Pub Date : 2002-07-12DOI: 10.1109/IPFA.2002.1025631
Kin Leong, Y. Andrew, B. H. Lim, E. Chua, Y. K. Lim, Suat Cheng, Khoo Sherry
Wafer level Isothermal (ISOT) test is a highly accelerated test for interconnect electromigration (EM) evaluation, giving benefits of shorter test time and cost savings. Activation energy and physical failure modes of ISOT tests are determined for Copper (Cu) damascene lines. Comparisons are made with long term package level EM test in these aspects, emphasizing the important similarities. ISOT activation energy is consistent over a wide range of test temperatures studied and no significant influence of temperature gradients induced line failures is observed. KeywordsCopper, Isothermal, Electromigration
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