Pub Date : 2017-05-01DOI: 10.1109/DTIP.2017.7984487
B. Plesz, G. Takács, P. Szabó, Z. Kohári, M. Németh, G. Bognár
The work presents a new solution proposal to the cooling of concentrator photovoltaic cells. In our concept the microscale channels are integrated into the back surface metallization, the microscale channels are formed by electroplating copper around a photoresist channel pattern. This approach has the advantage that it has no restrictions regarding the solar cell material and technology. In this work we give a description on the process technology, perform mechanical simulations for the feasibility of our approach, optimize the channel geometry for a 20 × 20 mm concentrator solar cell and estimate the cooling performance of the microscale channel structure at different operating conditions. We found, that the proposed cooling solution would have a calculated thermal resistance of 0.26 K/W at pressure drop of 100 kPa. This would result in a temperature raise of less than 8 K in case of a concentration level of 100 suns and a solar cell efficiency of 25 %.
{"title":"Integrated microscale cooling for concentrator solar cells","authors":"B. Plesz, G. Takács, P. Szabó, Z. Kohári, M. Németh, G. Bognár","doi":"10.1109/DTIP.2017.7984487","DOIUrl":"https://doi.org/10.1109/DTIP.2017.7984487","url":null,"abstract":"The work presents a new solution proposal to the cooling of concentrator photovoltaic cells. In our concept the microscale channels are integrated into the back surface metallization, the microscale channels are formed by electroplating copper around a photoresist channel pattern. This approach has the advantage that it has no restrictions regarding the solar cell material and technology. In this work we give a description on the process technology, perform mechanical simulations for the feasibility of our approach, optimize the channel geometry for a 20 × 20 mm concentrator solar cell and estimate the cooling performance of the microscale channel structure at different operating conditions. We found, that the proposed cooling solution would have a calculated thermal resistance of 0.26 K/W at pressure drop of 100 kPa. This would result in a temperature raise of less than 8 K in case of a concentration level of 100 suns and a solar cell efficiency of 25 %.","PeriodicalId":354534,"journal":{"name":"2017 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP)","volume":"56 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131232972","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2017-05-01DOI: 10.1109/DTIP.2017.7984492
A. Lucibello, G. Sardi, E. Proietti, R. Marcelli, G. Bartolucci
In this paper we present the methodology and the numerical results related to the analysis of aging of the SU-8 polymer when used as a primary layer for the realization of Coplanar Waveguide (CPW) structures. As test devices, we used a set of transmission lines with different lengths and T-shaped open stubs shunt resonators; by using these geometries, we are able to acquire the data in a broadband range, in principle between 1 GHz and 40 GHz. We conduct the analysis by comparing two different technology run: the first wafer with a deposited layer by a 12-year-old SU-8 and the second wafer, with the same photolithographed metallic geometries, with a brand-new processed SU-8 photoresist.
{"title":"Microwave broadband characterization of aging of SU-8 polymer as CPW substrate","authors":"A. Lucibello, G. Sardi, E. Proietti, R. Marcelli, G. Bartolucci","doi":"10.1109/DTIP.2017.7984492","DOIUrl":"https://doi.org/10.1109/DTIP.2017.7984492","url":null,"abstract":"In this paper we present the methodology and the numerical results related to the analysis of aging of the SU-8 polymer when used as a primary layer for the realization of Coplanar Waveguide (CPW) structures. As test devices, we used a set of transmission lines with different lengths and T-shaped open stubs shunt resonators; by using these geometries, we are able to acquire the data in a broadband range, in principle between 1 GHz and 40 GHz. We conduct the analysis by comparing two different technology run: the first wafer with a deposited layer by a 12-year-old SU-8 and the second wafer, with the same photolithographed metallic geometries, with a brand-new processed SU-8 photoresist.","PeriodicalId":354534,"journal":{"name":"2017 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP)","volume":"64 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114841662","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2017-05-01DOI: 10.1109/DTIP.2017.7984456
Miguel Diez Garcia, V. Raimbault, S. Joly, L. Oyhenart, L. Bilbao, C. Nguyên, I. Ledoux-Rak, L. Béchou, I. Obieta, C. Dejous
Thermal Ultraviolet NanoImprint Lithography is a fast and reliable process to manufacture large scale integrated polymer-based optical components from a soft stamp. This technology already provides polymer integrated components for optical communications operating in the infrared region. However, several fabrication issues must be addressed to enable reliable mass production of optical components working in the visible region, especially when patterning large devices with nanometric features. In this work, we report our fabrication results on grating coupler and optical microring resonators with SU-8 resist. The device is conceived for monomode visible wavelength operation dedicated to future optical sensing applications. For this purpose, sub-micron waveguides are needed. We reported two main defects on soft stamp fabrication: partial sidewall detachment and shifted or double embossing of the features. Nanoimprinting SU-8 waveguides was achieved with the operational devices of the soft stamp.
{"title":"Enabling patterning of polymer optical devices working at visible wavelength using thermal nano-imprint lithography","authors":"Miguel Diez Garcia, V. Raimbault, S. Joly, L. Oyhenart, L. Bilbao, C. Nguyên, I. Ledoux-Rak, L. Béchou, I. Obieta, C. Dejous","doi":"10.1109/DTIP.2017.7984456","DOIUrl":"https://doi.org/10.1109/DTIP.2017.7984456","url":null,"abstract":"Thermal Ultraviolet NanoImprint Lithography is a fast and reliable process to manufacture large scale integrated polymer-based optical components from a soft stamp. This technology already provides polymer integrated components for optical communications operating in the infrared region. However, several fabrication issues must be addressed to enable reliable mass production of optical components working in the visible region, especially when patterning large devices with nanometric features. In this work, we report our fabrication results on grating coupler and optical microring resonators with SU-8 resist. The device is conceived for monomode visible wavelength operation dedicated to future optical sensing applications. For this purpose, sub-micron waveguides are needed. We reported two main defects on soft stamp fabrication: partial sidewall detachment and shifted or double embossing of the features. Nanoimprinting SU-8 waveguides was achieved with the operational devices of the soft stamp.","PeriodicalId":354534,"journal":{"name":"2017 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP)","volume":"41 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131678250","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2017-05-01DOI: 10.1109/DTIP.2017.7984501
A. Somà, M. M. Saleem, B. Margesin
This paper presents the design, FEM modeling and experimental characterization of the elastic-plastic behavior of electroplated gold specimens undergoing tensile loading. The test structures are designed and optimized to achieve high stress values in the double-clamped specimen with a rectangular cross-section in the middle of the test structure. High stresses in the specimen are achieved by using electrostatic actuation to the plates, constrained using hinges. The range of electrostatic actuation is increased using bottom partial-plate electrodes on the substrate. The static deflection of the central specimen in the test structures under multiple loading cycles is obtained using experimental characterization and a change in the static pull-in voltage with each loading cycle is observed evaluating the permanent strain due to plasticity.
{"title":"Experimental characterization of elastic-plastic behavior of MEMS electroplated gold specimens","authors":"A. Somà, M. M. Saleem, B. Margesin","doi":"10.1109/DTIP.2017.7984501","DOIUrl":"https://doi.org/10.1109/DTIP.2017.7984501","url":null,"abstract":"This paper presents the design, FEM modeling and experimental characterization of the elastic-plastic behavior of electroplated gold specimens undergoing tensile loading. The test structures are designed and optimized to achieve high stress values in the double-clamped specimen with a rectangular cross-section in the middle of the test structure. High stresses in the specimen are achieved by using electrostatic actuation to the plates, constrained using hinges. The range of electrostatic actuation is increased using bottom partial-plate electrodes on the substrate. The static deflection of the central specimen in the test structures under multiple loading cycles is obtained using experimental characterization and a change in the static pull-in voltage with each loading cycle is observed evaluating the permanent strain due to plasticity.","PeriodicalId":354534,"journal":{"name":"2017 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134065561","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2017-05-01DOI: 10.1109/DTIP.2017.7984477
Meng Liu, Tie Li, Yuelin Wang
Field emission properties of SiC emitters with 14 nm gap between the cathode and anode are investigated here. With this nano gap, field emission can be turned on at 3V, which is much lower than that in previous works and comparable to that of CNT emitters. Its emission current follows the Fowler-Nordheim relationship and reaches up to 22.3nA at 5V. The influence of emitter width on field emission properties is also investigated here. With the decrease of emitter width, field emission from single SiC emitter is significantly enhanced. This work provides a path way to design and optimize field emission based vacuum devices working at low voltage.
{"title":"Extreme low voltage field emission of SiC nanowire","authors":"Meng Liu, Tie Li, Yuelin Wang","doi":"10.1109/DTIP.2017.7984477","DOIUrl":"https://doi.org/10.1109/DTIP.2017.7984477","url":null,"abstract":"Field emission properties of SiC emitters with 14 nm gap between the cathode and anode are investigated here. With this nano gap, field emission can be turned on at 3V, which is much lower than that in previous works and comparable to that of CNT emitters. Its emission current follows the Fowler-Nordheim relationship and reaches up to 22.3nA at 5V. The influence of emitter width on field emission properties is also investigated here. With the decrease of emitter width, field emission from single SiC emitter is significantly enhanced. This work provides a path way to design and optimize field emission based vacuum devices working at low voltage.","PeriodicalId":354534,"journal":{"name":"2017 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP)","volume":"714 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122017834","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2017-05-01DOI: 10.1109/DTIP.2017.7984473
M. Pustan, C. Bîrleanu, C. Dudescu, R. Chiorean, R. Muller, A. Baracu
This paper presents the fabrication and characterization of a mechanical microswitch structures for the out-of-the plane displacements. The mobile electrode is connected to the anchors through several rectangular hinges fabricated in different geometrical dimensions. The mechanical response of investigated switch structures depends on the number of hinges and their geometrical dimensions. The geometrical dimensions of hinges have a strong influence on the stiffness of mobile electrode. The scope of research work is to analyze the mechanical behavior microswitch structures in order to improve the accuracy in response and to increase the microdevice lifetime. The mechanical switch structures analyzed in this paper are fabricated by electron beam evaporation from aluminum, due to its adequate mechanical and electrical properties. Experimental tests are performed using an atomic force microscope. A mechanical force given by the bending deflection of an atomic force microscope probe and its stiffness is applied in the mid-position of the mobile electrode. The mobile electrode is deflected toward the substrate. The obtained experimental curve provides information about the stiffness of investigated structures. As the number of hinges increases, the stiffness of structures is increased. The stiffness has influence on the restoring force of mobile electrode from substrate after the acting signal is removed. The out-of-the plane switches can be monolithically integrated in radio frequency devices.
{"title":"Design, fabrication and characterization of RF MEMS switches with robust contact","authors":"M. Pustan, C. Bîrleanu, C. Dudescu, R. Chiorean, R. Muller, A. Baracu","doi":"10.1109/DTIP.2017.7984473","DOIUrl":"https://doi.org/10.1109/DTIP.2017.7984473","url":null,"abstract":"This paper presents the fabrication and characterization of a mechanical microswitch structures for the out-of-the plane displacements. The mobile electrode is connected to the anchors through several rectangular hinges fabricated in different geometrical dimensions. The mechanical response of investigated switch structures depends on the number of hinges and their geometrical dimensions. The geometrical dimensions of hinges have a strong influence on the stiffness of mobile electrode. The scope of research work is to analyze the mechanical behavior microswitch structures in order to improve the accuracy in response and to increase the microdevice lifetime. The mechanical switch structures analyzed in this paper are fabricated by electron beam evaporation from aluminum, due to its adequate mechanical and electrical properties. Experimental tests are performed using an atomic force microscope. A mechanical force given by the bending deflection of an atomic force microscope probe and its stiffness is applied in the mid-position of the mobile electrode. The mobile electrode is deflected toward the substrate. The obtained experimental curve provides information about the stiffness of investigated structures. As the number of hinges increases, the stiffness of structures is increased. The stiffness has influence on the restoring force of mobile electrode from substrate after the acting signal is removed. The out-of-the plane switches can be monolithically integrated in radio frequency devices.","PeriodicalId":354534,"journal":{"name":"2017 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP)","volume":"30 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124023671","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2017-05-01DOI: 10.1109/DTIP.2017.7984489
D. Hah, C. Je, Sungq Lee
Effects of substrate bending to the characteristics of capacitive miniaturized ultrasonic transducers (CMUTs) on a flexible substrate are studied through finite element analysis (FEA) for the design purpose. The target application of the devices is intravascular ultrasonography (IVUS) where transducers are brought to the proximity of the imaging targets so that high resolution images can be obtained without much concern of signal attenuation. In order to eliminate mechanical rotation used in the conventional IVUS, the transducer array can be manufactured on a flexible substrate and to wrap it around a cylindrical frame. It can be anticipated that the characteristics of the transducers will be altered by such bending of the substrate through geometrical dimension changes and stress induced. Pull-in voltages and resonant frequencies of CMUTs were studied via FEA for various bending radii and membrane thicknesses. It was found that both pull-in voltages and resonant frequencies become smaller for the transducers on a bent substrate compared to the ones on a flat substrate. It was also found that pull-in voltages decrease as the substrate bending radius is reduced.
{"title":"Design of capacitive micromachined ultrasonic transducers (CMUTs) on a flexible substrate for intravascular ultrasonography (IVUS) applications","authors":"D. Hah, C. Je, Sungq Lee","doi":"10.1109/DTIP.2017.7984489","DOIUrl":"https://doi.org/10.1109/DTIP.2017.7984489","url":null,"abstract":"Effects of substrate bending to the characteristics of capacitive miniaturized ultrasonic transducers (CMUTs) on a flexible substrate are studied through finite element analysis (FEA) for the design purpose. The target application of the devices is intravascular ultrasonography (IVUS) where transducers are brought to the proximity of the imaging targets so that high resolution images can be obtained without much concern of signal attenuation. In order to eliminate mechanical rotation used in the conventional IVUS, the transducer array can be manufactured on a flexible substrate and to wrap it around a cylindrical frame. It can be anticipated that the characteristics of the transducers will be altered by such bending of the substrate through geometrical dimension changes and stress induced. Pull-in voltages and resonant frequencies of CMUTs were studied via FEA for various bending radii and membrane thicknesses. It was found that both pull-in voltages and resonant frequencies become smaller for the transducers on a bent substrate compared to the ones on a flat substrate. It was also found that pull-in voltages decrease as the substrate bending radius is reduced.","PeriodicalId":354534,"journal":{"name":"2017 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP)","volume":"137 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122946723","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2017-05-01DOI: 10.1109/DTIP.2017.7984488
A. Farooq, P. Weitz, G. Evreinov, R. Raisamo, D. Takahata
In line with our previous work, this research focuses on enhancing touchscreen based interaction through stick-slip phenomena. By balancing inertial and frictional forces on a transparent screen overlay, we can control the resulting directional forces specific to multiple objects on a touchscreen surface. Using “stick-slip” phenomenon, we can associate tangible objects in relation to their virtual environment and adjust their behavior in real time without any stiff mechanical linkages. Our previous research shows the possible advantages of such a system (Stick-Slip Kinesthetic Display Surface) for a wide range of applications, such as continuous supervised input as well as novel applications with cross-environment interaction, where real-world physical objects can interact with their virtual counterparts and vice versa. However, to ensure that the directional forces are sufficient for these and other types of applications to serve as the system output, the mechanical actuation mechanism needs to be specifically designed for the particular novel use case. This research utilizes an electromagnetic setup to develop custom designed linear actuator which can increase the efficiency of the stick-slip based system. Our testing shows that the custom actuator is stable and more efficient at generating directional forces in the smart kinesthetic display surfaces (SKDS) as compared to actuators designed for conventional vibrotactile feedback.
{"title":"Developing actuation mechanism for stick-slip based intelligent mobile displays","authors":"A. Farooq, P. Weitz, G. Evreinov, R. Raisamo, D. Takahata","doi":"10.1109/DTIP.2017.7984488","DOIUrl":"https://doi.org/10.1109/DTIP.2017.7984488","url":null,"abstract":"In line with our previous work, this research focuses on enhancing touchscreen based interaction through stick-slip phenomena. By balancing inertial and frictional forces on a transparent screen overlay, we can control the resulting directional forces specific to multiple objects on a touchscreen surface. Using “stick-slip” phenomenon, we can associate tangible objects in relation to their virtual environment and adjust their behavior in real time without any stiff mechanical linkages. Our previous research shows the possible advantages of such a system (Stick-Slip Kinesthetic Display Surface) for a wide range of applications, such as continuous supervised input as well as novel applications with cross-environment interaction, where real-world physical objects can interact with their virtual counterparts and vice versa. However, to ensure that the directional forces are sufficient for these and other types of applications to serve as the system output, the mechanical actuation mechanism needs to be specifically designed for the particular novel use case. This research utilizes an electromagnetic setup to develop custom designed linear actuator which can increase the efficiency of the stick-slip based system. Our testing shows that the custom actuator is stable and more efficient at generating directional forces in the smart kinesthetic display surfaces (SKDS) as compared to actuators designed for conventional vibrotactile feedback.","PeriodicalId":354534,"journal":{"name":"2017 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP)","volume":"44 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130979187","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2017-05-01DOI: 10.1109/DTIP.2017.7984471
Xuesong Shang, Yang Li, Huan Liu, Takeshi Kobayashi, Dong F. Wang, T. Itoh, R. Maeda
A passive (power-less), bending type MEMS DC current sensor to satisfy the increasing needs of DC power supply for monitoring the electricity consumption by either one-wire or two-wire appliance cord was proposed in our past work (DTIP 2011). A MEMS-scale prototype DC sensor, comprised of 5 parallel PZT plates, was then micro-fabricated for preliminarily examination (DTIP 2012). A novel oscillating type MEMS DC current sensor, comprised of both actuating and sensing elements, was further proposed for two-wire DC electric appliances (DTIP2013). Then the ANSYS analytical model for the proposed cantilever-based device with integrating a micro-magnet was established and the frequency shifts due to the applied exterior magnetic field were preliminarily studied (DTIP2014). And a bending type MEMS-scale DC current sensor device with three parallel PZT partition plates, was fabricated for preliminary examination (DTIP2015). In present study, the relationship between magnetic induction and sensitivity of the proposed DC current sensor is discussed both analytically and experimentally. It can be found that the sensitivity increases with the increasing of the magnetic induction, approached by applying the different number of fixed magnets. And the effect of this approaching on the measurement accuracy will be discussed in the future.
{"title":"Developing MEMS DC electric current sensor for end-use monitoring of DC power supply: Part VI — Corresponding relationship between sensitivity and magnetic induction","authors":"Xuesong Shang, Yang Li, Huan Liu, Takeshi Kobayashi, Dong F. Wang, T. Itoh, R. Maeda","doi":"10.1109/DTIP.2017.7984471","DOIUrl":"https://doi.org/10.1109/DTIP.2017.7984471","url":null,"abstract":"A passive (power-less), bending type MEMS DC current sensor to satisfy the increasing needs of DC power supply for monitoring the electricity consumption by either one-wire or two-wire appliance cord was proposed in our past work (DTIP 2011). A MEMS-scale prototype DC sensor, comprised of 5 parallel PZT plates, was then micro-fabricated for preliminarily examination (DTIP 2012). A novel oscillating type MEMS DC current sensor, comprised of both actuating and sensing elements, was further proposed for two-wire DC electric appliances (DTIP2013). Then the ANSYS analytical model for the proposed cantilever-based device with integrating a micro-magnet was established and the frequency shifts due to the applied exterior magnetic field were preliminarily studied (DTIP2014). And a bending type MEMS-scale DC current sensor device with three parallel PZT partition plates, was fabricated for preliminary examination (DTIP2015). In present study, the relationship between magnetic induction and sensitivity of the proposed DC current sensor is discussed both analytically and experimentally. It can be found that the sensitivity increases with the increasing of the magnetic induction, approached by applying the different number of fixed magnets. And the effect of this approaching on the measurement accuracy will be discussed in the future.","PeriodicalId":354534,"journal":{"name":"2017 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP)","volume":"15 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126458501","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2017-05-01DOI: 10.1109/DTIP.2017.7984459
Gabriele Bosetti, J. Manz, G. Schrag, A. Dehé
This paper presents a system-level, physic-based compact model of a novel out-of-plane capacitive MEMS transducer based on a combination of plate- and comb-capacitor drives. Unlike conventional plate-capacitor-like transducers both electrodes of this novel device are movable. This feature results in a device dynamics analogous to a weakly coupled two-degree-of-freedom oscillator system. An analysis of the governing electro-mechanical and fluid-mechanical coupling effects is presented together with an analytical description of the dynamics of the coupled electrodes. The proposed model can be simulated with the help of standard circuit simulation software enabling both transient and small signal analysis. Dynamic measurements performed on prototype devices in a low-pressure environment are used to calibrate and validate the model. Sensitivity enhancement and resonance frequency shift due to electrostatic spring softening are self-consistently included in the model since the interaction among mechanical, electrical, and fluidic domain is implemented on a physical basis. The presented study provides accurate physical understanding of the device, which can be employed to analyze and improve the transducer characteristics. The energy-coupled and modular modeling approach enables the extension of the model to investigate the performance of the device under the impact of the surrounding atmosphere and the effects of device packaging.
{"title":"Modeling of an out-of-plane capacitive MEMS transducer with dynamically coupled electrodes","authors":"Gabriele Bosetti, J. Manz, G. Schrag, A. Dehé","doi":"10.1109/DTIP.2017.7984459","DOIUrl":"https://doi.org/10.1109/DTIP.2017.7984459","url":null,"abstract":"This paper presents a system-level, physic-based compact model of a novel out-of-plane capacitive MEMS transducer based on a combination of plate- and comb-capacitor drives. Unlike conventional plate-capacitor-like transducers both electrodes of this novel device are movable. This feature results in a device dynamics analogous to a weakly coupled two-degree-of-freedom oscillator system. An analysis of the governing electro-mechanical and fluid-mechanical coupling effects is presented together with an analytical description of the dynamics of the coupled electrodes. The proposed model can be simulated with the help of standard circuit simulation software enabling both transient and small signal analysis. Dynamic measurements performed on prototype devices in a low-pressure environment are used to calibrate and validate the model. Sensitivity enhancement and resonance frequency shift due to electrostatic spring softening are self-consistently included in the model since the interaction among mechanical, electrical, and fluidic domain is implemented on a physical basis. The presented study provides accurate physical understanding of the device, which can be employed to analyze and improve the transducer characteristics. The energy-coupled and modular modeling approach enables the extension of the model to investigate the performance of the device under the impact of the surrounding atmosphere and the effects of device packaging.","PeriodicalId":354534,"journal":{"name":"2017 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP)","volume":"19a 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128195348","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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