Pub Date : 2022-07-10DOI: 10.1109/fleps53764.2022.9781498
Olalekan O. Olowo, Ruoshi Zhang, Ji-Tzuoh Lin, Danming Wei, A. Sherehiy, Douglas Jackson, Dilan Ratnayake, Alireza Tofangchi, D. Popa
Inkjet printing for fabricating microstructures has gained popularity during the last decade, making it possible to realize complex electronic circuits, components, and devices previously manufactured using 2D lithographic processes. In this work, we use aerosol inkjet printing delivered from the NeXus, a custom-built microfabrication platform that can deposit silver ink on a flexible printed circuit (FPC) substrate. We present the fabrication method of a 10mm diameter circular strain gauge tactile sensor, which is annealed using oven curing or intense pulse light (IPL) process. The resulting sensor performance under varying curing schedules is evaluated by loading packaged sensors with increasing weight, reporting a measured resistance in the 300Ω-1.2kΩ range.
{"title":"Aerosol Jet Printed Tactile Sensor on Flexible Substrate","authors":"Olalekan O. Olowo, Ruoshi Zhang, Ji-Tzuoh Lin, Danming Wei, A. Sherehiy, Douglas Jackson, Dilan Ratnayake, Alireza Tofangchi, D. Popa","doi":"10.1109/fleps53764.2022.9781498","DOIUrl":"https://doi.org/10.1109/fleps53764.2022.9781498","url":null,"abstract":"Inkjet printing for fabricating microstructures has gained popularity during the last decade, making it possible to realize complex electronic circuits, components, and devices previously manufactured using 2D lithographic processes. In this work, we use aerosol inkjet printing delivered from the NeXus, a custom-built microfabrication platform that can deposit silver ink on a flexible printed circuit (FPC) substrate. We present the fabrication method of a 10mm diameter circular strain gauge tactile sensor, which is annealed using oven curing or intense pulse light (IPL) process. The resulting sensor performance under varying curing schedules is evaluated by loading packaged sensors with increasing weight, reporting a measured resistance in the 300Ω-1.2kΩ range.","PeriodicalId":221424,"journal":{"name":"2022 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS)","volume":"15 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-07-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124017750","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2022-07-10DOI: 10.1109/fleps53764.2022.9781527
M. S. Baghini, R. Dahiya
Tunneling based piezoresistive sensors are often utilized for dynamic pressure sensing due to their low cost, ease of fabrication, ability to be printed and integrated with read-out modules. These devices can be subsequently integrated with transistors, actuators and other components towards the development of multifunctional electronic skin (e-Skin), where it is important that sensors exhibit uniform and replicable behavior. This can also help to minimize the need for compensation circuits during long-term use. In this study, direct ink writing of custommade low viscosity graphite ink is used to develop soft piezoresistive pressure sensors. The uniformity of the devices is gauged via the base conductivity and piezoresistive response, both of which exhibit a very good coefficient of variation of 2.21% and 7.1%, respectively. Furthermore, the sensors are sensitive to a wide range of forces from 0-7 N (~3.2 MPa maximum pressure). These devices pave the way towards efficient integration of pressure sensors for object grasping and manipulation due to their small size and bendability.
{"title":"Direct ink writing of tunnelling graphite based soft piezoresistive pressure sensors","authors":"M. S. Baghini, R. Dahiya","doi":"10.1109/fleps53764.2022.9781527","DOIUrl":"https://doi.org/10.1109/fleps53764.2022.9781527","url":null,"abstract":"Tunneling based piezoresistive sensors are often utilized for dynamic pressure sensing due to their low cost, ease of fabrication, ability to be printed and integrated with read-out modules. These devices can be subsequently integrated with transistors, actuators and other components towards the development of multifunctional electronic skin (e-Skin), where it is important that sensors exhibit uniform and replicable behavior. This can also help to minimize the need for compensation circuits during long-term use. In this study, direct ink writing of custommade low viscosity graphite ink is used to develop soft piezoresistive pressure sensors. The uniformity of the devices is gauged via the base conductivity and piezoresistive response, both of which exhibit a very good coefficient of variation of 2.21% and 7.1%, respectively. Furthermore, the sensors are sensitive to a wide range of forces from 0-7 N (~3.2 MPa maximum pressure). These devices pave the way towards efficient integration of pressure sensors for object grasping and manipulation due to their small size and bendability.","PeriodicalId":221424,"journal":{"name":"2022 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS)","volume":"51 1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-07-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"117313016","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2022-07-10DOI: 10.1109/fleps53764.2022.9781571
Arshad Khan, Muhammad Umaid Bukhari, Khawaja Qasim Maqbool, K. Riaz, A. Bermak
The rapid increase in plastic pollution has become dangerous for the future sustainability of our planet. Without proper recycling, thrown away plastic objects usually end up in landfills and remain there for centuries causing irreversible damage to the environment. The energy consumption of ever-increasing portable electronic devices is another challenge for the world. To mitigate these pressing issues, we propose a plastic clear bag based triboelectric nanogenerator (PCB-TENG). Plastic from a discarded clear bag in combination with paper is used to fabricate the proposed PCB-TENG. The fabricated nanogenerator can produce maximum open circuit voltage of 22 V, maximum power of 57 µW and can be used to power small electronic devices. The proposed TENG provides a way to mitigate plastic waste and promote the idea of circular economy.
{"title":"Recycled Plastic Waste-based Triboelectric Nanogenerator Reinforcing Circular Economy","authors":"Arshad Khan, Muhammad Umaid Bukhari, Khawaja Qasim Maqbool, K. Riaz, A. Bermak","doi":"10.1109/fleps53764.2022.9781571","DOIUrl":"https://doi.org/10.1109/fleps53764.2022.9781571","url":null,"abstract":"The rapid increase in plastic pollution has become dangerous for the future sustainability of our planet. Without proper recycling, thrown away plastic objects usually end up in landfills and remain there for centuries causing irreversible damage to the environment. The energy consumption of ever-increasing portable electronic devices is another challenge for the world. To mitigate these pressing issues, we propose a plastic clear bag based triboelectric nanogenerator (PCB-TENG). Plastic from a discarded clear bag in combination with paper is used to fabricate the proposed PCB-TENG. The fabricated nanogenerator can produce maximum open circuit voltage of 22 V, maximum power of 57 µW and can be used to power small electronic devices. The proposed TENG provides a way to mitigate plastic waste and promote the idea of circular economy.","PeriodicalId":221424,"journal":{"name":"2022 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS)","volume":"232 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-07-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124977983","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2022-07-10DOI: 10.1109/fleps53764.2022.9781494
Ariba Siddiqui, Kamalesh Tripathy, M. Bhattacharjee
Biomedical implants, considered as a remarkable breakthrough in the field of medical science has been evolving gradually over the past few decades. However, charging them through batteries is a major issue due to their short lifespan and bulky nature. Therefore, to eliminate the use of batteries Ultrasonic Power Transmission (UPT) technology is perceived as the ideal technique for charging implants. This paper proposes an optimum computational model of the UPT system employing PVDF (polyvinylidene fluoride) based transducer. It was simulated at an optimum frequency of 900 kHz that resulted in an acoustic pressure of 218 Pa at the transmitting end. At a depth of 3 cm, the simulated model is able to generate a maximum output voltage of 0.13 volts and an energy density of 4.21 µJ/m3 at the receiver output. The proposed UPT model on a PVDF (polyvinylidene fluoride) substrate facilitates higher flexibility, superior biocompatibility with light-weight structure and stable mechanical property.
{"title":"Ultrasonic Power Transfer in Biomedical Implants using Flexible Transducer","authors":"Ariba Siddiqui, Kamalesh Tripathy, M. Bhattacharjee","doi":"10.1109/fleps53764.2022.9781494","DOIUrl":"https://doi.org/10.1109/fleps53764.2022.9781494","url":null,"abstract":"Biomedical implants, considered as a remarkable breakthrough in the field of medical science has been evolving gradually over the past few decades. However, charging them through batteries is a major issue due to their short lifespan and bulky nature. Therefore, to eliminate the use of batteries Ultrasonic Power Transmission (UPT) technology is perceived as the ideal technique for charging implants. This paper proposes an optimum computational model of the UPT system employing PVDF (polyvinylidene fluoride) based transducer. It was simulated at an optimum frequency of 900 kHz that resulted in an acoustic pressure of 218 Pa at the transmitting end. At a depth of 3 cm, the simulated model is able to generate a maximum output voltage of 0.13 volts and an energy density of 4.21 µJ/m3 at the receiver output. The proposed UPT model on a PVDF (polyvinylidene fluoride) substrate facilitates higher flexibility, superior biocompatibility with light-weight structure and stable mechanical property.","PeriodicalId":221424,"journal":{"name":"2022 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS)","volume":"22 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-07-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121642601","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2022-07-10DOI: 10.1109/fleps53764.2022.9781514
Luca De Pamphilis, Adamos Christou, A. Dahiya, R. Dahiya
Direct printing of inorganic nanowires (NWs) at selected locations on diverse substrates is an attractive route for obtaining multifunctional devices. Towards this, contact printing has been explored to assemble aligned NWs-based uniform electronic layers over large areas. However, repeated lithography steps are needed to obtain these electronic layers at selected locations, which is a cumbersome and wasteful process. Herein, we present a new method for lithography-free patterning of NW-based electronic layers at selected locations. First, contact printing is used to realise electronic layers of high-density, highly aligned NWs over large areas. Then, using a micropatterned elastomer stamp, we remove the NWs from locations where they are not required. To enhance the removal yield, we used the capillary-force-assisted stamp technique that uses a thin layer of evaporated water as an instant glue to increase the adhesion between NWs and elastomeric stamps. The optimised process shows a high removal yield (~99%), thanks to the strong capillary adhesive forces developed at the stamp-NW interface, and a good pattern fidelity. The present study demonstrates selective contact removal approach as a contamination-free NW patterning process suitable for large area, high-performance flexible electronics.
{"title":"Selective removal of contact printed nanowires for lithography-free patterning","authors":"Luca De Pamphilis, Adamos Christou, A. Dahiya, R. Dahiya","doi":"10.1109/fleps53764.2022.9781514","DOIUrl":"https://doi.org/10.1109/fleps53764.2022.9781514","url":null,"abstract":"Direct printing of inorganic nanowires (NWs) at selected locations on diverse substrates is an attractive route for obtaining multifunctional devices. Towards this, contact printing has been explored to assemble aligned NWs-based uniform electronic layers over large areas. However, repeated lithography steps are needed to obtain these electronic layers at selected locations, which is a cumbersome and wasteful process. Herein, we present a new method for lithography-free patterning of NW-based electronic layers at selected locations. First, contact printing is used to realise electronic layers of high-density, highly aligned NWs over large areas. Then, using a micropatterned elastomer stamp, we remove the NWs from locations where they are not required. To enhance the removal yield, we used the capillary-force-assisted stamp technique that uses a thin layer of evaporated water as an instant glue to increase the adhesion between NWs and elastomeric stamps. The optimised process shows a high removal yield (~99%), thanks to the strong capillary adhesive forces developed at the stamp-NW interface, and a good pattern fidelity. The present study demonstrates selective contact removal approach as a contamination-free NW patterning process suitable for large area, high-performance flexible electronics.","PeriodicalId":221424,"journal":{"name":"2022 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS)","volume":"119 7 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-07-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126297276","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2022-07-10DOI: 10.1109/fleps53764.2022.9781496
Akshaya Kumar Aliyana, Aiswarya Baburaj, H. M. Jalajamony, N. Kumar S. K., R. Dahiya, Renny Edwin Fernadez
This work reports the impact of analyte pH conditions on the sensitivity of the Ammonium (${text{N}}{{text{H}}_4}^ + $) sensor. The ${text{N}}{{text{H}}_4}^ + $ sensor was developed by screen printing an IDE structure and subsequently modified with multiwalled carbon nanotube (MWCNT) and Zinc Oxide (ZnO) nanocomposite active layer on a fiber epoxy substrate. The sensor impedance response was studied for the varying ${text{N}}{{text{H}}_4}^ + $ analyte pH levels, and device sensitivity was found to decrease with increased analyte pH concentrations (pH 4 - pH 9). The maximum impedance of the sensor operated at pH 4 was ~ 10.5% higher when performed at pH 9. The outcome demonstrates that the presented study could open new opportunities to develop highly sensitive nutrient sensors based on tuning of the analyte pH conditions. Alternately the study highlights the need for maintaining analyte pH conditions for the stable and reliable response of the flexible ammonium sensor.
{"title":"Impact of Analyte pH on the Sensitivity of Screen-Printed Flexible Ammonium Sensor","authors":"Akshaya Kumar Aliyana, Aiswarya Baburaj, H. M. Jalajamony, N. Kumar S. K., R. Dahiya, Renny Edwin Fernadez","doi":"10.1109/fleps53764.2022.9781496","DOIUrl":"https://doi.org/10.1109/fleps53764.2022.9781496","url":null,"abstract":"This work reports the impact of analyte pH conditions on the sensitivity of the Ammonium (${text{N}}{{text{H}}_4}^ + $) sensor. The ${text{N}}{{text{H}}_4}^ + $ sensor was developed by screen printing an IDE structure and subsequently modified with multiwalled carbon nanotube (MWCNT) and Zinc Oxide (ZnO) nanocomposite active layer on a fiber epoxy substrate. The sensor impedance response was studied for the varying ${text{N}}{{text{H}}_4}^ + $ analyte pH levels, and device sensitivity was found to decrease with increased analyte pH concentrations (pH 4 - pH 9). The maximum impedance of the sensor operated at pH 4 was ~ 10.5% higher when performed at pH 9. The outcome demonstrates that the presented study could open new opportunities to develop highly sensitive nutrient sensors based on tuning of the analyte pH conditions. Alternately the study highlights the need for maintaining analyte pH conditions for the stable and reliable response of the flexible ammonium sensor.","PeriodicalId":221424,"journal":{"name":"2022 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS)","volume":"2012 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-07-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128121314","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2022-07-10DOI: 10.1109/fleps53764.2022.9781509
Lukas Rauter, Johanna Zikulnig, T. Moldaschl, D. Holzmann, H. Zangl, L. Faller, J. Kosel
This paper presents a fully printed wireless humidity sensor for structural health monitoring in smart lightweight construction parts. The sensor concept aims for sustainability and minimalism, fabricated by inkjet printing on uncoated paper substrate, working without the use of a battery or a chip. Measurement results show a wireless operation over a distance of 3mm, a sensitivity of 4.16 kHz per °C with a linear response and small hysteresis.
{"title":"Printed wireless battery-free humidity sensor for integration into lightweight construction parts","authors":"Lukas Rauter, Johanna Zikulnig, T. Moldaschl, D. Holzmann, H. Zangl, L. Faller, J. Kosel","doi":"10.1109/fleps53764.2022.9781509","DOIUrl":"https://doi.org/10.1109/fleps53764.2022.9781509","url":null,"abstract":"This paper presents a fully printed wireless humidity sensor for structural health monitoring in smart lightweight construction parts. The sensor concept aims for sustainability and minimalism, fabricated by inkjet printing on uncoated paper substrate, working without the use of a battery or a chip. Measurement results show a wireless operation over a distance of 3mm, a sensitivity of 4.16 kHz per °C with a linear response and small hysteresis.","PeriodicalId":221424,"journal":{"name":"2022 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS)","volume":"43 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-07-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128187179","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2022-07-10DOI: 10.1109/fleps53764.2022.9781478
T. Eom, Minhyun Jung, Jihyun Bae, Sanghun Jeon
Wearable devices necessitate a variety of properties, including flexibility, elasticity and light weight, and considerable advances have been achieved for demand. However, there are some difficulties in improving the manufacturing process and scalability for wearable devices. A fabric coated with PEDOT:PSS and other conductive inks were fabricated for temperature sensing and the sensing properties changed according to the degree of stretching. The output thermoelectric voltage was 1mV at a temperature difference of 338K. Conductive fabric-based temperature sensors have substantial potential in medical technologies such as bio-signal monitoring as well as Human Machine Interface (HMI).
{"title":"Flexible and stretchable conductive fabric for temperature detection","authors":"T. Eom, Minhyun Jung, Jihyun Bae, Sanghun Jeon","doi":"10.1109/fleps53764.2022.9781478","DOIUrl":"https://doi.org/10.1109/fleps53764.2022.9781478","url":null,"abstract":"Wearable devices necessitate a variety of properties, including flexibility, elasticity and light weight, and considerable advances have been achieved for demand. However, there are some difficulties in improving the manufacturing process and scalability for wearable devices. A fabric coated with PEDOT:PSS and other conductive inks were fabricated for temperature sensing and the sensing properties changed according to the degree of stretching. The output thermoelectric voltage was 1mV at a temperature difference of 338K. Conductive fabric-based temperature sensors have substantial potential in medical technologies such as bio-signal monitoring as well as Human Machine Interface (HMI).","PeriodicalId":221424,"journal":{"name":"2022 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS)","volume":"13 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-07-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114207185","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2022-07-10DOI: 10.1109/fleps53764.2022.9781555
Adamos Christou, A. Dahiya, R. Dahiya
The wearable and flexible sensors are enabling advances in next-generation technologies such as soft robotics, mobile healthcare, internet of things etc. In consequence, novel materials and manufacturing methods have received most of the attention so far. However, with the growing use of these technologies in real applications, other important areas such as mechanical reliability under repeated mechanical deformations also require greater consideration. A few studies covering this aspect have mainly focused on mechanical stress under simple bending conditions and ignored stress evolution under twisting (torsional) movements. The present work studies the influence of different parameters such as carrier substrate dimensions and its material and twisting angles on the stress distribution during torsional movements using finite element method. Following this, highly stretchable strain sensors are fabricated using nanocomposite of carbon nanotubes and Ecoflex™ and tested under various twisting angles. The soft strain sensor possesses excellent repeatable and robust torsional strain detection properties with >100% change in resistance at ±90° of twisting and has shown potential for wearable and robotics applications.
{"title":"Finite element analysis of stress distribution in soft sensors under torsional loading","authors":"Adamos Christou, A. Dahiya, R. Dahiya","doi":"10.1109/fleps53764.2022.9781555","DOIUrl":"https://doi.org/10.1109/fleps53764.2022.9781555","url":null,"abstract":"The wearable and flexible sensors are enabling advances in next-generation technologies such as soft robotics, mobile healthcare, internet of things etc. In consequence, novel materials and manufacturing methods have received most of the attention so far. However, with the growing use of these technologies in real applications, other important areas such as mechanical reliability under repeated mechanical deformations also require greater consideration. A few studies covering this aspect have mainly focused on mechanical stress under simple bending conditions and ignored stress evolution under twisting (torsional) movements. The present work studies the influence of different parameters such as carrier substrate dimensions and its material and twisting angles on the stress distribution during torsional movements using finite element method. Following this, highly stretchable strain sensors are fabricated using nanocomposite of carbon nanotubes and Ecoflex™ and tested under various twisting angles. The soft strain sensor possesses excellent repeatable and robust torsional strain detection properties with >100% change in resistance at ±90° of twisting and has shown potential for wearable and robotics applications.","PeriodicalId":221424,"journal":{"name":"2022 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS)","volume":"9 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-07-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121804045","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2022-07-10DOI: 10.1109/fleps53764.2022.9781487
Ruoshi Zhang, Ji-Tzuoh Lin, D. Popa
Additive manufacturing technology presents new opportunities and challenges for tactile sensor fabrication and packaging. Specifically, aerosol jet printing technology enables on-demand deposition of a wide selection of materials onto flexible substrates with potentially uneven surfaces, and feature sizes in the micron scale. One of the applications of aerosol jet printing is integrated tactile sensors onto robotic and mechatronic devices. In this paper, we present a design and simulation study of a new tactile sensor that is compatible with the aerosol jet printing process on customized, flexible printed circuit (FPC) substrates, featuring a strain gauge with a circular pattern. The tactile sensor is packaged in between the cover and bedding - two pieces of elastomer material that give the sensor space to comply and deform. A dimple and a cavity were added to the cover and bedding respectively to help the sensor concentrate external forces onto the location where strain is detected. Finite element analysis (FEA) was conducted to study the performance of the proposed design, with respect to the relative sizes of the dimple and the cavity on the circular sensor pattern. Simulation results show the feasibility of finding the best combination of the dimple and cavity size, which can be used to optimize our sensor design.
{"title":"Finite Element Analysis of a Flexible Tactile Sensor with Circular Pattern","authors":"Ruoshi Zhang, Ji-Tzuoh Lin, D. Popa","doi":"10.1109/fleps53764.2022.9781487","DOIUrl":"https://doi.org/10.1109/fleps53764.2022.9781487","url":null,"abstract":"Additive manufacturing technology presents new opportunities and challenges for tactile sensor fabrication and packaging. Specifically, aerosol jet printing technology enables on-demand deposition of a wide selection of materials onto flexible substrates with potentially uneven surfaces, and feature sizes in the micron scale. One of the applications of aerosol jet printing is integrated tactile sensors onto robotic and mechatronic devices. In this paper, we present a design and simulation study of a new tactile sensor that is compatible with the aerosol jet printing process on customized, flexible printed circuit (FPC) substrates, featuring a strain gauge with a circular pattern. The tactile sensor is packaged in between the cover and bedding - two pieces of elastomer material that give the sensor space to comply and deform. A dimple and a cavity were added to the cover and bedding respectively to help the sensor concentrate external forces onto the location where strain is detected. Finite element analysis (FEA) was conducted to study the performance of the proposed design, with respect to the relative sizes of the dimple and the cavity on the circular sensor pattern. Simulation results show the feasibility of finding the best combination of the dimple and cavity size, which can be used to optimize our sensor design.","PeriodicalId":221424,"journal":{"name":"2022 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS)","volume":"19 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-07-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125457734","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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