Pub Date : 2015-05-26DOI: 10.1109/APEMC.2015.7175397
V. Tomasevic, A. Boyer, S. Ben Dhia
In order to merge low power and high voltage devices on the same chip at competitive cost, Smart Power integrated circuits (ICs) are extensively used. Electrical noise induced by power stage switching or external disturbances generates parasitic substrate currents, leading to a local shift of the substrate potential which can severely disturb low voltage circuits. Nowadays this is the major cause of failure of Smart Power ICs, inducing costly circuit redesign. Modern CAD tools cannot accurately simulate this injection of minority carriers in the substrate and their propagation in the substrate. In order to create a link between circuit design, modelling and implementation in innovative CAD tools there is a need to validate these models by measuring the high voltage perturbations that activate parasitic structures in the substrate directly on the chip. This paper presents an on-chip noise sensor dedicated to measurements of transient voltage fluctuations induced by high voltage activity and coupled by the substrate.
{"title":"Development of an on-chip sensor for substrate coupling study in Smart Power mixed ICs","authors":"V. Tomasevic, A. Boyer, S. Ben Dhia","doi":"10.1109/APEMC.2015.7175397","DOIUrl":"https://doi.org/10.1109/APEMC.2015.7175397","url":null,"abstract":"In order to merge low power and high voltage devices on the same chip at competitive cost, Smart Power integrated circuits (ICs) are extensively used. Electrical noise induced by power stage switching or external disturbances generates parasitic substrate currents, leading to a local shift of the substrate potential which can severely disturb low voltage circuits. Nowadays this is the major cause of failure of Smart Power ICs, inducing costly circuit redesign. Modern CAD tools cannot accurately simulate this injection of minority carriers in the substrate and their propagation in the substrate. In order to create a link between circuit design, modelling and implementation in innovative CAD tools there is a need to validate these models by measuring the high voltage perturbations that activate parasitic structures in the substrate directly on the chip. This paper presents an on-chip noise sensor dedicated to measurements of transient voltage fluctuations induced by high voltage activity and coupled by the substrate.","PeriodicalId":325138,"journal":{"name":"2015 Asia-Pacific Symposium on Electromagnetic Compatibility (APEMC)","volume":"20 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-05-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126463605","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2015-05-26DOI: 10.1109/APEMC.2015.7175346
Gang-Wei Cao, Yen-Tang Chang, Kwong-Kau Tiong, Han-Nien Lin
An off-board direct RF power injection (DPI) method using a probe is proposed to investigate the IC immunity. The details of the measurement setup are outlined in this works. We also reviewed the conventional DPI method in addition to a discussion on the limitation of the test printed circuit board. The 3 dB bandwidth of this proposed probe is confirmed. A low dropout regulator (LDO) is used to compare the performance of the on-board injection network and the proposed scheme. The experimental result shows that the maximum deviation of the immunity level is less than 1 dB between the conventional and the proposed method.
{"title":"Investigation of off-board DPI method","authors":"Gang-Wei Cao, Yen-Tang Chang, Kwong-Kau Tiong, Han-Nien Lin","doi":"10.1109/APEMC.2015.7175346","DOIUrl":"https://doi.org/10.1109/APEMC.2015.7175346","url":null,"abstract":"An off-board direct RF power injection (DPI) method using a probe is proposed to investigate the IC immunity. The details of the measurement setup are outlined in this works. We also reviewed the conventional DPI method in addition to a discussion on the limitation of the test printed circuit board. The 3 dB bandwidth of this proposed probe is confirmed. A low dropout regulator (LDO) is used to compare the performance of the on-board injection network and the proposed scheme. The experimental result shows that the maximum deviation of the immunity level is less than 1 dB between the conventional and the proposed method.","PeriodicalId":325138,"journal":{"name":"2015 Asia-Pacific Symposium on Electromagnetic Compatibility (APEMC)","volume":"32 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-05-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126616991","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2015-05-26DOI: 10.1109/APEMC.2015.7175395
Minkang Moon, Hongseok Kim, Jinwook Song, Y. Kwack, Dong-Hyun Kim, Beomshik Kim, Eulyong Kim, Joungho Kim
In this paper, the equivalent circuit model of the return paths of common mode electromagnetic interference (EMI) noise currents from the motor drive system (MDS) in hybrid electric vehicle (HEV) is proposed. The proposed model includes three kinds of the return current paths: braided shield of three-phase cable, metallic vehicle body and the parasitic capacitance between the vehicle components. In order to extract the equivalent lumped circuit parameters, both the electrostatic simulation and impedance measurements were used. The simulation result of the entire MDS of HEV including the proposed return current path model shows that the main path of common mode EMI noise current at AM radio frequency range is the braided shield of the three-phase motor cable.
{"title":"Modeling and analysis of return paths of common mode EMI noise currents from motor drive system in hybrid electric vehicle","authors":"Minkang Moon, Hongseok Kim, Jinwook Song, Y. Kwack, Dong-Hyun Kim, Beomshik Kim, Eulyong Kim, Joungho Kim","doi":"10.1109/APEMC.2015.7175395","DOIUrl":"https://doi.org/10.1109/APEMC.2015.7175395","url":null,"abstract":"In this paper, the equivalent circuit model of the return paths of common mode electromagnetic interference (EMI) noise currents from the motor drive system (MDS) in hybrid electric vehicle (HEV) is proposed. The proposed model includes three kinds of the return current paths: braided shield of three-phase cable, metallic vehicle body and the parasitic capacitance between the vehicle components. In order to extract the equivalent lumped circuit parameters, both the electrostatic simulation and impedance measurements were used. The simulation result of the entire MDS of HEV including the proposed return current path model shows that the main path of common mode EMI noise current at AM radio frequency range is the braided shield of the three-phase motor cable.","PeriodicalId":325138,"journal":{"name":"2015 Asia-Pacific Symposium on Electromagnetic Compatibility (APEMC)","volume":"42 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-05-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121264665","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2015-05-26DOI: 10.1109/APEMC.2015.7175384
M. Ng,, Yi-Hsin Pang
This paper presents a miniaturized four-port crossover consisting two cascaded branch-line couplers implemented by dual transmission lines. A dual transmission line is composed of two parallel-connected transmission lines with high impedance and different electrical lengths. This design has the advantage of circuit layout flexibility and size reduction. The electrical size is 21% reduced comparing with the size of a crossover utilized with two cascaded branch-line couplers.
{"title":"A miniaturized planar crossover using dual transmission lines","authors":"M. Ng,, Yi-Hsin Pang","doi":"10.1109/APEMC.2015.7175384","DOIUrl":"https://doi.org/10.1109/APEMC.2015.7175384","url":null,"abstract":"This paper presents a miniaturized four-port crossover consisting two cascaded branch-line couplers implemented by dual transmission lines. A dual transmission line is composed of two parallel-connected transmission lines with high impedance and different electrical lengths. This design has the advantage of circuit layout flexibility and size reduction. The electrical size is 21% reduced comparing with the size of a crossover utilized with two cascaded branch-line couplers.","PeriodicalId":325138,"journal":{"name":"2015 Asia-Pacific Symposium on Electromagnetic Compatibility (APEMC)","volume":"4 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-05-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132529000","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2015-05-26DOI: 10.1109/APEMC.2015.7175307
A. Krayni, A. Hadjem, A. Sibille, C. Roblin, J. Wiart
With the rapid development of technology and the easy access to wireless services, children become more and more addicted to wireless technologies and increasingly exposed to electromagnetic waves. This tendency is reflected in the large researches carried in the study of child's exposure, wherein also the present paper is inscribed. This study dedicated to investigate the exposure of child to the electromagnetic radiations emitted by some wireless devices. Firstly, we give an overview of the numerical tools used in the assessment of the exposure. Secondly, we present some results obtained with a heterogeneous child model. Finally, we discuss the statistical approaches dedicated to analyze the exposure variability in realistic wireless networks.
{"title":"Assessment methodologies of child exposure in realistic wireless contexts","authors":"A. Krayni, A. Hadjem, A. Sibille, C. Roblin, J. Wiart","doi":"10.1109/APEMC.2015.7175307","DOIUrl":"https://doi.org/10.1109/APEMC.2015.7175307","url":null,"abstract":"With the rapid development of technology and the easy access to wireless services, children become more and more addicted to wireless technologies and increasingly exposed to electromagnetic waves. This tendency is reflected in the large researches carried in the study of child's exposure, wherein also the present paper is inscribed. This study dedicated to investigate the exposure of child to the electromagnetic radiations emitted by some wireless devices. Firstly, we give an overview of the numerical tools used in the assessment of the exposure. Secondly, we present some results obtained with a heterogeneous child model. Finally, we discuss the statistical approaches dedicated to analyze the exposure variability in realistic wireless networks.","PeriodicalId":325138,"journal":{"name":"2015 Asia-Pacific Symposium on Electromagnetic Compatibility (APEMC)","volume":"261 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-05-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133497384","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2015-05-26DOI: 10.1109/APEMC.2015.7175325
Jongwoo Jeong, Jingook Kim, N. Kang, K. Han
In this paper, an indirect contact probing method is presented to characterize vertical interconnects. By adopting a dielectric contactor, the indirect contact probing protects interconnects from the direct-contact of probe tips. Also, the dielectric contactor improves the measurement sensitivity. Moreover, providing the constant gap of the contactor omits additional control and sensor electronics. The procedure for the proposed method starts with one-port calibration enabling the dielectric contactor between the probe pads and the device-under-tests (DUT) characterized. Next, the indirect-contact measurement on the DUT is conducted. The DUT is finally extracted from de-embedding the dielectric contactor layer. We extend the proposed method from a single pair of vias to multiple vias, and multi-port network extraction to obtain coupling between vias is also carried out. In simulations the proposed method for a single pair of vias characterizes the vias from 0.8 GHz to 30 GHz, and for multi-via testing and multi-port extraction from 0.8 GHz to around 25 GHz. We have verified all via defects can be successfully identified from the indirect contact probing method.
{"title":"Multi-port characterization of vias using indirect contact probing method","authors":"Jongwoo Jeong, Jingook Kim, N. Kang, K. Han","doi":"10.1109/APEMC.2015.7175325","DOIUrl":"https://doi.org/10.1109/APEMC.2015.7175325","url":null,"abstract":"In this paper, an indirect contact probing method is presented to characterize vertical interconnects. By adopting a dielectric contactor, the indirect contact probing protects interconnects from the direct-contact of probe tips. Also, the dielectric contactor improves the measurement sensitivity. Moreover, providing the constant gap of the contactor omits additional control and sensor electronics. The procedure for the proposed method starts with one-port calibration enabling the dielectric contactor between the probe pads and the device-under-tests (DUT) characterized. Next, the indirect-contact measurement on the DUT is conducted. The DUT is finally extracted from de-embedding the dielectric contactor layer. We extend the proposed method from a single pair of vias to multiple vias, and multi-port network extraction to obtain coupling between vias is also carried out. In simulations the proposed method for a single pair of vias characterizes the vias from 0.8 GHz to 30 GHz, and for multi-via testing and multi-port extraction from 0.8 GHz to around 25 GHz. We have verified all via defects can be successfully identified from the indirect contact probing method.","PeriodicalId":325138,"journal":{"name":"2015 Asia-Pacific Symposium on Electromagnetic Compatibility (APEMC)","volume":"46 3 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-05-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134613114","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2015-05-26DOI: 10.1109/APEMC.2015.7175253
Shih-Chi Lai, Chi-Ming Chiang, Chia-Lun Tang
A novel SAR (specific absorption rate) reduced solution for tablet application is presented in this paper. The proposed antenna is constructed an IFA (inverted-F antenna) with a shorted loop structure and easy realized for tablet device applications. The antenna radiators are printed on a single layer FR4 substrate with small size of 51.2 × 8.2 × 0.4 mm3 and fed by a RF coaxial cable with I-PEX connector. The proposed antenna can support triplet-bands (850/1900/2100) of WWAN communication system that covers 824~894 MHz, 1850~1990 MHz and 1920~2170 MHz and operate with minimum 40% radiation efficiency across these bands. The active performance TRP are measured about 28.5 dBm and 27.5 dBm in GRPS 850/1900 channels respectively, and about 19.5 and 21.5 dBm in both WCDMA band II and band V. The SAR performance of tablet back and tip side that we measured are less than 1.3 mW/g in low and high band which can meet FCC SAR limitation within 1.6 mW/g. All simulation data are simulated by SEMCAD EM software tool [1] and SAR test results are measured by DASY5 SAR equipment.
{"title":"SAR reduced antenna solution for tablet application","authors":"Shih-Chi Lai, Chi-Ming Chiang, Chia-Lun Tang","doi":"10.1109/APEMC.2015.7175253","DOIUrl":"https://doi.org/10.1109/APEMC.2015.7175253","url":null,"abstract":"A novel SAR (specific absorption rate) reduced solution for tablet application is presented in this paper. The proposed antenna is constructed an IFA (inverted-F antenna) with a shorted loop structure and easy realized for tablet device applications. The antenna radiators are printed on a single layer FR4 substrate with small size of 51.2 × 8.2 × 0.4 mm3 and fed by a RF coaxial cable with I-PEX connector. The proposed antenna can support triplet-bands (850/1900/2100) of WWAN communication system that covers 824~894 MHz, 1850~1990 MHz and 1920~2170 MHz and operate with minimum 40% radiation efficiency across these bands. The active performance TRP are measured about 28.5 dBm and 27.5 dBm in GRPS 850/1900 channels respectively, and about 19.5 and 21.5 dBm in both WCDMA band II and band V. The SAR performance of tablet back and tip side that we measured are less than 1.3 mW/g in low and high band which can meet FCC SAR limitation within 1.6 mW/g. All simulation data are simulated by SEMCAD EM software tool [1] and SAR test results are measured by DASY5 SAR equipment.","PeriodicalId":325138,"journal":{"name":"2015 Asia-Pacific Symposium on Electromagnetic Compatibility (APEMC)","volume":"39 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-05-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"117171105","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2015-05-26DOI: 10.1109/APEMC.2015.7175389
X. Gao, D. Su, Yujun Li
Electric Vehicle (EV) is driven by electromotor, whose power comes from vehicle power battery. The advantage of the EV is the mechanical simplicity of the drivetrain, but the electromagnetic interference (EMI) is a difficult problem to solve. This paper first describes the electromagnetic interference (EMI) phenomenon generated by one kind of DC/DC converter, Then analyses the reason of the EMI, and finally puts forward the design optimization direction of EMC from the vehicle.
{"title":"Study on electromagnetic interference of DC/DC converter used in the EV","authors":"X. Gao, D. Su, Yujun Li","doi":"10.1109/APEMC.2015.7175389","DOIUrl":"https://doi.org/10.1109/APEMC.2015.7175389","url":null,"abstract":"Electric Vehicle (EV) is driven by electromotor, whose power comes from vehicle power battery. The advantage of the EV is the mechanical simplicity of the drivetrain, but the electromagnetic interference (EMI) is a difficult problem to solve. This paper first describes the electromagnetic interference (EMI) phenomenon generated by one kind of DC/DC converter, Then analyses the reason of the EMI, and finally puts forward the design optimization direction of EMC from the vehicle.","PeriodicalId":325138,"journal":{"name":"2015 Asia-Pacific Symposium on Electromagnetic Compatibility (APEMC)","volume":"229 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-05-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116254085","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2015-05-26DOI: 10.1109/APEMC.2015.7175374
S. Cruciani, M. Feliziani, F. Maradei
The paper provides an investigation on the shielding effectiveness (SE) of graphene planar sheets and enclosures by a numerical tool. The finite element method-impedance network boundary conditions (FEM-INBC) method has been recently used to model planar graphene layers. Here, this method is applied to model complex geometries as two-dimensional enclosures with shaped graphene sheet walls.
{"title":"Prediction of shielding effectiveness in graphene enclosures by FEM-INBC method","authors":"S. Cruciani, M. Feliziani, F. Maradei","doi":"10.1109/APEMC.2015.7175374","DOIUrl":"https://doi.org/10.1109/APEMC.2015.7175374","url":null,"abstract":"The paper provides an investigation on the shielding effectiveness (SE) of graphene planar sheets and enclosures by a numerical tool. The finite element method-impedance network boundary conditions (FEM-INBC) method has been recently used to model planar graphene layers. Here, this method is applied to model complex geometries as two-dimensional enclosures with shaped graphene sheet walls.","PeriodicalId":325138,"journal":{"name":"2015 Asia-Pacific Symposium on Electromagnetic Compatibility (APEMC)","volume":"26 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-05-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123626683","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2015-05-26DOI: 10.1109/APEMC.2015.7175398
Xu Gao, Chunchun Sui, S. Hemmady, Joey Rivera, L. Andivahis, D. Pommerenke, D. Beetner
Integrated circuits (ICs) sometimes fail when their power supply is disrupted by external noise, such as might occur during an electrical fast transient (EFT). A delay model was proposed in [1] which can be used to predict the variations in the delays through logic circuits caused by electromagnetic induced noise in the power supply voltage. This model is relatively simple and requires few parameters, giving it the potential to be used even when the IC is a “black bos” and little information is available about the inner circuits. While design information might be approximated through testing, critical process characteristics may not be available which are needed for accurate results. The parameter of greatest concern is the velocity saturation index, since this parameter can exponentially increase the impact of power supply noise on delay. This paper describes an investigation of the sensitivity of the delay model in [1] to the velocity saturation index. Results indicate that the estimated delay, found while treating much of the circuit as a black box, is largely insensitive to the velocity saturation index. This result suggests that this model can be used effectively for prediction of electromagnetically-induced delay errors, even when limited process or circuit information is known.
{"title":"Predicting EMI induced delay errors in integrated circuits: Sensitivity to the velocity saturation index","authors":"Xu Gao, Chunchun Sui, S. Hemmady, Joey Rivera, L. Andivahis, D. Pommerenke, D. Beetner","doi":"10.1109/APEMC.2015.7175398","DOIUrl":"https://doi.org/10.1109/APEMC.2015.7175398","url":null,"abstract":"Integrated circuits (ICs) sometimes fail when their power supply is disrupted by external noise, such as might occur during an electrical fast transient (EFT). A delay model was proposed in [1] which can be used to predict the variations in the delays through logic circuits caused by electromagnetic induced noise in the power supply voltage. This model is relatively simple and requires few parameters, giving it the potential to be used even when the IC is a “black bos” and little information is available about the inner circuits. While design information might be approximated through testing, critical process characteristics may not be available which are needed for accurate results. The parameter of greatest concern is the velocity saturation index, since this parameter can exponentially increase the impact of power supply noise on delay. This paper describes an investigation of the sensitivity of the delay model in [1] to the velocity saturation index. Results indicate that the estimated delay, found while treating much of the circuit as a black box, is largely insensitive to the velocity saturation index. This result suggests that this model can be used effectively for prediction of electromagnetically-induced delay errors, even when limited process or circuit information is known.","PeriodicalId":325138,"journal":{"name":"2015 Asia-Pacific Symposium on Electromagnetic Compatibility (APEMC)","volume":"21 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-05-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121859395","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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