Pub Date : 2012-05-09DOI: 10.1109/ISSE.2012.6273084
S. Barto, R. Radev
There are many methods used for quality investigation and for optimizing production processes. Such optimization methods help with increasing production effectiveness, decreasing costs and increasing the quality of products. In this paper, fractional factorial experiments are applied to investigate different factors of electrically conductive adhesives modified with silver nanoparticles after the application of mechanical aging and the influence on resistance and non-linearity of joints. The factors considered in the experiment were concentration of silver particles, the size of nanoparticles and the combination of both factors.
{"title":"Using fractional factorial experiments for determination of factors influencing parameters of electrically conductive adhesives","authors":"S. Barto, R. Radev","doi":"10.1109/ISSE.2012.6273084","DOIUrl":"https://doi.org/10.1109/ISSE.2012.6273084","url":null,"abstract":"There are many methods used for quality investigation and for optimizing production processes. Such optimization methods help with increasing production effectiveness, decreasing costs and increasing the quality of products. In this paper, fractional factorial experiments are applied to investigate different factors of electrically conductive adhesives modified with silver nanoparticles after the application of mechanical aging and the influence on resistance and non-linearity of joints. The factors considered in the experiment were concentration of silver particles, the size of nanoparticles and the combination of both factors.","PeriodicalId":277579,"journal":{"name":"2012 35th International Spring Seminar on Electronics Technology","volume":"136 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-05-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123254053","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2012-05-09DOI: 10.1109/ISSE.2012.6273166
T. Blecha, J. Cengery, P. Kuberský, M. Kroupa
This paper describes system design for the identification of the fast-moving objects based on RFID frequency band 2,45 GHz. Reasons for using this frequency band 2,45 GHz are here summarized. Literature survey of available systems using this frequency band was done. Active tag and reader for identification fast-moving objects have been designed. The antenna and power supply design for active tags are involved. Experience finding can be utilized in the field of transportation for identification of vehicles, goods and other objects.
{"title":"Identification of fast-moving objects in frequency band 2.45 GHz","authors":"T. Blecha, J. Cengery, P. Kuberský, M. Kroupa","doi":"10.1109/ISSE.2012.6273166","DOIUrl":"https://doi.org/10.1109/ISSE.2012.6273166","url":null,"abstract":"This paper describes system design for the identification of the fast-moving objects based on RFID frequency band 2,45 GHz. Reasons for using this frequency band 2,45 GHz are here summarized. Literature survey of available systems using this frequency band was done. Active tag and reader for identification fast-moving objects have been designed. The antenna and power supply design for active tags are involved. Experience finding can be utilized in the field of transportation for identification of vehicles, goods and other objects.","PeriodicalId":277579,"journal":{"name":"2012 35th International Spring Seminar on Electronics Technology","volume":"57 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-05-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124826546","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2012-05-09DOI: 10.1109/ISSE.2012.6273151
J. Pulec, J. Somer
This article deals with thick film frequency filter design, its manufacturing and properties. The technology of thick-film is widely used in military or industrial, because of possibility to manufacture cost-effectively prototypes and small series [1]. The civil using includes railway transport, where this is the main part of communication modules (e.g. duplexers), where serves for splitting of transmitted and received signal [2]. This paper describes design for the thick-film manufacturing process and discusses the manufacturing possibilities.
{"title":"Planar thick film frequency filter design","authors":"J. Pulec, J. Somer","doi":"10.1109/ISSE.2012.6273151","DOIUrl":"https://doi.org/10.1109/ISSE.2012.6273151","url":null,"abstract":"This article deals with thick film frequency filter design, its manufacturing and properties. The technology of thick-film is widely used in military or industrial, because of possibility to manufacture cost-effectively prototypes and small series [1]. The civil using includes railway transport, where this is the main part of communication modules (e.g. duplexers), where serves for splitting of transmitted and received signal [2]. This paper describes design for the thick-film manufacturing process and discusses the manufacturing possibilities.","PeriodicalId":277579,"journal":{"name":"2012 35th International Spring Seminar on Electronics Technology","volume":"231 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-05-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114642869","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2012-05-09DOI: 10.1109/ISSE.2012.6273077
O. Oliinyk, B. Tsyganok, B. Serdega, I. Matiash
This paper is devoted to the principles of modulation-polarization microscopy applied to surface and volume structures of solid-state materials of electronics, photonics and bioelectronics. A new setup of modulation-polarization microscope is introduced; its main advantages are speed, interference immunity, high detectivity, cheapness and simplicity of implementation. Presented method and preliminary results confirm the usability of the new photoelastic microscope for research and development of MEMS devices; micro-nano control and processing of crystal, polymers and metals surfaces and transparent volumes.
{"title":"Application of photoelastic microscopy for researches in MEMS technology and photonics","authors":"O. Oliinyk, B. Tsyganok, B. Serdega, I. Matiash","doi":"10.1109/ISSE.2012.6273077","DOIUrl":"https://doi.org/10.1109/ISSE.2012.6273077","url":null,"abstract":"This paper is devoted to the principles of modulation-polarization microscopy applied to surface and volume structures of solid-state materials of electronics, photonics and bioelectronics. A new setup of modulation-polarization microscope is introduced; its main advantages are speed, interference immunity, high detectivity, cheapness and simplicity of implementation. Presented method and preliminary results confirm the usability of the new photoelastic microscope for research and development of MEMS devices; micro-nano control and processing of crystal, polymers and metals surfaces and transparent volumes.","PeriodicalId":277579,"journal":{"name":"2012 35th International Spring Seminar on Electronics Technology","volume":"115 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-05-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116870043","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2012-05-09DOI: 10.1109/ISSE.2012.6273144
H. Steiner, F. Keplinger, W. Hortschitz, M. Stifter
SU-8 is widely used as a material for sensors and actuators or as a bonding layer for microelectromechanical systems (MEMS). Therefore, its physical properties, such as the Young's modulus and the thermal expansion coefficient were broadly investigated. However, no reliable data can be found around 0°C. Therefore, the thermal expansion of the material in the temperature range of -30°C up to +30°C was examined. The thermal expansion was measured via the deflection of appropriate designed structures with the help of an optical microscope. A sealable chamber with a Peltier-element was built and utilized to control the temperature and the ambient atmosphere (N2). It was found, that SU-8 shrinks, when absorbed water vanishes due to an N2 purge. Additionally, the thermal expansion of the SU-8 exhibits a non linear behavior in the range from -20°C to +20°C.
{"title":"The non-linear thermal behavior of SU-8","authors":"H. Steiner, F. Keplinger, W. Hortschitz, M. Stifter","doi":"10.1109/ISSE.2012.6273144","DOIUrl":"https://doi.org/10.1109/ISSE.2012.6273144","url":null,"abstract":"SU-8 is widely used as a material for sensors and actuators or as a bonding layer for microelectromechanical systems (MEMS). Therefore, its physical properties, such as the Young's modulus and the thermal expansion coefficient were broadly investigated. However, no reliable data can be found around 0°C. Therefore, the thermal expansion of the material in the temperature range of -30°C up to +30°C was examined. The thermal expansion was measured via the deflection of appropriate designed structures with the help of an optical microscope. A sealable chamber with a Peltier-element was built and utilized to control the temperature and the ambient atmosphere (N2). It was found, that SU-8 shrinks, when absorbed water vanishes due to an N2 purge. Additionally, the thermal expansion of the SU-8 exhibits a non linear behavior in the range from -20°C to +20°C.","PeriodicalId":277579,"journal":{"name":"2012 35th International Spring Seminar on Electronics Technology","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-05-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129118682","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2012-05-09DOI: 10.1109/ISSE.2012.6273106
J. Freisleben, A. Hamácek, R. Vik, J. Černý, M. Kroupa, T. Džugan
This article deals with the research of singlet oxygen generation using phthalocyanine photosensitizer. Singlet oxygen is extraordinary reactive and can be used in many applications such as photodynamic therapy, disinfection or chemical synthesis. For singlet oxygen generation, the photosensitized method in a new developed generator based on LED emitters was used. The amount of singlet oxygen generated by LED emitters was compared with laser excitation. The principle of measurement, design of a singlet oxygen generator and control unit are discussed in more detail.
{"title":"Design of a singlet oxygen generator based on LED emitters","authors":"J. Freisleben, A. Hamácek, R. Vik, J. Černý, M. Kroupa, T. Džugan","doi":"10.1109/ISSE.2012.6273106","DOIUrl":"https://doi.org/10.1109/ISSE.2012.6273106","url":null,"abstract":"This article deals with the research of singlet oxygen generation using phthalocyanine photosensitizer. Singlet oxygen is extraordinary reactive and can be used in many applications such as photodynamic therapy, disinfection or chemical synthesis. For singlet oxygen generation, the photosensitized method in a new developed generator based on LED emitters was used. The amount of singlet oxygen generated by LED emitters was compared with laser excitation. The principle of measurement, design of a singlet oxygen generator and control unit are discussed in more detail.","PeriodicalId":277579,"journal":{"name":"2012 35th International Spring Seminar on Electronics Technology","volume":"45 14 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-05-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131368735","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2012-05-09DOI: 10.1109/ISSE.2012.6273074
V. Wirth, T. Blecha, L. Herc, L. Klocker, R. Linhart, K. Rendl, P. Sehnal, F. Steiner
This article deals with possibilities of the automatic testing of multimedia units. The aim of the work was to design and realize an automatic test system for a functional parameter measurement of multimedia units. The system was built up by the help of individual measuring devices and the designed multiplexer. The entire system is controlled by the control computer. For the control computer was necessary to create software to control and communicate with devices and multimedia unit itself. For making utility programs, the programming language Labview and Teststand software tool from National Instruments was chosen.
{"title":"Automatic testing of multimedia units","authors":"V. Wirth, T. Blecha, L. Herc, L. Klocker, R. Linhart, K. Rendl, P. Sehnal, F. Steiner","doi":"10.1109/ISSE.2012.6273074","DOIUrl":"https://doi.org/10.1109/ISSE.2012.6273074","url":null,"abstract":"This article deals with possibilities of the automatic testing of multimedia units. The aim of the work was to design and realize an automatic test system for a functional parameter measurement of multimedia units. The system was built up by the help of individual measuring devices and the designed multiplexer. The entire system is controlled by the control computer. For the control computer was necessary to create software to control and communicate with devices and multimedia unit itself. For making utility programs, the programming language Labview and Teststand software tool from National Instruments was chosen.","PeriodicalId":277579,"journal":{"name":"2012 35th International Spring Seminar on Electronics Technology","volume":"210 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-05-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124911632","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2012-05-09DOI: 10.1109/ISSE.2012.6273157
R. Schramm, A. Reinhardt, J. Franke
The present study aims to display new opportunities for flexible printed circuit boards (FPC) in electronic manufacturing by using biopolymers based on renewable materials as substrate material. Therefore, four different biopolymers, polyhydroxybutyrate (PHB), cellulose acetate (CA) and two different copolymers of polylactid acid and thermoplastic polyester elastomer (PLA+TPC), were processed with the standard process chain of the electronic manufacturing. Thereby, the main focus of attention was the thermal behavior during the hot embossing and reflow soldering in a vapor phase reflow soldering oven. Furthermore, manufactured FPCs were put in a temperature-humidity-test for 200 hours. The aim is to identify the weaknesses of current available biopolymers in order to improve future biopolymers for using in the electronic manufacturing.
{"title":"Capability of biopolymers in electronics manufacturing","authors":"R. Schramm, A. Reinhardt, J. Franke","doi":"10.1109/ISSE.2012.6273157","DOIUrl":"https://doi.org/10.1109/ISSE.2012.6273157","url":null,"abstract":"The present study aims to display new opportunities for flexible printed circuit boards (FPC) in electronic manufacturing by using biopolymers based on renewable materials as substrate material. Therefore, four different biopolymers, polyhydroxybutyrate (PHB), cellulose acetate (CA) and two different copolymers of polylactid acid and thermoplastic polyester elastomer (PLA+TPC), were processed with the standard process chain of the electronic manufacturing. Thereby, the main focus of attention was the thermal behavior during the hot embossing and reflow soldering in a vapor phase reflow soldering oven. Furthermore, manufactured FPCs were put in a temperature-humidity-test for 200 hours. The aim is to identify the weaknesses of current available biopolymers in order to improve future biopolymers for using in the electronic manufacturing.","PeriodicalId":277579,"journal":{"name":"2012 35th International Spring Seminar on Electronics Technology","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-05-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116271621","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2012-05-09DOI: 10.1109/ISSE.2012.6273116
P. Mashkov, B. Gyoch, S. Penchev, H. Beloev
In this work investigations are connected with development of method of LEDs' junctions' temperatures estimation at real operating conditions. Direct junction temperature determination is not possible and alternative methods have to be developed. Suitable, cheap and reliable method for direct estimation of LEDs' junction temperatures during operating of lighting equipment is proposed. It is realized by employing the temperature dependence of LEDs' forward voltage drop. Two different types of LEDs have been investigated at various ambient conditions (air temperatures from 20°C to 45°C) and different current values through LEDs - from 350 mA to 600 mA. Recommendations concerning calibrations, calculations and junctions' temperatures evaluations are presented. Developed method allows achieving of reliable results “in situ” for thermal performance of LEDs using non expensive experimental equipment.
{"title":"Method for in-situ power LEDs' junction temperature measurements","authors":"P. Mashkov, B. Gyoch, S. Penchev, H. Beloev","doi":"10.1109/ISSE.2012.6273116","DOIUrl":"https://doi.org/10.1109/ISSE.2012.6273116","url":null,"abstract":"In this work investigations are connected with development of method of LEDs' junctions' temperatures estimation at real operating conditions. Direct junction temperature determination is not possible and alternative methods have to be developed. Suitable, cheap and reliable method for direct estimation of LEDs' junction temperatures during operating of lighting equipment is proposed. It is realized by employing the temperature dependence of LEDs' forward voltage drop. Two different types of LEDs have been investigated at various ambient conditions (air temperatures from 20°C to 45°C) and different current values through LEDs - from 350 mA to 600 mA. Recommendations concerning calibrations, calculations and junctions' temperatures evaluations are presented. Developed method allows achieving of reliable results “in situ” for thermal performance of LEDs using non expensive experimental equipment.","PeriodicalId":277579,"journal":{"name":"2012 35th International Spring Seminar on Electronics Technology","volume":"12 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-05-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115787536","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2012-05-09DOI: 10.1109/ISSE.2012.6273162
M. Kościelski, K. Bukat, J. Sitek, M. Jakubowska, W. Niedźwiedź, A. Mlozniak
In the previous work we have been engaged in experiments of the solder paste consisting of nanoparticles of silver with different grain sizes, and also carbon nanotubes (CNT) before and after modification. The basic properties of the tested pastes were very promising. Here we would like to present our findings on mixed solder pastes that consist of silver nanopowder and modified CNT. Such mixtures have not been presented in the literature yet. In this article the results of basic tests such as slump, solder ball etc. as well as results of shear tests of solder joints will be presented.
{"title":"Sac 305 solder paste with silver nanopowder and carbon nanotubes addition - basic properties of pastes and solder joints","authors":"M. Kościelski, K. Bukat, J. Sitek, M. Jakubowska, W. Niedźwiedź, A. Mlozniak","doi":"10.1109/ISSE.2012.6273162","DOIUrl":"https://doi.org/10.1109/ISSE.2012.6273162","url":null,"abstract":"In the previous work we have been engaged in experiments of the solder paste consisting of nanoparticles of silver with different grain sizes, and also carbon nanotubes (CNT) before and after modification. The basic properties of the tested pastes were very promising. Here we would like to present our findings on mixed solder pastes that consist of silver nanopowder and modified CNT. Such mixtures have not been presented in the literature yet. In this article the results of basic tests such as slump, solder ball etc. as well as results of shear tests of solder joints will be presented.","PeriodicalId":277579,"journal":{"name":"2012 35th International Spring Seminar on Electronics Technology","volume":"45 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-05-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128322507","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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