Pub Date : 2012-05-09DOI: 10.1109/ISSE.2012.6273152
J. Grochowski, M. Guziewicz, R. Kruszka, M. Borysiewicz, K. Kopalko, A. Piotrowska
The aim of our work was to produce p-n heterojunction with the high level of optical transmission. P-type NiO and n-type ZnO:Al films deposited by magnetron sputtering were used to fabricate p-n diodes. These were thermally processed in Ar ambient at 400°C in order to obtain high optical transmission and better electrical characteristics. The best diode's parameters were rectifying ratio of 6.7·104 and reverse current at the level of 6·10-7A at -3 V of bias. The best obtained optical transmission of the bilayer was near 20% in the visual wavelength region.
{"title":"Fabrication and characterization of p-NiO/n-ZnO heterojunction towards transparent diode","authors":"J. Grochowski, M. Guziewicz, R. Kruszka, M. Borysiewicz, K. Kopalko, A. Piotrowska","doi":"10.1109/ISSE.2012.6273152","DOIUrl":"https://doi.org/10.1109/ISSE.2012.6273152","url":null,"abstract":"The aim of our work was to produce p-n heterojunction with the high level of optical transmission. P-type NiO and n-type ZnO:Al films deposited by magnetron sputtering were used to fabricate p-n diodes. These were thermally processed in Ar ambient at 400°C in order to obtain high optical transmission and better electrical characteristics. The best diode's parameters were rectifying ratio of 6.7·104 and reverse current at the level of 6·10-7A at -3 V of bias. The best obtained optical transmission of the bilayer was near 20% in the visual wavelength region.","PeriodicalId":277579,"journal":{"name":"2012 35th International Spring Seminar on Electronics Technology","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-05-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129715170","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2012-05-09DOI: 10.1109/ISSE.2012.6273101
R. Soukup, A. Hamácek, J. Řeboun
This paper presents a research focused on development of low-cost manufacturing process which enables fabrication of accurate organic humidity sensors, where only screen printing is used for all layers deposition. It means that not only the interdigital structures with 50 μm line and space, but also phatolocynine sensing film and protective polymer layer are screen printed. The interdigital structures are printed by advanced screen printing in order to replace complex an expensive vacuum processes. In the frame of this research a novel screen printing technique for deposition of low viscose organic sensing film was also developed, where non-standard precise stainless steel Beta mesh was used for screens.
{"title":"Organic based sensors: Novel screen printing technique for sensing layers deposition","authors":"R. Soukup, A. Hamácek, J. Řeboun","doi":"10.1109/ISSE.2012.6273101","DOIUrl":"https://doi.org/10.1109/ISSE.2012.6273101","url":null,"abstract":"This paper presents a research focused on development of low-cost manufacturing process which enables fabrication of accurate organic humidity sensors, where only screen printing is used for all layers deposition. It means that not only the interdigital structures with 50 μm line and space, but also phatolocynine sensing film and protective polymer layer are screen printed. The interdigital structures are printed by advanced screen printing in order to replace complex an expensive vacuum processes. In the frame of this research a novel screen printing technique for deposition of low viscose organic sensing film was also developed, where non-standard precise stainless steel Beta mesh was used for screens.","PeriodicalId":277579,"journal":{"name":"2012 35th International Spring Seminar on Electronics Technology","volume":"23 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-05-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126872172","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2012-05-09DOI: 10.1109/ISSE.2012.6273168
N. Blaz, G. Miskovic, A. Maric, M. Damnjanović, G. Radosavljevic, L. Zivanov
This paper presents the development of LC sensor comprised of a movable inductor and a fixed inductor-capacitor resonant circuit, thereby causing the sensor resonant frequency to be displacement dependent. The sensor has been fabricated in PCB (Printed Circuit Board) technology and experimentally characterized. Experimentally obtained results are compared with an electrical model. Good agreement between measured results and parameters estimated by analytical calculations are obtained.
{"title":"Modeling and characterization of LC displacement sensor in PCB technology","authors":"N. Blaz, G. Miskovic, A. Maric, M. Damnjanović, G. Radosavljevic, L. Zivanov","doi":"10.1109/ISSE.2012.6273168","DOIUrl":"https://doi.org/10.1109/ISSE.2012.6273168","url":null,"abstract":"This paper presents the development of LC sensor comprised of a movable inductor and a fixed inductor-capacitor resonant circuit, thereby causing the sensor resonant frequency to be displacement dependent. The sensor has been fabricated in PCB (Printed Circuit Board) technology and experimentally characterized. Experimentally obtained results are compared with an electrical model. Good agreement between measured results and parameters estimated by analytical calculations are obtained.","PeriodicalId":277579,"journal":{"name":"2012 35th International Spring Seminar on Electronics Technology","volume":"3 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-05-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122268267","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2012-05-09DOI: 10.1109/ISSE.2012.6273142
N. Nenov, N. Dodev, D. Atmadzhova, G. Stoychev
The paper presented is dedicated to developing an underground train tilting control system acting over the secondary suspension while negotiating curves. The goal is to improve the ride quality while passing curves at relatively high speeds. The system changes the parameters of the secondary suspension depending on the lateral acceleration of the wagon body, running speed and bogie rotation, all measured by means of sensors.
{"title":"Sensors and control system for tilting of underground trains in curves","authors":"N. Nenov, N. Dodev, D. Atmadzhova, G. Stoychev","doi":"10.1109/ISSE.2012.6273142","DOIUrl":"https://doi.org/10.1109/ISSE.2012.6273142","url":null,"abstract":"The paper presented is dedicated to developing an underground train tilting control system acting over the secondary suspension while negotiating curves. The goal is to improve the ride quality while passing curves at relatively high speeds. The system changes the parameters of the secondary suspension depending on the lateral acceleration of the wagon body, running speed and bogie rotation, all measured by means of sensors.","PeriodicalId":277579,"journal":{"name":"2012 35th International Spring Seminar on Electronics Technology","volume":"120 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-05-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128015428","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2012-05-09DOI: 10.1109/ISSE.2012.6273112
P. Krivic, F. Wenzl, C. Sommer, G. Langer, P. Pachler, H. Hoschopf, P. Fulmek, J. Nicolics
The reliability and long-term stability of solid-state lighting devices strongly depend on successful thermal management. It is well known that junction temperature instability negatively impacts the lightning properties of LED illuminators. However, for prediction of life time and longterm stability the temperature distribution also inside the color converter must be known. A deeper understanding of these demanding thermal issues is provided in our paper on the base of measurements and simulations also taking into account the spatial power loss distribution due to absorption of light and Stokes shift within the color converter. For this purpose 3-dimensional models were set-up and examined to thermally characterize high-power LED assemblies. Two different types of set-ups were investigated. Moreover, an efficient solution is presented where a junction-to-case thermal resistance below 10 K/W is achieved.
{"title":"Investigation of thermal properties of power LED illumination assemblies","authors":"P. Krivic, F. Wenzl, C. Sommer, G. Langer, P. Pachler, H. Hoschopf, P. Fulmek, J. Nicolics","doi":"10.1109/ISSE.2012.6273112","DOIUrl":"https://doi.org/10.1109/ISSE.2012.6273112","url":null,"abstract":"The reliability and long-term stability of solid-state lighting devices strongly depend on successful thermal management. It is well known that junction temperature instability negatively impacts the lightning properties of LED illuminators. However, for prediction of life time and longterm stability the temperature distribution also inside the color converter must be known. A deeper understanding of these demanding thermal issues is provided in our paper on the base of measurements and simulations also taking into account the spatial power loss distribution due to absorption of light and Stokes shift within the color converter. For this purpose 3-dimensional models were set-up and examined to thermally characterize high-power LED assemblies. Two different types of set-ups were investigated. Moreover, an efficient solution is presented where a junction-to-case thermal resistance below 10 K/W is achieved.","PeriodicalId":277579,"journal":{"name":"2012 35th International Spring Seminar on Electronics Technology","volume":"40 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-05-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124702563","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2012-05-09DOI: 10.1109/ISSE.2012.6273079
Martin Molhanec, P. Mach
The main idea behind of this paper is aimed to improve PM (Project Management) in the field of product design, concretely in the branch of packaging with employing a Model Based (in other words Model Driven) approach. We propose a modern and innovative project management framework covering entire life cycle of manufacturing project. This original approach, a novelty of the Authors, contributes to more efficient project management of manufacturing process. It also increases quality, reliability and testing-capability of particular project process. Further, the Authors describe selected software and methodical tools suitable for the support of the process. Finally, a brief description of Model Based Project Management Framework (MBPMF) is set and some future directions of further research are indicated.
{"title":"Quality management from the perspective of model based Project Management framework","authors":"Martin Molhanec, P. Mach","doi":"10.1109/ISSE.2012.6273079","DOIUrl":"https://doi.org/10.1109/ISSE.2012.6273079","url":null,"abstract":"The main idea behind of this paper is aimed to improve PM (Project Management) in the field of product design, concretely in the branch of packaging with employing a Model Based (in other words Model Driven) approach. We propose a modern and innovative project management framework covering entire life cycle of manufacturing project. This original approach, a novelty of the Authors, contributes to more efficient project management of manufacturing process. It also increases quality, reliability and testing-capability of particular project process. Further, the Authors describe selected software and methodical tools suitable for the support of the process. Finally, a brief description of Model Based Project Management Framework (MBPMF) is set and some future directions of further research are indicated.","PeriodicalId":277579,"journal":{"name":"2012 35th International Spring Seminar on Electronics Technology","volume":"67 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-05-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131634708","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2012-05-09DOI: 10.1109/ISSE.2012.6273163
D. Mladenova, V. Siderov, I. Zhivkov, O. Salyk, M. Ohlídal, I. Yordanova, R. Yordanov, P. Philippov, M. Weiter
This paper compares chromatic white light (CWL) and interference microscope measurements aiming to find a proper non-contact method for a thickness determination of thin soft organic films. Standard samples with vacuum deposited aluminum films of different thicknesses in the range of 50-1000 nm were prepared and measured by both methods. It was found that the CWL technique is proper for a measurement of thin soft organic films with higher than 40-50 nm film thicknesses. As a complementary feature of the method 2D and 3D surface morphology imaging of the films could be recorded and the surface film roughness could be calculated. In a case of optical inhomogeneity the method requires covering with a uniform high reflective coating. The interference microscopy method results in a relatively lower film thickness with a higher standard deviation and a higher standard relative error. It could be connected with the resolution of the interferograms measured.
{"title":"Thickness measurement of thin soft organic films","authors":"D. Mladenova, V. Siderov, I. Zhivkov, O. Salyk, M. Ohlídal, I. Yordanova, R. Yordanov, P. Philippov, M. Weiter","doi":"10.1109/ISSE.2012.6273163","DOIUrl":"https://doi.org/10.1109/ISSE.2012.6273163","url":null,"abstract":"This paper compares chromatic white light (CWL) and interference microscope measurements aiming to find a proper non-contact method for a thickness determination of thin soft organic films. Standard samples with vacuum deposited aluminum films of different thicknesses in the range of 50-1000 nm were prepared and measured by both methods. It was found that the CWL technique is proper for a measurement of thin soft organic films with higher than 40-50 nm film thicknesses. As a complementary feature of the method 2D and 3D surface morphology imaging of the films could be recorded and the surface film roughness could be calculated. In a case of optical inhomogeneity the method requires covering with a uniform high reflective coating. The interference microscopy method results in a relatively lower film thickness with a higher standard deviation and a higher standard relative error. It could be connected with the resolution of the interferograms measured.","PeriodicalId":277579,"journal":{"name":"2012 35th International Spring Seminar on Electronics Technology","volume":"21 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-05-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131285778","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2012-05-09DOI: 10.1109/ISSE.2012.6273094
B. Gyoch, P. Mashkov, Stanislav Penchev
Investigation deals with problems of computer-aided design of wide-band antireflection (AR) coatings for semiconductor photosensitive devices (discrete photo receivers, CCD-cameras, modern security systems and others) for spectral region 0.9 μm - 1.7 μm. In practice during deposition of multilayer coatings some deviations of desired coatings' thicknesses always occurs which worsens antireflection properties of the coatings. It is important to know how the phase thickness deviations influence on transmission spectrum of the system: substrate - AR coating. As a result of the analysis it is shown that six-layer structure possesses the lowest reflection and high stability when phase thickness deviations' occurs.
{"title":"Phase thickness deviations' influence on properties of antireflection coatings for near infrared detectors","authors":"B. Gyoch, P. Mashkov, Stanislav Penchev","doi":"10.1109/ISSE.2012.6273094","DOIUrl":"https://doi.org/10.1109/ISSE.2012.6273094","url":null,"abstract":"Investigation deals with problems of computer-aided design of wide-band antireflection (AR) coatings for semiconductor photosensitive devices (discrete photo receivers, CCD-cameras, modern security systems and others) for spectral region 0.9 μm - 1.7 μm. In practice during deposition of multilayer coatings some deviations of desired coatings' thicknesses always occurs which worsens antireflection properties of the coatings. It is important to know how the phase thickness deviations influence on transmission spectrum of the system: substrate - AR coating. As a result of the analysis it is shown that six-layer structure possesses the lowest reflection and high stability when phase thickness deviations' occurs.","PeriodicalId":277579,"journal":{"name":"2012 35th International Spring Seminar on Electronics Technology","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-05-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129020766","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2012-05-09DOI: 10.1109/ISSE.2012.6273167
P. Kuberský, A. Hamácek, M. Kroupa, J. Štulík, V. Zwiefelhofer
This study deals with intrinsic parameters of electrochemical amperometric gas sensors with a solid-state polymeric electrolyte. An experimental electrochemical NO2 sensor based on organic ionic liquid was developed. Subsequently, electrical and mechanical parameters of the sensor were studied and an appropriate potentiostat circuit was designed for the evaluation of a sensor response to the particular gas. The description of the sensor, measurement procedures and results of experiments will be presented in more detail.
{"title":"Potentiostat solution for electrochemical amperometric gas sensor","authors":"P. Kuberský, A. Hamácek, M. Kroupa, J. Štulík, V. Zwiefelhofer","doi":"10.1109/ISSE.2012.6273167","DOIUrl":"https://doi.org/10.1109/ISSE.2012.6273167","url":null,"abstract":"This study deals with intrinsic parameters of electrochemical amperometric gas sensors with a solid-state polymeric electrolyte. An experimental electrochemical NO2 sensor based on organic ionic liquid was developed. Subsequently, electrical and mechanical parameters of the sensor were studied and an appropriate potentiostat circuit was designed for the evaluation of a sensor response to the particular gas. The description of the sensor, measurement procedures and results of experiments will be presented in more detail.","PeriodicalId":277579,"journal":{"name":"2012 35th International Spring Seminar on Electronics Technology","volume":"27 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-05-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132963604","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2012-05-09DOI: 10.1109/ISSE.2012.6273174
D. Chernenko, M. Zhovnir, B. Tsyganok, O. Oliinyk
This paper reviews the results of theoretical and experimental researches of wireless passive surface acoustic wave (SAW) sensors. The new methods for improvement of SAW sensor parameters are described, they are: distance range, sensitivity and multiple accesses.
{"title":"Wireless passive pressure sensor using frequency coded SAW structures","authors":"D. Chernenko, M. Zhovnir, B. Tsyganok, O. Oliinyk","doi":"10.1109/ISSE.2012.6273174","DOIUrl":"https://doi.org/10.1109/ISSE.2012.6273174","url":null,"abstract":"This paper reviews the results of theoretical and experimental researches of wireless passive surface acoustic wave (SAW) sensors. The new methods for improvement of SAW sensor parameters are described, they are: distance range, sensitivity and multiple accesses.","PeriodicalId":277579,"journal":{"name":"2012 35th International Spring Seminar on Electronics Technology","volume":"153 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-05-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132864768","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}