Pub Date : 2022-07-10DOI: 10.1109/fleps53764.2022.9781515
Christian Zajc, Markus Haberler, I. Siegl, G. Holweg, C. Steger
A System-on-Chip (SoC) for Drug-of-Abuse (DoA) testing for Point-Of-Care (POC) is presented. The SoC enables electrochemical measurements on biochemical sensors and provides interface capabilities to rechargeable energy storage elements. An integrated 13.56 MHz contactless interface enables two-way wireless communication and power transfer. Autonomous POC applications with rechargeable energy storage require a power-aware power management to enable measurements from a single charge. This is achieved by a power management that supports different power supply modes in a flexible manner, optimized for the application in POC diagnostics. The SoC consumes 7.9 µA in deep sleep and 3.5 mA in active mode. Power optimizations are investigated and evaluated on a Printed Circuit Board (PCB)-based demonstrator. The obtained results can be applied to POC platforms to increase the power-awareness.
{"title":"Power-Aware System-on-Chip for Point-Of-Care Diagnostic Applications","authors":"Christian Zajc, Markus Haberler, I. Siegl, G. Holweg, C. Steger","doi":"10.1109/fleps53764.2022.9781515","DOIUrl":"https://doi.org/10.1109/fleps53764.2022.9781515","url":null,"abstract":"A System-on-Chip (SoC) for Drug-of-Abuse (DoA) testing for Point-Of-Care (POC) is presented. The SoC enables electrochemical measurements on biochemical sensors and provides interface capabilities to rechargeable energy storage elements. An integrated 13.56 MHz contactless interface enables two-way wireless communication and power transfer. Autonomous POC applications with rechargeable energy storage require a power-aware power management to enable measurements from a single charge. This is achieved by a power management that supports different power supply modes in a flexible manner, optimized for the application in POC diagnostics. The SoC consumes 7.9 µA in deep sleep and 3.5 mA in active mode. Power optimizations are investigated and evaluated on a Printed Circuit Board (PCB)-based demonstrator. The obtained results can be applied to POC platforms to increase the power-awareness.","PeriodicalId":221424,"journal":{"name":"2022 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS)","volume":"24 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-07-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114652566","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2022-07-10DOI: 10.1109/fleps53764.2022.9781498
Olalekan O. Olowo, Ruoshi Zhang, Ji-Tzuoh Lin, Danming Wei, A. Sherehiy, Douglas Jackson, Dilan Ratnayake, Alireza Tofangchi, D. Popa
Inkjet printing for fabricating microstructures has gained popularity during the last decade, making it possible to realize complex electronic circuits, components, and devices previously manufactured using 2D lithographic processes. In this work, we use aerosol inkjet printing delivered from the NeXus, a custom-built microfabrication platform that can deposit silver ink on a flexible printed circuit (FPC) substrate. We present the fabrication method of a 10mm diameter circular strain gauge tactile sensor, which is annealed using oven curing or intense pulse light (IPL) process. The resulting sensor performance under varying curing schedules is evaluated by loading packaged sensors with increasing weight, reporting a measured resistance in the 300Ω-1.2kΩ range.
{"title":"Aerosol Jet Printed Tactile Sensor on Flexible Substrate","authors":"Olalekan O. Olowo, Ruoshi Zhang, Ji-Tzuoh Lin, Danming Wei, A. Sherehiy, Douglas Jackson, Dilan Ratnayake, Alireza Tofangchi, D. Popa","doi":"10.1109/fleps53764.2022.9781498","DOIUrl":"https://doi.org/10.1109/fleps53764.2022.9781498","url":null,"abstract":"Inkjet printing for fabricating microstructures has gained popularity during the last decade, making it possible to realize complex electronic circuits, components, and devices previously manufactured using 2D lithographic processes. In this work, we use aerosol inkjet printing delivered from the NeXus, a custom-built microfabrication platform that can deposit silver ink on a flexible printed circuit (FPC) substrate. We present the fabrication method of a 10mm diameter circular strain gauge tactile sensor, which is annealed using oven curing or intense pulse light (IPL) process. The resulting sensor performance under varying curing schedules is evaluated by loading packaged sensors with increasing weight, reporting a measured resistance in the 300Ω-1.2kΩ range.","PeriodicalId":221424,"journal":{"name":"2022 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS)","volume":"15 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-07-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124017750","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2022-07-10DOI: 10.1109/fleps53764.2022.9781497
F. C. Gattinara Di Zubiena, L. D’Alvia, Z. Del Prete, E. Palermo
The lack of proprioception in lower limb amputees is a major cause of gait asymmetry, balance issues and risk of falling. Various devices have been proposed to solve these problems, allowing to gather information about the gait cycle and provide the patient with sensory feedback. The static characterization of a novel stretchable strain sensor manufactured through 3D printing will be studied in this study. This sensor will be the sensitive element of a new wearable proprioceptive device for patients with passive lower limb prostheses. For the realization of the sensor, an elastomeric material (Agilus30Clear), printed with the PolyJet methodology, was used for the support while a eutectic Gallium-Indium (eGaIn) metal alloy was used as the deformation sensitive element. Static tests were conducted for studying the behavior of the sensor with respect to strain. The results provided a good response to the stimulus with good repeatability, sensitivity and R2 values.
{"title":"A static characterization of stretchable 3D-printed strain sensor for restoring proprioception in amputees","authors":"F. C. Gattinara Di Zubiena, L. D’Alvia, Z. Del Prete, E. Palermo","doi":"10.1109/fleps53764.2022.9781497","DOIUrl":"https://doi.org/10.1109/fleps53764.2022.9781497","url":null,"abstract":"The lack of proprioception in lower limb amputees is a major cause of gait asymmetry, balance issues and risk of falling. Various devices have been proposed to solve these problems, allowing to gather information about the gait cycle and provide the patient with sensory feedback. The static characterization of a novel stretchable strain sensor manufactured through 3D printing will be studied in this study. This sensor will be the sensitive element of a new wearable proprioceptive device for patients with passive lower limb prostheses. For the realization of the sensor, an elastomeric material (Agilus30Clear), printed with the PolyJet methodology, was used for the support while a eutectic Gallium-Indium (eGaIn) metal alloy was used as the deformation sensitive element. Static tests were conducted for studying the behavior of the sensor with respect to strain. The results provided a good response to the stimulus with good repeatability, sensitivity and R2 values.","PeriodicalId":221424,"journal":{"name":"2022 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS)","volume":"31 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-07-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130594861","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2022-07-10DOI: 10.1109/fleps53764.2022.9781537
Mindaugas Ilickas, R. Mardosaitė, B. Abakevičienė, S. Račkauskas
ZnO nanowires are often used for UV sensing, however in order to obtain high performance a complicated multistep process for preparation together with high measurement temperatures are used. In this work we demonstrate a facile one-step spray-coating method for the preparation of UV sensors based on ZnO tetrapod (ZnO-T) structure, demonstrating both high response (on/off) and fast rise-decay times at room temperature. Such UV sensors could be in principle deposited on any substrates; therefore this method could be used for flexible UV sensor preparation.
{"title":"Room temperature ZnO nanowire UV sensors by spray-coating","authors":"Mindaugas Ilickas, R. Mardosaitė, B. Abakevičienė, S. Račkauskas","doi":"10.1109/fleps53764.2022.9781537","DOIUrl":"https://doi.org/10.1109/fleps53764.2022.9781537","url":null,"abstract":"ZnO nanowires are often used for UV sensing, however in order to obtain high performance a complicated multistep process for preparation together with high measurement temperatures are used. In this work we demonstrate a facile one-step spray-coating method for the preparation of UV sensors based on ZnO tetrapod (ZnO-T) structure, demonstrating both high response (on/off) and fast rise-decay times at room temperature. Such UV sensors could be in principle deposited on any substrates; therefore this method could be used for flexible UV sensor preparation.","PeriodicalId":221424,"journal":{"name":"2022 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS)","volume":"55 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-07-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125983027","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2022-07-10DOI: 10.1109/fleps53764.2022.9781514
Luca De Pamphilis, Adamos Christou, A. Dahiya, R. Dahiya
Direct printing of inorganic nanowires (NWs) at selected locations on diverse substrates is an attractive route for obtaining multifunctional devices. Towards this, contact printing has been explored to assemble aligned NWs-based uniform electronic layers over large areas. However, repeated lithography steps are needed to obtain these electronic layers at selected locations, which is a cumbersome and wasteful process. Herein, we present a new method for lithography-free patterning of NW-based electronic layers at selected locations. First, contact printing is used to realise electronic layers of high-density, highly aligned NWs over large areas. Then, using a micropatterned elastomer stamp, we remove the NWs from locations where they are not required. To enhance the removal yield, we used the capillary-force-assisted stamp technique that uses a thin layer of evaporated water as an instant glue to increase the adhesion between NWs and elastomeric stamps. The optimised process shows a high removal yield (~99%), thanks to the strong capillary adhesive forces developed at the stamp-NW interface, and a good pattern fidelity. The present study demonstrates selective contact removal approach as a contamination-free NW patterning process suitable for large area, high-performance flexible electronics.
{"title":"Selective removal of contact printed nanowires for lithography-free patterning","authors":"Luca De Pamphilis, Adamos Christou, A. Dahiya, R. Dahiya","doi":"10.1109/fleps53764.2022.9781514","DOIUrl":"https://doi.org/10.1109/fleps53764.2022.9781514","url":null,"abstract":"Direct printing of inorganic nanowires (NWs) at selected locations on diverse substrates is an attractive route for obtaining multifunctional devices. Towards this, contact printing has been explored to assemble aligned NWs-based uniform electronic layers over large areas. However, repeated lithography steps are needed to obtain these electronic layers at selected locations, which is a cumbersome and wasteful process. Herein, we present a new method for lithography-free patterning of NW-based electronic layers at selected locations. First, contact printing is used to realise electronic layers of high-density, highly aligned NWs over large areas. Then, using a micropatterned elastomer stamp, we remove the NWs from locations where they are not required. To enhance the removal yield, we used the capillary-force-assisted stamp technique that uses a thin layer of evaporated water as an instant glue to increase the adhesion between NWs and elastomeric stamps. The optimised process shows a high removal yield (~99%), thanks to the strong capillary adhesive forces developed at the stamp-NW interface, and a good pattern fidelity. The present study demonstrates selective contact removal approach as a contamination-free NW patterning process suitable for large area, high-performance flexible electronics.","PeriodicalId":221424,"journal":{"name":"2022 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS)","volume":"119 7 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-07-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126297276","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2022-07-10DOI: 10.1109/fleps53764.2022.9781571
Arshad Khan, Muhammad Umaid Bukhari, Khawaja Qasim Maqbool, K. Riaz, A. Bermak
The rapid increase in plastic pollution has become dangerous for the future sustainability of our planet. Without proper recycling, thrown away plastic objects usually end up in landfills and remain there for centuries causing irreversible damage to the environment. The energy consumption of ever-increasing portable electronic devices is another challenge for the world. To mitigate these pressing issues, we propose a plastic clear bag based triboelectric nanogenerator (PCB-TENG). Plastic from a discarded clear bag in combination with paper is used to fabricate the proposed PCB-TENG. The fabricated nanogenerator can produce maximum open circuit voltage of 22 V, maximum power of 57 µW and can be used to power small electronic devices. The proposed TENG provides a way to mitigate plastic waste and promote the idea of circular economy.
{"title":"Recycled Plastic Waste-based Triboelectric Nanogenerator Reinforcing Circular Economy","authors":"Arshad Khan, Muhammad Umaid Bukhari, Khawaja Qasim Maqbool, K. Riaz, A. Bermak","doi":"10.1109/fleps53764.2022.9781571","DOIUrl":"https://doi.org/10.1109/fleps53764.2022.9781571","url":null,"abstract":"The rapid increase in plastic pollution has become dangerous for the future sustainability of our planet. Without proper recycling, thrown away plastic objects usually end up in landfills and remain there for centuries causing irreversible damage to the environment. The energy consumption of ever-increasing portable electronic devices is another challenge for the world. To mitigate these pressing issues, we propose a plastic clear bag based triboelectric nanogenerator (PCB-TENG). Plastic from a discarded clear bag in combination with paper is used to fabricate the proposed PCB-TENG. The fabricated nanogenerator can produce maximum open circuit voltage of 22 V, maximum power of 57 µW and can be used to power small electronic devices. The proposed TENG provides a way to mitigate plastic waste and promote the idea of circular economy.","PeriodicalId":221424,"journal":{"name":"2022 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS)","volume":"232 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-07-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124977983","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2022-07-10DOI: 10.1109/fleps53764.2022.9781507
F. Torricelli, E. Macchia, P. Bollella, C. Di Franco, Z. Kovács-Vajna, G. Scamarcio, L. Torsi
Single-Molecule organic transistors embedding a large-area bioreceptor surface can potentially revolutionize the current medical diagnostic approaches. For instance, sensing a single molecule in a biological fluid can provide early and noninvasive detection of a disease. The development of a reliable and multiplexed electronic large-area single-molecule technology urgently requires the improvement of our current understanding. Here we propose a physical model of large-area single-molecule organic transistor sensors. The model describes the electrical measurements and provides meaningful information about the sensor operation. The bioelectronic responses can be linked to the physical parameters and guidelines for device optimization are suggested.
{"title":"Physical Modelling of Large-Area Single-Molecule Organic Transistors","authors":"F. Torricelli, E. Macchia, P. Bollella, C. Di Franco, Z. Kovács-Vajna, G. Scamarcio, L. Torsi","doi":"10.1109/fleps53764.2022.9781507","DOIUrl":"https://doi.org/10.1109/fleps53764.2022.9781507","url":null,"abstract":"Single-Molecule organic transistors embedding a large-area bioreceptor surface can potentially revolutionize the current medical diagnostic approaches. For instance, sensing a single molecule in a biological fluid can provide early and noninvasive detection of a disease. The development of a reliable and multiplexed electronic large-area single-molecule technology urgently requires the improvement of our current understanding. Here we propose a physical model of large-area single-molecule organic transistor sensors. The model describes the electrical measurements and provides meaningful information about the sensor operation. The bioelectronic responses can be linked to the physical parameters and guidelines for device optimization are suggested.","PeriodicalId":221424,"journal":{"name":"2022 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS)","volume":"6 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-07-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123734638","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2022-07-10DOI: 10.1109/fleps53764.2022.9781576
Habib Nassar, R. Dahiya
This paper presents the use of an optimized conductive thermoplastic filament as a strain sensing material in embedded structures with enhanced sensing performance. The custom filament was produced from low aspect ratio multi-walled carbon nanotubes (MWCNT) dispersed in a thermoplastic polyurethane (TPU) polymer matrix. Multi-material fused deposition modelling (FDM) was used to 3D print the TPU/MWCNT filament and the embedding TPU materials. The design and fabrication of the sensor and its characterization at different bending angles are presented in this paper. The sensor exhibited a change of resistance of ~30% at 90º bending which is far superior to all other similarly fabricated non-functionalized MWCNT-based strain sensors. Gaps were introduced in the printed sensor design by altering the infill percentage to further enhance its performance. The use of 50% infill showed the highest change in resistance values at the same bending angle. By optimizing the filler particle morphology, filler concentration, and sensor design, a high performance and durable strain sensor was developed in this work. 3D printed embedded strain sensors find application in various fields such as prosthetics, robotics, wearables, and medical electronics.
{"title":"3D Printed Embedded Strain Sensor with Enhanced Performance","authors":"Habib Nassar, R. Dahiya","doi":"10.1109/fleps53764.2022.9781576","DOIUrl":"https://doi.org/10.1109/fleps53764.2022.9781576","url":null,"abstract":"This paper presents the use of an optimized conductive thermoplastic filament as a strain sensing material in embedded structures with enhanced sensing performance. The custom filament was produced from low aspect ratio multi-walled carbon nanotubes (MWCNT) dispersed in a thermoplastic polyurethane (TPU) polymer matrix. Multi-material fused deposition modelling (FDM) was used to 3D print the TPU/MWCNT filament and the embedding TPU materials. The design and fabrication of the sensor and its characterization at different bending angles are presented in this paper. The sensor exhibited a change of resistance of ~30% at 90º bending which is far superior to all other similarly fabricated non-functionalized MWCNT-based strain sensors. Gaps were introduced in the printed sensor design by altering the infill percentage to further enhance its performance. The use of 50% infill showed the highest change in resistance values at the same bending angle. By optimizing the filler particle morphology, filler concentration, and sensor design, a high performance and durable strain sensor was developed in this work. 3D printed embedded strain sensors find application in various fields such as prosthetics, robotics, wearables, and medical electronics.","PeriodicalId":221424,"journal":{"name":"2022 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS)","volume":"32 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-07-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114176907","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2022-07-10DOI: 10.1109/fleps53764.2022.9781478
T. Eom, Minhyun Jung, Jihyun Bae, Sanghun Jeon
Wearable devices necessitate a variety of properties, including flexibility, elasticity and light weight, and considerable advances have been achieved for demand. However, there are some difficulties in improving the manufacturing process and scalability for wearable devices. A fabric coated with PEDOT:PSS and other conductive inks were fabricated for temperature sensing and the sensing properties changed according to the degree of stretching. The output thermoelectric voltage was 1mV at a temperature difference of 338K. Conductive fabric-based temperature sensors have substantial potential in medical technologies such as bio-signal monitoring as well as Human Machine Interface (HMI).
{"title":"Flexible and stretchable conductive fabric for temperature detection","authors":"T. Eom, Minhyun Jung, Jihyun Bae, Sanghun Jeon","doi":"10.1109/fleps53764.2022.9781478","DOIUrl":"https://doi.org/10.1109/fleps53764.2022.9781478","url":null,"abstract":"Wearable devices necessitate a variety of properties, including flexibility, elasticity and light weight, and considerable advances have been achieved for demand. However, there are some difficulties in improving the manufacturing process and scalability for wearable devices. A fabric coated with PEDOT:PSS and other conductive inks were fabricated for temperature sensing and the sensing properties changed according to the degree of stretching. The output thermoelectric voltage was 1mV at a temperature difference of 338K. Conductive fabric-based temperature sensors have substantial potential in medical technologies such as bio-signal monitoring as well as Human Machine Interface (HMI).","PeriodicalId":221424,"journal":{"name":"2022 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS)","volume":"13 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-07-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114207185","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2022-07-10DOI: 10.1109/fleps53764.2022.9781481
Sajjad Hajian, S. Ahmadi, D. Maddipatla, P. Eskandari, S. Masihi, M. Panahi, B. B. Narakathu, B. Bazuin, M. Atashbar
Graphene derivatives and their composites have attracted significant research interest for the development of novel sensors. Optimizing the formulation of graphene-based composites plays a significant role in developing sensors with improved features, such as high sensitivity and humidity stability. In this work, graphene oxide (GO)-based temperature sensors with high sensitivity were developed on a flexible substrate, using a facile fabrication method, and the humidity stability of the sensors was improved by ~58% while maintaining a high sensitivity towards the temperature. GO ink was used as the sensing layer of one temperature sensor (TS1), and a composite of GO and poly(3,4-ethylenedioxythiophene): poly (styrene sulfonate) (PEDOT:PSS) was used as the sensing layer of another temperature sensor (TS2). The resistive responses of sensors towards varying temperatures ranging from 10 °C to 80 °C were investigated. The temperature sensors showed linear responses, with slopes of -0.98 and -0.69, and correlation coefficients of 0.9994 and 0.998 for TS1 and TS2 temperature sensors, respectively. The temperature coefficient of resistance (TCR) of temperature sensors were calculated as -1.00 and -0.68 %/°C for TS1 and TS2 sensors, respectively. The sensitivity of temperature sensors towards humidity was calculated as 0.107 and 0.045 %/%RH for TS1 and TS2 temperature sensors, respectively. It was observed that adding PEDOT:PSS to GO improves the humidity stability of the temperature sensors by ~58% while maintaining a high TCR.
{"title":"Facile Fabrication of Graphene Oxide-based Flexible Temperature Sensor and Improving its Humidity Stability","authors":"Sajjad Hajian, S. Ahmadi, D. Maddipatla, P. Eskandari, S. Masihi, M. Panahi, B. B. Narakathu, B. Bazuin, M. Atashbar","doi":"10.1109/fleps53764.2022.9781481","DOIUrl":"https://doi.org/10.1109/fleps53764.2022.9781481","url":null,"abstract":"Graphene derivatives and their composites have attracted significant research interest for the development of novel sensors. Optimizing the formulation of graphene-based composites plays a significant role in developing sensors with improved features, such as high sensitivity and humidity stability. In this work, graphene oxide (GO)-based temperature sensors with high sensitivity were developed on a flexible substrate, using a facile fabrication method, and the humidity stability of the sensors was improved by ~58% while maintaining a high sensitivity towards the temperature. GO ink was used as the sensing layer of one temperature sensor (TS1), and a composite of GO and poly(3,4-ethylenedioxythiophene): poly (styrene sulfonate) (PEDOT:PSS) was used as the sensing layer of another temperature sensor (TS2). The resistive responses of sensors towards varying temperatures ranging from 10 °C to 80 °C were investigated. The temperature sensors showed linear responses, with slopes of -0.98 and -0.69, and correlation coefficients of 0.9994 and 0.998 for TS1 and TS2 temperature sensors, respectively. The temperature coefficient of resistance (TCR) of temperature sensors were calculated as -1.00 and -0.68 %/°C for TS1 and TS2 sensors, respectively. The sensitivity of temperature sensors towards humidity was calculated as 0.107 and 0.045 %/%RH for TS1 and TS2 temperature sensors, respectively. It was observed that adding PEDOT:PSS to GO improves the humidity stability of the temperature sensors by ~58% while maintaining a high TCR.","PeriodicalId":221424,"journal":{"name":"2022 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS)","volume":"103 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-07-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114256070","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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