Pub Date : 2014-04-01DOI: 10.1109/DTIP.2014.7056697
M. Maroufi, M. Shamshirsaz
Resonant Piezoelectric-excited Millimeter-sized Cantilevers (PEMC), has attracted many researchers' interests in the applications such as liquid level and density sensing. As in these applications, the PEMC are partially immersed in liquid, an appropriate analytical model is needed to predict the dynamic behavior of these devices. In this work, a PEMC has been designed and fabricated for liquid level sensing. An analytical model is developed and applied to evaluate the behavior of this device with respect to different tip immersion depths. To validate the proposed model, the theoretical results are compared with the experimental results for the tip immersion depths varying from 5 mm to 15 mm in water for two different resonant modes. A slight deviation between theoretical and experimental model have been observed. To justify the deviations, uncertain parameters and also hydrodynamic force's correction factor have been considered in modeling. This correction factor is introduced in theoretical modeling order to achieve a better estimation of the effect of immersion depth variation on the hydrodynamic force. To determine these parameters using experimental results, Particle Swarm Optimization (PSO) method is utilized. Applying this method, the deviation of theoretical results from experimental data is being significantly reduced. The results show that the uncertain parameters have negligible effect on the natural frequency shift of the PEMC in different immersion depths and on the contrary the hydrodynamic force's correction factor affects it drastically. It is concluded that to improve resonant behavior modeling of the PEMC partially immersed in liquid, for different immersion depths, an appropriate estimation of liquid force is required by insertion of hydrodynamic correction factor.
{"title":"Resonant behavior study of PZT sensor in liquid using PSO method","authors":"M. Maroufi, M. Shamshirsaz","doi":"10.1109/DTIP.2014.7056697","DOIUrl":"https://doi.org/10.1109/DTIP.2014.7056697","url":null,"abstract":"Resonant Piezoelectric-excited Millimeter-sized Cantilevers (PEMC), has attracted many researchers' interests in the applications such as liquid level and density sensing. As in these applications, the PEMC are partially immersed in liquid, an appropriate analytical model is needed to predict the dynamic behavior of these devices. In this work, a PEMC has been designed and fabricated for liquid level sensing. An analytical model is developed and applied to evaluate the behavior of this device with respect to different tip immersion depths. To validate the proposed model, the theoretical results are compared with the experimental results for the tip immersion depths varying from 5 mm to 15 mm in water for two different resonant modes. A slight deviation between theoretical and experimental model have been observed. To justify the deviations, uncertain parameters and also hydrodynamic force's correction factor have been considered in modeling. This correction factor is introduced in theoretical modeling order to achieve a better estimation of the effect of immersion depth variation on the hydrodynamic force. To determine these parameters using experimental results, Particle Swarm Optimization (PSO) method is utilized. Applying this method, the deviation of theoretical results from experimental data is being significantly reduced. The results show that the uncertain parameters have negligible effect on the natural frequency shift of the PEMC in different immersion depths and on the contrary the hydrodynamic force's correction factor affects it drastically. It is concluded that to improve resonant behavior modeling of the PEMC partially immersed in liquid, for different immersion depths, an appropriate estimation of liquid force is required by insertion of hydrodynamic correction factor.","PeriodicalId":268119,"journal":{"name":"2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP)","volume":"20 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133701470","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2014-04-01DOI: 10.1109/DTIP.2014.7056676
J. Nebhen, E. Savary, W. Rahajandraibe, C. Dufaza, S. Meillére, E. Kussener, H. Barthélemy, J. Czarny, H. Lhermet
Investigation of readout electronic dedicated to electromechanical audio sensor is presented. The circuit is able of reading piezoresistive gauge implemented with silicon nanowire (NEMS) and bring electromechanical signal to high-resolution digital output. Low-noise low-power CMOS operational transconductance amplifier (OTA) is presented. The low-noise amplifier (LNA) has been designed in a 0.28 μm CMOS process with a 2.5 V supply voltage and occupies an area of 120 × 160 μm2. For the Post-layout Simulation, the OTA achieves a 65 dB DC gain. It achieves a noise floor of 6 nV/√Hz within the frequency range from 1 Hz to 10 kHz. The total power consumption including the common mode feedback circuit (CMFB) and the biasing circuit is 150 μW.
{"title":"Low-noise CMOS amplifier for readout electronic of resistive NEMS audio sensor","authors":"J. Nebhen, E. Savary, W. Rahajandraibe, C. Dufaza, S. Meillére, E. Kussener, H. Barthélemy, J. Czarny, H. Lhermet","doi":"10.1109/DTIP.2014.7056676","DOIUrl":"https://doi.org/10.1109/DTIP.2014.7056676","url":null,"abstract":"Investigation of readout electronic dedicated to electromechanical audio sensor is presented. The circuit is able of reading piezoresistive gauge implemented with silicon nanowire (NEMS) and bring electromechanical signal to high-resolution digital output. Low-noise low-power CMOS operational transconductance amplifier (OTA) is presented. The low-noise amplifier (LNA) has been designed in a 0.28 μm CMOS process with a 2.5 V supply voltage and occupies an area of 120 × 160 μm2. For the Post-layout Simulation, the OTA achieves a 65 dB DC gain. It achieves a noise floor of 6 nV/√Hz within the frequency range from 1 Hz to 10 kHz. The total power consumption including the common mode feedback circuit (CMFB) and the biasing circuit is 150 μW.","PeriodicalId":268119,"journal":{"name":"2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP)","volume":"10 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133780140","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2014-04-01DOI: 10.1109/DTIP.2014.7056652
M. M. Zaki, Sandy Zaehringer, N. Schwesinger
This paper introduces for the first time a 100um thick PZT actuator driven by single sided interdigitated electrodes that achieves a deformation of 15 μm which benefits from the piezoelectric nonlinearity and the reduced stiffness of the substrate. The deformation was at first simulated using a finite element model. The actuator was later fabricated using a standard lithographic process. The characterization followed on using a white light interferometer and a laser Doppler vibrometer.
{"title":"Thin PZT materials for large deformation interdigitated acutators: Simulation & experimental validation","authors":"M. M. Zaki, Sandy Zaehringer, N. Schwesinger","doi":"10.1109/DTIP.2014.7056652","DOIUrl":"https://doi.org/10.1109/DTIP.2014.7056652","url":null,"abstract":"This paper introduces for the first time a 100um thick PZT actuator driven by single sided interdigitated electrodes that achieves a deformation of 15 μm which benefits from the piezoelectric nonlinearity and the reduced stiffness of the substrate. The deformation was at first simulated using a finite element model. The actuator was later fabricated using a standard lithographic process. The characterization followed on using a white light interferometer and a laser Doppler vibrometer.","PeriodicalId":268119,"journal":{"name":"2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP)","volume":"25 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128083943","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2014-04-01DOI: 10.1109/DTIP.2014.7056691
P. Nguyen, C. Seguineau, J. Desmarres, J. Alexis, T. Masri
The present paper first focuses on discussing application ranges for the scratch test and the microtensile test. For that purpose, both have been implemented on the same nickel coating plated on several substrates, in particular a PCB, which are expected to have different adhesion behaviors. Afterward, correlations are highlighted between these two types of adhesion tests.
{"title":"A comparative study of microscratch and microtensile adhesion tests for nickel coatings on various substrates","authors":"P. Nguyen, C. Seguineau, J. Desmarres, J. Alexis, T. Masri","doi":"10.1109/DTIP.2014.7056691","DOIUrl":"https://doi.org/10.1109/DTIP.2014.7056691","url":null,"abstract":"The present paper first focuses on discussing application ranges for the scratch test and the microtensile test. For that purpose, both have been implemented on the same nickel coating plated on several substrates, in particular a PCB, which are expected to have different adhesion behaviors. Afterward, correlations are highlighted between these two types of adhesion tests.","PeriodicalId":268119,"journal":{"name":"2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129250950","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2014-04-01DOI: 10.1109/DTIP.2014.7056663
Alessia Di Pancrazio, P. Bruschi, M. Piotto
A flow sensor based on a differential microcalorimeter integrated onto a silicon chip is presented. A tunable readout interface, capable of compensating for the sensor offset and offset drift, is integrated on the same chip as the sensing structures. The liquid flow is conveyed to the sensing structure by means of a proper package provided of micro-channels. A simple technique is used to deposit a silicone film onto the flow channel walls, including the chip surface exposed to the liquid. In this way electrical insulation between the sensing chip and the liquid flow is obtained. Results of test performed in deionized water flow are presented.
{"title":"Low power, MEMS liquid flow sensor with silicone coating electrical insulation","authors":"Alessia Di Pancrazio, P. Bruschi, M. Piotto","doi":"10.1109/DTIP.2014.7056663","DOIUrl":"https://doi.org/10.1109/DTIP.2014.7056663","url":null,"abstract":"A flow sensor based on a differential microcalorimeter integrated onto a silicon chip is presented. A tunable readout interface, capable of compensating for the sensor offset and offset drift, is integrated on the same chip as the sensing structures. The liquid flow is conveyed to the sensing structure by means of a proper package provided of micro-channels. A simple technique is used to deposit a silicone film onto the flow channel walls, including the chip surface exposed to the liquid. In this way electrical insulation between the sensing chip and the liquid flow is obtained. Results of test performed in deionized water flow are presented.","PeriodicalId":268119,"journal":{"name":"2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP)","volume":"17 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123726672","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2014-04-01DOI: 10.1109/DTIP.2014.7056674
J. Juillard
This paper is dedicated to the comparison of three techniques of reduced-order modeling (ROM) that may be applied to MEMS beams subject to nonlinear damping and restoring forces. These methods are compared in terms of simplicity and accuracy, in the static, transient and steady-state regimes. It is shown that one of the most popular ROM methods may lead to dramatically wrong results in the case of single-mode decomposition.
{"title":"A comparative study of reduced-order modeling techniques for nonlinear MEMS beams","authors":"J. Juillard","doi":"10.1109/DTIP.2014.7056674","DOIUrl":"https://doi.org/10.1109/DTIP.2014.7056674","url":null,"abstract":"This paper is dedicated to the comparison of three techniques of reduced-order modeling (ROM) that may be applied to MEMS beams subject to nonlinear damping and restoring forces. These methods are compared in terms of simplicity and accuracy, in the static, transient and steady-state regimes. It is shown that one of the most popular ROM methods may lead to dramatically wrong results in the case of single-mode decomposition.","PeriodicalId":268119,"journal":{"name":"2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP)","volume":"38 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114412744","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2014-04-01DOI: 10.1109/DTIP.2014.7056680
A. Somà, G. De Pasquale, M. M. Saleem
The study of creep in MEMS is crucial for their lifetime prediction and reliability evaluation. The experimental approaches used in macromechanics can be extended to the microscale if their effectiveness is proved by dedicated experiments. This goal may provide more general validity of creep effects prediction in MEMS, instead of spotted experiments on single devices like those ones reported in most of the work presented in literature. The demonstration of the validity of some established creep models and experimental methodologies also in the micromechanics is the goal of this paper.
{"title":"Creep in MEMS","authors":"A. Somà, G. De Pasquale, M. M. Saleem","doi":"10.1109/DTIP.2014.7056680","DOIUrl":"https://doi.org/10.1109/DTIP.2014.7056680","url":null,"abstract":"The study of creep in MEMS is crucial for their lifetime prediction and reliability evaluation. The experimental approaches used in macromechanics can be extended to the microscale if their effectiveness is proved by dedicated experiments. This goal may provide more general validity of creep effects prediction in MEMS, instead of spotted experiments on single devices like those ones reported in most of the work presented in literature. The demonstration of the validity of some established creep models and experimental methodologies also in the micromechanics is the goal of this paper.","PeriodicalId":268119,"journal":{"name":"2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP)","volume":"96 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121809299","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2014-04-01DOI: 10.1109/DTIP.2014.7056651
Sae-Won Lee, Ying Chen, R. Vaughan, Meenakshinathan Parameswaran Ash, D. Titz, F. Ferrero, C. Luxey, A. Mahanfar
A novel micro-electro-mechanical systems (MEMS) fabrication process is developed to create self-assembled on-chip high efficiency antennas. A self-assembly technique is used to create out-of-plane on-chip antennas with excellent radiation efficiency on low resistivity substrates. This paper discusses on the fabrication of a monopole antenna and the measurement of the antenna's radiation pattern characteristics. To achieve improved isolation and reduced loss, a thick dielectric layer was placed under the antennas and the transmission lines. The measurement shows maximum realized gain of -2.5 dBi at 66 GHz.
{"title":"Polymer MEMS fabrication process for system-on-chip self-assembled millimeter-wave antennas","authors":"Sae-Won Lee, Ying Chen, R. Vaughan, Meenakshinathan Parameswaran Ash, D. Titz, F. Ferrero, C. Luxey, A. Mahanfar","doi":"10.1109/DTIP.2014.7056651","DOIUrl":"https://doi.org/10.1109/DTIP.2014.7056651","url":null,"abstract":"A novel micro-electro-mechanical systems (MEMS) fabrication process is developed to create self-assembled on-chip high efficiency antennas. A self-assembly technique is used to create out-of-plane on-chip antennas with excellent radiation efficiency on low resistivity substrates. This paper discusses on the fabrication of a monopole antenna and the measurement of the antenna's radiation pattern characteristics. To achieve improved isolation and reduced loss, a thick dielectric layer was placed under the antennas and the transmission lines. The measurement shows maximum realized gain of -2.5 dBi at 66 GHz.","PeriodicalId":268119,"journal":{"name":"2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP)","volume":"4 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129414566","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2014-04-01DOI: 10.1109/DTIP.2014.7056661
G. Sassine, I. Shahosseini, M. Woytasik, E. Martincic, J. Moulin, É. Lefeuvre, A. Houdouin, S. Durand, N. Yaakoubi
In this paper, a theoretical approach for the electrodynamic motor optimization has been presented. The analytical simulations of the electroacoustic efficiency were validated with an experimental measurements were we have seen a very good agreement. The same assembled device was characterized in an anechoic chamber, where we have detected an SPL around 80 dB for 0.5 W.
{"title":"High acoustic performance MEMS microspeaker","authors":"G. Sassine, I. Shahosseini, M. Woytasik, E. Martincic, J. Moulin, É. Lefeuvre, A. Houdouin, S. Durand, N. Yaakoubi","doi":"10.1109/DTIP.2014.7056661","DOIUrl":"https://doi.org/10.1109/DTIP.2014.7056661","url":null,"abstract":"In this paper, a theoretical approach for the electrodynamic motor optimization has been presented. The analytical simulations of the electroacoustic efficiency were validated with an experimental measurements were we have seen a very good agreement. The same assembled device was characterized in an anechoic chamber, where we have detected an SPL around 80 dB for 0.5 W.","PeriodicalId":268119,"journal":{"name":"2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP)","volume":"16 7 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125787113","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2014-04-01DOI: 10.1109/DTIP.2014.7056693
D. A. Saab, S. Mostarshedi, P. Basset, D. Angelescu, E. Richalot
In the present paper, the reduced spectral reflectance properties of silicon micro/nanostructures are studied. In the aim of implementing a predictive reflectance simulation model based on surface topography, an alternative design method of an equivalent unit cell is proposed, where the dimensions and shape are determined based on statistical parameters of the sample topography. A good concordance is reported when comparing reflectance simulations of the equivalent unit cell structure with measurements on Black Silicon (BSi) samples performed with an integrating sphere.
{"title":"Optical properties characterization of silicon micro/nanostructures: Towards a predictive reflectance simulation model based on surface topography","authors":"D. A. Saab, S. Mostarshedi, P. Basset, D. Angelescu, E. Richalot","doi":"10.1109/DTIP.2014.7056693","DOIUrl":"https://doi.org/10.1109/DTIP.2014.7056693","url":null,"abstract":"In the present paper, the reduced spectral reflectance properties of silicon micro/nanostructures are studied. In the aim of implementing a predictive reflectance simulation model based on surface topography, an alternative design method of an equivalent unit cell is proposed, where the dimensions and shape are determined based on statistical parameters of the sample topography. A good concordance is reported when comparing reflectance simulations of the equivalent unit cell structure with measurements on Black Silicon (BSi) samples performed with an integrating sphere.","PeriodicalId":268119,"journal":{"name":"2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP)","volume":"30 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125634763","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
京公网安备 11010802042870号
京ICP备2023020795号-1
扫码关注我们
求助内容：
应助结果提醒方式：