Wear-resistant Cu-Sn alloys are further enhanced by laser shock peening (LSP) to meet increasingly demanding service conditions. This study employs a multiscale approach, combining experiments, theoretical calculations, and molecular dynamics (MD) simulations to systematically investigate the effects of LSP on the microstructure and surface properties of Cu-Sn alloy, thus revealing the underlying mechanisms responsible for the improved wear resistance at both macroscopic and atomic scales. The results show that LSP effectively refines grain size, induces a deeper plastic deformation layer, and significantly enhances surface hardness and compressive residual stress (CRS). Notably, the wear rate is reduced by up to 65.4 % (reaching 14.59 ± 1.09 × 10-⁶ mm³/N·m) compared to the untreated sample, and the dominant wear mechanism shifts from adhesive wear to abrasive wear. This improvement is attributed to the synergistic effect of CRS and hardness. Furthermore, the MD simulations of LSP and subsequent wear behavior are coupled to directly study the influence of LSP on wear resistance at the atomic scale. Theoretical analyses and MD simulations demonstrate that crystal defects introduced by LSP play a critical role in enhancing wear resistance by inhibiting dislocation motion and surface deformation. This work provides atomic-scale insights into the wear resistance mechanisms of LSP-treated Cu-Sn alloys, offering a theoretical foundation for the optimization of LSP techniques.
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