Pub Date : 2022-07-10DOI: 10.1109/fleps53764.2022.9781516
Shweta Shekar, S. Subramanian, Praveen C Ramamurthy
The present work reports the use of a conjugated organic molecule for the detection of hexavalent chromium ions. The organic molecule designed herein is a guanidine-based moiety that has shown a limit of detection as low as 1ppm when used in the form of a chemiresistive sensor.
{"title":"Design and fabrication of a solid-state chemiresistive sensor for the detection of hexavalent chromium","authors":"Shweta Shekar, S. Subramanian, Praveen C Ramamurthy","doi":"10.1109/fleps53764.2022.9781516","DOIUrl":"https://doi.org/10.1109/fleps53764.2022.9781516","url":null,"abstract":"The present work reports the use of a conjugated organic molecule for the detection of hexavalent chromium ions. The organic molecule designed herein is a guanidine-based moiety that has shown a limit of detection as low as 1ppm when used in the form of a chemiresistive sensor.","PeriodicalId":221424,"journal":{"name":"2022 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS)","volume":"24 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-07-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127921161","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2022-07-10DOI: 10.1109/fleps53764.2022.9781517
E. Altinozen, A. Vukovic, P. Sewell
This paper reports on a computational model that is used to assess the reflection loss and transmission of flexible interconnects fabricated on a PI substrate and exposed to torsion deformation. Realistic material parameters that include dielectric and metallic losses typical of interconnects fabricated on the PI substrate are used in the model.
{"title":"Impact of Torsion on Flexible Interconnects","authors":"E. Altinozen, A. Vukovic, P. Sewell","doi":"10.1109/fleps53764.2022.9781517","DOIUrl":"https://doi.org/10.1109/fleps53764.2022.9781517","url":null,"abstract":"This paper reports on a computational model that is used to assess the reflection loss and transmission of flexible interconnects fabricated on a PI substrate and exposed to torsion deformation. Realistic material parameters that include dielectric and metallic losses typical of interconnects fabricated on the PI substrate are used in the model.","PeriodicalId":221424,"journal":{"name":"2022 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS)","volume":"15 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-07-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125607319","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2022-07-10DOI: 10.1109/fleps53764.2022.9781489
L. Xing, A. Casson
Electroencephalography (EEG) is the non-invasive monitoring of the electrical activity in the brain, and forms a key part of Brain-Computer Interfaces (BCIs). Traditionally EEG instrumentation has been connected to the head using wet Ag/AgCl electrodes in the shape of a (typically) 1 cm disc. However, the conductive gel used increases set up time, and all the electrodes are the same size and shape for all users and head/hair shapes. Recently 3D printed EEG electrodes have been proposed to allow personalised EEG electrodes. However, to-date these have relied on printing a base structure which is then coated in Ag/AgCl. This paper presents 3D printed EEG electrodes using a directly conductive filament. The resulting electrodes do not require a conductive gel or coating, can be personalized, and cost less money and manufacturing time. The new electrodes are characterized in terms of electrical resistance, skin contact impedance and mechanical strength, all showing an acceptable performance. We demonstrate their use for recording Steady-State Visual Evoked Potential (SSVEP) brain responses in comparison to wet and dry Ag/AgCl electrodes.
{"title":"Directly conductive, flexible, 3D printed, EEG electrodes","authors":"L. Xing, A. Casson","doi":"10.1109/fleps53764.2022.9781489","DOIUrl":"https://doi.org/10.1109/fleps53764.2022.9781489","url":null,"abstract":"Electroencephalography (EEG) is the non-invasive monitoring of the electrical activity in the brain, and forms a key part of Brain-Computer Interfaces (BCIs). Traditionally EEG instrumentation has been connected to the head using wet Ag/AgCl electrodes in the shape of a (typically) 1 cm disc. However, the conductive gel used increases set up time, and all the electrodes are the same size and shape for all users and head/hair shapes. Recently 3D printed EEG electrodes have been proposed to allow personalised EEG electrodes. However, to-date these have relied on printing a base structure which is then coated in Ag/AgCl. This paper presents 3D printed EEG electrodes using a directly conductive filament. The resulting electrodes do not require a conductive gel or coating, can be personalized, and cost less money and manufacturing time. The new electrodes are characterized in terms of electrical resistance, skin contact impedance and mechanical strength, all showing an acceptable performance. We demonstrate their use for recording Steady-State Visual Evoked Potential (SSVEP) brain responses in comparison to wet and dry Ag/AgCl electrodes.","PeriodicalId":221424,"journal":{"name":"2022 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS)","volume":"30 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-07-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123086950","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2022-07-10DOI: 10.1109/fleps53764.2022.9781486
Ibrahim Bozyel, Alper Endes, Aybuke Akkoca, Baris Yuksekkaya, Dincer Gokcen
Flexible sensors have a great impact in removing the barriers of the electronic components caused by their rigid shape. This study introduces optimal artificial intelligence algorithms for the classification of high precision flex-sensor outputs in sensing various liquids. The composite-based sensor was realized by combining polydimethylsiloxane (PDMS) and laser-induced graphene formed on polyimide (PI). PI substrate was engraved by blue laser to produce graphene sheets over the surface, while this approach decreases cost of sensor production, reliability of mass production was improved with less process steps. The recorded capacitance values were used to classify various liquids dropped over the sensor, then more than 90% accuracy, precision, and recall results were obtained under the scope of this study.
{"title":"AI-based Liquid Classification with Laser-Induced Graphene Flex-Sensor","authors":"Ibrahim Bozyel, Alper Endes, Aybuke Akkoca, Baris Yuksekkaya, Dincer Gokcen","doi":"10.1109/fleps53764.2022.9781486","DOIUrl":"https://doi.org/10.1109/fleps53764.2022.9781486","url":null,"abstract":"Flexible sensors have a great impact in removing the barriers of the electronic components caused by their rigid shape. This study introduces optimal artificial intelligence algorithms for the classification of high precision flex-sensor outputs in sensing various liquids. The composite-based sensor was realized by combining polydimethylsiloxane (PDMS) and laser-induced graphene formed on polyimide (PI). PI substrate was engraved by blue laser to produce graphene sheets over the surface, while this approach decreases cost of sensor production, reliability of mass production was improved with less process steps. The recorded capacitance values were used to classify various liquids dropped over the sensor, then more than 90% accuracy, precision, and recall results were obtained under the scope of this study.","PeriodicalId":221424,"journal":{"name":"2022 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS)","volume":"258 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-07-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116211278","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2022-07-10DOI: 10.1109/FLEPS53764.2022.9781513
Aswathi R. Nair, S. Sambandan
This paper discusses a novel technique for patterning metal thin film for thin film transistor applications. This is a roll to roll compatible patterning technique which involves the formation of an arc discharge between a metal electrode and the metal thin film. The arc discharge results in the etching of metal thin film in a very narrow region. Preliminary studies indicate the formation of etched regions having feature size as small as 30μm at an applied voltage of 100V. Further, a metal-semiconductor-metal structure is fabricated by patterning the metal using both the standard shadow mask method and the proposed arc etching method. A comparison between the current-voltage characteristics in both cases demonstrate the possibility of using arc etching as a source-drain patterning technique suitable for thin film transistors.
{"title":"Metal Patterning via Arc Etching for Thin Film Electronics","authors":"Aswathi R. Nair, S. Sambandan","doi":"10.1109/FLEPS53764.2022.9781513","DOIUrl":"https://doi.org/10.1109/FLEPS53764.2022.9781513","url":null,"abstract":"This paper discusses a novel technique for patterning metal thin film for thin film transistor applications. This is a roll to roll compatible patterning technique which involves the formation of an arc discharge between a metal electrode and the metal thin film. The arc discharge results in the etching of metal thin film in a very narrow region. Preliminary studies indicate the formation of etched regions having feature size as small as 30μm at an applied voltage of 100V. Further, a metal-semiconductor-metal structure is fabricated by patterning the metal using both the standard shadow mask method and the proposed arc etching method. A comparison between the current-voltage characteristics in both cases demonstrate the possibility of using arc etching as a source-drain patterning technique suitable for thin film transistors.","PeriodicalId":221424,"journal":{"name":"2022 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS)","volume":"19 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-07-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124998323","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2022-07-10DOI: 10.1109/fleps53764.2022.9781573
Mathias Fayolle, Séverine de Mulatier, R. Delattre, S. Blayac
This paper proposes a simple and effective method to wirelessly connect a microcontroller to a sensor using Serial Peripheral Interface (SPI). The transmission is done using capacitive interconnections. A pair of electrodes replaces the ohmic connection between the Integrated Circuits (IC). Our system is suited for prototyping ultrathin electronics and reconfigurable interfaces with sensors. A wireless communication with a packet error rate of 0.4 % between a microcontroller and a TC72 temperature sensor is demonstrated.
{"title":"Demonstration of near-field capacitive standard communication bus for ultrathin reconfigurable sensor nodes","authors":"Mathias Fayolle, Séverine de Mulatier, R. Delattre, S. Blayac","doi":"10.1109/fleps53764.2022.9781573","DOIUrl":"https://doi.org/10.1109/fleps53764.2022.9781573","url":null,"abstract":"This paper proposes a simple and effective method to wirelessly connect a microcontroller to a sensor using Serial Peripheral Interface (SPI). The transmission is done using capacitive interconnections. A pair of electrodes replaces the ohmic connection between the Integrated Circuits (IC). Our system is suited for prototyping ultrathin electronics and reconfigurable interfaces with sensors. A wireless communication with a packet error rate of 0.4 % between a microcontroller and a TC72 temperature sensor is demonstrated.","PeriodicalId":221424,"journal":{"name":"2022 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS)","volume":"10 6","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-07-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114046337","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2022-07-10DOI: 10.1109/fleps53764.2022.9781501
A. Panchal, Ankit Malik, Bidisha Nath, Praveen C Ramamurthy
This work presents the sensing ability demonstrated by thiophene derivative in an OFET architecture. The detection ability of the fabricated device was tested in real-time for acetone at various intervals manifesting as variation in drain currents. 1x1 cm2 90 nm thermal oxide substrate were used for lithographically patterning of interdigitated source-drain structures with a channel length of 40um. A reduction in drain current by ~35% and charge carrier mobility by ~ 53% was observed attributed to the sensing action performed by thiophene derivative film by acetone vapor interaction. The photoluminescence spectra corroborate the specific interaction of acetone molecules with sensing element.
{"title":"Conducting Polymer based Field-Effect Transistor for Volatile Organic Compound Sensing","authors":"A. Panchal, Ankit Malik, Bidisha Nath, Praveen C Ramamurthy","doi":"10.1109/fleps53764.2022.9781501","DOIUrl":"https://doi.org/10.1109/fleps53764.2022.9781501","url":null,"abstract":"This work presents the sensing ability demonstrated by thiophene derivative in an OFET architecture. The detection ability of the fabricated device was tested in real-time for acetone at various intervals manifesting as variation in drain currents. 1x1 cm2 90 nm thermal oxide substrate were used for lithographically patterning of interdigitated source-drain structures with a channel length of 40um. A reduction in drain current by ~35% and charge carrier mobility by ~ 53% was observed attributed to the sensing action performed by thiophene derivative film by acetone vapor interaction. The photoluminescence spectra corroborate the specific interaction of acetone molecules with sensing element.","PeriodicalId":221424,"journal":{"name":"2022 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS)","volume":"9 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-07-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"113963835","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2022-07-10DOI: 10.1109/fleps53764.2022.9781550
L. Sarcina, F. Viola, Francesco Modena, P. Bollella, M. Caironi, I. Esposito, L. Torsi, F. Torricelli, E. Macchia
Pancreatic-biliary cancer represents a challenge for clinicians since the detection is performed at later stages and treated with palliative approaches. A screening method for the early detection should be of paramount importance. The aim of this study is the detection of pancreatic mucinous cysts protein markers (MUC1) in human serum down to the physical limit, using an Electrolyte-gated FET based technology, namely the "Single-Molecule assay with a large Transistor" (SiMoT) platform. The structure and transistor components have been developed on plastic substrates. The 3D gate structure is compatible with an ELISA plate. The functionalization procedure is assessed independently through Surface Plasmon Resonance, enabling the real-time monitoring of the gold modification with antibodies essential for the assay.
{"title":"Large-area bio-electronic sensors for early detection of pancreatic-biliary cancer protein markers","authors":"L. Sarcina, F. Viola, Francesco Modena, P. Bollella, M. Caironi, I. Esposito, L. Torsi, F. Torricelli, E. Macchia","doi":"10.1109/fleps53764.2022.9781550","DOIUrl":"https://doi.org/10.1109/fleps53764.2022.9781550","url":null,"abstract":"Pancreatic-biliary cancer represents a challenge for clinicians since the detection is performed at later stages and treated with palliative approaches. A screening method for the early detection should be of paramount importance. The aim of this study is the detection of pancreatic mucinous cysts protein markers (MUC1) in human serum down to the physical limit, using an Electrolyte-gated FET based technology, namely the \"Single-Molecule assay with a large Transistor\" (SiMoT) platform. The structure and transistor components have been developed on plastic substrates. The 3D gate structure is compatible with an ELISA plate. The functionalization procedure is assessed independently through Surface Plasmon Resonance, enabling the real-time monitoring of the gold modification with antibodies essential for the assay.","PeriodicalId":221424,"journal":{"name":"2022 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS)","volume":"34 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-07-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122721959","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2022-07-10DOI: 10.1109/fleps53764.2022.9781488
Pedro González-Losada, Hao Yang, Rui M. R. Pinto, Mohammadmahdi Faraji, Rosana A. Dias, K. Vinayakumar
The advancement in Internet of Things (IoT) and 5G technologies are pushing the interest in zero power sensor networks in different sectors including wearables, wellbeing, smart packaging, and agriculture. In this manuscript, we report the adhesive-bonded piezoroelectret for the application in zero-power sensors. Laser-patterned polyvinyl chloride (PVC) adhesive tape is used to bond two 25 µm-thick FEP sheets with chargetrapping voids. The bonded fluorinated ethylene propylene (FEP) sheets were charged using a 1) pyroelectric and 2) corona discharging approach to produce piezoroelectrets. Produced piezoroelectrets were characterized for the force response and piezoelectric coefficient (d33 = 20-30 pC/N) using an in-house built setup. Further, the repeatability between different piezoroelectret samples fabricated using a similar approach is validated. Produced flexible piezoelectret was used to measure the human cardiac pulse pressure in the wrist.
{"title":"Flexible ferroelectret for zero power wearable application","authors":"Pedro González-Losada, Hao Yang, Rui M. R. Pinto, Mohammadmahdi Faraji, Rosana A. Dias, K. Vinayakumar","doi":"10.1109/fleps53764.2022.9781488","DOIUrl":"https://doi.org/10.1109/fleps53764.2022.9781488","url":null,"abstract":"The advancement in Internet of Things (IoT) and 5G technologies are pushing the interest in zero power sensor networks in different sectors including wearables, wellbeing, smart packaging, and agriculture. In this manuscript, we report the adhesive-bonded piezoroelectret for the application in zero-power sensors. Laser-patterned polyvinyl chloride (PVC) adhesive tape is used to bond two 25 µm-thick FEP sheets with chargetrapping voids. The bonded fluorinated ethylene propylene (FEP) sheets were charged using a 1) pyroelectric and 2) corona discharging approach to produce piezoroelectrets. Produced piezoroelectrets were characterized for the force response and piezoelectric coefficient (d33 = 20-30 pC/N) using an in-house built setup. Further, the repeatability between different piezoroelectret samples fabricated using a similar approach is validated. Produced flexible piezoelectret was used to measure the human cardiac pulse pressure in the wrist.","PeriodicalId":221424,"journal":{"name":"2022 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS)","volume":"39 5 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-07-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132535861","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2022-07-10DOI: 10.1109/fleps53764.2022.9781581
Parinaz Eskandari, C. L. Beaver, S. Rossbach, D. Maddipatla, M. Atashbar
A flexible microplasma discharge device (MDD) was fabricated for the eradication of Candida albicans, an opportunistic pathogenic yeast, using ambient air as the sterilization agent. To fabricate the MDD, silver ink was deposited on flexible polyethylene terephthalate (PET) films in a honeycomb and circular design using screen-printing process to fabricate the top and bottom electrodes. Then the MDD was assembled by attaching the top and bottom electrode using a two-sided Kapton tape (dielectric layer). The antifungal efficacy of the MDD was investigated by varying parameters including treatment time (60, 90 and 120 seconds) and applied voltage (6, 8 and 10 V). The antifungal efficacies of 12.5% and 100% were achieved for applied voltage ranging from 6 V to 10 V for a treatment time of 60 seconds respectively. Similarly, as the treatment time increased from 60 seconds to 120 seconds for an applied voltage of 6 V, an efficacy rate of 3% to 95% was obtained, respectively. In addition, a surface temperature of 22.4 °C was measured at an applied voltage of 6 V which is safe to the wound area. This clearly demonstrated that the MDD can eliminate the C. albicans with an efficacy rate of 95% at a low voltage of 6 V and treatment time of 120 seconds.
{"title":"Flexible Microplasma Discharge Device for Treating Burn Wound Injuries Against Fungal Infections","authors":"Parinaz Eskandari, C. L. Beaver, S. Rossbach, D. Maddipatla, M. Atashbar","doi":"10.1109/fleps53764.2022.9781581","DOIUrl":"https://doi.org/10.1109/fleps53764.2022.9781581","url":null,"abstract":"A flexible microplasma discharge device (MDD) was fabricated for the eradication of Candida albicans, an opportunistic pathogenic yeast, using ambient air as the sterilization agent. To fabricate the MDD, silver ink was deposited on flexible polyethylene terephthalate (PET) films in a honeycomb and circular design using screen-printing process to fabricate the top and bottom electrodes. Then the MDD was assembled by attaching the top and bottom electrode using a two-sided Kapton tape (dielectric layer). The antifungal efficacy of the MDD was investigated by varying parameters including treatment time (60, 90 and 120 seconds) and applied voltage (6, 8 and 10 V). The antifungal efficacies of 12.5% and 100% were achieved for applied voltage ranging from 6 V to 10 V for a treatment time of 60 seconds respectively. Similarly, as the treatment time increased from 60 seconds to 120 seconds for an applied voltage of 6 V, an efficacy rate of 3% to 95% was obtained, respectively. In addition, a surface temperature of 22.4 °C was measured at an applied voltage of 6 V which is safe to the wound area. This clearly demonstrated that the MDD can eliminate the C. albicans with an efficacy rate of 95% at a low voltage of 6 V and treatment time of 120 seconds.","PeriodicalId":221424,"journal":{"name":"2022 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-07-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130375405","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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