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[1991] Proceedings. IEEE Micro Electro Mechanical Systems最新文献

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Fabrication of active integrated optical micro-encoder 有源集成光学微编码器的研制
Pub Date : 1991-01-30 DOI: 10.1109/MEMSYS.1991.114802
R. Sawada, H. Tanaka, O. Ohguchi, J. Shimada, S. Hara
A novel integrated optical micro-encoder based on diffraction is presented, which can measure the relative distance traveled against a grating (scale) in the grating vector direction. A measurement resolution of less than 0.01 mu m is possible. The encoder is extremely small, only 500- mu m square, which is 1/100 the size of conventional encoders. Therefore, the encoder can be incorporated into a micro-machine and can be moved at high speed, since its inertia is extremely low. This encoder can be used even when the gap between the encoder and the grating is a few hundred micrometers.<>
提出了一种新型的基于衍射的集成光学微编码器,该编码器可以测量光栅矢量方向上与光栅(刻度)的相对距离。测量分辨率可小于0.01 μ m。编码器非常小,只有500平方米,是传统编码器尺寸的1/100。因此,由于编码器的惯性极低,编码器可以集成到微型机器中,并且可以高速移动。这种编码器即使在编码器与光栅之间的间隙为几百微米时也可以使用。
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引用次数: 31
Ferroelectric thin film ultrasonic micromotors 铁电薄膜超声微电机
Pub Date : 1991-01-30 DOI: 10.1109/MEMSYS.1991.114779
K. Udayakumar, S. Bart, A. Flynn, J. Chen, L. Tavrow, L. Cross, R. A. Brooks, D. Ehrlich
Ferroelectric thin films of lead zirconate titanate (PZT) of morphotropic phase-boundary composition have been fabricated by a sol-gel spin-on technique for application to a new family of flexure-wave piezoelectric micromotors characterized by low speed and high torque. The high relative dielectric constant (1300) and breakdown strength (1 MV/cm) of the films lead to high stored energy densities. The piezoelectric coefficients d/sub 33/ and d/sub 31/ were measured to be 220 pC/N and -88 pC/N, respectively; the electromechanical coupling factors calculated from these data were k/sub 33/=0.49, k/sub 31/=0.22, and k/sub p/=0.32. The development of the piezoelectric ultrasonic micromotors from the PZT thin films and the architecture of the stator structure are described. Nonoptimized prototype micromotors show rotational velocities of 100-300 rpm and net normalized torques in the pN-m/V/sup 2/ range.<>
采用溶胶-凝胶自旋技术制备了具有形态亲相界成分的锆钛酸铅(PZT)铁电薄膜,并将其应用于低速大转矩的新型挠曲波压电微电机。薄膜具有较高的相对介电常数(1300)和击穿强度(1 MV/cm),具有较高的储能密度。测得压电系数d/sub 33/和d/sub 31/分别为220 pC/N和-88 pC/N;根据这些数据计算的机电耦合系数为k/sub 33/=0.49, k/sub 31/=0.22, k/sub p/=0.32。介绍了压电超声微电机的发展及其定子结构。未优化的原型微电机的转速为100-300 rpm,净归一化扭矩在pN-m/V/sup 2/范围内。
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引用次数: 72
Theoretical modeling of boundary conditions in microfabricated beams 微加工梁边界条件的理论建模
Pub Date : 1991-01-30 DOI: 10.1109/MEMSYS.1991.114787
R. Mullen, M. Mehregany, M. P. Omar, W. Ko
The authors report detailed modeling of step-up boundary conditions in surface micromachined beams and investigate their effects on the onset of buckling in doubly supported beams. Both cantilever and doubly supported beams are considered. Finite element analysis is used to accurately model the mechanical behavior of the step-up boundary conditions. An extended beam model which uses equivalent torsional and axial stiffnesses in conjunction with a simply supported boundary condition is developed to account for the finite stiffness of a step-up boundary condition. The finite element results are used to calculate the values of the equivalent stiffnesses of the extended beam model for practical geometries of step-up boundary conditions. The extended beam model is used to calculate buckling loads for doubly supported beams. Equivalent stiffness values for torsional and axial springs are for geometries of practical importance to microelectromechanical systems.<>
作者报告了表面微机械梁的升压边界条件的详细建模,并研究了它们对双支梁屈曲开始的影响。考虑了悬臂梁和双支承梁。采用有限元分析准确模拟了升压边界条件下的力学行为。采用等效扭转刚度和轴向刚度与简支边界条件相结合的扩展梁模型用于解释升压边界条件的有限刚度。利用有限元计算结果计算了实际几何升压边界条件下扩展梁模型的等效刚度值。采用扩展梁模型计算双支梁的屈曲载荷。扭转弹簧和轴向弹簧的等效刚度值适用于对微机电系统具有实际重要性的几何形状
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引用次数: 47
Flexible microactuator for miniature robots 用于微型机器人的柔性微驱动器
Pub Date : 1991-01-30 DOI: 10.1109/MEMSYS.1991.114797
Koichi Suzumori, S. Iikura, H. Tanaka
A new type of flexible microactuator (FMA) has been developed for use in miniature robots. They are constructed using fiber-reinforced rubber and are actuated by an electropneumatic or electrohydraulic system. These microactuators have many degrees of freedom (including pitch, yaw, and stretch), making them suitable for robotic mechanisms such as arms, legs, or fingers. Pliant miniature robots can be created by combining FMAs. One example is a robot arm a few millimeters in diameter with seven degrees of freedom. The basic characteristics of the FMAs have been analyzed theoretically and experimentally. It is noted that, since the statistics and dynamics are predicted easily, FMAs can be designed efficiently.<>
开发了一种用于微型机器人的新型柔性微执行器。它们由纤维增强橡胶制成,由电气动或电液压系统驱动。这些微致动器有许多自由度(包括俯仰、偏航和拉伸),使它们适用于机器人机构,如手臂、腿或手指。通过结合fma可以创造出柔韧的微型机器人。一个例子是直径几毫米,有七个自由度的机械臂。对fma的基本特性进行了理论和实验分析。值得注意的是,由于统计和动力学是容易预测的,所以可以有效地设计fma。
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引用次数: 140
Mathematical model and experimental verification of shape memory alloy for designing micro actuator 形状记忆合金设计微执行器的数学模型及实验验证
Pub Date : 1991-01-30 DOI: 10.1109/MEMSYS.1991.114778
K. Ikuta, M. Tsukamoto, S. Hirose
An advanced mathematical model of a shape memory alloy (SMA) useful for designing SMA micro-devices is proposed and applied to coil spring theory to analyze the appropriate mechanical and electrical characteristics. This model can handle three phases of the SMA: the parent phase, the martensitic phase, and the R-phase. of three steps. First, the mechanical properties of the three phases are modeled at the solid mechanics level. Second, a model of thermoelectric transformation is obtained at the thermodynamic level. Finally, the first and second steps are combined. The model was applied to coil spring theory and was verified successfully by experiments under general conditions.<>
提出了一种适用于形状记忆合金(SMA)微器件设计的先进数学模型,并将其应用于线圈弹簧理论,分析了形状记忆合金的机电特性。该模型可以处理SMA的三个阶段:母相、马氏体相和r相。三步。首先,在固体力学水平上对三种相的力学性能进行了建模。其次,在热力学水平上建立了热电转换模型。最后,将第一步和第二步结合起来。将该模型应用于螺旋弹簧理论,并在一般条件下进行了实验验证。
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引用次数: 191
A micropipe fabrication process 一种微管制造工艺
Pub Date : 1991-01-30 DOI: 10.1109/MEMSYS.1991.114773
C. Kuo, T. Masuzawa, M. Fujino
A novel process for fabricating a micropipe has been developed. This process is based on electrochemical deposition of metal onto a core or a microelectrode which is prepared by WEDG (wire electrodischarge grinding). This procedure is simple and the entire process can be carried out automatically. Using this method, one can produce a high-accuracy micropipe with a length 100 times its inner diameter. A 3-mm-long micropipe of 23- mu m I.D. and 186- mu m O.D. with extremely high precision of straightness, roundness, and concentricity was successfully manufactured. Owing to the advantages of WEDG, the inner and outer shapes of the micropipe can be controlled independently, and produceable shapes include various irregular sections, such as triangular, rectangular, and polygonal sections.<>
提出了一种制造微管的新工艺。该工艺是基于电化学沉积金属到芯或微电极上,这是由WEDG(线材电火花磨削)制备的。该程序简单,整个过程可以自动进行。利用这种方法,可以制作出长度为内径100倍的高精度微管。成功制造了直径23 μ m、外径186 μ m、直线度、圆度、同心度精度极高的3毫米长微管。由于WEDG的优点,微管的内外形状可以独立控制,可生产的形状包括各种不规则截面,如三角形、矩形和多边形截面。
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引用次数: 21
Micro-magnetic alloy tubes for switching and splicing single-mode fibers 单模光纤开关和拼接用微磁合金管
Pub Date : 1991-01-30 DOI: 10.1109/MEMSYS.1991.114774
S. Nagaoka
The author describes a novel technique for switching and splicing single-mode fibers that uses micromagnetic alloy tubes. A micro-magnetic alloy tube, with an inner diameter a few microns larger than that of a standard single-mode fiber and a thickness of several tens of microns, has been successfully fabricated by a combination of the metallization and etching of a glass fiber. The tube can easily be inserted into the fiber and fixed by adhesive to construct an optical switch or to splice fibers. The developed mechanically actuated single-mode fiber switch has a latching-type switching mechanism and exhibits a low insertion loss of 0.9 dB and a low driving power of 9 mW with a relatively short switching response time of <6 ms. It exhibits high stable operation throughout endurance, vibration, and shock tests. The microtube has also been applied to single-mode fiber splicing. In the tube, facing fibers can be aligned with a lateral misalignment of less than 2 mu m. Transparent adhesive is used to bond the fibers to the tube. The adhesive also serves as an index matching fluid to reduce the Fresnel reflection loss at the fiber ends. The measured splicing losses are 0.3-0.5 dB.<>
本文介绍了一种利用微磁合金管进行单模光纤开关和拼接的新技术。利用玻璃纤维的金属化和蚀刻相结合的方法,成功制备了内径比标准单模光纤大几微米、厚度达几十微米的微磁合金管。该管可以很容易地插入光纤并通过粘合剂固定,以构建光开关或拼接光纤。所研制的机械驱动单模光纤开关具有闭锁式开关机构,插入损耗低至0.9 dB,驱动功率低至9 mW,开关响应时间相对较短。
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引用次数: 15
Integrated microelectromechanical systems: A perspective on MEMS in the 90s 集成微机电系统:90年代微机电系统的展望
Pub Date : 1900-01-01 DOI: 10.1109/MEMSYS.1991.114765
K. Wise
The author examines the opportunities and challenges facing the development of integrated microelectromechanical systems (MEMS). It has now been established that micromachined sensors can be produced with high yield and merged with integrated electronics, both in monolithic chips and in hybrid multichip assemblies. For some types of sensors, accuracy is approaching 16 bits, and VLSI interface circuits are being defined to allow features such as self-testing and digital compensation to be used. Continuing technical challenges for full MEMS include the development of processes capable of three-dimensional microstructures, improved drive technologies for microactuators, better approaches to packaging and microassembly, and the creation of workstation-based simulators, operating from rich databases of materials and structural information. Formidable challenges in non-technical areas are also posed, including the definition of appropriate applications for MEMS and the accomplishment of the needed changes in established host systems to take advantage of their features. These issues are illustrated by several devices currently being developed, including integrated neuroelectronic interfaces, pressure and flow sensors, microvalves, and scan tips for near-field microscopy.<>
本文探讨了集成微机电系统(MEMS)发展面临的机遇和挑战。现在已经确定,微机械传感器可以在单片芯片和混合多芯片组件中以高产量生产并与集成电子设备合并。对于某些类型的传感器,精度接近16位,并且正在定义VLSI接口电路,以允许使用自我测试和数字补偿等功能。完整MEMS的持续技术挑战包括三维微结构工艺的发展,微致动器驱动技术的改进,封装和微组装的更好方法,以及基于工作站的模拟器的创建,从丰富的材料和结构信息数据库中操作。在非技术领域也提出了艰巨的挑战,包括为MEMS定义适当的应用,以及在已建立的主机系统中完成所需的更改以利用其特性。目前正在开发的几种设备说明了这些问题,包括集成的神经电子接口,压力和流量传感器,微阀和近场显微镜的扫描提示。
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引用次数: 35
Optical exposure systems for three-dimensional fabrication of microprobe 用于微探针三维制造的光学曝光系统
Pub Date : 1900-01-01 DOI: 10.1109/MEMSYS.1991.114766
M. Esashi, K. Minami, S. Shoji
New optical exposure systems for patterning on nonplanar surfaces were developed. One of them is the photoresist exposure system; the other is the Parylene laser ablation system with KrF excimer laser. Microprobe multielectrodes for recording neuron impulses were fabricated with the photoresist exposure system. However, this method has the disadvantage that it is difficult to coat a nonplanar surface with photoresist uniformly. It is demonstrated that Parylene can be coated uniformly on a nonplanar surface and be patterned by a Parylene laser ablation system. A Cr line with a 10 mu m width on a glass plate was patterned by Parylene laser ablation and the subsequent lift-off technique. This process is useful for patterning thin film on nonplanar surfaces.<>
开发了一种新的用于非平面表面的光学曝光系统。其中之一是光刻胶曝光系统;另一种是KrF准分子激光的聚对二甲苯激光烧蚀系统。利用光刻胶曝光系统制备了用于记录神经元脉冲的微探针多电极。然而,这种方法的缺点是难以均匀地在非平面表面涂覆光刻胶。结果表明,聚对二甲苯可以均匀地涂覆在非平面表面上,并可以通过聚对二甲苯激光烧蚀系统形成图案。采用聚对二甲苯激光烧蚀和随后的发射技术,在玻璃板上刻制了宽度为10 μ m的Cr线。该工艺对于在非平面表面上制作薄膜图案化是有用的。
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引用次数: 15
Polysilicon microstructures 多晶硅微观结构
Pub Date : 1900-01-01 DOI: 10.1109/MEMSYS.1991.114793
M. M. Farooqui, A. Evans
The sacrificial etch technology for fabricating free-standing three-dimensional microstructures in polysilicon has been successfully implemented. A variety of techniques for reducing the intrinsic compressive stress have been employed in fabricating low stress structures. Low-temperature-deposited microcrystalline polysilicon and polysilicon deposited over doped oxide were found to have low intrinsic stress, without additional annealing. A simple technique for obtaining additional compliance in diaphragms is described. Anisotropically etched submicron fibers and plastically deformed polysilicon shells are some of the unusual devices that have been obtained.<>
在多晶硅中成功地实现了自制三维微结构的牺牲蚀刻技术。各种降低本征压应力的技术已被用于制造低应力结构。发现低温沉积的微晶多晶硅和掺杂氧化物沉积的多晶硅具有低的本征应力,无需额外退火。本文描述了一种获得膜片额外顺应性的简单技术。各向异性蚀刻亚微米纤维和塑性变形多晶硅壳是已经获得的一些不寻常的器件。
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引用次数: 17
期刊
[1991] Proceedings. IEEE Micro Electro Mechanical Systems
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