Pub Date : 2012-05-09DOI: 10.1109/ISSE.2012.6273173
I. Lita, D. Visan
This paper presents the implementation of a power line communication module capable to realize data transmission using as communication channel the metallic lines designed for distribution of electrical power in buildings. The key advantage of this solution is given by the existence of abundant pre-installed wires and wall outlets which reduce considerably the costs of communication medium. The proposed solution allows the implementation of a distributed control system for home automation which supposes for example the remote control of electrical apparatus, monitoring of the thermal conditioning installations, ventilation equipment etc. Also the proposed power lines modules allows the communication between local computers or even audio communication between users. For experimental purposes, a LabVIEW application was implemented and used to control two power line modules that realize data communications using existing in-building power lines. By employing LabVIEW software is obtained a system with improved flexibility and an easy to use and friendly control interface.
{"title":"Power line communication module for distributed control systems","authors":"I. Lita, D. Visan","doi":"10.1109/ISSE.2012.6273173","DOIUrl":"https://doi.org/10.1109/ISSE.2012.6273173","url":null,"abstract":"This paper presents the implementation of a power line communication module capable to realize data transmission using as communication channel the metallic lines designed for distribution of electrical power in buildings. The key advantage of this solution is given by the existence of abundant pre-installed wires and wall outlets which reduce considerably the costs of communication medium. The proposed solution allows the implementation of a distributed control system for home automation which supposes for example the remote control of electrical apparatus, monitoring of the thermal conditioning installations, ventilation equipment etc. Also the proposed power lines modules allows the communication between local computers or even audio communication between users. For experimental purposes, a LabVIEW application was implemented and used to control two power line modules that realize data communications using existing in-building power lines. By employing LabVIEW software is obtained a system with improved flexibility and an easy to use and friendly control interface.","PeriodicalId":277579,"journal":{"name":"2012 35th International Spring Seminar on Electronics Technology","volume":"13 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-05-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134367505","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2012-05-09DOI: 10.1109/ISSE.2012.6273138
K. Dušek, M. Novák, A. Rudajevová
The operator or pick and place machine sometimes place the component on its position with a small shift. It isn't a critical mistake, because it is a well known phenomenon that during the time when the solder paste is in liquid state the wetting force that acts on components shifts the component to the correct (straight) position according to the soldering pads. This article deals with study of SMD components self-alignment in surface mount technology. In this article, the component self-alignment with regard to different types of solders, different types of reflow technology, different solder paste volume and different component placement angles was observed. In our experiments three types of solders - one leaded (Sn62/Pb36/Ag2) and two lead-free (Sn99,25/Cu0,7/Ni0,05 and Sn95,5/Ag4/Cu0,5) and two types of reflow technologies (hot air soldering and vapor phase soldering) were used.
{"title":"Study of the components self-alignment in surface mount technology","authors":"K. Dušek, M. Novák, A. Rudajevová","doi":"10.1109/ISSE.2012.6273138","DOIUrl":"https://doi.org/10.1109/ISSE.2012.6273138","url":null,"abstract":"The operator or pick and place machine sometimes place the component on its position with a small shift. It isn't a critical mistake, because it is a well known phenomenon that during the time when the solder paste is in liquid state the wetting force that acts on components shifts the component to the correct (straight) position according to the soldering pads. This article deals with study of SMD components self-alignment in surface mount technology. In this article, the component self-alignment with regard to different types of solders, different types of reflow technology, different solder paste volume and different component placement angles was observed. In our experiments three types of solders - one leaded (Sn62/Pb36/Ag2) and two lead-free (Sn99,25/Cu0,7/Ni0,05 and Sn95,5/Ag4/Cu0,5) and two types of reflow technologies (hot air soldering and vapor phase soldering) were used.","PeriodicalId":277579,"journal":{"name":"2012 35th International Spring Seminar on Electronics Technology","volume":"9 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-05-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114474549","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2012-05-09DOI: 10.1109/ISSE.2012.6273114
A. Bonyár, T. Hurtony, G. Harsányi
Hereby we introduce a method called selective electrochemical etching for the investigation of solder joint microstructures. The aim of this technique is to remove the tin from the solder joint, which enables the examination of the remaining intermetallic microstructures in such a detail, which is unlike to any other previously established method. In our work we discuss the importance of intermetallic compound (IMC) investigation and compare the existing methods with our proposed technique. Pilot measurement results are also presented on selectively etched SAC (Sn-Ag-Cu) alloy solder joints. We present the found relationship between 1) the soldering methods and parameters, 2) the resulting microstructures, 3) the amount of the removed charge/Sn phase during the etching and 4) shear test results on the different solder joints. In our paper we will also investigate the effect of the etching conditions (e.g. etching time, electrolyte concentration, etc.) in order to reach the optimal etching depth, considering the detail and integrity of the intermetallic structures.
{"title":"Selective electrochemical etching for the investigation of solder joint microstructures","authors":"A. Bonyár, T. Hurtony, G. Harsányi","doi":"10.1109/ISSE.2012.6273114","DOIUrl":"https://doi.org/10.1109/ISSE.2012.6273114","url":null,"abstract":"Hereby we introduce a method called selective electrochemical etching for the investigation of solder joint microstructures. The aim of this technique is to remove the tin from the solder joint, which enables the examination of the remaining intermetallic microstructures in such a detail, which is unlike to any other previously established method. In our work we discuss the importance of intermetallic compound (IMC) investigation and compare the existing methods with our proposed technique. Pilot measurement results are also presented on selectively etched SAC (Sn-Ag-Cu) alloy solder joints. We present the found relationship between 1) the soldering methods and parameters, 2) the resulting microstructures, 3) the amount of the removed charge/Sn phase during the etching and 4) shear test results on the different solder joints. In our paper we will also investigate the effect of the etching conditions (e.g. etching time, electrolyte concentration, etc.) in order to reach the optimal etching depth, considering the detail and integrity of the intermetallic structures.","PeriodicalId":277579,"journal":{"name":"2012 35th International Spring Seminar on Electronics Technology","volume":"31 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-05-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116183546","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2012-05-09DOI: 10.1109/ISSE.2012.6273124
A. Pietrikova, M. Kravčík
This paper presents results of investigation of rheology behavior of three solder pastes with various densities (approaching viscosities). Comparison of three viscosity structural models and one thixotropy model were used for description of rheological flow curve of these solder pastes samples. Solder pastes are metal alloys suspended in flux medium and spotlight of this paper is on modeling of viscosity structural models of solder paste. Solder paste rheology is the most important parameter which affects the paste printing process, the reflow soldering performance, and wherefore the resulting solders joint quality and reliability. The rheology behavior can be correlated to the performance of the materials during the stencil printing (dispensing) process. Solder pastes exhibit non-Newtonian rheological characteristics such as shear thinning i.e. the reduction of viscosity with increased shear in dependency on temperature and time. Thixotropy and viscosity structural models help to understand the rate of structural change of solder paste. The viscosity values from structural models are compared with empiric measured values.
{"title":"Investigation of rheology behavior of solder paste","authors":"A. Pietrikova, M. Kravčík","doi":"10.1109/ISSE.2012.6273124","DOIUrl":"https://doi.org/10.1109/ISSE.2012.6273124","url":null,"abstract":"This paper presents results of investigation of rheology behavior of three solder pastes with various densities (approaching viscosities). Comparison of three viscosity structural models and one thixotropy model were used for description of rheological flow curve of these solder pastes samples. Solder pastes are metal alloys suspended in flux medium and spotlight of this paper is on modeling of viscosity structural models of solder paste. Solder paste rheology is the most important parameter which affects the paste printing process, the reflow soldering performance, and wherefore the resulting solders joint quality and reliability. The rheology behavior can be correlated to the performance of the materials during the stencil printing (dispensing) process. Solder pastes exhibit non-Newtonian rheological characteristics such as shear thinning i.e. the reduction of viscosity with increased shear in dependency on temperature and time. Thixotropy and viscosity structural models help to understand the rate of structural change of solder paste. The viscosity values from structural models are compared with empiric measured values.","PeriodicalId":277579,"journal":{"name":"2012 35th International Spring Seminar on Electronics Technology","volume":"93 4 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-05-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127981856","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2012-05-09DOI: 10.1109/ISSE.2012.6273088
V. Bande, D. Pitica, I. Ciascai
The water level calculation technique is based on the capacitance measurement of a multi - capacitor sensor partially immersed into the liquid. Every capacitance can be expressed from the mathematical point of view in terms of liquid column height by the geometrical parameters of every capacitor formed. The formula takes into consideration all parasitical effects due to geometrical limitations. The level is calculated using two different algorithms and the compared with a industrial level sensor and a ruler. Finally, the capacitance - level formula is plotted for fastening the level “reading” procedure.
{"title":"Multi - Capacitor sensor algorithm for water level measurement","authors":"V. Bande, D. Pitica, I. Ciascai","doi":"10.1109/ISSE.2012.6273088","DOIUrl":"https://doi.org/10.1109/ISSE.2012.6273088","url":null,"abstract":"The water level calculation technique is based on the capacitance measurement of a multi - capacitor sensor partially immersed into the liquid. Every capacitance can be expressed from the mathematical point of view in terms of liquid column height by the geometrical parameters of every capacitor formed. The formula takes into consideration all parasitical effects due to geometrical limitations. The level is calculated using two different algorithms and the compared with a industrial level sensor and a ruler. Finally, the capacitance - level formula is plotted for fastening the level “reading” procedure.","PeriodicalId":277579,"journal":{"name":"2012 35th International Spring Seminar on Electronics Technology","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-05-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127378727","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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