Pub Date : 1987-06-01DOI: 10.1109/ARFTG.1987.323865
H. Burger, R.F. Windell
Conventional Computer-Aided Design (CAD) programs for stripline and rnicrostrip circuit design have only a few circuit models for junctions and discontinuities, and these are not accurate at frequencies and geometries where the junctions are distributed rather than lumped. Planar analysis can be used to study moderately complex junction and circuit shapes composed of distributed elements and the resulting S-parameters used by other programs in further analysis. This paper describes the procedure for performing a planar analysis, assuming that a computer program is available. This procedure is applied to the designs of an equal split power divider and a compensated ring hybrid as exarnples. The results are compared with designs made with lumped element junctions and with measured data. It is shown that plannar analysis can produce a more accurate circuit design in less time than previous methods, and that the calculated performance predictions are more accurate than current measurement practice can achieve.
{"title":"Improving Computer-Aided Design Accuracy with Planar Analysis Models of Junctions and Discontinuities","authors":"H. Burger, R.F. Windell","doi":"10.1109/ARFTG.1987.323865","DOIUrl":"https://doi.org/10.1109/ARFTG.1987.323865","url":null,"abstract":"Conventional Computer-Aided Design (CAD) programs for stripline and rnicrostrip circuit design have only a few circuit models for junctions and discontinuities, and these are not accurate at frequencies and geometries where the junctions are distributed rather than lumped. Planar analysis can be used to study moderately complex junction and circuit shapes composed of distributed elements and the resulting S-parameters used by other programs in further analysis. This paper describes the procedure for performing a planar analysis, assuming that a computer program is available. This procedure is applied to the designs of an equal split power divider and a compensated ring hybrid as exarnples. The results are compared with designs made with lumped element junctions and with measured data. It is shown that plannar analysis can produce a more accurate circuit design in less time than previous methods, and that the calculated performance predictions are more accurate than current measurement practice can achieve.","PeriodicalId":287736,"journal":{"name":"29th ARFTG Conference Digest","volume":"7 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1987-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124046375","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1987-06-01DOI: 10.1109/ARFTG.1987.323870
Donald J. Lanzinger
Literature on the subject of group delay variations due to transmission line impedance mismatches is scarce. This paper investigates the causes of impedance mismatches and their effects on the group delay of a wideband signal propagating through a system containing transmission lines between various subassemblies. Due to practical limitations, all subassemblies present non-ideal input and output impedance matches to the transmission lines connecting them together. Therefore, this produces the case of two impedance mismatches separated by a length of transmission line. This, in turn, causes sinusoidal group delay (as well as amplitude) variations to occur. There can also be multiple mismatches between a transmission line source and load due to components such as switches, power splitters, directional couplers, etc., inserted between the source and load. The periodic frequency of these sinusoidal group delay variations as well as their peak-to-valley amplitudes depend on the absolute magnitude of the reflection coefficients of the impedance mismatches, the electrical length of the transmission line between them, and the transmission loss of the transmission line. The group delay variations can cause significant signal distortion even with normally assumed sufficient values of voltage standing wave ratio (VSWR) at the input and output ports of the subassemblies. This paper presents various methods to predict the values of these group delay variations. In addition, practical compensation methods to reduce or eliminate the group delay variations are given.
{"title":"Group Delay Caused by Impedance Mismatch","authors":"Donald J. Lanzinger","doi":"10.1109/ARFTG.1987.323870","DOIUrl":"https://doi.org/10.1109/ARFTG.1987.323870","url":null,"abstract":"Literature on the subject of group delay variations due to transmission line impedance mismatches is scarce. This paper investigates the causes of impedance mismatches and their effects on the group delay of a wideband signal propagating through a system containing transmission lines between various subassemblies. Due to practical limitations, all subassemblies present non-ideal input and output impedance matches to the transmission lines connecting them together. Therefore, this produces the case of two impedance mismatches separated by a length of transmission line. This, in turn, causes sinusoidal group delay (as well as amplitude) variations to occur. There can also be multiple mismatches between a transmission line source and load due to components such as switches, power splitters, directional couplers, etc., inserted between the source and load. The periodic frequency of these sinusoidal group delay variations as well as their peak-to-valley amplitudes depend on the absolute magnitude of the reflection coefficients of the impedance mismatches, the electrical length of the transmission line between them, and the transmission loss of the transmission line. The group delay variations can cause significant signal distortion even with normally assumed sufficient values of voltage standing wave ratio (VSWR) at the input and output ports of the subassemblies. This paper presents various methods to predict the values of these group delay variations. In addition, practical compensation methods to reduce or eliminate the group delay variations are given.","PeriodicalId":287736,"journal":{"name":"29th ARFTG Conference Digest","volume":"49 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1987-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115202269","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1987-06-01DOI: 10.1109/ARFTG.1987.323860
M. Roos
So in summary, what EIP is offering in the modular measurement workstation is a way for design and test engineers to a) very cost-effectively configure a total measurement solution, not individual measurement instruments: b) tailor a measurement solution for a particular application and c) give customers a very good upgrade path to continue to enhance the system to meet emerging needs.
{"title":"Using Modularity to Improve Microwave Instrumentation","authors":"M. Roos","doi":"10.1109/ARFTG.1987.323860","DOIUrl":"https://doi.org/10.1109/ARFTG.1987.323860","url":null,"abstract":"So in summary, what EIP is offering in the modular measurement workstation is a way for design and test engineers to a) very cost-effectively configure a total measurement solution, not individual measurement instruments: b) tailor a measurement solution for a particular application and c) give customers a very good upgrade path to continue to enhance the system to meet emerging needs.","PeriodicalId":287736,"journal":{"name":"29th ARFTG Conference Digest","volume":"64 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1987-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131278568","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1987-06-01DOI: 10.1109/ARFTG.1987.323863
Bernhard Ziegnerr
An automated wafer level RF/DC test system useful to frequency above 20 GHz has been developed to characterize and determine acceptability of microwave semiconductor die prior to dicing the wafer. This concept has been implemented by the integration of a programmable wafer prober with both an automated DC and RF automatic network analyzer. The entire measurement is under computer control.
{"title":"Automated RF/DC Testing of Microwave Device Wafers","authors":"Bernhard Ziegnerr","doi":"10.1109/ARFTG.1987.323863","DOIUrl":"https://doi.org/10.1109/ARFTG.1987.323863","url":null,"abstract":"An automated wafer level RF/DC test system useful to frequency above 20 GHz has been developed to characterize and determine acceptability of microwave semiconductor die prior to dicing the wafer. This concept has been implemented by the integration of a programmable wafer prober with both an automated DC and RF automatic network analyzer. The entire measurement is under computer control.","PeriodicalId":287736,"journal":{"name":"29th ARFTG Conference Digest","volume":"6 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1987-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123905975","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1987-06-01DOI: 10.1109/ARFTG.1987.323855
R. Schwartz
I I I I I Many noise parameter test sets have been introduced during the past several years [ l]-[S]. The test set described in this paper emphasizes the features useful for automating this measurement. Specifically, the proposed test set utilizes a single digital input tuner; a mechanical tuner, which is inherently slow, is not required. This test set can also reference the measurement to the input of a transistor mounted on a carrier, measure noise parameters to high frequencies and be integrated inexpensively into a microwave test environment where a noise figure meter and vector network analyzer are present. The input tuner represents the only addition to this environment.
{"title":"Automated Noise Parameter Measurement Using a New De-Embedding. Algorithm","authors":"R. Schwartz","doi":"10.1109/ARFTG.1987.323855","DOIUrl":"https://doi.org/10.1109/ARFTG.1987.323855","url":null,"abstract":"I I I I I Many noise parameter test sets have been introduced during the past several years [ l]-[S]. The test set described in this paper emphasizes the features useful for automating this measurement. Specifically, the proposed test set utilizes a single digital input tuner; a mechanical tuner, which is inherently slow, is not required. This test set can also reference the measurement to the input of a transistor mounted on a carrier, measure noise parameters to high frequencies and be integrated inexpensively into a microwave test environment where a noise figure meter and vector network analyzer are present. The input tuner represents the only addition to this environment.","PeriodicalId":287736,"journal":{"name":"29th ARFTG Conference Digest","volume":"15 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1987-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115444176","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1987-06-01DOI: 10.1109/ARFTG.1987.323856
G. Nalder
{"title":"Data Acquisition and Baseband Analysis Techniques of the HP 3048A Phase Noise Measurement System","authors":"G. Nalder","doi":"10.1109/ARFTG.1987.323856","DOIUrl":"https://doi.org/10.1109/ARFTG.1987.323856","url":null,"abstract":"","PeriodicalId":287736,"journal":{"name":"29th ARFTG Conference Digest","volume":"244 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1987-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115606387","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1987-06-01DOI: 10.1109/ARFTG.1987.323867
M. Pierpoint, R. Pollard, J. Richardson
This paper reviews the most recent automated tuning techniques and comments on their respective advantages. The development of a simple model, capable of predicting the response of a slide-screw tuner from 45 MHz to 18 GHz, is described and compared with measurements of an existing tuner. The parameters affecting slide-screw tuner performance are identified with particular attention being paid to the slug. A tuning slug design is presented achieving optimum tuner performance over the 2 to 18 GHz frequency range.
{"title":"The Design and Modelling of Automated Broadband Slide-Screw Tuners","authors":"M. Pierpoint, R. Pollard, J. Richardson","doi":"10.1109/ARFTG.1987.323867","DOIUrl":"https://doi.org/10.1109/ARFTG.1987.323867","url":null,"abstract":"This paper reviews the most recent automated tuning techniques and comments on their respective advantages. The development of a simple model, capable of predicting the response of a slide-screw tuner from 45 MHz to 18 GHz, is described and compared with measurements of an existing tuner. The parameters affecting slide-screw tuner performance are identified with particular attention being paid to the slug. A tuning slug design is presented achieving optimum tuner performance over the 2 to 18 GHz frequency range.","PeriodicalId":287736,"journal":{"name":"29th ARFTG Conference Digest","volume":"44 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1987-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130040407","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1987-06-01DOI: 10.1109/ARFTG.1987.323866
D. Harvey
Currently most microwave measurements on GaAs wafers are made using RF probes which are calibrated to the probe tips. When a microstrip circuit or device needs to be measured, errors are introduced as a result of the transition from the coplanar probe tips to the microstrip line. In this paper an equivalent circuit of the transition to microstrip is presented. Knowing the characteristics of this transition, the S-parameters of monolithic microstrip circuits can be de-embedded from measured data. Comparisons of measured, theoretical, and de-embedded electrical characteristics are shown up to 26 GHz.
{"title":"A Lumped Coplanar to Microstrip Transition Model for De-Embedding S-Parameters Measured on GAAS Wafers","authors":"D. Harvey","doi":"10.1109/ARFTG.1987.323866","DOIUrl":"https://doi.org/10.1109/ARFTG.1987.323866","url":null,"abstract":"Currently most microwave measurements on GaAs wafers are made using RF probes which are calibrated to the probe tips. When a microstrip circuit or device needs to be measured, errors are introduced as a result of the transition from the coplanar probe tips to the microstrip line. In this paper an equivalent circuit of the transition to microstrip is presented. Knowing the characteristics of this transition, the S-parameters of monolithic microstrip circuits can be de-embedded from measured data. Comparisons of measured, theoretical, and de-embedded electrical characteristics are shown up to 26 GHz.","PeriodicalId":287736,"journal":{"name":"29th ARFTG Conference Digest","volume":"45 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1987-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121982986","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1987-06-01DOI: 10.1109/ARFTG.1987.323861
R. Pollard
The techniques for the calibration of a microwave network analyzer have been developed largely on the basis of the use of a number of devices (standards) to determine the terms of the system error model. This paper discusses techniques which employs only one component the properties of which determine the quality of the error corrected results. The component is an electrically short length of transmission line which, although theoretically desirable, is difficult to manufacture and connect. The paper describes the design and construction of such a structure and demonstrates its use in obtaining significantly improved error correction when used in conjunction with an HP 8510 network analyzer.
{"title":"Network Analyzer Calibration Using Short Lengths of Precision Transmission Line","authors":"R. Pollard","doi":"10.1109/ARFTG.1987.323861","DOIUrl":"https://doi.org/10.1109/ARFTG.1987.323861","url":null,"abstract":"The techniques for the calibration of a microwave network analyzer have been developed largely on the basis of the use of a number of devices (standards) to determine the terms of the system error model. This paper discusses techniques which employs only one component the properties of which determine the quality of the error corrected results. The component is an electrically short length of transmission line which, although theoretically desirable, is difficult to manufacture and connect. The paper describes the design and construction of such a structure and demonstrates its use in obtaining significantly improved error correction when used in conjunction with an HP 8510 network analyzer.","PeriodicalId":287736,"journal":{"name":"29th ARFTG Conference Digest","volume":"21 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1987-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123032874","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
京公网安备 11010802042870号
京ICP备2023020795号-1
扫码关注我们
求助内容：
应助结果提醒方式：