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GaAs IC Symposium. IEEE Gallium Arsenide Integrated Circuit Symposium. 19th Annual Technical Digest 1997最新文献

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W-CDMA: An approach toward next generation mobile radio system, IMT-2000 W-CDMA:下一代移动无线电系统IMT-2000的一种方法
Y. Furuya
This paper described the wideband CDMA (W-CDMA) system, which has been selected as a strong candidate for next generation cellular systems in Japan. The proposed system can satisfy IMT-2000 system requirement. Basic system performances were confirmed through the field test in Tokyo metropolitan area. Detailed specification work for W-CDMA system has started, since the system has been agreed to be feasible through the field test.
本文介绍了宽带CDMA (W-CDMA)系统,该系统已被选为日本下一代蜂窝系统的有力候选。该系统能够满足IMT-2000系统的要求。通过在东京市区的现场测试,确认了系统的基本性能。W-CDMA系统的详细规范工作已经开始,因为该系统已经通过现场测试被认为是可行的。
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引用次数: 1
Resonant tunneling circuit technology: has it arrived? 共振隧道电路技术:到来了吗?
A. Seabaugh, B. Brar, T. Broekaert, G. Frazier, F. Morris, E. Beam
A three-dimensional large-scale integration (LSI) process for fabrication of resonant tunneling diodes and heterojunction field-effect transistors on InP has been demonstrated, combining two of today's fastest semiconductor devices. Demonstrations of this technology now include multigigahertz digital and mixed-signal circuits and ultralow power SRAM circuits; 25 to 100 GHz circuits are clearly in range for this technology.
一种三维大规模集成(LSI)工艺,用于在InP上制造谐振隧道二极管和异质结场效应晶体管,结合了当今最快的两种半导体器件。该技术的演示现在包括多千兆赫数字和混合信号电路以及超低功耗SRAM电路;25到100 GHz的电路显然在这项技术的范围内。
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引用次数: 26
Effects of electrostatic discharge on GaAs-based HBTs 静电放电对gaas基HBTs的影响
T. Henderson
Short term and long term effects of electrostatic discharge (ESD) on GaAs-based HBTs are described. Both single-finger and multi-finger devices were tested, at ESD levels from 300 to 8000 V. Typically, devices subject to ESD show increasing levels of leakage current and/or decreased breakdown voltages. ESD effects on single and multi-finger devices are discussed, as well as the effects of ballasting. Finally, the results of long-term bias stress on ESD exposed devices is described.
介绍了静电放电(ESD)对gaas基HBTs的短期和长期影响。单指和多指设备都在300到8000 V的ESD水平下进行了测试。通常情况下,受ESD影响的器件显示泄漏电流水平增加和/或击穿电压降低。讨论了静电对单指和多指器件的影响,以及镇流器的影响。最后,描述了长期偏置应力对静电放电暴露器件的影响。
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引用次数: 9
Bandpass delta-sigma modulator with 800 MHz center frequency 带通δ - σ调制器与800mhz中心频率
A. Jayaraman, P. Asbeck, K. Nary, S. Beccue, Keh-Chung Wang
A fourth-order bandpass /spl Delta/-/spl Sigma/ modulator with center frequency of 800 MHz designed and fabricated in AlGaAs/GaAs heterojunction bipolar transistor (HBT) technology is reported. The modulator can be clocked at a continuum of frequencies from 2-4 GHz. Its performance was characterized at one convenient clock frequency, 3.2 GHz, since clocking the modulator at 4 times the center frequency allows for trivial extraction of in-phase and quadrature components of the bandpass signal in the digital domain. The 1-bit modulator output achieves a signal-to-noise ratio of 66 dB over a 100 kHz bandwidth and 41 dB over a 25 MHz bandwidth (which covers the entire cellular band).
采用AlGaAs/GaAs异质结双极晶体管(HBT)技术,设计制作了中心频率为800 MHz的四阶带通/spl Delta/-/spl Sigma/调制器。调制器可以在2-4千兆赫的连续频率上计时。它的性能特点是在一个方便的时钟频率,3.2 GHz,因为时钟调制器在中心频率的4倍,允许在数字域提取带通信号的同相和正交分量。1位调制器输出在100 kHz带宽上实现66 dB的信噪比,在25 MHz带宽(覆盖整个蜂窝频段)上实现41 dB的信噪比。
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引用次数: 43
GaAs MMICs for cellular broadband wireless infrastructure: a system perspective 用于蜂窝宽带无线基础设施的GaAs mmic:系统视角
C. Buck, P. Lombardelli, M. J. Pomeroy
Rather than describing a MMIC in detail, this paper focuses on some of the system level issues concerning the integration of MMICs. The system to be described is a MM-wave Broadband Wireless system and is a commercial system where cost plays a crucial role in its success. MMICs can provide a low cost solution but only if they are incorporated in the correct manner. Three aspects of integration are discussed: a suitable low cost transition from waveguide to the MMIC, a method of contacting the MMIC to the transition and low cost housing.
本文不是详细描述MMIC,而是着重于有关MMIC集成的一些系统级问题。所描述的系统是毫米波宽带无线系统,是一个商业系统,成本对其成功起着至关重要的作用。mmic可以提供低成本的解决方案,但前提是它们必须以正确的方式集成。讨论了集成的三个方面:从波导到MMIC的合适的低成本过渡,MMIC到过渡的连接方法和低成本外壳。
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引用次数: 0
A high performance GaAs MMIC upconverter with an automatic gain control amplifier 具有自动增益控制放大器的高性能GaAs MMIC上变频器
Huainan Ma, Sher Jiun Fang, Fujiang Lin, Khen-Sang Tan, J. Shibata, Atsushi Tamura, Hiroshi Nakamura
A newly developed GaAs MMIC upconverter with an automatic gain control (AGC) amplifier is presented. The circuit is to be used in a 1.9 GHz RF transceiver for the Japanese PHS applications. The features of the upconverter are: (1) on-chip 50 /spl Omega/ impedance matching for all AC input and output signals; (2) a double balanced Gilbert cell and a 2-stage AGC amplifier with matching circuits that provide 23 dB conversion gain, -39 dBc LO suppression, -23 dBc image suppression and 30 dB gain control; (3) Adjacent Channel Power (ACP) of -70 dBc; and (4) a die size of only 2.87 mm/sup 2/ (2.52 mm/spl times/1.14 mm).
介绍了一种新研制的带自动增益控制放大器的GaAs MMIC上变频器。该电路将用于日本小灵通应用的1.9 GHz射频收发器。上变频器的特点是:(1)片上50 /spl ω /阻抗匹配所有交流输入输出信号;(2)一个双平衡吉尔伯特单元和一个2级AGC放大器,其匹配电路提供23db转换增益、- 39dbc LO抑制、- 23dbc图像抑制和30db增益控制;(3)相邻通道功率(ACP) -70 dBc;(4)模具尺寸仅为2.87 mm/sup 2/ (2.52 mm/sup倍/1.14 mm)。
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引用次数: 9
Device technology of InP/InGaAs HBTs for 40-Gb/s optical transmission application 用于40gb /s光传输的InP/InGaAs HBTs器件技术
H. Masuda, K. Ouchi, A. Terano, H. Suzuki, K. Watanabe, T. Oka, H. Matsubara, T. Tanoue
Several techniques that enable high-yield fabrication of high-performance high-thermal-stability InP/InGaAs heterojunction bipolar transistors (HBTs) for use in 40-Gb/s ICs were developed. The T-shaped emitter electrode structure provides a simple fabrication process. A highly-C-doped base and a new Pt/Ti/Mo/Ti/Pt/Au metal system result in a thin base and low base resistance. An InP subcollector suppresses thermal runaway at high collector current. Using these techniques, an extremely high cutoff frequency f/sub T/ of 235 GHz was achieved for an HBT, along with a static 1/2 frequency divider operating up to 44 GHz.
开发了几种用于40gb /s集成电路的高性能高热稳定性InP/InGaAs异质结双极晶体管(HBTs)的高产能制造技术。t形发射极结构提供了一种简单的制造工艺。高碳掺杂基材和新型Pt/Ti/Mo/Ti/Pt/Au金属体系使基材薄,基材电阻低。InP副集电极抑制高集电极电流时的热失控。使用这些技术,HBT实现了235 GHz的极高截止频率f/sub /,以及高达44 GHz的静态1/2分频器。
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引用次数: 17
Millimeter-wave HBT MMIC synthesizers using subharmonically injection-locked oscillators 使用次谐波注入锁定振荡器的毫米波HBT MMIC合成器
E. Suematsu, M. Yagura, A. Yamada, K. Kishimoto, Yu Zhu, J. Twynam, K. Sakuno, T. Hasegawa, M. Hasegawa, H. Sato
A subharmonically injection-locked MMIC harmonic VCO for use as a synthesized local oscillator in the 60 GHz band has been experimentally investigated. The designs using HBT MMICs are based on the use of 2nd subharmonic injection locking of the harmonic VCOs to upconvert to millimeter-wave frequency and broaden the locking range. The use of the 4th harmonic signal from the VCOs allows a factor of eight increase in the locking range. The transmission type injection-locked MMIC VCO with the refractive type load circuit increases not only the locking range, but also the high-order harmonic output power in the locked VCO output.
实验研究了一种用于60ghz频段合成本振的次谐波注入锁定MMIC谐波压控振荡器。使用HBT mmic的设计是基于使用谐波压控振荡器的2次谐波注入锁定,上变频到毫米波频率,并扩大锁定范围。使用来自压控振荡器的四次谐波信号可以使锁定范围增加八倍。采用折光型负载电路的传输型注入锁相MMIC压控振荡器不仅增加了锁相范围,而且提高了锁相压控振荡器输出的高次谐波输出功率。
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引用次数: 8
A high speed and high precision 64/spl times/33 crosspoint switch IC 高速高精度64/spl次/33交点开关IC
R. Savarã
A monolithic 2.125GB/s per port 64/spl times/33 crosspoint switch IC has been designed, fabricated, and tested. A 0.6 um enhancement/depletion, recessed gate GaAs process was chosen for this product, which offers high speed devices with low power dissipation. The design used SCFL (Source Coupled FET Logic) standard cells for the switch matrix. All the data path signals use standard differential PECL input and output levels to maintain precision pulse width characteristics. The control signals, are in TTL levels. The high speed data inputs are DC biased allowing AC coupled operation. The switch offers non-blocking programming, and can be configured prior to enabling the outputs for synchronous reprogramming and operation from a single +5V supply.
设计、制造和测试了一个单片2.125GB/s /端口64/spl times/33交叉点开关IC。该产品选择了0.6 um增强/耗尽的嵌入式栅极GaAs工艺,可提供低功耗的高速器件。该设计使用SCFL(源耦合场效应管逻辑)标准单元作为开关矩阵。所有的数据路径信号使用标准差分PECL输入和输出电平,以保持精确的脉宽特性。控制信号,是在TTL电平。高速数据输入是直流偏置,允许交流耦合操作。该开关提供非阻塞编程,并且可以在启用输出之前进行配置,以便从单个+5V电源进行同步重新编程和操作。
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引用次数: 0
Radiation hardened complementary GaAs(CGaAs/sup TM/) 辐射硬化互补砷化镓(CGaAs/sup TM/)
M. LaMacchla, J. Abrokwah, B. Bernhardt, B. Crawforth, B. Mathes, T. McGuire, T. Weatherford
The addition of a low temperature GaAs (LTG) layer to the self-aligned complementary GaAs (CGaAs/sup TM/) HIGFET structure has reduced the SEU sensitivity while improving the short channel characteristics of the P-channel HIGFETs. Subthreshold leakage currents, gate leakage, and output conductances have been significantly reduced. Designs of 170 K transistor complexity have been demonstrated on CGaAs/sup TM/ wafers with the LTG layer.
在自向互补GaAs (CGaAs/sup TM/) HIGFET结构中加入低温GaAs (LTG)层降低了SEU灵敏度,同时改善了p沟道HIGFET的短沟道特性。亚阈值泄漏电流,栅极泄漏和输出电导已显著降低。已经在具有LTG层的CGaAs/sup TM/晶圆上演示了170 K晶体管复杂度的设计。
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引用次数: 1
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GaAs IC Symposium. IEEE Gallium Arsenide Integrated Circuit Symposium. 19th Annual Technical Digest 1997
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