Pub Date : 2022-07-10DOI: 10.1109/fleps53764.2022.9781575
Anis Fatema, Ivin Kuriakose, Deeksha Devendra, A. Hussain
The technological advancements in healthcare monitoring devices, automation, consumer electronics, and soft robotics have resulted in extensive research in flexible pressure, force, and tactile sensors. Piezoresistive sensors are the most widely used flexible pressure sensors due to their low-cost fabrication, high flexibility and simple data-acquisition circuits. In this paper, we report the bending response of a velostat-based flexible pressure sensor by examining its reliability when subjected to repeated mechanical stress. The observed deviation in output voltage was 0.95% for 15 mm, 0.95% for 20 mm, 0.97% for 25 mm, and 2.2% for 30 mm bending radii, for 150 bending cycles, with respect to the flat position. We present a two-parameter (a, b) calibration for the pressure sensor with a fixed bias resistance in the readout circuit. This model can be used to further minimize the deviation due to bending cycles. The results obtained from the experimental research have shown a practical possibility of implementing velostat-based sensors for both static and dynamic flexible systems.
{"title":"Investigation of the Mechanical Reliability of a Velostat-based Flexible Pressure Sensor","authors":"Anis Fatema, Ivin Kuriakose, Deeksha Devendra, A. Hussain","doi":"10.1109/fleps53764.2022.9781575","DOIUrl":"https://doi.org/10.1109/fleps53764.2022.9781575","url":null,"abstract":"The technological advancements in healthcare monitoring devices, automation, consumer electronics, and soft robotics have resulted in extensive research in flexible pressure, force, and tactile sensors. Piezoresistive sensors are the most widely used flexible pressure sensors due to their low-cost fabrication, high flexibility and simple data-acquisition circuits. In this paper, we report the bending response of a velostat-based flexible pressure sensor by examining its reliability when subjected to repeated mechanical stress. The observed deviation in output voltage was 0.95% for 15 mm, 0.95% for 20 mm, 0.97% for 25 mm, and 2.2% for 30 mm bending radii, for 150 bending cycles, with respect to the flat position. We present a two-parameter (a, b) calibration for the pressure sensor with a fixed bias resistance in the readout circuit. This model can be used to further minimize the deviation due to bending cycles. The results obtained from the experimental research have shown a practical possibility of implementing velostat-based sensors for both static and dynamic flexible systems.","PeriodicalId":221424,"journal":{"name":"2022 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-07-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130798029","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2022-07-10DOI: 10.1109/fleps53764.2022.9781561
Muhammad-Hassan Malik, Lukas Rauter, H. Zangl, A. Binder, A. Roshanghias
Paper as a substrate for electronic circuits with inkjet printing of conductors and insulators offers advantages such as low-cost, flexibility, eco-friendliness, and recyclability. To realize circuitry on papers, inkjet printing is one of the standard methodologies. However, heterogeneous integration of components on inkjet printed papers has faced reliability issues; therefore, inkjet printing is still not the mainstream in the fabrication of electronic papers (E-papers). Accordingly, in this study, the feasibility and reliability of integrating ultra-thin chips (UTC) on inkjet printed papers were discussed and analyzed. The significant effects of printed layer thickness on both electrical performance and long-term stability of the E-papers were demonstrated. The results were also compared to screen-printed papers.
{"title":"Ultra-Thin Chips (UTC) Integration on Inkjet-Printed Papers","authors":"Muhammad-Hassan Malik, Lukas Rauter, H. Zangl, A. Binder, A. Roshanghias","doi":"10.1109/fleps53764.2022.9781561","DOIUrl":"https://doi.org/10.1109/fleps53764.2022.9781561","url":null,"abstract":"Paper as a substrate for electronic circuits with inkjet printing of conductors and insulators offers advantages such as low-cost, flexibility, eco-friendliness, and recyclability. To realize circuitry on papers, inkjet printing is one of the standard methodologies. However, heterogeneous integration of components on inkjet printed papers has faced reliability issues; therefore, inkjet printing is still not the mainstream in the fabrication of electronic papers (E-papers). Accordingly, in this study, the feasibility and reliability of integrating ultra-thin chips (UTC) on inkjet printed papers were discussed and analyzed. The significant effects of printed layer thickness on both electrical performance and long-term stability of the E-papers were demonstrated. The results were also compared to screen-printed papers.","PeriodicalId":221424,"journal":{"name":"2022 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-07-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131181631","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2022-07-10DOI: 10.1109/fleps53764.2022.9781564
D. K. Neethipathi, Priyanka Ganguly, Ajay Beniwal, M. Scott, Adrian M. Bass, R. Dahiya
Monitoring of heavy metal ions in aquatic environment can be a tedious process, especially in harsh, logistically challenging field conditions. This work demonstrates the detection of copper ions in water using a low-cost screen printed 2D molybdenum disulfide (MoS2) nanoparticle based electrochemical sensor. To deal with the common field-testing challenges, an easily disposable, flexible, compact sized reliable sensor was fabricated using a screen-printing technique. The developed sensor shows an excellent performance with a linear range of 5 µM to 1000 µM, a low limits of detection (LOD) value of just 0.3125 µM, and high repeatability with standard deviation less than 0.5%. With this performance and attractive attributes such as flexible form factor, low-cost fabrication and disposability etc. the presented sensor shows a great potential for practical applications in soil and water monitoring.
{"title":"MoS2 modified screen printed carbon electrode based flexible sensor for detection of Copper","authors":"D. K. Neethipathi, Priyanka Ganguly, Ajay Beniwal, M. Scott, Adrian M. Bass, R. Dahiya","doi":"10.1109/fleps53764.2022.9781564","DOIUrl":"https://doi.org/10.1109/fleps53764.2022.9781564","url":null,"abstract":"Monitoring of heavy metal ions in aquatic environment can be a tedious process, especially in harsh, logistically challenging field conditions. This work demonstrates the detection of copper ions in water using a low-cost screen printed 2D molybdenum disulfide (MoS2) nanoparticle based electrochemical sensor. To deal with the common field-testing challenges, an easily disposable, flexible, compact sized reliable sensor was fabricated using a screen-printing technique. The developed sensor shows an excellent performance with a linear range of 5 µM to 1000 µM, a low limits of detection (LOD) value of just 0.3125 µM, and high repeatability with standard deviation less than 0.5%. With this performance and attractive attributes such as flexible form factor, low-cost fabrication and disposability etc. the presented sensor shows a great potential for practical applications in soil and water monitoring.","PeriodicalId":221424,"journal":{"name":"2022 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS)","volume":"13 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-07-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128801178","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2022-07-10DOI: 10.1109/fleps53764.2022.9781508
Rudra Mukherjee, A. Dahiya, R. Dahiya
Additive manufacturing is an economic and resource efficient route for development of flexible electronics for applications such as robotics, wearables, and real-time health monitoring systems. Although the 2-D and 3-D printing are mature technologies , their application in flexible electronics is still in early stage and comes with challenges such as poor reliability under repeated bending conditions. This is because the level of mechanical stresses that various components of a flexible electronic module must endure is substantially high. For example, the interconnects experience a large part of bending and twisting stresses, which can affect their conductivity and decrease the responsivity and reliability of the electronic module. In this paper, we assess the base resistance and endurance of screen-printed silver interconnects on commonly used soft and flexible substrates for up to 4000 bending and twisting cycles. It is observed that the base resistance and endurance of screen-printed silver interconnects are heavily dependent on the substrate. The endurance analysis present here will benefit applications such as smart tags, where screen printed interconnects or metal lines are extensively used.
{"title":"Torsional and bending endurance analysis of screen-printed interconnects on various flexible substrates","authors":"Rudra Mukherjee, A. Dahiya, R. Dahiya","doi":"10.1109/fleps53764.2022.9781508","DOIUrl":"https://doi.org/10.1109/fleps53764.2022.9781508","url":null,"abstract":"Additive manufacturing is an economic and resource efficient route for development of flexible electronics for applications such as robotics, wearables, and real-time health monitoring systems. Although the 2-D and 3-D printing are mature technologies , their application in flexible electronics is still in early stage and comes with challenges such as poor reliability under repeated bending conditions. This is because the level of mechanical stresses that various components of a flexible electronic module must endure is substantially high. For example, the interconnects experience a large part of bending and twisting stresses, which can affect their conductivity and decrease the responsivity and reliability of the electronic module. In this paper, we assess the base resistance and endurance of screen-printed silver interconnects on commonly used soft and flexible substrates for up to 4000 bending and twisting cycles. It is observed that the base resistance and endurance of screen-printed silver interconnects are heavily dependent on the substrate. The endurance analysis present here will benefit applications such as smart tags, where screen printed interconnects or metal lines are extensively used.","PeriodicalId":221424,"journal":{"name":"2022 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS)","volume":"25 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-07-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127404969","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2022-07-10DOI: 10.1109/fleps53764.2022.9781558
S. Khan, J. Kosel
A hybrid manufacturing method is presented using a combination of screen printing and casting, which are commonly used and widely accepted industrial manufacturing processes, to create multi-layered flexible sensors. The method enables the efficient fabrication of sensors that consist of conductive metallic pastes and silicone polymers. The feasibility of the manufacturing method is demonstrated for a parallel plate capacitive pressure sensor. The top and bottom metallic layers of the sensor are made using screen-printed nanoparticle-based silver conductive paste, while the pressure-sensitive silicone layer is formed by casting Ecoflex.
{"title":"A hybrid casting and screen-printing based manufacturing method for flexible sensors","authors":"S. Khan, J. Kosel","doi":"10.1109/fleps53764.2022.9781558","DOIUrl":"https://doi.org/10.1109/fleps53764.2022.9781558","url":null,"abstract":"A hybrid manufacturing method is presented using a combination of screen printing and casting, which are commonly used and widely accepted industrial manufacturing processes, to create multi-layered flexible sensors. The method enables the efficient fabrication of sensors that consist of conductive metallic pastes and silicone polymers. The feasibility of the manufacturing method is demonstrated for a parallel plate capacitive pressure sensor. The top and bottom metallic layers of the sensor are made using screen-printed nanoparticle-based silver conductive paste, while the pressure-sensitive silicone layer is formed by casting Ecoflex.","PeriodicalId":221424,"journal":{"name":"2022 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS)","volume":"C-18 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-07-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126765974","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2022-07-10DOI: 10.1109/fleps53764.2022.9781510
R. Mansour, O. Omoniyi, A. Reid, W. Brindley, B. G. Stewart, J. Windmill
Sugar casting is a simple and cost-effective direct method of generating polymer foams. By incorporating grains directly into mixtures of polymer and piezoelectric nanoparticles it is possible to create highly compliant materials with excellent piezoelectric properties. In this work, we use the sugar casting method in combination with spin coating to prepare a highly sensitive and flexible 0-3 piezoelectric polymer thin film membranes with a layer thickness of 20 to 190 µm. Porosities and elasticity are tuned by simply adjusting the sugar/polymer mass ratio. The expected outcome of this research was improvements to the piezoelectric voltage, the g33 measure, due to the increased compliance of the material, however iezoelectric composite membranes with high concentrations of PMN-PT also demonstrated gains in piezoelectric coupling, the d33 measure, when cast with high volume fractions of sugar. A remarkably high d33 coefficient of 69 pm/V was measured using the laser vibrometer technique. These innovative materials were developed as broadband ultrasonic sensors for partial discharge detection in undersea cables, however they have potential uses in energy scavenging platforms, biosensors, and acoustic actuators, among others.
{"title":"Synergy of PMN-PT with piezoelectric polymer using sugar casting method for sensing applications","authors":"R. Mansour, O. Omoniyi, A. Reid, W. Brindley, B. G. Stewart, J. Windmill","doi":"10.1109/fleps53764.2022.9781510","DOIUrl":"https://doi.org/10.1109/fleps53764.2022.9781510","url":null,"abstract":"Sugar casting is a simple and cost-effective direct method of generating polymer foams. By incorporating grains directly into mixtures of polymer and piezoelectric nanoparticles it is possible to create highly compliant materials with excellent piezoelectric properties. In this work, we use the sugar casting method in combination with spin coating to prepare a highly sensitive and flexible 0-3 piezoelectric polymer thin film membranes with a layer thickness of 20 to 190 µm. Porosities and elasticity are tuned by simply adjusting the sugar/polymer mass ratio. The expected outcome of this research was improvements to the piezoelectric voltage, the g33 measure, due to the increased compliance of the material, however iezoelectric composite membranes with high concentrations of PMN-PT also demonstrated gains in piezoelectric coupling, the d33 measure, when cast with high volume fractions of sugar. A remarkably high d33 coefficient of 69 pm/V was measured using the laser vibrometer technique. These innovative materials were developed as broadband ultrasonic sensors for partial discharge detection in undersea cables, however they have potential uses in energy scavenging platforms, biosensors, and acoustic actuators, among others.","PeriodicalId":221424,"journal":{"name":"2022 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS)","volume":"37 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-07-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122408719","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2022-07-10DOI: 10.1109/fleps53764.2022.9781520
S. Wang, J. S. Spüntrup, B. Albrecht, C. Harendt, J. Burghartz
Since the late 20th century, there has been an increasing demand and interest for stretchable, bendable, and flexible electronics for different applications, such as medicine, wearable devices, and in industry applications. Unlike most image sensors, which are planar and inflexible, in this work, an ultra-thin image sensor is performed as a Hybrid System in Foil (HySiF) by using Chip-Film Patch technology, which is a concept for high-performance and ultra-thin flexible electronics. The technology allows the integration of ultra-thin chips and widely distributed electronic components, such as sensors, microcontrollers, or antennas, in thin flexible polymer film, using CMOS-compatible equipment and processing. In order to characterize this image sensor embedded in foil, an adapter board for the Andvantest 93000SOIC test system was developed. This paper demonstrates production process of the HySiF and its´ behavior and performance. In addition, the applications and future work of this bendable image sensor in foil system is discussed.
{"title":"Processing and Chracterisation of an Ultra-thin Image Sensor Chip in flexible Foil System","authors":"S. Wang, J. S. Spüntrup, B. Albrecht, C. Harendt, J. Burghartz","doi":"10.1109/fleps53764.2022.9781520","DOIUrl":"https://doi.org/10.1109/fleps53764.2022.9781520","url":null,"abstract":"Since the late 20th century, there has been an increasing demand and interest for stretchable, bendable, and flexible electronics for different applications, such as medicine, wearable devices, and in industry applications. Unlike most image sensors, which are planar and inflexible, in this work, an ultra-thin image sensor is performed as a Hybrid System in Foil (HySiF) by using Chip-Film Patch technology, which is a concept for high-performance and ultra-thin flexible electronics. The technology allows the integration of ultra-thin chips and widely distributed electronic components, such as sensors, microcontrollers, or antennas, in thin flexible polymer film, using CMOS-compatible equipment and processing. In order to characterize this image sensor embedded in foil, an adapter board for the Andvantest 93000SOIC test system was developed. This paper demonstrates production process of the HySiF and its´ behavior and performance. In addition, the applications and future work of this bendable image sensor in foil system is discussed.","PeriodicalId":221424,"journal":{"name":"2022 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS)","volume":"31 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-07-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127981313","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2022-07-10DOI: 10.1109/fleps53764.2022.9781541
Lukas M. Bongartz, Anton Weissbach, Matteo Cucchi, K. Leo, H. Kleemann
Organic electrochemical transistors (OECTs) are appealing platforms for neuromorphic computing and biosensing, as they mimic the brains functionality of interacting electronic and ionic charges. While their rise to date has attracted much attention and revealed excellent application potential, little is known about the underlying physics. This deficiency applies in particular to the pronounced hysteresis found in the transfer curves - a property which, applicable as short- or long-term memory effect, is essential for neuromorphic functionality. Here we report, to the best of our knowledge, on the first temperature-dependent measurements of OECTs, which reveal remarkable insights on multiple device features to allow a glimpse into the thermodynamics of the underlying electrochemical reaction.
{"title":"Temperature-Dependence of All-Solid-State Organic Electrochemical Transistors","authors":"Lukas M. Bongartz, Anton Weissbach, Matteo Cucchi, K. Leo, H. Kleemann","doi":"10.1109/fleps53764.2022.9781541","DOIUrl":"https://doi.org/10.1109/fleps53764.2022.9781541","url":null,"abstract":"Organic electrochemical transistors (OECTs) are appealing platforms for neuromorphic computing and biosensing, as they mimic the brains functionality of interacting electronic and ionic charges. While their rise to date has attracted much attention and revealed excellent application potential, little is known about the underlying physics. This deficiency applies in particular to the pronounced hysteresis found in the transfer curves - a property which, applicable as short- or long-term memory effect, is essential for neuromorphic functionality. Here we report, to the best of our knowledge, on the first temperature-dependent measurements of OECTs, which reveal remarkable insights on multiple device features to allow a glimpse into the thermodynamics of the underlying electrochemical reaction.","PeriodicalId":221424,"journal":{"name":"2022 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-07-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115942103","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2022-07-10DOI: 10.1109/fleps53764.2022.9781546
Enrico Zanazzi, Giada Marchi, V. Mulloni, M. Donelli, L. Lorenzelli
This paper presents a preliminary optimization study of the performance of conductive resonators inkjet-printed on polyethylene terephthalate (PET) with an increasing number of printed layers in a range 1-20 layers. Samples were tested and the amplitude of the frequency response was demonstrated to follow a power function with the increasing number of layers. Results indicate that with only 2 printed layers the signal intensity approaches 70% of the maximum intensity obtained with the highest number of layers (20), and that with 5 printed layers the signal reaches 83%. This demonstrates that only few deposited layers can be considered a good compromise for the production of Radio-Frequency IDentification (RFID) resonators by inkjet-printing on PET. Finally, the selected sample was tested as a chipless humidity sensor in a configuration with a 150µm-thick Nafion 117 sensitive material.
{"title":"Optimizing the number of printed layers in a PET inkjet-printed chipless RFID sensor","authors":"Enrico Zanazzi, Giada Marchi, V. Mulloni, M. Donelli, L. Lorenzelli","doi":"10.1109/fleps53764.2022.9781546","DOIUrl":"https://doi.org/10.1109/fleps53764.2022.9781546","url":null,"abstract":"This paper presents a preliminary optimization study of the performance of conductive resonators inkjet-printed on polyethylene terephthalate (PET) with an increasing number of printed layers in a range 1-20 layers. Samples were tested and the amplitude of the frequency response was demonstrated to follow a power function with the increasing number of layers. Results indicate that with only 2 printed layers the signal intensity approaches 70% of the maximum intensity obtained with the highest number of layers (20), and that with 5 printed layers the signal reaches 83%. This demonstrates that only few deposited layers can be considered a good compromise for the production of Radio-Frequency IDentification (RFID) resonators by inkjet-printing on PET. Finally, the selected sample was tested as a chipless humidity sensor in a configuration with a 150µm-thick Nafion 117 sensitive material.","PeriodicalId":221424,"journal":{"name":"2022 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS)","volume":"7 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-07-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116876400","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2022-07-10DOI: 10.1109/fleps53764.2022.9781599
Sheikh Dobir Hossain, Miguel A. Palacios Mora, Annatoma Arif, Bhushan Lohani, Robert C. Roberts
This work presents a flexible and chipless radiofrequency identification (RFID) memory sensor for customizable temperature threshold detection wirelessly. The developed memory sensor is built with a polydimethylsiloxane (PDMS) substrate and metal loaded three microchannel based complementary split circular ring resonators. We inject Eutectic Gallium Indium (EGaIn) liquid metal alloy and composite oil composed of a mixture of two common cooking oils - grapeseed and coconut oil - through the channel results in a stretchable, bendable, rollable, and twistable device suitable for monitoring environmental temperature variation. 3D printed molds are used for designing the microchannel based flexible substrate. The geometry of the design has the novelty of having a microchannel inside a flexible substrate that offers food safe sensor. Moreover, the materials inside the channel can store sensing information for lower temperatures, eliminating continuous temperature monitoring. The experimental results of the fabricated prototype confirm the sensor can detect temperature thresholds of 4°C and 8°C up to 52° of bending angle. This paper also verifies the resonator can work as a permanent temperature memory sensor.
{"title":"Flexible Chipless RFID Temperature Memory Sensor","authors":"Sheikh Dobir Hossain, Miguel A. Palacios Mora, Annatoma Arif, Bhushan Lohani, Robert C. Roberts","doi":"10.1109/fleps53764.2022.9781599","DOIUrl":"https://doi.org/10.1109/fleps53764.2022.9781599","url":null,"abstract":"This work presents a flexible and chipless radiofrequency identification (RFID) memory sensor for customizable temperature threshold detection wirelessly. The developed memory sensor is built with a polydimethylsiloxane (PDMS) substrate and metal loaded three microchannel based complementary split circular ring resonators. We inject Eutectic Gallium Indium (EGaIn) liquid metal alloy and composite oil composed of a mixture of two common cooking oils - grapeseed and coconut oil - through the channel results in a stretchable, bendable, rollable, and twistable device suitable for monitoring environmental temperature variation. 3D printed molds are used for designing the microchannel based flexible substrate. The geometry of the design has the novelty of having a microchannel inside a flexible substrate that offers food safe sensor. Moreover, the materials inside the channel can store sensing information for lower temperatures, eliminating continuous temperature monitoring. The experimental results of the fabricated prototype confirm the sensor can detect temperature thresholds of 4°C and 8°C up to 52° of bending angle. This paper also verifies the resonator can work as a permanent temperature memory sensor.","PeriodicalId":221424,"journal":{"name":"2022 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS)","volume":"58 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-07-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125435586","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
京公网安备 11010802042870号
京ICP备2023020795号-1
扫码关注我们
求助内容：
应助结果提醒方式：