Pub Date : 2012-05-09DOI: 10.1109/ISSE.2012.6273122
M. Nicák, B. Psota, Petr Kosina, Jiri Stary, J. Šandera
This paper describes design, construction and some recent tests of three dimensional stacked lead-free soldered structures based on Low Temperature Co-fired Ceramic substrates (LTCC). These structures have a great potential to create compact structure combining multiple different modules in one package. Internal connections used in these 3D structures have an important role, because they not only provide electrical and signal connection, but they also present mechanical attachment between connected substrates. Goal of this work is to develop, simulate and evaluate new structures based on interesting “zero shrink” Heraeus HL2000 LTCC substrates, where dimples help to reduce thermo-mechanical stress and pads modified with copper to reduce problems with leaching.
{"title":"Zero shrink LTCC 3D structure interconnections","authors":"M. Nicák, B. Psota, Petr Kosina, Jiri Stary, J. Šandera","doi":"10.1109/ISSE.2012.6273122","DOIUrl":"https://doi.org/10.1109/ISSE.2012.6273122","url":null,"abstract":"This paper describes design, construction and some recent tests of three dimensional stacked lead-free soldered structures based on Low Temperature Co-fired Ceramic substrates (LTCC). These structures have a great potential to create compact structure combining multiple different modules in one package. Internal connections used in these 3D structures have an important role, because they not only provide electrical and signal connection, but they also present mechanical attachment between connected substrates. Goal of this work is to develop, simulate and evaluate new structures based on interesting “zero shrink” Heraeus HL2000 LTCC substrates, where dimples help to reduce thermo-mechanical stress and pads modified with copper to reduce problems with leaching.","PeriodicalId":277579,"journal":{"name":"2012 35th International Spring Seminar on Electronics Technology","volume":"24 9 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-05-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128796248","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2012-05-09DOI: 10.1109/ISSE.2012.6273076
Janos Szecsenyi, R. Bátorfi, Z. Illyefalvi-Vitéz
To reach excellent reliability of micro wire bonds, manufacturers must apply materials at high quality. This work discusses the comparison of two kinds of ENEPIG (Electroless Nickel - Electroless Palladium - Immersion Gold) surface finishes on copper sheets of terminals used for thermosonic gold wire bonding. The main difference between the two samples is the thickness of the gold layers on the top. To estimate the thickness of the layers a calculation based on EDS (Energy Dispersive X-ray Spectrometry) method was used. The thicknesses of the checked samples showed perfect match with the specification. The surface roughness was examined by Alpha Step Surface Profiler; and AFM (Atomic Force Microscope) was used to get a picture about the surface in higher resolution. The discovered raggedness of the surface, which certainly originates from the rolling of the copper sheet, may influence negatively the strength of the bonds, because the stitch bond gets in touch with the surface on a smaller area. The reliability was tested by measuring bond shear force after more and more cycles of thermal shock test. We noticed that the shear force increased with the advance of the number of the thermal cycles. According to the examinations the low cost surface finish covered with thinner gold layer can replace the more expensive layer structure with thicker gold.
{"title":"Mechanical and structural analysis of thermosonic wire bonds","authors":"Janos Szecsenyi, R. Bátorfi, Z. Illyefalvi-Vitéz","doi":"10.1109/ISSE.2012.6273076","DOIUrl":"https://doi.org/10.1109/ISSE.2012.6273076","url":null,"abstract":"To reach excellent reliability of micro wire bonds, manufacturers must apply materials at high quality. This work discusses the comparison of two kinds of ENEPIG (Electroless Nickel - Electroless Palladium - Immersion Gold) surface finishes on copper sheets of terminals used for thermosonic gold wire bonding. The main difference between the two samples is the thickness of the gold layers on the top. To estimate the thickness of the layers a calculation based on EDS (Energy Dispersive X-ray Spectrometry) method was used. The thicknesses of the checked samples showed perfect match with the specification. The surface roughness was examined by Alpha Step Surface Profiler; and AFM (Atomic Force Microscope) was used to get a picture about the surface in higher resolution. The discovered raggedness of the surface, which certainly originates from the rolling of the copper sheet, may influence negatively the strength of the bonds, because the stitch bond gets in touch with the surface on a smaller area. The reliability was tested by measuring bond shear force after more and more cycles of thermal shock test. We noticed that the shear force increased with the advance of the number of the thermal cycles. According to the examinations the low cost surface finish covered with thinner gold layer can replace the more expensive layer structure with thicker gold.","PeriodicalId":277579,"journal":{"name":"2012 35th International Spring Seminar on Electronics Technology","volume":"15 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-05-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"117071451","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2012-05-09DOI: 10.1109/ISSE.2012.6273096
C. Negrea, P. Svasta, M. Rangu
This paper presents a method of multi-domain modeling for power Light Emitting Diodes (LEDs) with the goal of providing the ability for simultaneous simulations of electrical, thermal and optical behavior. This approach enables engineers to have a better insight into LED critical performance parameters in various operating conditions, by considering the main electrical-thermal and optical interactions. Our proposed multi-domain model integrates an electrical model based on typical diode equations, a dynamic thermal model composed of a Cauer type RC network driven by currnet source, and an optical model derived from the forward current and junction temperature variations of the total luminous flux. The presented approach offers three significant advantages over the traditional single-domain modeling: the effects of packaging and board level thermal management can be evaluated in correlation with electrical parameters, the self heating effect of the junction can be analyzed in the time domain, and the variation of luminous flux output can be observed. The model is defined based on SPICE circuit elements and can be used with any conventional SPICE circuit solver, without the need for solver algorithm modification. The inputs necessary for defining the model are based on standard LED measurements and are often specified in the manufacturer's datasheets. All the necessary algorithms required to obtain the multi-domain model SPICE code were implemented in Matlab.
{"title":"Electro-thermal modeling of power LED using SPICE circuit solver","authors":"C. Negrea, P. Svasta, M. Rangu","doi":"10.1109/ISSE.2012.6273096","DOIUrl":"https://doi.org/10.1109/ISSE.2012.6273096","url":null,"abstract":"This paper presents a method of multi-domain modeling for power Light Emitting Diodes (LEDs) with the goal of providing the ability for simultaneous simulations of electrical, thermal and optical behavior. This approach enables engineers to have a better insight into LED critical performance parameters in various operating conditions, by considering the main electrical-thermal and optical interactions. Our proposed multi-domain model integrates an electrical model based on typical diode equations, a dynamic thermal model composed of a Cauer type RC network driven by currnet source, and an optical model derived from the forward current and junction temperature variations of the total luminous flux. The presented approach offers three significant advantages over the traditional single-domain modeling: the effects of packaging and board level thermal management can be evaluated in correlation with electrical parameters, the self heating effect of the junction can be analyzed in the time domain, and the variation of luminous flux output can be observed. The model is defined based on SPICE circuit elements and can be used with any conventional SPICE circuit solver, without the need for solver algorithm modification. The inputs necessary for defining the model are based on standard LED measurements and are often specified in the manufacturer's datasheets. All the necessary algorithms required to obtain the multi-domain model SPICE code were implemented in Matlab.","PeriodicalId":277579,"journal":{"name":"2012 35th International Spring Seminar on Electronics Technology","volume":"96 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-05-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121465413","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2012-05-09DOI: 10.1109/ISSE.2012.6273119
A. Brodeala, A. Bonea, C. Ionescu, M. Vlădescu, P. Svasta
The paper aims to describe methods of dealing with printing issues related to printing metallic nanoparticle inks with micrometric dimensions. The particular focus is on inks containing metal nanoparticles, complexes and metallo-organic compounds that reach acceptable conductivity for the structures. These need to be sintered, the low temperature representing the novel aspect. The work describes the achievement of such electrical tracks with nanoparticle inks printed with commercially available silver ink EMD5603 from Sunchemical. The electrical tracks were printed with different resolutions, on two flexible substrates and the thermal treatment was performed at different temperatures.
{"title":"Physical properties of silver inkjet printed circuits","authors":"A. Brodeala, A. Bonea, C. Ionescu, M. Vlădescu, P. Svasta","doi":"10.1109/ISSE.2012.6273119","DOIUrl":"https://doi.org/10.1109/ISSE.2012.6273119","url":null,"abstract":"The paper aims to describe methods of dealing with printing issues related to printing metallic nanoparticle inks with micrometric dimensions. The particular focus is on inks containing metal nanoparticles, complexes and metallo-organic compounds that reach acceptable conductivity for the structures. These need to be sintered, the low temperature representing the novel aspect. The work describes the achievement of such electrical tracks with nanoparticle inks printed with commercially available silver ink EMD5603 from Sunchemical. The electrical tracks were printed with different resolutions, on two flexible substrates and the thermal treatment was performed at different temperatures.","PeriodicalId":277579,"journal":{"name":"2012 35th International Spring Seminar on Electronics Technology","volume":"30 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-05-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124532371","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2012-05-09DOI: 10.1109/ISSE.2012.6273104
T. Džugan, A. Hamácek, J. Řeboun, K. Hromadka, R. Vik
This article deals with the research of an impact of various gases and vapours on electrical parameters of phthalocyanine. Cross-sensitivity was researched in order to exclude a negative impact of organic vapours on humidity sensor. Thin layer of phthalocyanine was exposed to various vapours, and then responses of its electrical characteristics were measured. This suitable material for humidity sensors, was deposited from the liquid phase on a substrate with interdigital electrodes and than exposed to the effect of analytes. Subsequently, the impedance characteristic of this thin film layer was measured. The comparison of responses to various gases and vapours is discussed in more detail as well.
{"title":"Cross-sensitivity of humidity sensor layers based on organic materials","authors":"T. Džugan, A. Hamácek, J. Řeboun, K. Hromadka, R. Vik","doi":"10.1109/ISSE.2012.6273104","DOIUrl":"https://doi.org/10.1109/ISSE.2012.6273104","url":null,"abstract":"This article deals with the research of an impact of various gases and vapours on electrical parameters of phthalocyanine. Cross-sensitivity was researched in order to exclude a negative impact of organic vapours on humidity sensor. Thin layer of phthalocyanine was exposed to various vapours, and then responses of its electrical characteristics were measured. This suitable material for humidity sensors, was deposited from the liquid phase on a substrate with interdigital electrodes and than exposed to the effect of analytes. Subsequently, the impedance characteristic of this thin film layer was measured. The comparison of responses to various gases and vapours is discussed in more detail as well.","PeriodicalId":277579,"journal":{"name":"2012 35th International Spring Seminar on Electronics Technology","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-05-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115748823","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2012-05-09DOI: 10.1109/ISSE.2012.6273170
C. Lenz, S. Ziesche, U. Partsch, H. Neubert
This work presents miniaturized piezoresistive load cells in LTCC for low force ranges. Compared to former investigations on this area we designed the load cells according to commercial products. We used a freestanding cartwheel structure with co-fired piezoresistive resistors as deformable bodies which combines both: high sensitivity and a high robustness against shear forces. The designed packaging allows the sensing of compressive and tensile forces for different ranges (2 N, 5 N and 10 N) and is characterized by a high miniaturization. We developed an analytical model to design the cartwheel structures and to predict the expected characteristics. To increase the repeatability and the reliability we studied different fabrication techniques to reduce cracks, delaminations and sagging. The sensor elements were fabricated in the standard LTCC-technology on GT 951. The fabricated load cells were characterized between 25 °C and 80 °C regarding relevant parameters. The results show a good match to the theoretically calculated values.
这项工作提出了用于低力范围的LTCC小型化压阻式称重传感器。与以往在该领域的研究相比，我们根据商业产品设计了称重传感器。我们使用了一个独立的车轮结构和共烧压阻电阻作为可变形体，它结合了高灵敏度和抗剪切力的高稳健性。所设计的封装允许对不同范围(2 N, 5 N和10 N)的压缩和拉伸力进行传感，其特点是高度小型化。我们建立了一个分析模型来设计侧轮结构和预测预期的特性。为了提高可重复性和可靠性，我们研究了不同的制造技术，以减少裂纹，分层和下垂。传感器元件在GT 951上采用标准ltcc技术制造。根据相关参数在25°C到80°C之间进行了表征。计算结果与理论计算值吻合较好。
{"title":"Low temperature cofired ceramics (LTCC)-based miniaturized load cells","authors":"C. Lenz, S. Ziesche, U. Partsch, H. Neubert","doi":"10.1109/ISSE.2012.6273170","DOIUrl":"https://doi.org/10.1109/ISSE.2012.6273170","url":null,"abstract":"This work presents miniaturized piezoresistive load cells in LTCC for low force ranges. Compared to former investigations on this area we designed the load cells according to commercial products. We used a freestanding cartwheel structure with co-fired piezoresistive resistors as deformable bodies which combines both: high sensitivity and a high robustness against shear forces. The designed packaging allows the sensing of compressive and tensile forces for different ranges (2 N, 5 N and 10 N) and is characterized by a high miniaturization. We developed an analytical model to design the cartwheel structures and to predict the expected characteristics. To increase the repeatability and the reliability we studied different fabrication techniques to reduce cracks, delaminations and sagging. The sensor elements were fabricated in the standard LTCC-technology on GT 951. The fabricated load cells were characterized between 25 °C and 80 °C regarding relevant parameters. The results show a good match to the theoretically calculated values.","PeriodicalId":277579,"journal":{"name":"2012 35th International Spring Seminar on Electronics Technology","volume":"123 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-05-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115830677","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2012-05-09DOI: 10.1109/ISSE.2012.6273085
D. Bonfert, D. Hemmetzberger, I. Bose, G. Klink, K. Bock, P. Svasta, C. Ionescu
There is a necessity to include sensors (resistors) in the design of organic electronic systems in order to extend the range of possible applications. It is essential to identify potential resistive materials, the processes and methods to structure them and to analyze their resistive properties on flexible substrates. One material widely used in organic electronics is the intrinsically conductive polymer (ICP) poly (3, 4-ethylendioxythiophene) doped with polystyrene sulfonate acid (PEDOT:PSS). In this paper we focus on the DC- and pulsed stress behavior of this conductive polymer on flexible substrates and the resulting changes of his resistive properties.
{"title":"Electrical stress on intrinsically conductive polymer layer","authors":"D. Bonfert, D. Hemmetzberger, I. Bose, G. Klink, K. Bock, P. Svasta, C. Ionescu","doi":"10.1109/ISSE.2012.6273085","DOIUrl":"https://doi.org/10.1109/ISSE.2012.6273085","url":null,"abstract":"There is a necessity to include sensors (resistors) in the design of organic electronic systems in order to extend the range of possible applications. It is essential to identify potential resistive materials, the processes and methods to structure them and to analyze their resistive properties on flexible substrates. One material widely used in organic electronics is the intrinsically conductive polymer (ICP) poly (3, 4-ethylendioxythiophene) doped with polystyrene sulfonate acid (PEDOT:PSS). In this paper we focus on the DC- and pulsed stress behavior of this conductive polymer on flexible substrates and the resulting changes of his resistive properties.","PeriodicalId":277579,"journal":{"name":"2012 35th International Spring Seminar on Electronics Technology","volume":"14 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-05-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128163331","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2012-05-09DOI: 10.1109/ISSE.2012.6273140
G. Radosavljevic, A. Maric, L. Zivanov, S. Toškov, W. Smetana
The purpose of this paper is to demonstrate influence of material properties and fabrication technique on the performance of embedded pressure sensors. Three different wireless pressure sensors, operating in the MHz, based on a passive wireless inductor-capacitor resonant circuit are designed and fabricated in the LTCC technology. The first design of sensor where sensor membranes are formed as a sandwich composition comprising electrode layers which are placed between two dielectric tapes can be found suitable for applications in chemically aggressive environments. The second pressure sensor realization was designed to meet the requirements of higher sensitivity. The last sensor design was realized with intention to minimize overall sensor dimension. Obtained results show good agreement with foreseen expectations.
{"title":"Resonant sensors for wireless pressure monitoring realized in LTCC-technology","authors":"G. Radosavljevic, A. Maric, L. Zivanov, S. Toškov, W. Smetana","doi":"10.1109/ISSE.2012.6273140","DOIUrl":"https://doi.org/10.1109/ISSE.2012.6273140","url":null,"abstract":"The purpose of this paper is to demonstrate influence of material properties and fabrication technique on the performance of embedded pressure sensors. Three different wireless pressure sensors, operating in the MHz, based on a passive wireless inductor-capacitor resonant circuit are designed and fabricated in the LTCC technology. The first design of sensor where sensor membranes are formed as a sandwich composition comprising electrode layers which are placed between two dielectric tapes can be found suitable for applications in chemically aggressive environments. The second pressure sensor realization was designed to meet the requirements of higher sensitivity. The last sensor design was realized with intention to minimize overall sensor dimension. Obtained results show good agreement with foreseen expectations.","PeriodicalId":277579,"journal":{"name":"2012 35th International Spring Seminar on Electronics Technology","volume":"38 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-05-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"117308794","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2012-05-09DOI: 10.1109/ISSE.2012.6273075
T. Novák, F. Steiner
This article deals with the growth of intermetallic compounds (IMCs) in solder joints and influence of these IMCs on properties of soldered joints. The test specimens of printed circuit boards (PCBs) with different surface finishes were made for this experiment. Tin_G (galvanic tin), Tin_C (immersion tin), Cu (pure copper), OSP (organic solderability preservative) and ENIG (electroless nickel immersion gold) surface finishes were chosen. The soldered joints were created on the test specimens by reflow soldering process concretely vapour-phase soldering. The surface mount solder joints of LCCC resistor of size 1206 were studied. Two lead-free solder paste and one tin-lead solder paste were chosen for research of IMCs and their influence on properties of soldered joints. The test specimens were exposed to elevated aging for research of IMCs growth in solder joint. The specimens were thermal stressed in hot air oven at the temperature of 150°C for a periods of 0, 1, 2, 4, 8, and 16 days. The shear test was used for research of IMCs growth influence on strength of soldered joints. The results of analysis of IMCs in solder joints using confocal and metallographic microscopes and the results of shear strength measurement will be presented in this article.
{"title":"Influence of intermetallic compounds growth on properties of lead-free solder joints","authors":"T. Novák, F. Steiner","doi":"10.1109/ISSE.2012.6273075","DOIUrl":"https://doi.org/10.1109/ISSE.2012.6273075","url":null,"abstract":"This article deals with the growth of intermetallic compounds (IMCs) in solder joints and influence of these IMCs on properties of soldered joints. The test specimens of printed circuit boards (PCBs) with different surface finishes were made for this experiment. Tin_G (galvanic tin), Tin_C (immersion tin), Cu (pure copper), OSP (organic solderability preservative) and ENIG (electroless nickel immersion gold) surface finishes were chosen. The soldered joints were created on the test specimens by reflow soldering process concretely vapour-phase soldering. The surface mount solder joints of LCCC resistor of size 1206 were studied. Two lead-free solder paste and one tin-lead solder paste were chosen for research of IMCs and their influence on properties of soldered joints. The test specimens were exposed to elevated aging for research of IMCs growth in solder joint. The specimens were thermal stressed in hot air oven at the temperature of 150°C for a periods of 0, 1, 2, 4, 8, and 16 days. The shear test was used for research of IMCs growth influence on strength of soldered joints. The results of analysis of IMCs in solder joints using confocal and metallographic microscopes and the results of shear strength measurement will be presented in this article.","PeriodicalId":277579,"journal":{"name":"2012 35th International Spring Seminar on Electronics Technology","volume":"94 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-05-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115094929","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2012-05-09DOI: 10.1109/ISSE.2012.6273080
B. Illés, B. Horváth, B. Lipak, A. Géczy
The aim of this research is to examine the whiskering ability of immersion tin layers in natural and elevated temperatures and elevated or decreased humidity environments. Immersion tin layer with 2 μm layer thickness on copper substrate has been tested. Five different groups of samples has been investigated: a reference in room environment (25 °C/ 50% RH), two hot and dry circumstances in 50 °C and 105 °C temperature with 15% Relative Humidity (RH) and two hot and wet circumstances in 40 °C and 105 °C temperature with 92% RH and 100% RH respectively. The whisker growth was observed by using Scanning Electron Microscopy (SEM). The structure of the whiskers and the tin layer were also examined with FIB (Focused Ion Beam). It is shown that the immersion tin layer is also capable of growing tin whiskers. Most of the detected whiskers were the so called “nodule” types, approximately 3-9 μm long with 1-2 μm thickness.
{"title":"Investigating whisker growth on immersion tin surface finishing","authors":"B. Illés, B. Horváth, B. Lipak, A. Géczy","doi":"10.1109/ISSE.2012.6273080","DOIUrl":"https://doi.org/10.1109/ISSE.2012.6273080","url":null,"abstract":"The aim of this research is to examine the whiskering ability of immersion tin layers in natural and elevated temperatures and elevated or decreased humidity environments. Immersion tin layer with 2 μm layer thickness on copper substrate has been tested. Five different groups of samples has been investigated: a reference in room environment (25 °C/ 50% RH), two hot and dry circumstances in 50 °C and 105 °C temperature with 15% Relative Humidity (RH) and two hot and wet circumstances in 40 °C and 105 °C temperature with 92% RH and 100% RH respectively. The whisker growth was observed by using Scanning Electron Microscopy (SEM). The structure of the whiskers and the tin layer were also examined with FIB (Focused Ion Beam). It is shown that the immersion tin layer is also capable of growing tin whiskers. Most of the detected whiskers were the so called “nodule” types, approximately 3-9 μm long with 1-2 μm thickness.","PeriodicalId":277579,"journal":{"name":"2012 35th International Spring Seminar on Electronics Technology","volume":"54 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-05-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115313733","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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