Pub Date : 2014-04-01DOI: 10.1109/DTIP.2014.7056632
J. Brueckner, E. Auerswald, R. Dudek, B. Wunderle, B. Michel, S. Rzepka, A. Dehé
The strength of poly-silicon membranes was investigated by experimental tests and numerical simulations. A new fracture test has been developed that replicates the loading situation under real service conditions well but with higher stress level. A set of 45 membranes was tested at each of the three positions on the wafer in order to assure statistical accuracy and to evaluate the strength distribution across the wafer. Using finite element simulation, fracture stresses were calculated and analyzed by means of a two-parametric Weibull distribution subsequently. High values were found for the characteristic fracture stresses. They are in the range of 5,400-6,000 MPa.
{"title":"Statistical strength investigation of poly-silicon membranes using microscopic loading tests and numerical simulation","authors":"J. Brueckner, E. Auerswald, R. Dudek, B. Wunderle, B. Michel, S. Rzepka, A. Dehé","doi":"10.1109/DTIP.2014.7056632","DOIUrl":"https://doi.org/10.1109/DTIP.2014.7056632","url":null,"abstract":"The strength of poly-silicon membranes was investigated by experimental tests and numerical simulations. A new fracture test has been developed that replicates the loading situation under real service conditions well but with higher stress level. A set of 45 membranes was tested at each of the three positions on the wafer in order to assure statistical accuracy and to evaluate the strength distribution across the wafer. Using finite element simulation, fracture stresses were calculated and analyzed by means of a two-parametric Weibull distribution subsequently. High values were found for the characteristic fracture stresses. They are in the range of 5,400-6,000 MPa.","PeriodicalId":268119,"journal":{"name":"2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP)","volume":"17 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126521751","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2014-04-01DOI: 10.1109/DTIP.2014.7056650
Sun-min Kim, Kwang‐Yong Kim
Parametric study on thermal performances of a hybrid double-side micro-jet cooling system were performed through the three-dimensional Reynolds-averaged Navier-Stokes analysis. Three design variables, viz, the diameter of the jet hole, the distance from the upper jet exit to substrate, and the distance from the lower jet exit to substrate were assessed to analyze the impact on cooling performance. The steady incompressible turbulent flow and conjugate heat transfer in the cooling system were calculated using the shear stress transport turbulence model. The grid dependency test was performed to determine the optimal number of grids to reduce the computational time and conserve system resources. To validate current study, the numerical results were compared with experimental data, and it shows good agreements. To compare the cooling performance, the maximum temperature on the semiconductor and the pressure drop were assessed. As a result, the diameter of jet shows the highest sensitivity on the maximum temperature. The distance from the lower jet exit to substrate also shows the largest impact on the pressure drop, while the other design variables show little differences.
{"title":"Parametric study on thermal performance of a hybrid double-side micro-jet cooling system","authors":"Sun-min Kim, Kwang‐Yong Kim","doi":"10.1109/DTIP.2014.7056650","DOIUrl":"https://doi.org/10.1109/DTIP.2014.7056650","url":null,"abstract":"Parametric study on thermal performances of a hybrid double-side micro-jet cooling system were performed through the three-dimensional Reynolds-averaged Navier-Stokes analysis. Three design variables, viz, the diameter of the jet hole, the distance from the upper jet exit to substrate, and the distance from the lower jet exit to substrate were assessed to analyze the impact on cooling performance. The steady incompressible turbulent flow and conjugate heat transfer in the cooling system were calculated using the shear stress transport turbulence model. The grid dependency test was performed to determine the optimal number of grids to reduce the computational time and conserve system resources. To validate current study, the numerical results were compared with experimental data, and it shows good agreements. To compare the cooling performance, the maximum temperature on the semiconductor and the pressure drop were assessed. As a result, the diameter of jet shows the highest sensitivity on the maximum temperature. The distance from the lower jet exit to substrate also shows the largest impact on the pressure drop, while the other design variables show little differences.","PeriodicalId":268119,"journal":{"name":"2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP)","volume":"216 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127606804","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2014-04-01DOI: 10.1109/DTIP.2014.7056628
Chung-Yao Yang, Chen-Meng Kuan, Chao-Min Cheng, J. Yeh
This paper describes an easy-to-handle approach for creating three-dimensional millimeter-scale polymeric structures on various solid materials as a mold (soft lithography) using daily-use tools for developing in-vitro point-of-care diagnostics devices. These polymeric structures are made from UV-activated materials, adhesive tapes as the mask and UV-LED flashlight as the light source. This physical-based approach is easily operated by hand and is accessible to the less economically developing regions and home. This method provides a new tool to detect biochemicals - glucose, cholesterol, and nitrite ion in this study - in buffer solution and human serum on PDMS structures, and the results can be compared to the products in the market. This study, we believe, would provide a wide range of potential applications, such as the development of point-of-care devices and microfluidics devices, or easy-to-handle fabrication method for the developing regions as well to build "zero-cost" systems.
{"title":"Fabricating small-scale polymeric structures for in-vitro diagnosis via daily-use tools","authors":"Chung-Yao Yang, Chen-Meng Kuan, Chao-Min Cheng, J. Yeh","doi":"10.1109/DTIP.2014.7056628","DOIUrl":"https://doi.org/10.1109/DTIP.2014.7056628","url":null,"abstract":"This paper describes an easy-to-handle approach for creating three-dimensional millimeter-scale polymeric structures on various solid materials as a mold (soft lithography) using daily-use tools for developing in-vitro point-of-care diagnostics devices. These polymeric structures are made from UV-activated materials, adhesive tapes as the mask and UV-LED flashlight as the light source. This physical-based approach is easily operated by hand and is accessible to the less economically developing regions and home. This method provides a new tool to detect biochemicals - glucose, cholesterol, and nitrite ion in this study - in buffer solution and human serum on PDMS structures, and the results can be compared to the products in the market. This study, we believe, would provide a wide range of potential applications, such as the development of point-of-care devices and microfluidics devices, or easy-to-handle fabrication method for the developing regions as well to build \"zero-cost\" systems.","PeriodicalId":268119,"journal":{"name":"2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP)","volume":"8 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134293042","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2014-04-01DOI: 10.1109/DTIP.2014.7056629
Ming-Tzer Lin, Yi-Sheng Liao, Feng-Chih Hsu, Y. Wang, Han Kao, De-Shau Huang
High-power LED lamp is developing in the recent year for energy saving. However, the issue of heat dissipation on LED chip still needs to solve. The heat generation is increased with the power of LED, which reduce the life cycle of LED. LED lamp configuration design influences on dissipating heat from chip since LED array is enclosed by plastic, and surrounds with stationary air. The LED lamp manufactures will to improve the heat dissipation. The study of LED array was focus on heat transfer mechanism. For the fluid flied and heat dissipation analysis for an integrated LED lamp is little. The study is to model a LED lamp to explore thermal and fluid field around the lamp by using FLUENT software. For 6W LED lamp, the simulation results show that 87.8°C of chip temperature and 77.8 mm/s of maximum air velocity inside lampshade were observed and two sets of air circulation were formed. By using the presented model, the different lamp fin designs for heat dissipation of LED chip were evaluated. A LED lamp with 24 fins for higher heat dissipation rate was obtained. The method successfully evaluates the different design. The proposed model is contributed to heat dissipation mechanism design for LED lamp producer.
{"title":"Constructing high-power LED lamp model to evaluate different heat dissipation mechanism design","authors":"Ming-Tzer Lin, Yi-Sheng Liao, Feng-Chih Hsu, Y. Wang, Han Kao, De-Shau Huang","doi":"10.1109/DTIP.2014.7056629","DOIUrl":"https://doi.org/10.1109/DTIP.2014.7056629","url":null,"abstract":"High-power LED lamp is developing in the recent year for energy saving. However, the issue of heat dissipation on LED chip still needs to solve. The heat generation is increased with the power of LED, which reduce the life cycle of LED. LED lamp configuration design influences on dissipating heat from chip since LED array is enclosed by plastic, and surrounds with stationary air. The LED lamp manufactures will to improve the heat dissipation. The study of LED array was focus on heat transfer mechanism. For the fluid flied and heat dissipation analysis for an integrated LED lamp is little. The study is to model a LED lamp to explore thermal and fluid field around the lamp by using FLUENT software. For 6W LED lamp, the simulation results show that 87.8°C of chip temperature and 77.8 mm/s of maximum air velocity inside lampshade were observed and two sets of air circulation were formed. By using the presented model, the different lamp fin designs for heat dissipation of LED chip were evaluated. A LED lamp with 24 fins for higher heat dissipation rate was obtained. The method successfully evaluates the different design. The proposed model is contributed to heat dissipation mechanism design for LED lamp producer.","PeriodicalId":268119,"journal":{"name":"2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP)","volume":"22 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134498326","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2014-04-01DOI: 10.1109/DTIP.2014.7056702
D. Terasawa, Dong F. Wang, Takahiro Kizaki, T. Itoh, R. Maeda
A passive (power-less), bending type MEMS DC current sensor to satisfy the increasing needs of DC power supply for monitoring the electricity consumption by either one-wire or two-wire appliance cord was first proposed in our previous work (DTD? 2011). A MEMS-scale prototype DC sensor, comprised of 5 parallel PZT plates, was then micro-fabricated for preliminarily examination (DTD? 2012). Recently, a novel oscillating type MEMS DC current sensor, comprised of both actuating and sensing elements, was further proposed for two-wire DC electric appliances (DTD?2013). Its applicability to constantly measure the DC current without using cord separator was preliminarily verified. The change of the maximum value of the output voltage was found to linearly increase with the applied DC current. In present study however, a beam-shaped cantilever-based magnetic sensor has been proposed with integrating a micro-magnet, expected to be applicable to terrestrial magnetism with a higher sensitivity in the future. The ANSYS analytical model for the proposed cantilever-based device with integrating a micro-magnet was established and the frequency shifts due to the applied exterior magnetic field were preliminarily studied.
{"title":"Developing MEMS DC electric current sensor for end-use monitoring of DC power supply: Part IV — Cantilever-based magnetic field sensor device","authors":"D. Terasawa, Dong F. Wang, Takahiro Kizaki, T. Itoh, R. Maeda","doi":"10.1109/DTIP.2014.7056702","DOIUrl":"https://doi.org/10.1109/DTIP.2014.7056702","url":null,"abstract":"A passive (power-less), bending type MEMS DC current sensor to satisfy the increasing needs of DC power supply for monitoring the electricity consumption by either one-wire or two-wire appliance cord was first proposed in our previous work (DTD? 2011). A MEMS-scale prototype DC sensor, comprised of 5 parallel PZT plates, was then micro-fabricated for preliminarily examination (DTD? 2012). Recently, a novel oscillating type MEMS DC current sensor, comprised of both actuating and sensing elements, was further proposed for two-wire DC electric appliances (DTD?2013). Its applicability to constantly measure the DC current without using cord separator was preliminarily verified. The change of the maximum value of the output voltage was found to linearly increase with the applied DC current. In present study however, a beam-shaped cantilever-based magnetic sensor has been proposed with integrating a micro-magnet, expected to be applicable to terrestrial magnetism with a higher sensitivity in the future. The ANSYS analytical model for the proposed cantilever-based device with integrating a micro-magnet was established and the frequency shifts due to the applied exterior magnetic field were preliminarily studied.","PeriodicalId":268119,"journal":{"name":"2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP)","volume":"359 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125649838","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2014-04-01DOI: 10.1109/DTIP.2014.7056686
Romain Petre-Bordenave, C. Seguineau, Lucie Thebault, J. Desmarres, J. Alexis
This paper deals with the identification of elastic-plastic material properties by means of nanoindentation. A dimensional analysis leads to the identification of a specific parameter based on the estimation of the pile-up effect This parameter may be used in an inverse analysis. Theoretical aspects and experimental issues are discussed.
{"title":"Quantification of the pile-up effect for improving inverse mechanical analysis by means of nanoindentation","authors":"Romain Petre-Bordenave, C. Seguineau, Lucie Thebault, J. Desmarres, J. Alexis","doi":"10.1109/DTIP.2014.7056686","DOIUrl":"https://doi.org/10.1109/DTIP.2014.7056686","url":null,"abstract":"This paper deals with the identification of elastic-plastic material properties by means of nanoindentation. A dimensional analysis leads to the identification of a specific parameter based on the estimation of the pile-up effect This parameter may be used in an inverse analysis. Theoretical aspects and experimental issues are discussed.","PeriodicalId":268119,"journal":{"name":"2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP)","volume":"32 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129577582","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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