Vacuum hot-compression bonding (VHCB) technology exhibits irreplaceable advantages in manufacturing critical components of high-entropy alloys (HEAs). Although the bonding mechanism of the VHCB process has been widely investigated, its dependence on the initial grain size remains to be further clarified. The interfacial bonding behavior of CoCrFeMnNi HEA VHCB joints with different initial grain sizes was systematically investigated. The results indicate that the reduction in initial grain size, on the one hand, improves diffusion conditions of interfacial atomic, accelerating the dissolution of interfacial oxide particles, and on the other hand, enhances the kinetics of interfacial dynamic recrystallization and promotes the migration of interfacial grain boundaries (IGBs). The IGB migration process for fine-grained joints results from the combined effects of discontinuous dynamic recrystallization, twin-induced interfacial boundary migration, and triple junction transformation. In contrast, the elimination of IGBs in coarse-grained joints is mainly related to the evolution of discontinuous and continuous dynamic recrystallized grains. The mechanical analysis results demonstrate that the enhanced strengthening effects in the fine-grained joint not only improve the strength of the joint but also optimize its failure mode during fracture. The initial grain size changed from 149.6 μm to 7.8 μm, and the recovery rates of ultimate tensile strength and elongation of the joint increased from 88.6 % and 54.3 % to 102.2 % and 104.6 %, respectively, reflecting the gradual enhancement of the interfacial bonding quality.
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