recently, concise equivalent circuit models for vias in multilayer configurations have been explored by the authors. The models accurately reflect the important physical properties of vias, since the topology utilized has a one-to-one correlation to the geometrical structure and the dimensions of the via. In this paper, the proposed physics-based via models are extended to include the interaction between two signal vias and a signal via plus a reference (ground) via. The models were then compared to experimental data obtained from several structures laid out on a 16-layer printed circuit board. The measurements performed using a 4-port vector network analyzer and the high performance recessed probe launching technique evidenced good correlation to 20 GHz and beyond.","PeriodicalId":206352,"journal":{"name":"2007 IEEE Workshop on Signal Propagation on Interconnects","volume":"76 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2007-05-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134137279","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2007-05-13DOI: 10.1109/SPI.2007.4512231
C. Crognale, V. Ricchiuti, S. Caputo, S. Saracino
This paper analyzes a pioneering topic in the telecommunications field: how preserving the signal integrity in all-optical ultra-fast signal processing boards with optical interconnects and Semiconductor Optical Amplifiers (SOAs), probably the most well-known active devices used in the Optical Time Domain Multiplexing systems (OTDM). In particular, it investigates the performances of an attractive SOA-based de-multiplexing architecture which, thanks to the potentialities of integration of these components, appears particularly suitable for being adopted in an OTDM interconnection. The analysis presents a criterion for suppressing the signal degradation, known as pattern- dependence effect, which normally affects the probe signal traversing this type of device, and shows an example of SOA de-multiplexer used in a 100 Gbit/s RZ-OTDM interconnection where the 25 Gb/s tributary channels, are extracted without any significant optical signal degradation.
{"title":"Preserving signal integrity in a SOA-based de-multiplexer used in OTDM interconnections","authors":"C. Crognale, V. Ricchiuti, S. Caputo, S. Saracino","doi":"10.1109/SPI.2007.4512231","DOIUrl":"https://doi.org/10.1109/SPI.2007.4512231","url":null,"abstract":"This paper analyzes a pioneering topic in the telecommunications field: how preserving the signal integrity in all-optical ultra-fast signal processing boards with optical interconnects and Semiconductor Optical Amplifiers (SOAs), probably the most well-known active devices used in the Optical Time Domain Multiplexing systems (OTDM). In particular, it investigates the performances of an attractive SOA-based de-multiplexing architecture which, thanks to the potentialities of integration of these components, appears particularly suitable for being adopted in an OTDM interconnection. The analysis presents a criterion for suppressing the signal degradation, known as pattern- dependence effect, which normally affects the probe signal traversing this type of device, and shows an example of SOA de-multiplexer used in a 100 Gbit/s RZ-OTDM interconnection where the 25 Gb/s tributary channels, are extracted without any significant optical signal degradation.","PeriodicalId":206352,"journal":{"name":"2007 IEEE Workshop on Signal Propagation on Interconnects","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2007-05-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132078144","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2007-05-13DOI: 10.1109/SPI.2007.4512249
Andy Kuo, Andrew Labun, Nicholas Swart, André Ivanov
In this paper, we propose a simple and efficient model to predict the timing impact of crosstalk in high-speed interconnects with impedance discontinuities. This model is based on the reflection and superposition principles. The results of the simple model are accurate to picoseconds or less, when compared to HSPICE simulations with 1~40mm interconnect length. The model can also be extended to deal with multiple parallel interconnects. In addition, this model can predict timing results relatively quickly, compared to simulation by HSPICE.
{"title":"Crosstalk timing model for high-speed interconnects with impedance discontinuity","authors":"Andy Kuo, Andrew Labun, Nicholas Swart, André Ivanov","doi":"10.1109/SPI.2007.4512249","DOIUrl":"https://doi.org/10.1109/SPI.2007.4512249","url":null,"abstract":"In this paper, we propose a simple and efficient model to predict the timing impact of crosstalk in high-speed interconnects with impedance discontinuities. This model is based on the reflection and superposition principles. The results of the simple model are accurate to picoseconds or less, when compared to HSPICE simulations with 1~40mm interconnect length. The model can also be extended to deal with multiple parallel interconnects. In addition, this model can predict timing results relatively quickly, compared to simulation by HSPICE.","PeriodicalId":206352,"journal":{"name":"2007 IEEE Workshop on Signal Propagation on Interconnects","volume":"45 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2007-05-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126720234","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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