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2007 IEEE Radio Frequency Integrated Circuits (RFIC) Symposium最新文献

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65 nm HR SOI CMOS Technology: emergence of Millimeter-Wave SoC 65nm HR SOI CMOS技术:毫米波SoC的出现
Pub Date : 2007-06-03 DOI: 10.1109/RFIC.2007.380945
F. Gianesello, S. Montusclat, B. Martineau, D. Gloria, C. Raynaud, S. Boret, G. Dambrine, S. Lépilliet, R. Pilard
Today, measurement of 65 nm CMOS and 130 nm-based SiGe HBTs technologies demonstrate both Ftau (current gain cut-off frequency) and Fmax (maximum oscillation frequency) higher than 200 GHz, which are clearly comparable to advanced commercially available 100 nm III-V HEMT. Consequently, the integration of full transceiver at 60 GHz has been achieved both in SiGe bipolar and CMOS technology. In the same time passive circuits working at 220 GHz have been achieved and characterized on high resistivity SOI demonstrating state-of-the-art performances and good agreement with electrical simulations using developed models. Moreover, HR SOI has also demonstrated some advantages concerning the performances of integrated antennas and a first fully integrated prototype with amplifier, filter and antenna has already been achieved using STMicroelectronics 130 nm CMOS HR SOI technology. This paper will review the MMW performances of STMicrolectronics 65 nm CMOS HR SOI technology from device up to circuit level and discuss the opportunities of MMW SoC integrated on CMOS HR SOI technology.
目前,对65纳米CMOS和130纳米SiGe hbt技术的测量表明,Ftau(电流增益截止频率)和Fmax(最大振荡频率)均高于200 GHz,这显然可与先进的商用100纳米III-V HEMT相媲美。因此,在SiGe双极和CMOS技术下实现了60 GHz全收发器的集成。与此同时,工作在220 GHz的无源电路已经实现,并在高电阻率SOI上进行了表征,展示了最先进的性能,并且与使用开发模型进行的电气模拟非常吻合。此外,HR SOI在集成天线的性能方面也显示出一些优势,并且已经采用意法半导体(STMicroelectronics) 130 nm CMOS HR SOI技术实现了第一个放大器、滤波器和天线的完全集成原型。本文将从器件到电路层面回顾意法半导体65nm CMOS HR SOI技术的毫米波性能,并讨论集成在CMOS HR SOI技术上的毫米波SoC的机会。
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引用次数: 16
Double Cross Coupled Colpitts VCO with Low Phase Noise using InGaP/GaAs HBT Technology 采用InGaP/GaAs HBT技术的低相位噪声双交叉耦合Colpitts压控振荡器
Pub Date : 2007-06-03 DOI: 10.1109/RFIC.2007.380955
B. Shrestha, Nam-Young Kim
The proposed double cross-coupled differential Colpitts voltage controlled oscillator (VCO) is designed using InGaP/GaAs HBT technology for an adaptive feedback interference cancellation system (AF-ICS). In this paper, two switching transistors were used to steer the bias current and voltage in the VCO core, thereby saving power. The VCO achieves excellent phase noise characteristics of -135 dBc/Hz at 1 MHz offset from carrier frequency (1.630 GHz) when supplied with a control voltage of 0 V Also, its tuning range is around 218 MHz with an output power of -3.91 dBm (including cable loss). It shows the figure of merit (FoM) of -180.5 dBc/Hz. Two pairs of base-collector (BC) diodes are integrated in the tank circuit to increase the VCO tuning range. The optimized chip size is 0.9 mm x 0.9 mm.
采用InGaP/GaAs HBT技术设计了双交叉耦合差分科尔皮茨压控振荡器(VCO),用于自适应反馈干扰抵消系统(AF-ICS)。本文采用两个开关晶体管来控制压控振荡器核心中的偏置电流和电压,从而节省了功耗。当控制电压为0 V时,VCO在载波频率(1.630 GHz)偏移1 MHz时实现了出色的相位噪声特性-135 dBc/Hz,其调谐范围约为218 MHz,输出功率为-3.91 dBm(包括电缆损耗)。它显示了-180.5 dBc/Hz的质量因数(FoM)。在槽电路中集成了两对基极集电极(BC)二极管,以增加VCO调谐范围。优化后的芯片尺寸为0.9 mm × 0.9 mm。
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引用次数: 12
A Multi-band 900MHz/1.8GHz/5.2GHz LNA for Reconfigurable Radio 用于可重构无线电的多频段900MHz/1.8GHz/5.2GHz LNA
Pub Date : 2007-06-03 DOI: 10.1109/RFIC.2007.380835
V. Dao, Q. Bui, C. Park
A multi-band 900 MHz/1.8 GHz/5.2 GHz low noise amplifier (LNA) which can operate at mobile band of 900 MHz and 1.8 G and WLAN band of 5.2 GHz frequency is proposed. Input matching, noise matching and narrow gain are achieved at three frequency bands by adopting a switched output load and a resistive shunt-feedback circuit. The proposed LNA is designed in TSMC 0.18 um CMOS technology with a supply voltage of 1.8 V. The LNA has gains of 14 dB, 13 dB and 16 dB and noise figures of 2.3 dB, 2.9 dB and 2.7 dB at 900 MHz, 1.8 GHz and 5.2 GHz frequency bands, respectively, while dissipating power of 7.5 mW at all frequency bands.
提出了一种900 MHz/1.8 GHz/5.2 GHz多频段低噪声放大器(LNA),可以工作在900 MHz和1.8 G的移动频段和5.2 GHz的WLAN频段。采用开关输出负载和阻性分流反馈电路,在三个频带实现输入匹配、噪声匹配和窄增益。LNA采用台积电0.18 um CMOS技术设计,电源电压为1.8 V。该LNA在900 MHz、1.8 GHz和5.2 GHz频段的增益分别为14 dB、13 dB和16 dB,噪声系数分别为2.3 dB、2.9 dB和2.7 dB,所有频段的功耗均为7.5 mW。
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引用次数: 41
RF-MEMS based adaptive antenna matching module 基于RF-MEMS的自适应天线匹配模块
Pub Date : 2007-06-03 DOI: 10.1109/RFIC.2007.380949
Andre van Bezooijen1, Maurice de Jongh1, Christophe Chanlo1, Henk Lennart Ruijs1, Jan ten Dolle1, Pieter Lok1, Freek van Straten1, Jack Sneep2, Reza Mahmoudi3, Arthur H.M. van Roermund3
To preserve the link quality, in fluctuating operating environments, an adaptive antenna matching module is presented that consists of a 5-bit RF-MEMS switched capacitor array, a bipolar 60/30 V MEMS-biasing voltage generator for improved reliability, and an impedance phase detector that provides information on mismatch. It uses an iterative up-down counting algorithm for robust control. Measurements show proper correction of the antenna reactance, even for a VSWR of 10. The switched capacitor array exhibits a large tuning range from 1 to 15 pF and an insertion loss of 0.4 dB. The detector dynamic range equals 35 dB with an accuracy of 8 degrees from 0.8 to 2 GHz. Adaptive matching will make isolators redundant.
为了在波动的工作环境中保持链路质量,提出了一种自适应天线匹配模块,该模块由一个5位RF-MEMS开关电容阵列、一个双极60/30 V mems偏置电压发生器(用于提高可靠性)和一个阻抗相位检测器(提供失配信息)组成。采用迭代上下计数算法进行鲁棒控制。测量结果表明,即使在10的驻波比下,天线电抗也有适当的校正。该开关电容阵列具有1至15pf的大调谐范围和0.4 dB的插入损耗。该探测器动态范围为35 dB,精度为8度,范围为0.8至2 GHz。自适应匹配将使隔离器冗余。
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引用次数: 26
A 0.5 V Receiver in 90 nm CMOS for 2.4 GHz Applications 用于2.4 GHz应用的90nm CMOS 0.5 V接收器
Pub Date : 2007-06-03 DOI: 10.1109/RFIC.2007.380844
N. Stanic, A. Balankutty, P. Kinget, Y. Tsividis
We report an ultra-low voltage RF receiver for applications in the 2.4 GHz band, designed in a 90 nm CMOS technology. The sliding-IF receiver prototype includes an LNA, an image-reject LC filter with single-ended to differential conversion, an RF mixer, an LC IF filter, a quadrature IF mixer, RF and IF LO buffers, and an I/Q baseband section with a VGA and a low-pass channel-select filter in each path, all integrated on-chip. It has a programmable overall gain of 30 dB, noise figure of 18 dB, out-of-channel IIP3 of -22 dBm, and 26 dB of on-chip image rejection. The 3.4 mm2 chip consumes 8.5 mW from a 0.5 V supply.
我们报告了一种应用于2.4 GHz频段的超低电压射频接收器,采用90nm CMOS技术设计。滑动中频接收器原型包括一个LNA,一个带单端到差分转换的图像抑制LC滤波器,一个RF混频器,一个LC中频滤波器,一个正交中频混频器,RF和中频LO缓冲器,以及一个带VGA和低通通道选择滤波器的I/Q基带部分,所有这些都集成在片上。它的可编程总增益为30 dB,噪声系数为18 dB,通道外IIP3为-22 dBm,片上图像抑制为26 dB。3.4 mm2的芯片从0.5 V电源消耗8.5 mW。
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引用次数: 12
Performance and Yield Optimization of mm-Wave PLL Front-End in 65nm SOI CMOS 65nm SOI CMOS毫米波锁相环前端性能及良率优化
Pub Date : 2007-06-03 DOI: 10.1109/RFIC.2007.380938
D. Lim, Jonghae Kim, J. Plouchart, Daeik D. Kim, Choongyeun Cho, D. Boning
A combination of LC-VCO and 2:1 CML static frequency divider has been fabricated in 65 nm SOI CMOS technology and operates at 70 GHz. A cascoded buffer amplifier is used in VCO-to-divider connection to compensate for the power losses caused by interconnect parasitics, and inductive peaking is employed for bandwidth enhancement. The bias condition of the frequency divider has been tuned to find an optimal bias point in existence of VCO and frequency divider operating range variation. The inter-die variation of VCO and divider performance variations over a wafer and their correlation have been estimated.
LC-VCO和2:1 CML静态分频器的组合采用65 nm SOI CMOS技术制造,工作频率为70 GHz。在vco -分压器连接中使用级联编码缓冲放大器来补偿互连寄生造成的功率损失,并使用感应峰值来增强带宽。对分频器的偏置条件进行了调整,在存在压控振荡器和分频器工作范围变化的情况下,找到了最优偏置点。在晶圆上估计了压控振荡器的芯片间变化和分频器性能的变化及其相关性。
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引用次数: 4
A 2.4 to 5.4 GHz Low Power CMOS Reconfigurable LNA for Multistandard Wireless Receiver 用于多标准无线接收机的2.4 ~ 5.4 GHz低功耗CMOS可重构LNA
Pub Date : 2007-06-03 DOI: 10.1109/RFIC.2007.380834
C. Fu, Chun-Lin Ko, C. Kuo
A CMOS reconfigurable LNA is reported. By combination of switched inductors and varactors it performs continuous frequency tuning from 2.4 to 5.4 GHz with 500 MHz 3 dB-bandwidth. Switching transistor is used to provide variable gain control over a 12 dB-range. The LNA supports standards including Bluetooth, WiMAX, UWB mode-1, 802.11 b/g and part of 802.11a. Fabricated in 0.13 um CMOS process the LNA achieves up to 25 dB power gain, 2.2 dB noise figure, -1 dBm IIP3 while consuming less than 5 mW from 1-V power supply.
报道了一种CMOS可重构LNA。通过开关电感和变容管的组合,它以500 MHz 3db带宽执行2.4至5.4 GHz的连续频率调谐。开关晶体管用于在12db范围内提供可变增益控制。LNA支持蓝牙、WiMAX、UWB mode-1、802.11 b/g和部分802.11a标准。LNA采用0.13 um CMOS工艺制造,可实现高达25 dB的功率增益,2.2 dB的噪声系数,-1 dBm的IIP3,同时从1 v电源消耗不到5 mW。
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引用次数: 35
A Low-Loss Compact Linear Varactor Based Phase-Shifter 一种低损耗紧凑型线性变容管移相器
Pub Date : 2007-06-03 DOI: 10.1109/RFIC.2007.380922
J. Qureshi, S. Kim, K. Buisman, C. Huang, M. Pelk, A. Akhnoukh, L. Larson, L. Nanver, L. D. de Vreede
Design trade-offs are presented for varactor-based variable phase-shifters in terms of size, tuning range, bandwidth/phase linearity and large-signal performance. Based on this study, a compact, low-loss (0.6dB/90deg @ 1.0 GHz), wideband and extremely linear varactor-based phase shifter is presented.
在尺寸、调谐范围、带宽/相位线性度和大信号性能方面,提出了基于变容的可变移相器的设计权衡。在此基础上,提出了一种紧凑、低损耗(0.6dB/90°@ 1.0 GHz)、宽带、极线性变容的移相器。
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引用次数: 17
A High Dynamic Range CMOS RF Power Amplifier with a Switchable Transformer for Polar Transmitters 一种高动态范围CMOS射频功率放大器,带可切换变压器,用于极性发射机
Pub Date : 2007-06-03 DOI: 10.1109/RFIC.2007.380988
Younsuk Kim, B. Ku, Changkun Park, Dong Ho Lee, Songcheol Hong
A fully integrated CMOS RF power amplifier for a 1.8 GHz band EDGE polar transmitter is presented. It is implemented with 0.18-mum CMOS process. The output power is 33.4 ~ 33.5 dBm and the power added efficiency is 39 ~ 41 percent when the frequency varies from 1.71 to 1.91 GHz. The dynamic range is increased by 12 dB with the use of the proposed switchable transformer, which meets the EDGE dynamic range requirement of 37 dB when the supply voltage changes from 0.8 to 3.3 V.
提出了一种用于1.8 GHz频段EDGE极性发射机的全集成CMOS射频功率放大器。采用0.18 μ m CMOS工艺实现。当频率在1.71 ~ 1.91 GHz范围内变化时,输出功率为33.4 ~ 33.5 dBm,功率增加效率为39% ~ 41%。当电源电压从0.8 V变化到3.3 V时,动态范围增加了12 dB,满足EDGE动态范围37 dB的要求。
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引用次数: 9
Ka-Band Low-Loss and High-Isolation 0.13 /spl mu/m CMOS SPST/SPDT Switches Using High Substrate Resistance 使用高衬底电阻的ka波段低损耗和高隔离0.13 /spl μ m CMOS SPST/SPDT开关
Pub Date : 2007-06-03 DOI: 10.1109/RFIC.2007.380948
Byung-Wook Min, Gabriel M. Rebeiz
This paper presents 35 GHz single-pole-single-throw (SPST) and single-pole-double-throw (SPDT) CMOS switches using a 0.13 mum BiCMOS process (IBM 8 HP). The CMOS transistors are designed to have a high substrate resistance to minimize the insertion loss and improve power handling capability. The SPST/SPDT switches have a insertion loss of 1.8 dB/2.2 dB, respectively, and an input 1-dB compression point (P1 dB) greater than 22 dBm. The isolation is greater than 30 dB at 35-40 GHz and is achieved using two parallel resonant networks. To our knowledge, this is the first demonstration of low-loss, high-isolation CMOS switches at Ka-band frequencies.
本文介绍了35 GHz单极单掷(SPST)和单极双掷(SPDT) CMOS开关,采用0.13 mum BiCMOS工艺(IBM 8 HP)。CMOS晶体管被设计成具有高衬底电阻,以最小化插入损耗并提高功率处理能力。SPST/SPDT开关的插入损耗分别为1.8 dB/2.2 dB,输入1-dB压缩点(P1 dB)大于22 dBm。在35-40 GHz时,隔离度大于30 dB,并使用两个并联谐振网络实现。据我们所知,这是在ka波段频率下首次演示低损耗,高隔离的CMOS开关。
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引用次数: 24
期刊
2007 IEEE Radio Frequency Integrated Circuits (RFIC) Symposium
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