Pub Date : 2007-05-13DOI: 10.1109/SPI.2007.4512214
S. Grivet-Talocia, A. Ubolli
This paper presents a new technique for the elimination of passivity violations in linear lumped macromodels. The main algorithm is based on the perturbation of imaginary eigenvalues of suitably-defined Hamiltonian matrices, as documented in the existing literature. We introduce a modification aimed at the minimization of the relative error in the model responses during the passivity enforcement. This strategy allows the accurate modeling of structures characterized by a large dynamic range, as typically found in microwave filters or advanced packaging applications.
{"title":"On relative error minimization in passivity enforcement schemes","authors":"S. Grivet-Talocia, A. Ubolli","doi":"10.1109/SPI.2007.4512214","DOIUrl":"https://doi.org/10.1109/SPI.2007.4512214","url":null,"abstract":"This paper presents a new technique for the elimination of passivity violations in linear lumped macromodels. The main algorithm is based on the perturbation of imaginary eigenvalues of suitably-defined Hamiltonian matrices, as documented in the existing literature. We introduce a modification aimed at the minimization of the relative error in the model responses during the passivity enforcement. This strategy allows the accurate modeling of structures characterized by a large dynamic range, as typically found in microwave filters or advanced packaging applications.","PeriodicalId":206352,"journal":{"name":"2007 IEEE Workshop on Signal Propagation on Interconnects","volume":"30 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2007-05-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114296629","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2007-05-13DOI: 10.1109/SPI.2007.4512261
A. Tsuchiya, H. Onodera
This paper reports measurement results of on-chip interconnects with CMP dummy fill. CMP dummy fill is a floating metal for metal density adjustment. In high frequency above 10 GHz, the eddy current induced in dummy fills affects the interconnect loss. We fabricated test structures of on-chip interconnect with dummy fills. From the measurement results, the effect of the dummy fills on the wire resistance is not negligible even if the ground wires are adjacent to the signal wire. The dummy fills in the upper/lower metal layer affect the wire resistance and the resistance increases by 20% at 50 GHz.
{"title":"Measurement of interconnect loss due to dummy fills","authors":"A. Tsuchiya, H. Onodera","doi":"10.1109/SPI.2007.4512261","DOIUrl":"https://doi.org/10.1109/SPI.2007.4512261","url":null,"abstract":"This paper reports measurement results of on-chip interconnects with CMP dummy fill. CMP dummy fill is a floating metal for metal density adjustment. In high frequency above 10 GHz, the eddy current induced in dummy fills affects the interconnect loss. We fabricated test structures of on-chip interconnect with dummy fills. From the measurement results, the effect of the dummy fills on the wire resistance is not negligible even if the ground wires are adjacent to the signal wire. The dummy fills in the upper/lower metal layer affect the wire resistance and the resistance increases by 20% at 50 GHz.","PeriodicalId":206352,"journal":{"name":"2007 IEEE Workshop on Signal Propagation on Interconnects","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2007-05-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114335354","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2007-05-13DOI: 10.1109/SPI.2007.4512238
J. R. Cubillo, J. Gaubert, S. Bourdel, H. Barthélemy, P. Pannier
We present in this paper, based on HFSS simulation studies, a simple way to improve a PCB to DIE transition (trough a Plastic Ball Grid Array (PBGA) package) for a 50 Ohm impedance of reference. The method uses well known technique for the synthesis of Low Pass (LP) filter based on Standard Engineering normalized tables. A II model of the PBGA transition at high frequency is used as one of the embedded building block of a typical LC ladder filter. The additional LC sections around the PBGA transition are distributed (microstrip) elements on the PCB side and lumped elements on the DIE side. Such simple filtering technique improves in very significant way the return loss (RL) margin over the accepted -10 dB threshold in the RF industry.
{"title":"A simple filtering approach to improve the return loss of a PCB to DIE transition trough a PBGA package for over GHz applications","authors":"J. R. Cubillo, J. Gaubert, S. Bourdel, H. Barthélemy, P. Pannier","doi":"10.1109/SPI.2007.4512238","DOIUrl":"https://doi.org/10.1109/SPI.2007.4512238","url":null,"abstract":"We present in this paper, based on HFSS simulation studies, a simple way to improve a PCB to DIE transition (trough a Plastic Ball Grid Array (PBGA) package) for a 50 Ohm impedance of reference. The method uses well known technique for the synthesis of Low Pass (LP) filter based on Standard Engineering normalized tables. A II model of the PBGA transition at high frequency is used as one of the embedded building block of a typical LC ladder filter. The additional LC sections around the PBGA transition are distributed (microstrip) elements on the PCB side and lumped elements on the DIE side. Such simple filtering technique improves in very significant way the return loss (RL) margin over the accepted -10 dB threshold in the RF industry.","PeriodicalId":206352,"journal":{"name":"2007 IEEE Workshop on Signal Propagation on Interconnects","volume":"59 7 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2007-05-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116276075","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2007-05-13DOI: 10.1109/SPI.2007.4512250
B. Levin
The rigorous method of calculations of characteristics of two-wire lines (twisted pairs) inside the metal armor and of a mutual coupling between lines is considered. It is shown that the mutual coupling between lines in multiple-conductor cables results in appearance of electromagnetic interferences (crosstalks) in communication channels. The voltages values (interferences) across the impedances placed at the beginning and the end of the adjacent line at the given power in the main line are determined.
{"title":"Calculation of crosstalks in multiple-conductor cables","authors":"B. Levin","doi":"10.1109/SPI.2007.4512250","DOIUrl":"https://doi.org/10.1109/SPI.2007.4512250","url":null,"abstract":"The rigorous method of calculations of characteristics of two-wire lines (twisted pairs) inside the metal armor and of a mutual coupling between lines is considered. It is shown that the mutual coupling between lines in multiple-conductor cables results in appearance of electromagnetic interferences (crosstalks) in communication channels. The voltages values (interferences) across the impedances placed at the beginning and the end of the adjacent line at the given power in the main line are determined.","PeriodicalId":206352,"journal":{"name":"2007 IEEE Workshop on Signal Propagation on Interconnects","volume":"2011 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2007-05-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125635317","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2007-05-13DOI: 10.1109/SPI.2007.4512218
N. Stevens, D. Deschrijver, T. Dhaene
A simple rule of thumb is proposed for automatic model order estimation of the rational macromodels for passive components and systems. Based on an analysis of the dynamic behavior of the (measured or simulated) frequency domain scattering parameters, upper and lower bounds for the number of poles are proposed. Several interconnection examples with different complexity are presented to illustrate the usefulness of the proposed approach.
{"title":"Fast automatic order estimation of rational macromodels for signal integrity analysis","authors":"N. Stevens, D. Deschrijver, T. Dhaene","doi":"10.1109/SPI.2007.4512218","DOIUrl":"https://doi.org/10.1109/SPI.2007.4512218","url":null,"abstract":"A simple rule of thumb is proposed for automatic model order estimation of the rational macromodels for passive components and systems. Based on an analysis of the dynamic behavior of the (measured or simulated) frequency domain scattering parameters, upper and lower bounds for the number of poles are proposed. Several interconnection examples with different complexity are presented to illustrate the usefulness of the proposed approach.","PeriodicalId":206352,"journal":{"name":"2007 IEEE Workshop on Signal Propagation on Interconnects","volume":"43 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2007-05-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124146452","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2007-05-13DOI: 10.1109/SPI.2007.4512242
T. Kuhler, E. Griese
Realizing electrical printed circuit boards with integrated optical interconnects for high bandwidth interconnects requires numerical models and procedures for analyzing and optimizing signal propagation within optical multimode waveguides. This paper presents a method based on the finite element method with edge elements in order to calculate the propagation constants of the guided modes of graded-index waveguides. This type of waveguides can be implemented in thin-glass applying an ion-exchange process.
{"title":"Modeling propagation characteristics of multimode graded-index waveguides with finite elements using edge-based elements","authors":"T. Kuhler, E. Griese","doi":"10.1109/SPI.2007.4512242","DOIUrl":"https://doi.org/10.1109/SPI.2007.4512242","url":null,"abstract":"Realizing electrical printed circuit boards with integrated optical interconnects for high bandwidth interconnects requires numerical models and procedures for analyzing and optimizing signal propagation within optical multimode waveguides. This paper presents a method based on the finite element method with edge elements in order to calculate the propagation constants of the guided modes of graded-index waveguides. This type of waveguides can be implemented in thin-glass applying an ion-exchange process.","PeriodicalId":206352,"journal":{"name":"2007 IEEE Workshop on Signal Propagation on Interconnects","volume":"2 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2007-05-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131146868","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2007-05-13DOI: 10.1109/SPI.2007.4512205
Y. Mekonnen, J. Schutt-Ainé
The vector-fitting algorithm has been used as the main macromodeling tool for approximating frequency domain responses of complex interconnects and electrical packages [Gustavsen and Semlyen, 1999]. In this paper, a new methodology is proposed to fit transfer functions of frequency response data obtained from numerical electromagnetic simulation or measured frequency-domain or time-domain response data. This new method, z-domain vector- fitting (ZDVF), is a formulation of vector-fitting method in the Z domain; it has an advantage of faster convergence and better numerical stability compared to the s-domain vector-fitting method (VF). The fast convergence of the method reduces the overall macromodel generation time. The accuracy, numerical stability and convergence speed of VF and ZDVF are compared. Examples are provided to demonstrate the advantage of the ZDVF.
{"title":"Broadband macromodeling of sampled frequency data using z-domain vector-fitting method","authors":"Y. Mekonnen, J. Schutt-Ainé","doi":"10.1109/SPI.2007.4512205","DOIUrl":"https://doi.org/10.1109/SPI.2007.4512205","url":null,"abstract":"The vector-fitting algorithm has been used as the main macromodeling tool for approximating frequency domain responses of complex interconnects and electrical packages [Gustavsen and Semlyen, 1999]. In this paper, a new methodology is proposed to fit transfer functions of frequency response data obtained from numerical electromagnetic simulation or measured frequency-domain or time-domain response data. This new method, z-domain vector- fitting (ZDVF), is a formulation of vector-fitting method in the Z domain; it has an advantage of faster convergence and better numerical stability compared to the s-domain vector-fitting method (VF). The fast convergence of the method reduces the overall macromodel generation time. The accuracy, numerical stability and convergence speed of VF and ZDVF are compared. Examples are provided to demonstrate the advantage of the ZDVF.","PeriodicalId":206352,"journal":{"name":"2007 IEEE Workshop on Signal Propagation on Interconnects","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2007-05-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131093669","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2007-05-13DOI: 10.1109/SPI.2007.4512259
D. Ioan, G. Ciuprina, Sebastian Kula Politehnica
The paper describes an effective procedure to extract the reduced order models of multi-wire on-chip interconnects. These models take into consideration effects of the high frequency electromagnetic field, such as propagation, skin effect, substrate losses, etc. The frequency dependent p.u.l. line parameters are extracted by solving with finite integral technique (FIT) two field problems with appropriate boundary conditions: 2D-EQS field for Y1(omega) and EMQS-TM field for Z1(omega). After the line extension, the reduced model is extracted by vector fitting (VFIT), and then the equivalent compact spice sub-circuit is synthesized by differential-equation method (DEM).
{"title":"Reduced order models for HF interconnect over lossy semiconductor substrate","authors":"D. Ioan, G. Ciuprina, Sebastian Kula Politehnica","doi":"10.1109/SPI.2007.4512259","DOIUrl":"https://doi.org/10.1109/SPI.2007.4512259","url":null,"abstract":"The paper describes an effective procedure to extract the reduced order models of multi-wire on-chip interconnects. These models take into consideration effects of the high frequency electromagnetic field, such as propagation, skin effect, substrate losses, etc. The frequency dependent p.u.l. line parameters are extracted by solving with finite integral technique (FIT) two field problems with appropriate boundary conditions: 2D-EQS field for Y1(omega) and EMQS-TM field for Z1(omega). After the line extension, the reduced model is extracted by vector fitting (VFIT), and then the equivalent compact spice sub-circuit is synthesized by differential-equation method (DEM).","PeriodicalId":206352,"journal":{"name":"2007 IEEE Workshop on Signal Propagation on Interconnects","volume":"13 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2007-05-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130315198","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2007-05-13DOI: 10.1109/SPI.2007.4512260
A. Scogna, C. Ritota
The present paper investigates the power supply noise in multilayered IC packages and analyzes the effect of shorting vias. A full wave code, based on the Finite Integration Technique (FIT), is used for the numerical simulations and it is validated by means of measurements. Furthermore two different solvers are employed to verify the accuracy of the proposed model: time domain and frequency domain. Some results are addressed: 1) the use of shorting vias allows achieving more than 50% noise suppression and 2) the mitigation level is related to the distance of the shorting vias from the signal via. The signal integrity on a signal propagating from the top layer to the bottom layer of the considered IC package is studied by means of Scattering parameters (S-parameters) and time domain reflectometry (TDR). In particular it is found that the TDR evaluated for the model with closer shorting vias results in a larger impedance variation.
{"title":"Power supply noise investigation of a multilayered IC package: full wave simulation and model validation","authors":"A. Scogna, C. Ritota","doi":"10.1109/SPI.2007.4512260","DOIUrl":"https://doi.org/10.1109/SPI.2007.4512260","url":null,"abstract":"The present paper investigates the power supply noise in multilayered IC packages and analyzes the effect of shorting vias. A full wave code, based on the Finite Integration Technique (FIT), is used for the numerical simulations and it is validated by means of measurements. Furthermore two different solvers are employed to verify the accuracy of the proposed model: time domain and frequency domain. Some results are addressed: 1) the use of shorting vias allows achieving more than 50% noise suppression and 2) the mitigation level is related to the distance of the shorting vias from the signal via. The signal integrity on a signal propagating from the top layer to the bottom layer of the considered IC package is studied by means of Scattering parameters (S-parameters) and time domain reflectometry (TDR). In particular it is found that the TDR evaluated for the model with closer shorting vias results in a larger impedance variation.","PeriodicalId":206352,"journal":{"name":"2007 IEEE Workshop on Signal Propagation on Interconnects","volume":"142 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2007-05-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132486354","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2007-05-13DOI: 10.1109/SPI.2007.4512207
D. Deschrijver, T. Dhaene, Y. Rolain
Vector fitting is a rational approximation technique, which is frequently used to calculate accurate macromodels of electrical and electronical structures. The robustness of the technique is obtained by combining the use of a weighted iterative least squares scheme and a well-chosen partial fraction basis. It was discussed in that numerical problems may occur if poles of higher-order multiplicities are required to approximate a frequency response. This paper shows that the orthonormal vector fitting technique [3] solves this problem in a fundamental way.
{"title":"Macromodeling of transfer functions with higher-order pole multiplicities","authors":"D. Deschrijver, T. Dhaene, Y. Rolain","doi":"10.1109/SPI.2007.4512207","DOIUrl":"https://doi.org/10.1109/SPI.2007.4512207","url":null,"abstract":"Vector fitting is a rational approximation technique, which is frequently used to calculate accurate macromodels of electrical and electronical structures. The robustness of the technique is obtained by combining the use of a weighted iterative least squares scheme and a well-chosen partial fraction basis. It was discussed in that numerical problems may occur if poles of higher-order multiplicities are required to approximate a frequency response. This paper shows that the orthonormal vector fitting technique [3] solves this problem in a fundamental way.","PeriodicalId":206352,"journal":{"name":"2007 IEEE Workshop on Signal Propagation on Interconnects","volume":"5 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2007-05-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115513332","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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