Pub Date : 2009-11-01DOI: 10.1109/COMCAS.2009.5385968
J. Park, S. Gelfand, M. Fitz
A nonlinear binary code with a single carrier M-QAM linear modulation is designed to control certain transitions in the symbol constellation. This concept is employed to develop spectral shaping modulation codes with M-QAM linear modulations so as to reduce out-of-band power. The code is realized as a nonlinear binary convolutional code, and the coded modulation is represented as a Markov chain. The closed form of the power spectral density for this trellis coded modulation is derived.
{"title":"Power spectral analysis of spectral shaping trellis coded modulation","authors":"J. Park, S. Gelfand, M. Fitz","doi":"10.1109/COMCAS.2009.5385968","DOIUrl":"https://doi.org/10.1109/COMCAS.2009.5385968","url":null,"abstract":"A nonlinear binary code with a single carrier M-QAM linear modulation is designed to control certain transitions in the symbol constellation. This concept is employed to develop spectral shaping modulation codes with M-QAM linear modulations so as to reduce out-of-band power. The code is realized as a nonlinear binary convolutional code, and the coded modulation is represented as a Markov chain. The closed form of the power spectral density for this trellis coded modulation is derived.","PeriodicalId":372928,"journal":{"name":"2009 IEEE International Conference on Microwaves, Communications, Antennas and Electronics Systems","volume":"26 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123606692","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2009-11-01DOI: 10.1109/COMCAS.2009.5386075
S. Bhattacharya, D. J. Chung, Yiwen Zhang, James Chen, J. Papapolymerou
This paper presents a new wafer level packaging (WLP) technique that combines thin, low cost organic layers with high performance MMICs. More specifically, we present a GaAs-based single stage amplifier covered with layers of a low loss Liquid Crystal Polymer organic material. It was observed that the RF performance of the MMIC is virtually unaffected by this technique unlike conventional packaging processes that degrade the RF performance due to the overlay of the dielectric material on the MMIC. The insertion loss for the laser ablated 50 micron vias was minimal up to 20 GHz. These results show that the hybrid WLP can be successfully implemented with virtually no performance degradation.
{"title":"A hybrid wafer level packaging technique for multi-chip interconnect using low loss organic layers","authors":"S. Bhattacharya, D. J. Chung, Yiwen Zhang, James Chen, J. Papapolymerou","doi":"10.1109/COMCAS.2009.5386075","DOIUrl":"https://doi.org/10.1109/COMCAS.2009.5386075","url":null,"abstract":"This paper presents a new wafer level packaging (WLP) technique that combines thin, low cost organic layers with high performance MMICs. More specifically, we present a GaAs-based single stage amplifier covered with layers of a low loss Liquid Crystal Polymer organic material. It was observed that the RF performance of the MMIC is virtually unaffected by this technique unlike conventional packaging processes that degrade the RF performance due to the overlay of the dielectric material on the MMIC. The insertion loss for the laser ablated 50 micron vias was minimal up to 20 GHz. These results show that the hybrid WLP can be successfully implemented with virtually no performance degradation.","PeriodicalId":372928,"journal":{"name":"2009 IEEE International Conference on Microwaves, Communications, Antennas and Electronics Systems","volume":"7 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123777159","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2009-11-01DOI: 10.1109/COMCAS.2009.5385988
S. Krupa, D. Wittwer, M. Martiskainen, M. Elliott, D. Lee, S. Harel, Y. Shalgi, S. Quantz
The RF performance of wireless consumer products is heavily affected by the antennas serving the various radio system. The antenna solutions provided for each communication system must be packaged in a manner compatible with high volume / low cost manufacturing processes and the systems employed to assemble them. In this paper, we present a trio of advanced antenna manufacturing processes developed to meet or exceed the stringent performance and packaging needs (present and future) for several disparate consumer wireless markets/product categories. This presentation details our unique, proprietary execution of the following advanced manufacturing processes: In-Mold Labeling (IML), Print-and-Plate (P&P) conductor deposition, and High Performance / Low Cost RF Substrate Assemblies. We demonstrate the utility of these manufacturing processes by prototyping equivalent sets of benchmark antenna structures (employing both our advanced and conventional fabrication processes) and compare their measured RF performance using typical passive antenna metrics (radiated efficiency, antenna gain patterns, impedance match, etc.). The commendable RF performance of these manufacturing technologies, coupled with their packaging and assembly benefits, highlight the true significance of these innovative manufacturing technologies.
{"title":"Advanced antenna manufacturing technologies","authors":"S. Krupa, D. Wittwer, M. Martiskainen, M. Elliott, D. Lee, S. Harel, Y. Shalgi, S. Quantz","doi":"10.1109/COMCAS.2009.5385988","DOIUrl":"https://doi.org/10.1109/COMCAS.2009.5385988","url":null,"abstract":"The RF performance of wireless consumer products is heavily affected by the antennas serving the various radio system. The antenna solutions provided for each communication system must be packaged in a manner compatible with high volume / low cost manufacturing processes and the systems employed to assemble them. In this paper, we present a trio of advanced antenna manufacturing processes developed to meet or exceed the stringent performance and packaging needs (present and future) for several disparate consumer wireless markets/product categories. This presentation details our unique, proprietary execution of the following advanced manufacturing processes: In-Mold Labeling (IML), Print-and-Plate (P&P) conductor deposition, and High Performance / Low Cost RF Substrate Assemblies. We demonstrate the utility of these manufacturing processes by prototyping equivalent sets of benchmark antenna structures (employing both our advanced and conventional fabrication processes) and compare their measured RF performance using typical passive antenna metrics (radiated efficiency, antenna gain patterns, impedance match, etc.). The commendable RF performance of these manufacturing technologies, coupled with their packaging and assembly benefits, highlight the true significance of these innovative manufacturing technologies.","PeriodicalId":372928,"journal":{"name":"2009 IEEE International Conference on Microwaves, Communications, Antennas and Electronics Systems","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115104929","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2009-11-01DOI: 10.1109/COMCAS.2009.5386083
M. Alon, S. Singer, S. Spiegel
The distortion mechanisms in supply modulation introduced by the PWM generator, the frequency response of DC regulator and the limited bandwidth of the high frequency recovery unit are analyzed for EDGE polar transmitters. It is demonstrated that there is an optimum regulator bandwidth that minimizes the total residual energy originated from the PWM generator and the low pass filter characteristics of the buck converter. The output spectrum was analyzed for a 5MHz PWM clock frequency buck converter. The results show that in order to meet EDGE transmission mask requirements, the bandwidth requirements of the high frequency recovery unit should be at least 10MHz for 300KHz converter bandwidth while a 95KHz converter bandwidth demands for no compensation at high frequencies.
{"title":"Distortion mechanisms in supply modulation of polar transmitters","authors":"M. Alon, S. Singer, S. Spiegel","doi":"10.1109/COMCAS.2009.5386083","DOIUrl":"https://doi.org/10.1109/COMCAS.2009.5386083","url":null,"abstract":"The distortion mechanisms in supply modulation introduced by the PWM generator, the frequency response of DC regulator and the limited bandwidth of the high frequency recovery unit are analyzed for EDGE polar transmitters. It is demonstrated that there is an optimum regulator bandwidth that minimizes the total residual energy originated from the PWM generator and the low pass filter characteristics of the buck converter. The output spectrum was analyzed for a 5MHz PWM clock frequency buck converter. The results show that in order to meet EDGE transmission mask requirements, the bandwidth requirements of the high frequency recovery unit should be at least 10MHz for 300KHz converter bandwidth while a 95KHz converter bandwidth demands for no compensation at high frequencies.","PeriodicalId":372928,"journal":{"name":"2009 IEEE International Conference on Microwaves, Communications, Antennas and Electronics Systems","volume":"109 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"117212055","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2009-11-01DOI: 10.1109/COMCAS.2009.5385996
E. Cohen, S. Ravid, D. Ritter
60GHz LNA/PAs, Phase shifters (PS), combiners and switches were designed for integrated phase array in CMOS. These components achieved the best known power consumption and size compared to previous publications reported, as a result of the methodology flow and layout optimization that was developed for 60 GHz designs. The extensive use of passive architecture together with the compact layout will enable full integrated phase arrays with tens of elements with 20mm2 size and less that 1 Watt of TX power.
{"title":"60 GHz components in CMOS for low power compact phase array applications","authors":"E. Cohen, S. Ravid, D. Ritter","doi":"10.1109/COMCAS.2009.5385996","DOIUrl":"https://doi.org/10.1109/COMCAS.2009.5385996","url":null,"abstract":"60GHz LNA/PAs, Phase shifters (PS), combiners and switches were designed for integrated phase array in CMOS. These components achieved the best known power consumption and size compared to previous publications reported, as a result of the methodology flow and layout optimization that was developed for 60 GHz designs. The extensive use of passive architecture together with the compact layout will enable full integrated phase arrays with tens of elements with 20mm2 size and less that 1 Watt of TX power.","PeriodicalId":372928,"journal":{"name":"2009 IEEE International Conference on Microwaves, Communications, Antennas and Electronics Systems","volume":"40 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123273458","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2009-11-01DOI: 10.1109/COMCAS.2009.5386030
Thilo Bednorz
This paper describes a new technique that allows group delay and relative phase measurements of frequency converters and mixers that don't have access to the local oscillator or the reference signal. In contrast to the methods offered by network analyzers in the past, the measurement accuracy of this technique is independent of the frequency and phase stability of the internal local oscillator of the DUT. The key of this new method is, that the DUT is stimulated with an nearly arbitrary two-tone signal. The phase difference between these two carriers is measured at the input and the output of the DUT to derive the group delay and the relative phase of the conversion loss of the DUT.
{"title":"Group delay and phase measurements at converters and multistage converters without LO access","authors":"Thilo Bednorz","doi":"10.1109/COMCAS.2009.5386030","DOIUrl":"https://doi.org/10.1109/COMCAS.2009.5386030","url":null,"abstract":"This paper describes a new technique that allows group delay and relative phase measurements of frequency converters and mixers that don't have access to the local oscillator or the reference signal. In contrast to the methods offered by network analyzers in the past, the measurement accuracy of this technique is independent of the frequency and phase stability of the internal local oscillator of the DUT. The key of this new method is, that the DUT is stimulated with an nearly arbitrary two-tone signal. The phase difference between these two carriers is measured at the input and the output of the DUT to derive the group delay and the relative phase of the conversion loss of the DUT.","PeriodicalId":372928,"journal":{"name":"2009 IEEE International Conference on Microwaves, Communications, Antennas and Electronics Systems","volume":"62 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125906181","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2009-11-01DOI: 10.1109/COMCAS.2009.5386037
P. Herczfeld, Yifei Li
In this paper we describe research on a microwave optical receiver where analog microwave circuitry is replaced by photonic components. The ultimate goal is to produce an optical-digital receiver capable of providing a spurious free dynamic range of ~140dBHz2/3 and a signal to noise ratio of 7dB in the 0 to 20GHz range with a 4 GHz bandwidth.
{"title":"Optically implemented microwave receiver frontend","authors":"P. Herczfeld, Yifei Li","doi":"10.1109/COMCAS.2009.5386037","DOIUrl":"https://doi.org/10.1109/COMCAS.2009.5386037","url":null,"abstract":"In this paper we describe research on a microwave optical receiver where analog microwave circuitry is replaced by photonic components. The ultimate goal is to produce an optical-digital receiver capable of providing a spurious free dynamic range of ~140dBHz2/3 and a signal to noise ratio of 7dB in the 0 to 20GHz range with a 4 GHz bandwidth.","PeriodicalId":372928,"journal":{"name":"2009 IEEE International Conference on Microwaves, Communications, Antennas and Electronics Systems","volume":"26 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127245017","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2009-11-01DOI: 10.1109/COMCAS.2009.5386086
Y. Melamed, A. EvenChen, S. Spiegel
This paper presents a systematic design methodology for logarithmic amplifiers and receiver signal strength indicator (RSSI) circuits. A close expression for the maximum detection error using a piece wise linear approximation of the logarithmic function was derived. The design methodology has been proposed that optimizes the power consumption and 3dB bandwidth of a single stage CMOS limiting amplifier according to the common mode voltages in order to meet the voltage gain and detection error requirements. The results for the RSSI circuit indicate 70dB dynamic range, 3dB bandwidth of 500MHz and maximum detection error of 0.6dB in the temperature range between −40°C and +70°C. The overall power consumption equals to 10.3mW in 180nm CMOS process technology.
{"title":"Systematic design of RSSI and logarithmic amplifiers circuits","authors":"Y. Melamed, A. EvenChen, S. Spiegel","doi":"10.1109/COMCAS.2009.5386086","DOIUrl":"https://doi.org/10.1109/COMCAS.2009.5386086","url":null,"abstract":"This paper presents a systematic design methodology for logarithmic amplifiers and receiver signal strength indicator (RSSI) circuits. A close expression for the maximum detection error using a piece wise linear approximation of the logarithmic function was derived. The design methodology has been proposed that optimizes the power consumption and 3dB bandwidth of a single stage CMOS limiting amplifier according to the common mode voltages in order to meet the voltage gain and detection error requirements. The results for the RSSI circuit indicate 70dB dynamic range, 3dB bandwidth of 500MHz and maximum detection error of 0.6dB in the temperature range between −40°C and +70°C. The overall power consumption equals to 10.3mW in 180nm CMOS process technology.","PeriodicalId":372928,"journal":{"name":"2009 IEEE International Conference on Microwaves, Communications, Antennas and Electronics Systems","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131324180","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2009-11-01DOI: 10.1109/COMCAS.2009.5385995
D. Wulich, R. Dabora, G. Tsouri
We investigate the use of synchronized superpositionmodulation for increasing spectral efficiency of frequency division multiple access systems such as the long-term evolution extension of UMTS. We present the basic concept and depict results for an arbitrary two-user scenario. In Addition, a method of optimizing constellations for multiple users is defined based on maximizing the sum-rate mutual-information. The optimization method is applied to a three-user scenario. Preliminary results motivate further research into means of implementing superpositionmodulation in FDMA systems.
{"title":"On increasing spectral efficiency of frequency division multiple access using synchronized superposition-modulation","authors":"D. Wulich, R. Dabora, G. Tsouri","doi":"10.1109/COMCAS.2009.5385995","DOIUrl":"https://doi.org/10.1109/COMCAS.2009.5385995","url":null,"abstract":"We investigate the use of synchronized superpositionmodulation for increasing spectral efficiency of frequency division multiple access systems such as the long-term evolution extension of UMTS. We present the basic concept and depict results for an arbitrary two-user scenario. In Addition, a method of optimizing constellations for multiple users is defined based on maximizing the sum-rate mutual-information. The optimization method is applied to a three-user scenario. Preliminary results motivate further research into means of implementing superpositionmodulation in FDMA systems.","PeriodicalId":372928,"journal":{"name":"2009 IEEE International Conference on Microwaves, Communications, Antennas and Electronics Systems","volume":"21 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127434928","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2009-11-01DOI: 10.1109/COMCAS.2009.5385983
M. Tur, L. Yaron, Oded Raz, R. Rotman
A photonic beamformer is presented, having smooth behavior. Third-order nonlinearities, resulting from its optoelectronic components, are investigated, with emphasis on their impact on the contrast of imaging radars. This contrast is shown to be severely limited by the induced RF nonlinearities. Limitations on the allowable modulation index are studied for linearly-chirped pulses returned from clutter.
{"title":"Performance issues with photonic beamformers","authors":"M. Tur, L. Yaron, Oded Raz, R. Rotman","doi":"10.1109/COMCAS.2009.5385983","DOIUrl":"https://doi.org/10.1109/COMCAS.2009.5385983","url":null,"abstract":"A photonic beamformer is presented, having smooth behavior. Third-order nonlinearities, resulting from its optoelectronic components, are investigated, with emphasis on their impact on the contrast of imaging radars. This contrast is shown to be severely limited by the induced RF nonlinearities. Limitations on the allowable modulation index are studied for linearly-chirped pulses returned from clutter.","PeriodicalId":372928,"journal":{"name":"2009 IEEE International Conference on Microwaves, Communications, Antennas and Electronics Systems","volume":"38 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129497938","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
京公网安备 11010802042870号
京ICP备2023020795号-1
扫码关注我们
求助内容：
应助结果提醒方式：