This numerical study deals with the CIGS solar cell considering Cd1-xZnxS buffer layer. The composition ‘x’ of the buffer layer is determined and its impact on the solar cell performance parameters is studied. The influence of the buffer layer thickness on quantum efficiency is also discussed. The tuned bandgap and optimized thickness of the Cd1-xZnxS buffer layer are then utilized to obtain the suitable bandgap of the CIGS absorber layer. The maximum power conversion zone is revealed in terms of the CIGS bandgap and the impact of this bandgap on spectral response as well as performance parameters are discussed. The Cd0.6Zn0.4S/CIGS interface is studied by varying the defect density from 1010 cm−3 to 1016 cm−3. The cell performances are also analyzed for the temperature ranging from 260 K to 350 K.
This work demonstrates a clear picture growth transition of aluminium nitride (AlN) films from the three-dimensional (3D) to the two-dimensional (2D) regime on the sapphire substrate at various temperatures using metal-organic chemical vapour deposition (MOCVD) under low reactor pressure. The high deposition rate of large 3D AlN islands that isolated each other change to 2D growth mode with a smoother surface as temperature increases from 800 °C to 1340 °C. From x-ray diffraction measurement, the AlN (100), AlN (002), and AlN (101) planes exhibit strong peak monocrystalline AlN (002) films as the temperature increase. It found that the AlN film grew at 1100 °C in the Frank–van der Merwe or 2D growth mode exhibits the highest crystalline quality with the threading dislocation density around 2.21 × 109 cm−2. In addition, the lattice vibrational parameters of the AlN films at 1100 °C shows the lowest phonon damping from IR spectra results. Thus, this study details the AlN epitaxial films growth transition, which is crucial for growing high crystalline quality AlN layer using the MOCVD technique.
Tunnel Filed Effect Transistors (TFETs) have appeared as an alternative for conventional CMOS due to their advantages like very low leakage current and steep sub-threshold slope. In semiconductor devices, noise is considered an undesired signal that can deteriorate the desired signal. In TFET structures different noise sources affect the performance at different frequency ranges. This paper presents a comprehensive review of impact of electrical noise on the performance of various TFET structures. The impact of both low-frequency noise sources and high-frequency sources have been discussed thoroughly. The study of different types of electrical noises occur in simple TFET device and different structures of TFET is presented.