Pub Date : 2015-05-26DOI: 10.1109/APEMC.2015.7175260
I. Chen, C. Peng, Guan-Lin Chen
In this article, we present a novel printed microstrip antenna design for the RFID reader in UHF band applications. This antenna consists of a printed microstrip, surrounded ground and strip-line metal reflector, making it easy to combine directional, high gain, low cross-polarization and wide bandwidth. Reduction in patch size of up to 37% with respect to a traditional rectangular patch operating at the same frequency is obtained. The experimental results of the constructed prototype are presented.
{"title":"A novel reduced size microstrip antenna for RFID reader in UHF band applications","authors":"I. Chen, C. Peng, Guan-Lin Chen","doi":"10.1109/APEMC.2015.7175260","DOIUrl":"https://doi.org/10.1109/APEMC.2015.7175260","url":null,"abstract":"In this article, we present a novel printed microstrip antenna design for the RFID reader in UHF band applications. This antenna consists of a printed microstrip, surrounded ground and strip-line metal reflector, making it easy to combine directional, high gain, low cross-polarization and wide bandwidth. Reduction in patch size of up to 37% with respect to a traditional rectangular patch operating at the same frequency is obtained. The experimental results of the constructed prototype are presented.","PeriodicalId":325138,"journal":{"name":"2015 Asia-Pacific Symposium on Electromagnetic Compatibility (APEMC)","volume":"118 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-05-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123217762","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
This paper presents a microstrip line fed fractal slot antenna. Koch snowflake fractal slot are used as a resort to achieve bandwidth enhancement. By increasing the iteration order (IO), the bandwidth can be significantly broaden. Both simulation and measurement are consistent with this theory.
{"title":"Bandwidth enhancement of microstrip fed Koch snowflake fractal slot antenna","authors":"Chun-Te Wu, Wei-Zhe Dai, Cheng-Nan Chiu, Han-Chang Hsieh","doi":"10.1109/APEMC.2015.7175352","DOIUrl":"https://doi.org/10.1109/APEMC.2015.7175352","url":null,"abstract":"This paper presents a microstrip line fed fractal slot antenna. Koch snowflake fractal slot are used as a resort to achieve bandwidth enhancement. By increasing the iteration order (IO), the bandwidth can be significantly broaden. Both simulation and measurement are consistent with this theory.","PeriodicalId":325138,"journal":{"name":"2015 Asia-Pacific Symposium on Electromagnetic Compatibility (APEMC)","volume":"14 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-05-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131610320","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2015-05-26DOI: 10.1109/APEMC.2015.7175228
Yang Tian, Kokyan Lee, Hong Wang
The detailed process flow and the characteristic of an advanced on-wave Cu-based microcoaxial technology are discussed in this paper. The microcoaxial technology can be used to build advanced passives for microwave and mm-wave application on any type of substrate. And as the high speed and high power transistors is available for CMOS technology recently, the microcoaxial technology also provides a good opportunity for the development of Si-based MMIC for wideband and low loss microwave and mm-wave applications.
{"title":"An on-wafer Cu-based microcoaxial technology for wideband and low loss microwave and mm-wave applications","authors":"Yang Tian, Kokyan Lee, Hong Wang","doi":"10.1109/APEMC.2015.7175228","DOIUrl":"https://doi.org/10.1109/APEMC.2015.7175228","url":null,"abstract":"The detailed process flow and the characteristic of an advanced on-wave Cu-based microcoaxial technology are discussed in this paper. The microcoaxial technology can be used to build advanced passives for microwave and mm-wave application on any type of substrate. And as the high speed and high power transistors is available for CMOS technology recently, the microcoaxial technology also provides a good opportunity for the development of Si-based MMIC for wideband and low loss microwave and mm-wave applications.","PeriodicalId":325138,"journal":{"name":"2015 Asia-Pacific Symposium on Electromagnetic Compatibility (APEMC)","volume":"20 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-05-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126444533","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2015-05-26DOI: 10.1109/APEMC.2015.7175332
G. Spadacini, F. Grassi, S. Pignari
This paper demonstrates the feasibility of SPICE simulation in time-domain of the CISPR 25 test setup to predict the conducted emission phenomenon generated by the inverter in electric vehicles. This is made possible by suitable selection and integration of heterogeneous unit-level circuit models, separately developed and validated in the recent technical literature to represent functional and/or high-frequency phenomena involved in the operation of the battery, the inverter, and the permanent-magnet synchronous motor, as well as in the propagation of conducted noise along the shielded cables of the power bus.
{"title":"SPICE simulation in time-domain of the CISPR 25 test setup for conducted emissions in electric vehicles","authors":"G. Spadacini, F. Grassi, S. Pignari","doi":"10.1109/APEMC.2015.7175332","DOIUrl":"https://doi.org/10.1109/APEMC.2015.7175332","url":null,"abstract":"This paper demonstrates the feasibility of SPICE simulation in time-domain of the CISPR 25 test setup to predict the conducted emission phenomenon generated by the inverter in electric vehicles. This is made possible by suitable selection and integration of heterogeneous unit-level circuit models, separately developed and validated in the recent technical literature to represent functional and/or high-frequency phenomena involved in the operation of the battery, the inverter, and the permanent-magnet synchronous motor, as well as in the propagation of conducted noise along the shielded cables of the power bus.","PeriodicalId":325138,"journal":{"name":"2015 Asia-Pacific Symposium on Electromagnetic Compatibility (APEMC)","volume":"30 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-05-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131750369","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2015-05-26DOI: 10.1109/APEMC.2015.7175264
Xing-Ming Li, Shan-Qing Hu, K. See, Kangrong Li
In high-speed electrical designs, the in-circuit characteristics of the components are usually obtained from in-circuit measurements as the references for designers. The two-probe approach (TPA) is one of in-circuit measurement approaches by adopting the inductive coupling effects of the current probes, and it gains good accuracy below 30MHz. In this paper, we propose an improved two-probe approach (ITPA) by introducing network parameters. Rather than modeling the measurement setup using equivalent circuits in the TPA, the proposed ITPA models it by using a three-port network, and pre-calibrates it before real measurements. By comparing the results measured from ITPA with those from the impedance analyzer (IA), it is proven that, the ITPA extends the highest measurement frequency to 100MHz from 30MHz (with the TPA), while maintaining allowable accuracy; besides, the ITPA avoids the trial-error pre-calibrations required in the TPA.
{"title":"Improved two-probe approach for in-circuit measurement based on three-port network pre-calibration","authors":"Xing-Ming Li, Shan-Qing Hu, K. See, Kangrong Li","doi":"10.1109/APEMC.2015.7175264","DOIUrl":"https://doi.org/10.1109/APEMC.2015.7175264","url":null,"abstract":"In high-speed electrical designs, the in-circuit characteristics of the components are usually obtained from in-circuit measurements as the references for designers. The two-probe approach (TPA) is one of in-circuit measurement approaches by adopting the inductive coupling effects of the current probes, and it gains good accuracy below 30MHz. In this paper, we propose an improved two-probe approach (ITPA) by introducing network parameters. Rather than modeling the measurement setup using equivalent circuits in the TPA, the proposed ITPA models it by using a three-port network, and pre-calibrates it before real measurements. By comparing the results measured from ITPA with those from the impedance analyzer (IA), it is proven that, the ITPA extends the highest measurement frequency to 100MHz from 30MHz (with the TPA), while maintaining allowable accuracy; besides, the ITPA avoids the trial-error pre-calibrations required in the TPA.","PeriodicalId":325138,"journal":{"name":"2015 Asia-Pacific Symposium on Electromagnetic Compatibility (APEMC)","volume":"20 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-05-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131849714","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2015-05-26DOI: 10.1109/APEMC.2015.7175300
Y. Kayano, H. Inoue
In order to provide basic considerations for the realization of methods for suppressing the mode-conversion and EM radiation from differential-paired lines with length mismatch, the mode-conversion in bend differential-paired lines with different EM coupling was studied with FDTD modelling. It is demonstrated that the differential-paired line with thinner dielectric substrate which can maintain narrow width of trace, is suitable for improving the SI performance and suppressing the EMI.
{"title":"Characteristics of mode-conversion of bent differential-paired lines with different EM coupling","authors":"Y. Kayano, H. Inoue","doi":"10.1109/APEMC.2015.7175300","DOIUrl":"https://doi.org/10.1109/APEMC.2015.7175300","url":null,"abstract":"In order to provide basic considerations for the realization of methods for suppressing the mode-conversion and EM radiation from differential-paired lines with length mismatch, the mode-conversion in bend differential-paired lines with different EM coupling was studied with FDTD modelling. It is demonstrated that the differential-paired line with thinner dielectric substrate which can maintain narrow width of trace, is suitable for improving the SI performance and suppressing the EMI.","PeriodicalId":325138,"journal":{"name":"2015 Asia-Pacific Symposium on Electromagnetic Compatibility (APEMC)","volume":"34 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-05-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130603635","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2015-05-26DOI: 10.1109/APEMC.2015.7175399
F. Caignet, Rémi Bèges, P. Besse, J. Laine, N. Nolhier, M. Bafleur
With the increased number of embedded systems into our surrounding area, the electronic devices are exposed to more severe environments and have to survive ElectroStatic Discharges (ESD). Both hard and functional failures have to be guaranteed. In this paper, we will present the methodology we started to develop eight years ago to predict the impact of (ESD). Through two main examples, we will show that a behavioral modeling of the device can give good simulation results. The next step will be the implementation of failure criteria to predict both hard and functional robustness. This paper is a summary of the various results obtained.
{"title":"Hierarchical modeling approach for system level ESD analysis: From hard to functional failure","authors":"F. Caignet, Rémi Bèges, P. Besse, J. Laine, N. Nolhier, M. Bafleur","doi":"10.1109/APEMC.2015.7175399","DOIUrl":"https://doi.org/10.1109/APEMC.2015.7175399","url":null,"abstract":"With the increased number of embedded systems into our surrounding area, the electronic devices are exposed to more severe environments and have to survive ElectroStatic Discharges (ESD). Both hard and functional failures have to be guaranteed. In this paper, we will present the methodology we started to develop eight years ago to predict the impact of (ESD). Through two main examples, we will show that a behavioral modeling of the device can give good simulation results. The next step will be the implementation of failure criteria to predict both hard and functional robustness. This paper is a summary of the various results obtained.","PeriodicalId":325138,"journal":{"name":"2015 Asia-Pacific Symposium on Electromagnetic Compatibility (APEMC)","volume":"113 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-05-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133336683","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2015-05-26DOI: 10.1109/APEMC.2015.7175383
H. Chou, Kai-Hao Bai, Chien-Te Yu, Chun-Chin Sun, Yao-Jiu Chen, Ming-Yu Lee
This paper presents a new RFID reader antenna design with its radiation beam switchable to track the tags in in the near-zone of array aperture. The antenna is realized by using microstrip antenna array with a beam-forming network based on Butler matrix. The radiation of array is focused in the near zone to avoid interferences resulted from the scatterers in the vicinity of antenna. The design approach, numerical simulation and experimental measurement over an antenna prototype are presented to validate the feasibility.
{"title":"Beam-switchable phased array antennas for the near-field RFID applications","authors":"H. Chou, Kai-Hao Bai, Chien-Te Yu, Chun-Chin Sun, Yao-Jiu Chen, Ming-Yu Lee","doi":"10.1109/APEMC.2015.7175383","DOIUrl":"https://doi.org/10.1109/APEMC.2015.7175383","url":null,"abstract":"This paper presents a new RFID reader antenna design with its radiation beam switchable to track the tags in in the near-zone of array aperture. The antenna is realized by using microstrip antenna array with a beam-forming network based on Butler matrix. The radiation of array is focused in the near zone to avoid interferences resulted from the scatterers in the vicinity of antenna. The design approach, numerical simulation and experimental measurement over an antenna prototype are presented to validate the feasibility.","PeriodicalId":325138,"journal":{"name":"2015 Asia-Pacific Symposium on Electromagnetic Compatibility (APEMC)","volume":"209 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-05-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133350012","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2015-05-26DOI: 10.1109/APEMC.2015.7175284
Chun-Te Wu, P. Chu, Sung-Ling Hsiao, Cheng-Nan Chiu, Han-Chang Hsieh
A simplified closed-form equation for microstrip lines radiation is applied for calculating electromagnetic interference(EMI) problems on printed circuit board (PCB). Conventionally, radiation problems have to resort to full wave simulators. However, those methods always cause insufficient memory for calculating complicated structure. Even if one have enough memory, it is always time-consuming for calculating a simple structure, not to mention a whole complicated real case containing hundreds of microstrip lines and vias. This equation can be combined with two dimensional finite difference time domain methods and transmission line equation to calculate EMI of microstrip lines and vias including the effect of power ground bounce, and power ground plane resonance.
{"title":"An equation-based method for calculating electromagnetic interference on printed circuit board","authors":"Chun-Te Wu, P. Chu, Sung-Ling Hsiao, Cheng-Nan Chiu, Han-Chang Hsieh","doi":"10.1109/APEMC.2015.7175284","DOIUrl":"https://doi.org/10.1109/APEMC.2015.7175284","url":null,"abstract":"A simplified closed-form equation for microstrip lines radiation is applied for calculating electromagnetic interference(EMI) problems on printed circuit board (PCB). Conventionally, radiation problems have to resort to full wave simulators. However, those methods always cause insufficient memory for calculating complicated structure. Even if one have enough memory, it is always time-consuming for calculating a simple structure, not to mention a whole complicated real case containing hundreds of microstrip lines and vias. This equation can be combined with two dimensional finite difference time domain methods and transmission line equation to calculate EMI of microstrip lines and vias including the effect of power ground bounce, and power ground plane resonance.","PeriodicalId":325138,"journal":{"name":"2015 Asia-Pacific Symposium on Electromagnetic Compatibility (APEMC)","volume":"140 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-05-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133546849","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2015-05-26DOI: 10.1109/APEMC.2015.7175239
Xinjun Zhang, M. Wei, Weifeng Shu, Yinglei Ren
Equalization (EQ) tuning methodology and system validation strategy on cascaded re-drivers for 6Gbps SAS and SATA application are discussed in this paper. DOE (Design of Experiment) is applied in the EQ tuning process on the TX link for SATA Gen3 applications and on the RX link for these applications that the eye diagram inside the host silicon can be accessed. Eye diagram measurements are the primary choice of designers to know the design margin. For these designs whose eye diagram are not available, BER (Bit Error Rate) test has to be applied although it can't tell any design margin information with a positive BER report. It is a good practice to do BER test under four corners (high, low voltage and high, low temperature) and skew'ed silicon, a pass BER report in these corner cases can provide additional confidence on the system.
{"title":"Equalization tuning and system validation on cascaded re-drivers for 6Gbps storage applications","authors":"Xinjun Zhang, M. Wei, Weifeng Shu, Yinglei Ren","doi":"10.1109/APEMC.2015.7175239","DOIUrl":"https://doi.org/10.1109/APEMC.2015.7175239","url":null,"abstract":"Equalization (EQ) tuning methodology and system validation strategy on cascaded re-drivers for 6Gbps SAS and SATA application are discussed in this paper. DOE (Design of Experiment) is applied in the EQ tuning process on the TX link for SATA Gen3 applications and on the RX link for these applications that the eye diagram inside the host silicon can be accessed. Eye diagram measurements are the primary choice of designers to know the design margin. For these designs whose eye diagram are not available, BER (Bit Error Rate) test has to be applied although it can't tell any design margin information with a positive BER report. It is a good practice to do BER test under four corners (high, low voltage and high, low temperature) and skew'ed silicon, a pass BER report in these corner cases can provide additional confidence on the system.","PeriodicalId":325138,"journal":{"name":"2015 Asia-Pacific Symposium on Electromagnetic Compatibility (APEMC)","volume":"21 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-05-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133457655","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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