Pub Date : 2014-11-01DOI: 10.1109/ICSJ.2014.7009602
S. Xi, T. Shi, Xiaoping Li, Zirong Tang
Randomly distributed silica nanowires show highly reflectivity in the whole visible wavelength, which can be used as white light coating for high-efficiency optoelectronic packaging as affirmed by our previous work. In this work, an improved process has been developed to recombine the silica nanowires as optical coating of LED reflector cup to form diffusive reflecting surface in LED packaging. This recombination was realized through two-step process: the synthesized silica nanowires were first dispersed in distilled water via artful magnetic stirring and then absorbed on specular surface by Van der Waals' force. This work provides an alternative and low-cost method for the improvement of lighting systems.
{"title":"Silica nanowires as new coating material for high-efficiency light reflection in LED system","authors":"S. Xi, T. Shi, Xiaoping Li, Zirong Tang","doi":"10.1109/ICSJ.2014.7009602","DOIUrl":"https://doi.org/10.1109/ICSJ.2014.7009602","url":null,"abstract":"Randomly distributed silica nanowires show highly reflectivity in the whole visible wavelength, which can be used as white light coating for high-efficiency optoelectronic packaging as affirmed by our previous work. In this work, an improved process has been developed to recombine the silica nanowires as optical coating of LED reflector cup to form diffusive reflecting surface in LED packaging. This recombination was realized through two-step process: the synthesized silica nanowires were first dispersed in distilled water via artful magnetic stirring and then absorbed on specular surface by Van der Waals' force. This work provides an alternative and low-cost method for the improvement of lighting systems.","PeriodicalId":362502,"journal":{"name":"IEEE CPMT Symposium Japan 2014","volume":"12 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130366225","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2014-11-01DOI: 10.1109/ICSJ.2014.7009618
Hsiang-Han Hsu, S. Nakagawa
Sources of loss occurred in optical MCM (multi-chip module) based optical link is investigated by simulations. An optical MCM is composed of an organic substrate, polymer waveguides, optochips, and connectors. In an optical link, two optical MCMs played as data transmitter (TX) and receiver (RX) are connected by a multimode fiber (MMF). Polymer waveguides are laminated and optochips are flip chip bonded on the organic substrate. At the entrance and end of each waveguide, there are a pair of turning mirrors. In TX, the light is emitted by a vertical-cavity surface-emitting laser (VCSEL) and then go through the upper cladding layer. After reflected by a turning mirror the light propagates along a 1-cm long straight polymer waveguide. At the waveguide end, light is reflected again and propagate toward a MMF. Coupling between waveguide and MMF is realized by a double lens connector. In RX, light comes from the MMF and propagates as similar way, and is collected by a photo diode (PD). The total link loss includes loss caused by turning mirror roughness is about 5 dB. This helps us to optimize link design for dense aligned high-speed optical MCM link system.
{"title":"Loss analysis for optical MCM based optical link","authors":"Hsiang-Han Hsu, S. Nakagawa","doi":"10.1109/ICSJ.2014.7009618","DOIUrl":"https://doi.org/10.1109/ICSJ.2014.7009618","url":null,"abstract":"Sources of loss occurred in optical MCM (multi-chip module) based optical link is investigated by simulations. An optical MCM is composed of an organic substrate, polymer waveguides, optochips, and connectors. In an optical link, two optical MCMs played as data transmitter (TX) and receiver (RX) are connected by a multimode fiber (MMF). Polymer waveguides are laminated and optochips are flip chip bonded on the organic substrate. At the entrance and end of each waveguide, there are a pair of turning mirrors. In TX, the light is emitted by a vertical-cavity surface-emitting laser (VCSEL) and then go through the upper cladding layer. After reflected by a turning mirror the light propagates along a 1-cm long straight polymer waveguide. At the waveguide end, light is reflected again and propagate toward a MMF. Coupling between waveguide and MMF is realized by a double lens connector. In RX, light comes from the MMF and propagates as similar way, and is collected by a photo diode (PD). The total link loss includes loss caused by turning mirror roughness is about 5 dB. This helps us to optimize link design for dense aligned high-speed optical MCM link system.","PeriodicalId":362502,"journal":{"name":"IEEE CPMT Symposium Japan 2014","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125769841","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2014-11-01DOI: 10.1109/ICSJ.2014.7009613
Yutaka Hashimoto, Shunsuke Nakano, K. Takagi, Yuji Kawamata
The packages for PoP process will become finer as 0.3mm pitch and it is necessary for solder materials to choice finer powder as Type6 because of the better transfer capability and soldering capability.
{"title":"Soldering material for fine PoP (Package on Package)","authors":"Yutaka Hashimoto, Shunsuke Nakano, K. Takagi, Yuji Kawamata","doi":"10.1109/ICSJ.2014.7009613","DOIUrl":"https://doi.org/10.1109/ICSJ.2014.7009613","url":null,"abstract":"The packages for PoP process will become finer as 0.3mm pitch and it is necessary for solder materials to choice finer powder as Type6 because of the better transfer capability and soldering capability.","PeriodicalId":362502,"journal":{"name":"IEEE CPMT Symposium Japan 2014","volume":"101 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122541423","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2014-11-01DOI: 10.1109/ICSJ.2014.7009620
Rika Nomura, N. Chujo, Akiko Mizushima, N. Matsushima, Kouichi Fukumiya, Itoe Akutsu, Koji Hata
We developed a compact optical fiber package for rack-to-rack transmission in information communication technology. Using pre-formed optical fiber instead of optical fiber strands and ribbon fiber, we achieved a reduction in the routing area and protection of the optical fiber. We fabricated a prototype mock-up board with optical modules and achieved a bandwidth of 3.3 Tb/s and an area of 4500 mm2. We confirmed a good transmission performance board-to-board with 5 m of optical cable at 25 Gb/s (PRBS: 231-1).
{"title":"3.3-Tb/s compact optical fiber package using pre-formed optical fiber","authors":"Rika Nomura, N. Chujo, Akiko Mizushima, N. Matsushima, Kouichi Fukumiya, Itoe Akutsu, Koji Hata","doi":"10.1109/ICSJ.2014.7009620","DOIUrl":"https://doi.org/10.1109/ICSJ.2014.7009620","url":null,"abstract":"We developed a compact optical fiber package for rack-to-rack transmission in information communication technology. Using pre-formed optical fiber instead of optical fiber strands and ribbon fiber, we achieved a reduction in the routing area and protection of the optical fiber. We fabricated a prototype mock-up board with optical modules and achieved a bandwidth of 3.3 Tb/s and an area of 4500 mm2. We confirmed a good transmission performance board-to-board with 5 m of optical cable at 25 Gb/s (PRBS: 231-1).","PeriodicalId":362502,"journal":{"name":"IEEE CPMT Symposium Japan 2014","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128667453","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2014-11-01DOI: 10.1109/ICSJ.2014.7009638
T. Sakamoto, S. Toyoda, M. Ueno, J. Kobayashi
500 kHz optical beam scanning with a full scan angle of over 100 mrad is demonstrated using a potassium tantalite niobate (KTa1-xNbxO3, KTN) deflector. To suppress any heating of the KTN chips during the high frequency operation and to have a sufficient interaction length to achieve more than 100 mrad deflection, the deflector consists of two KTN chips each of which has a pentagon-shaped electrode surface whose longest side is shortened to 1.5 mm. The full scan angle of the deflector is measured and the KTN temperature dependence of the permittivity accounts for the voltage and frequency dependence of the scan angle.
{"title":"High-speed optical beam scanning using KTN crystal","authors":"T. Sakamoto, S. Toyoda, M. Ueno, J. Kobayashi","doi":"10.1109/ICSJ.2014.7009638","DOIUrl":"https://doi.org/10.1109/ICSJ.2014.7009638","url":null,"abstract":"500 kHz optical beam scanning with a full scan angle of over 100 mrad is demonstrated using a potassium tantalite niobate (KTa1-xNbxO3, KTN) deflector. To suppress any heating of the KTN chips during the high frequency operation and to have a sufficient interaction length to achieve more than 100 mrad deflection, the deflector consists of two KTN chips each of which has a pentagon-shaped electrode surface whose longest side is shortened to 1.5 mm. The full scan angle of the deflector is measured and the KTN temperature dependence of the permittivity accounts for the voltage and frequency dependence of the scan angle.","PeriodicalId":362502,"journal":{"name":"IEEE CPMT Symposium Japan 2014","volume":"27 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126138835","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2014-11-01DOI: 10.1109/ICSJ.2014.7009626
Y. Matsuoka, Yong Lee, H. Arimoto, Masataka Sato, S. Komatsuzaki, Akira Ogura, K. Yamazaki, Y. Sunaga, T. Takai, N. Chujo, N. Matsushima
A compact 25-Gbit/s × 4-ch embedded optical module (EOM) composed of a straddle-shaped optical and electrical interface was fabricated and evaluated. The fabricated EOM provides highly efficient optical coupling and large optical-coupling tolerance, and it successfully demonstrated 25-Gbit/s error-free optical transmission. These optical performance results indicate that the fabricated compact EOM can be applied for on-board and rack-to-rack optical interconnections with high transmission density.
{"title":"A compact 25-Gbit/s × 4ch optical interconnect module with straddle-shaped optical and electrical interface","authors":"Y. Matsuoka, Yong Lee, H. Arimoto, Masataka Sato, S. Komatsuzaki, Akira Ogura, K. Yamazaki, Y. Sunaga, T. Takai, N. Chujo, N. Matsushima","doi":"10.1109/ICSJ.2014.7009626","DOIUrl":"https://doi.org/10.1109/ICSJ.2014.7009626","url":null,"abstract":"A compact 25-Gbit/s × 4-ch embedded optical module (EOM) composed of a straddle-shaped optical and electrical interface was fabricated and evaluated. The fabricated EOM provides highly efficient optical coupling and large optical-coupling tolerance, and it successfully demonstrated 25-Gbit/s error-free optical transmission. These optical performance results indicate that the fabricated compact EOM can be applied for on-board and rack-to-rack optical interconnections with high transmission density.","PeriodicalId":362502,"journal":{"name":"IEEE CPMT Symposium Japan 2014","volume":"32 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129426545","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2014-11-01DOI: 10.1109/ICSJ.2014.7009622
H. Matsutani, Kazuyuki Mitsukura, T. Makino, F. Duval, M. Detalle, Andy Miller, E. Beyne
Redistribution on a through-silicon via (TSV) with a copper interconnection and dielectric layer is one of the key components for a silicon-based interposer. In this paper, we report lithographic and mechanical performance for a positive-tone photosensitive insulation coating, CA6001B. Minimum resolution for CA6001B is 3 μm determined by electrical measurement with a test wafer having a copper redistribution and the patterned insulation layers. The CA6001B is one of the promising dielectric coatings for interposers possessing TSV and redistribution layer (RDL) structures.
{"title":"Photosensitive insulation coating for a copper redistribution layer process","authors":"H. Matsutani, Kazuyuki Mitsukura, T. Makino, F. Duval, M. Detalle, Andy Miller, E. Beyne","doi":"10.1109/ICSJ.2014.7009622","DOIUrl":"https://doi.org/10.1109/ICSJ.2014.7009622","url":null,"abstract":"Redistribution on a through-silicon via (TSV) with a copper interconnection and dielectric layer is one of the key components for a silicon-based interposer. In this paper, we report lithographic and mechanical performance for a positive-tone photosensitive insulation coating, CA6001B. Minimum resolution for CA6001B is 3 μm determined by electrical measurement with a test wafer having a copper redistribution and the patterned insulation layers. The CA6001B is one of the promising dielectric coatings for interposers possessing TSV and redistribution layer (RDL) structures.","PeriodicalId":362502,"journal":{"name":"IEEE CPMT Symposium Japan 2014","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133280828","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2014-11-01DOI: 10.1109/ICSJ.2014.7009599
Hsiang-Han Hsu, S. Nakagawa
Two types of polymer waveguides made by dry film process are characterized for silicon photonics chip packaging. In this paper, both DC and high-speed performance of the waveguides are demonstrated. DC characterization includes coupling loss from/to a single-mode fiber (SMF), near field pattern (NFP), far field pattern (FFP), and alignment tolerance measurement. The designed values for the waveguide cores are 10 μm in height and 14 μm in width. In terms of obtaining small enough coupling loss with butt coupling between the waveguides and SMFs, two kinds of numerical aperture (NA), 0.13 and 0.35, are selected. On the other hand, high-speed transmission experiments were tested by eye patterns. Clear eye openings were observed up to 25 Gbps. The results show dry-film polymer waveguides are one of a promising solutions for silicon photonics chip packaging used in next generation optical multi-chip module (MCM).
{"title":"Low power penalty, dry-film polymer waveguides for silicon photonics chip packaging","authors":"Hsiang-Han Hsu, S. Nakagawa","doi":"10.1109/ICSJ.2014.7009599","DOIUrl":"https://doi.org/10.1109/ICSJ.2014.7009599","url":null,"abstract":"Two types of polymer waveguides made by dry film process are characterized for silicon photonics chip packaging. In this paper, both DC and high-speed performance of the waveguides are demonstrated. DC characterization includes coupling loss from/to a single-mode fiber (SMF), near field pattern (NFP), far field pattern (FFP), and alignment tolerance measurement. The designed values for the waveguide cores are 10 μm in height and 14 μm in width. In terms of obtaining small enough coupling loss with butt coupling between the waveguides and SMFs, two kinds of numerical aperture (NA), 0.13 and 0.35, are selected. On the other hand, high-speed transmission experiments were tested by eye patterns. Clear eye openings were observed up to 25 Gbps. The results show dry-film polymer waveguides are one of a promising solutions for silicon photonics chip packaging used in next generation optical multi-chip module (MCM).","PeriodicalId":362502,"journal":{"name":"IEEE CPMT Symposium Japan 2014","volume":"16 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114357139","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2014-11-01DOI: 10.1109/ICSJ.2014.7009597
Y. Saito, Satoru Suzuki, T. Komuro
In electronic devices, the thermal characteristics of thermal interface materials are strongly affected by their heat sink contact conditions. In this study, we evaluate the thermal contact resistance between a heat sink and thermal interface materials and then present heat sink roughness levels using metal meshes. We also confirm the effectiveness of our new method via thermal resistance and electrical capacitance measurement experiments.
{"title":"Evaluation of thermal interface material with electric capacitance measurement: A new method using metal meshes to present finer surface roughness levels","authors":"Y. Saito, Satoru Suzuki, T. Komuro","doi":"10.1109/ICSJ.2014.7009597","DOIUrl":"https://doi.org/10.1109/ICSJ.2014.7009597","url":null,"abstract":"In electronic devices, the thermal characteristics of thermal interface materials are strongly affected by their heat sink contact conditions. In this study, we evaluate the thermal contact resistance between a heat sink and thermal interface materials and then present heat sink roughness levels using metal meshes. We also confirm the effectiveness of our new method via thermal resistance and electrical capacitance measurement experiments.","PeriodicalId":362502,"journal":{"name":"IEEE CPMT Symposium Japan 2014","volume":"23 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116713570","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2014-11-01DOI: 10.1109/ICSJ.2014.7009627
K. Nagashima, T. Kise, Y. Ishikawa, H. Nasu
We demonstrate an error free 28-Gb/s × 4-channel parallel-optical link using Sn-Ag-Cu solder reflow-capable miniature 1060-nm VCSEL-based optical modules. As an alternative solution to PSM4, we achieved error free transmission in 50-micrometer-core MMF beyond 500 m, owing to a low chromatic dispersion at 1060-nm, when the modules are operated at a bit stream of 28-Gb/s 231-1 PRBS.
{"title":"1060-nm VCSEL-based 28-Gb/s × 4-channnel optical signal transmission beyond 500-m MMF using high-density parallel-optical modules","authors":"K. Nagashima, T. Kise, Y. Ishikawa, H. Nasu","doi":"10.1109/ICSJ.2014.7009627","DOIUrl":"https://doi.org/10.1109/ICSJ.2014.7009627","url":null,"abstract":"We demonstrate an error free 28-Gb/s × 4-channel parallel-optical link using Sn-Ag-Cu solder reflow-capable miniature 1060-nm VCSEL-based optical modules. As an alternative solution to PSM4, we achieved error free transmission in 50-micrometer-core MMF beyond 500 m, owing to a low chromatic dispersion at 1060-nm, when the modules are operated at a bit stream of 28-Gb/s 231-1 PRBS.","PeriodicalId":362502,"journal":{"name":"IEEE CPMT Symposium Japan 2014","volume":"52 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131851583","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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