Pub Date : 2014-04-01DOI: 10.1109/DTIP.2014.7056678
A. Lucibello, E. Proietti, R. Marcelli, G. Bartolucci, G. de Angelis
This paper presents the design of distributed MEMS phase shifters by means of the image-parameters method. The proposed analytic approach utilizes a more precise modeling of the MEMS device with respect to that one usually adopted in literature. The most important analytic aspects concerning the synthesis technique are presented. As a demonstration of the method a structure characterized by a differential phase shift value of 90° is designed and simulated, exhibiting very good electric performance.
{"title":"Analytic design method for distributed RF MEMS phase shifters","authors":"A. Lucibello, E. Proietti, R. Marcelli, G. Bartolucci, G. de Angelis","doi":"10.1109/DTIP.2014.7056678","DOIUrl":"https://doi.org/10.1109/DTIP.2014.7056678","url":null,"abstract":"This paper presents the design of distributed MEMS phase shifters by means of the image-parameters method. The proposed analytic approach utilizes a more precise modeling of the MEMS device with respect to that one usually adopted in literature. The most important analytic aspects concerning the synthesis technique are presented. As a demonstration of the method a structure characterized by a differential phase shift value of 90° is designed and simulated, exhibiting very good electric performance.","PeriodicalId":268119,"journal":{"name":"2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP)","volume":"23 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115975044","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2014-04-01DOI: 10.1109/DTIP.2014.7056641
Aliza Aini Binti Md. Ralib Raghib, A. Nordin
An analysis of the electromechanical coupling coefficient for surface acoustic wave (SAW) devices developed in complementary metal oxide semiconductor (CMOS) is presented in this work. This SAW resonator uses zinc oxide (ZnO) as its piezoelectric thin film. The resonator's interdigitated electrodes were designed such that it produces 1 GHz resonance frequency. Finite element simulation of the CMOS SAW resonator was conducted using COMSOL Mutliphysics™. Three different analyses namely eigenfrequency, frequency domain and time domain analyses were conducted. The thicknesses of ZnO were varied from 2 μm to 5.5 μm with step size of 0.5 μm. Simulation results indicate maximum electromechanical coupling coefficient is achieved when normalized thickness is in the range of 0.63 <; (hzno/λ) <; 0.78. Experimental measurements were conducted on the fabricated CMOS SAW resonator and compared with the simulation results.
{"title":"Analysis of electromechanical coupling coefficient of surface acoustic wave resonator in ZnO piezoelectric thin film structure","authors":"Aliza Aini Binti Md. Ralib Raghib, A. Nordin","doi":"10.1109/DTIP.2014.7056641","DOIUrl":"https://doi.org/10.1109/DTIP.2014.7056641","url":null,"abstract":"An analysis of the electromechanical coupling coefficient for surface acoustic wave (SAW) devices developed in complementary metal oxide semiconductor (CMOS) is presented in this work. This SAW resonator uses zinc oxide (ZnO) as its piezoelectric thin film. The resonator's interdigitated electrodes were designed such that it produces 1 GHz resonance frequency. Finite element simulation of the CMOS SAW resonator was conducted using COMSOL Mutliphysics™. Three different analyses namely eigenfrequency, frequency domain and time domain analyses were conducted. The thicknesses of ZnO were varied from 2 μm to 5.5 μm with step size of 0.5 μm. Simulation results indicate maximum electromechanical coupling coefficient is achieved when normalized thickness is in the range of 0.63 <; (hzno/λ) <; 0.78. Experimental measurements were conducted on the fabricated CMOS SAW resonator and compared with the simulation results.","PeriodicalId":268119,"journal":{"name":"2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP)","volume":"12 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127008002","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2014-04-01DOI: 10.1109/DTIP.2014.7056657
A. T. Nguyen, Fjodors Tjulkins, E. Knut, Aasmundtveit, N. Hoivik, L. Hoff, Ole-Johannes H. N. Grymyr, P. Halvorsen, K. Imenes
This paper describes recent improvements of a myocardial accelerometer device, which can be used to perform continuous monitoring of heart activity with high specificity and sensitivity. The device is specified to be used for patients undergoing coronary bypass graft surgery. The improved device can reduce the complexity of implantation experienced with the former generation of sensors. A built-in function enabling temporary pacing was also integrated. Besides being an implantable accelerometer sensor, the device can pace the heart and sense the electrical signals when connected to an external pulse generator. Compliance tests for implantable medical device were carried out to prove the essential requirements set by the International Electrotechnical Commission.
{"title":"Packaging of a multifunctional implantable heart monitoring device","authors":"A. T. Nguyen, Fjodors Tjulkins, E. Knut, Aasmundtveit, N. Hoivik, L. Hoff, Ole-Johannes H. N. Grymyr, P. Halvorsen, K. Imenes","doi":"10.1109/DTIP.2014.7056657","DOIUrl":"https://doi.org/10.1109/DTIP.2014.7056657","url":null,"abstract":"This paper describes recent improvements of a myocardial accelerometer device, which can be used to perform continuous monitoring of heart activity with high specificity and sensitivity. The device is specified to be used for patients undergoing coronary bypass graft surgery. The improved device can reduce the complexity of implantation experienced with the former generation of sensors. A built-in function enabling temporary pacing was also integrated. Besides being an implantable accelerometer sensor, the device can pace the heart and sense the electrical signals when connected to an external pulse generator. Compliance tests for implantable medical device were carried out to prove the essential requirements set by the International Electrotechnical Commission.","PeriodicalId":268119,"journal":{"name":"2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP)","volume":"35 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124882689","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2014-04-01DOI: 10.1109/DTIP.2014.7056694
T. Dinh, P. Joubert, E. Martincic, E. Dufour-Gergam
Kapton-based flexible pressure sensor arrays are fabricated using a new technology of film transfer. The sensors are dedicated to the non-invasive measurement of pressure/force in robotic, sport and medical applications. The sensors are of a capacitive type, and composed of two millimetric copper electrodes, separated by a polydimethylsiloxane (PDMS) deformable dielectric layer. On the flexible arrays, a very small curvature radius is possible without any damage to the sensors. The inhomogeneity of the capacitances in array is quite low (deviation of ±7% compared to the average value). The process is accurate and reproducible (transfer yield of 100%). The electrical characterization is also presented. In the preliminary electro-mechanical characterization, a sensor (with a PDMS dielectric layer of 660 μm thickness and a free load capacitance of 480 fF) undergoes a capacitance change of 17% under a 300 kPa normal stress.
{"title":"Non-invasive capacitive pressure sensor: Microfabrication process and first electro-mechanical characterization","authors":"T. Dinh, P. Joubert, E. Martincic, E. Dufour-Gergam","doi":"10.1109/DTIP.2014.7056694","DOIUrl":"https://doi.org/10.1109/DTIP.2014.7056694","url":null,"abstract":"Kapton-based flexible pressure sensor arrays are fabricated using a new technology of film transfer. The sensors are dedicated to the non-invasive measurement of pressure/force in robotic, sport and medical applications. The sensors are of a capacitive type, and composed of two millimetric copper electrodes, separated by a polydimethylsiloxane (PDMS) deformable dielectric layer. On the flexible arrays, a very small curvature radius is possible without any damage to the sensors. The inhomogeneity of the capacitances in array is quite low (deviation of ±7% compared to the average value). The process is accurate and reproducible (transfer yield of 100%). The electrical characterization is also presented. In the preliminary electro-mechanical characterization, a sensor (with a PDMS dielectric layer of 660 μm thickness and a free load capacitance of 480 fF) undergoes a capacitance change of 17% under a 300 kPa normal stress.","PeriodicalId":268119,"journal":{"name":"2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP)","volume":"9 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133030127","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2014-04-01DOI: 10.1109/DTIP.2014.7056667
S. Gorreta, J. Pons-Nin, M. Dominguez-Pumar, E. Blokhina, O. Feely
Dielectric charging of insulating films in microelectromechanical systems (MEMS) has a crucial effect on the operation of those devices. A new method is presented in order to characterize the dynamics of the charge trapped in the dielectric layer of MEMS devices. This allows knowing the state of the charge at each sampling time without distorting the measurement. This approach allows one to model the expected behaviour of the trapped charge inside the dielectric as a response to a sigma-delta control of charge. The goodness of the proposed approach is obtained by matching the experimentally obtained closed loop response with the one predicted by the model obtained using the proposed characterization method.
{"title":"Characterization method of the dynamics of the trapped charge in contactless capacitive MEMS","authors":"S. Gorreta, J. Pons-Nin, M. Dominguez-Pumar, E. Blokhina, O. Feely","doi":"10.1109/DTIP.2014.7056667","DOIUrl":"https://doi.org/10.1109/DTIP.2014.7056667","url":null,"abstract":"Dielectric charging of insulating films in microelectromechanical systems (MEMS) has a crucial effect on the operation of those devices. A new method is presented in order to characterize the dynamics of the charge trapped in the dielectric layer of MEMS devices. This allows knowing the state of the charge at each sampling time without distorting the measurement. This approach allows one to model the expected behaviour of the trapped charge inside the dielectric as a response to a sigma-delta control of charge. The goodness of the proposed approach is obtained by matching the experimentally obtained closed loop response with the one predicted by the model obtained using the proposed characterization method.","PeriodicalId":268119,"journal":{"name":"2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP)","volume":"219 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130420644","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2014-04-01DOI: 10.1109/DTIP.2014.7056696
A. Tixier-Mita, Takuya Takahashi, H. Fujita, H. Toshiyoshi, I. Mori, Y. Mita, O. Français, B. Le Pioufle
The purpose of this article is to present first results of electrical detection of micro-beads, using impedance spectroscopy technique, with a wholly integrated device. The whole integration concerns as well the electronics as the micro-fluidic integration inside a LSI device, by post-processing. The results are first steps in the development of this wholly integrated device, intended to be for biological cells analyses.
{"title":"Detection of micro-beads by impedance spectroscopy: Towards a wholly integrated electronic device for biological cells applications","authors":"A. Tixier-Mita, Takuya Takahashi, H. Fujita, H. Toshiyoshi, I. Mori, Y. Mita, O. Français, B. Le Pioufle","doi":"10.1109/DTIP.2014.7056696","DOIUrl":"https://doi.org/10.1109/DTIP.2014.7056696","url":null,"abstract":"The purpose of this article is to present first results of electrical detection of micro-beads, using impedance spectroscopy technique, with a wholly integrated device. The whole integration concerns as well the electronics as the micro-fluidic integration inside a LSI device, by post-processing. The results are first steps in the development of this wholly integrated device, intended to be for biological cells analyses.","PeriodicalId":268119,"journal":{"name":"2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP)","volume":"17 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132542589","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2014-04-01DOI: 10.1109/DTIP.2014.7056683
R. Lévy, G. Papin, O. Le Traon, D. Janiaud, J. Guerard
The Vibrating Beam Accelerometer (VBA) consists in a vibrating micro beam anchored on one side and linked to a proof mass on the other side. The beam is maintained at resonance by means of an oscillator circuit, and when the proof mass is submitted to acceleration, compressive or tensile stresses are applied on the vibrating beam modifying its resonance frequency. The output of the accelerometer is a frequency measurement, its resolution is determined by the phase noise integrated over the sensor bandwidth, and its bias stability is determined by the close to carrier phase noise or frequency stability. If the beam resonator is actuated with increased force amplitude high enough to operate in the nonlinear region, far from carrier phase noise is decreased improving the sensor resolution while the close to carrier phase noise is increased deteriorating the resolution and bias stability. For inertial applications, the acceleration measurement is twice integrated to calculate the position, and as a consequence the bias stability is crucial. The bias stability is deteriorated when the beam resonator operates in the nonlinear region, this is the reason why VBAs work in the linear region for inertial applications. Concerning seismic ground sensor applications the bias stability is not considered and the important parameter is the resolution at the bandwidth determined by the frequency of the seismic waves. In this case it is then better to operate the beam resonator in the nonlinear region to improve the sensor resolution. Previous work have presented a behavioral model of the vibrating beam accelerometer including the beam resonator and the oscillator circuit taking into account the nonlinear terms. The transient and phase noise simulations are presented to show the improvement of the far from carrier phase noise and the degradation of the close to carrier phase noise while increasing the vibration amplitude in nonlinear region. These simulations are then compared to experimental measurements of the VIA vibrating beam accelerometer developed at ONERA. Finally these accelerometer noise is calculated from the phase noise simulations and the accelerometer resolution is optimized.
{"title":"A high resolution vibrating beam accelerometer working in nonlinear region for seismic ground sensor application","authors":"R. Lévy, G. Papin, O. Le Traon, D. Janiaud, J. Guerard","doi":"10.1109/DTIP.2014.7056683","DOIUrl":"https://doi.org/10.1109/DTIP.2014.7056683","url":null,"abstract":"The Vibrating Beam Accelerometer (VBA) consists in a vibrating micro beam anchored on one side and linked to a proof mass on the other side. The beam is maintained at resonance by means of an oscillator circuit, and when the proof mass is submitted to acceleration, compressive or tensile stresses are applied on the vibrating beam modifying its resonance frequency. The output of the accelerometer is a frequency measurement, its resolution is determined by the phase noise integrated over the sensor bandwidth, and its bias stability is determined by the close to carrier phase noise or frequency stability. If the beam resonator is actuated with increased force amplitude high enough to operate in the nonlinear region, far from carrier phase noise is decreased improving the sensor resolution while the close to carrier phase noise is increased deteriorating the resolution and bias stability. For inertial applications, the acceleration measurement is twice integrated to calculate the position, and as a consequence the bias stability is crucial. The bias stability is deteriorated when the beam resonator operates in the nonlinear region, this is the reason why VBAs work in the linear region for inertial applications. Concerning seismic ground sensor applications the bias stability is not considered and the important parameter is the resolution at the bandwidth determined by the frequency of the seismic waves. In this case it is then better to operate the beam resonator in the nonlinear region to improve the sensor resolution. Previous work have presented a behavioral model of the vibrating beam accelerometer including the beam resonator and the oscillator circuit taking into account the nonlinear terms. The transient and phase noise simulations are presented to show the improvement of the far from carrier phase noise and the degradation of the close to carrier phase noise while increasing the vibration amplitude in nonlinear region. These simulations are then compared to experimental measurements of the VIA vibrating beam accelerometer developed at ONERA. Finally these accelerometer noise is calculated from the phase noise simulations and the accelerometer resolution is optimized.","PeriodicalId":268119,"journal":{"name":"2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129143556","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2014-04-01DOI: 10.1109/DTIP.2014.7056691
P. Nguyen, C. Seguineau, J. Desmarres, J. Alexis, T. Masri
The present paper first focuses on discussing application ranges for the scratch test and the microtensile test. For that purpose, both have been implemented on the same nickel coating plated on several substrates, in particular a PCB, which are expected to have different adhesion behaviors. Afterward, correlations are highlighted between these two types of adhesion tests.
{"title":"A comparative study of microscratch and microtensile adhesion tests for nickel coatings on various substrates","authors":"P. Nguyen, C. Seguineau, J. Desmarres, J. Alexis, T. Masri","doi":"10.1109/DTIP.2014.7056691","DOIUrl":"https://doi.org/10.1109/DTIP.2014.7056691","url":null,"abstract":"The present paper first focuses on discussing application ranges for the scratch test and the microtensile test. For that purpose, both have been implemented on the same nickel coating plated on several substrates, in particular a PCB, which are expected to have different adhesion behaviors. Afterward, correlations are highlighted between these two types of adhesion tests.","PeriodicalId":268119,"journal":{"name":"2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129250950","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2014-04-01DOI: 10.1109/DTIP.2014.7056652
M. M. Zaki, Sandy Zaehringer, N. Schwesinger
This paper introduces for the first time a 100um thick PZT actuator driven by single sided interdigitated electrodes that achieves a deformation of 15 μm which benefits from the piezoelectric nonlinearity and the reduced stiffness of the substrate. The deformation was at first simulated using a finite element model. The actuator was later fabricated using a standard lithographic process. The characterization followed on using a white light interferometer and a laser Doppler vibrometer.
{"title":"Thin PZT materials for large deformation interdigitated acutators: Simulation & experimental validation","authors":"M. M. Zaki, Sandy Zaehringer, N. Schwesinger","doi":"10.1109/DTIP.2014.7056652","DOIUrl":"https://doi.org/10.1109/DTIP.2014.7056652","url":null,"abstract":"This paper introduces for the first time a 100um thick PZT actuator driven by single sided interdigitated electrodes that achieves a deformation of 15 μm which benefits from the piezoelectric nonlinearity and the reduced stiffness of the substrate. The deformation was at first simulated using a finite element model. The actuator was later fabricated using a standard lithographic process. The characterization followed on using a white light interferometer and a laser Doppler vibrometer.","PeriodicalId":268119,"journal":{"name":"2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP)","volume":"25 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128083943","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2014-04-01DOI: 10.1109/DTIP.2014.7056653
Guillaume Lehée, F. Parrain, J. Riou, A. Bosseboeuf
Resonant structures based on the combination of an electromechanical microresonator made in a thick single crystal Si layer and a differential piezoresistive detection with Si nanowires is a recent concept allowing a breakthrough in downscaling physical resonant sensors with equal to better performances. With an optimized design, the vacuum quality factor of these resonant structures will be ultimately limited by thermoelastic damping. Existing analytical models reasonably well predict the thermoelastic damping of transverse vibrations for beam resonators with and without axial stress but their limitations for resonators with more complex geometry is difficult to estimate. In this paper we investigate by Finite Element Method the effect of axial stress and of nanowire strain gages integration on the thermoelastic damping of vibrations of a beam resonator with a central inertial mass. Results show that axial stress effect depends on actuation force and that nanowires mainly alter the thermoelastic damping through an increase of resonator stiffness. As expected thermoelastic damping is reduced when torsional vibration modes are involved. Results are compared or analyzed with published analytical models.
{"title":"Thermoelastic damping modeling of a Si resonant beam with nanowire strain gauges","authors":"Guillaume Lehée, F. Parrain, J. Riou, A. Bosseboeuf","doi":"10.1109/DTIP.2014.7056653","DOIUrl":"https://doi.org/10.1109/DTIP.2014.7056653","url":null,"abstract":"Resonant structures based on the combination of an electromechanical microresonator made in a thick single crystal Si layer and a differential piezoresistive detection with Si nanowires is a recent concept allowing a breakthrough in downscaling physical resonant sensors with equal to better performances. With an optimized design, the vacuum quality factor of these resonant structures will be ultimately limited by thermoelastic damping. Existing analytical models reasonably well predict the thermoelastic damping of transverse vibrations for beam resonators with and without axial stress but their limitations for resonators with more complex geometry is difficult to estimate. In this paper we investigate by Finite Element Method the effect of axial stress and of nanowire strain gages integration on the thermoelastic damping of vibrations of a beam resonator with a central inertial mass. Results show that axial stress effect depends on actuation force and that nanowires mainly alter the thermoelastic damping through an increase of resonator stiffness. As expected thermoelastic damping is reduced when torsional vibration modes are involved. Results are compared or analyzed with published analytical models.","PeriodicalId":268119,"journal":{"name":"2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP)","volume":"14 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115335150","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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