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2021 28th International Conference on Mixed Design of Integrated Circuits and System最新文献

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Development of PSpice Macromodel for Monolithic Single-Supply Power Amplifiers 单片单电源功率放大器PSpice宏模型的开发
Pub Date : 2021-06-24 DOI: 10.23919/MIXDES52406.2021.9497565
I. Pandiev
A simple PSpice macromodel was developed, and verified for monolithic power amplifiers operated with a single-supply voltage. The proposed macromodel is developed using simplification and build-up techniques for macromodeling of operational amplifiers and simulates the basic static and dynamic characteristics, including input impedance, small-signal frequency responses at various voltage gains, output power versus supply voltage, slew-rate-limiting, voltage limiting, output offset voltage versus supply voltage ripples, and output resistance. Furthermore, the macromodel also takes into account the ground reference voltage in the amplifier at a single power supply voltage. The model was implemented as a hierarchical structure suitable for the PSpice circuit simulation platform. The sub-circuit was built using standard PSpice components and analog behavioral (ABM) blocks. The accuracy of the model was verified by comparing the simulation results of the electrical parameters with the respectively measured values by experimental testing of sample circuits. The comparative analysis showed that the relative error of the modeled large-signal parameters is less than 15%. Moreover, an error of 15% is quite acceptable, considering the technological tolerances of the electrical parameters for this type of analog ICs.
开发了一个简单的PSpice宏模型,并在单电源电压下对单片功率放大器进行了验证。所提出的宏观模型是使用简化和构建技术开发的,用于运算放大器的宏观建模,并模拟基本的静态和动态特性,包括输入阻抗,各种电压增益下的小信号频率响应,输出功率与电源电压,旋转速率限制,电压限制,输出失调电压与电源电压波纹以及输出电阻。此外,宏模型还考虑了放大器在单一电源电压下的接地参考电压。该模型采用适合PSpice电路仿真平台的分层结构实现。该子电路采用标准PSpice组件和模拟行为(ABM)模块构建。通过对样品电路的实验测试,将电参数的仿真结果与实测值进行比较,验证了模型的准确性。对比分析表明,模拟的大信号参数相对误差小于15%。此外,考虑到这种类型的模拟ic的电气参数的技术公差,15%的误差是完全可以接受的。
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引用次数: 3
Comparison of the Usefulness of Selected Thermo-sensitive Parameters of Power MOSFETs 功率mosfet所选热敏参数的有效性比较
Pub Date : 2021-06-24 DOI: 10.23919/MIXDES52406.2021.9497563
K. Górecki, K. Posobkiewicz
The paper analyses the usefulness of selected thermo-sensitive parameters (TSP) in measuring thermal resistance of power MOS transistors. Three TSPs were considered: threshold voltage, voltage at the forward biased drain-substrate junction and voltage between the drain and the source of the transistor operating in the linear range. For each of the mentioned TSPs, thermometric characteristics were measured at selected current values. The linear range of each of the measured characteristics was discussed. An analysis of the measurement error of thermal resistance of a selected power MOS transistor was carried out using each of the considered TSPs. The results of thermal resistance measurements performed using the considered TSPs and a thermoresistor were compared and discussed.
本文分析了选择热敏参数(TSP)测量功率MOS晶体管热阻的有效性。考虑了三个tsp:阈值电压、正向偏置漏极-衬底结电压和工作在线性范围内的晶体管漏极和源极之间的电压。对于每个提到的tsp,在选定的电流值下测量温度特性。讨论了各测量特性的线性范围。利用所考虑的tsp对所选功率MOS晶体管的热阻测量误差进行了分析。使用所考虑的tsp和热敏电阻进行热阻测量的结果进行了比较和讨论。
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引用次数: 1
Modeling and Simulation of Charge Trapping in 1/f Noise, RTN and BTI: from Devices to Circuits 1/f噪声、RTN和BTI中电荷捕获的建模与仿真:从器件到电路
Pub Date : 2021-06-24 DOI: 10.23919/MIXDES52406.2021.9497643
G. Wirth
Modeling and simulation of charge trapping is discussed in the context of random telegraph noise (RTN), bias temperature instability (BTI) and low-frequency noise (1/f noise), aiming unified compact modeling. Analytical formulations for 1/f noise (frequency domain), RTN (time domain) and BTI have been derived, using a single modeling framework, where model parameters are the same in frequency and time domain. The area scaling of 1/f noise, RTN and BTI is discussed in detail, as well as its variability among devices that by design should be identical. The modeling addresses the time dependent variability in the electrical behavior of devices and circuits.
在随机电报噪声(RTN)、偏置温度不稳定性(BTI)和低频噪声(1/f噪声)的背景下,讨论了电荷捕获的建模和仿真,以实现统一的紧凑建模。使用单一建模框架,推导出1/f噪声(频域)、RTN(时域)和BTI的解析公式,其中模型参数在频域和时域相同。详细讨论了1/f噪声、RTN和BTI的面积缩放,以及其在设计上应该相同的器件之间的可变性。该模型解决了设备和电路的电气行为随时间变化的问题。
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引用次数: 1
Section S1: Compact Modeling for Semiconductor Device, Sensor and IC Design 第S1部分:半导体器件、传感器和集成电路设计的紧凑建模
Pub Date : 2021-06-24 DOI: 10.23919/mixdes52406.2021.9497577
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引用次数: 0
Section 4: Power Electronics 第4节:电力电子
Pub Date : 2021-06-24 DOI: 10.23919/mixdes52406.2021.9497579
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引用次数: 0
Compact Analytical Model of Nanowire Junctionless ISFET 纳米线无结ISFET的紧凑解析模型
Pub Date : 2021-06-24 DOI: 10.23919/MIXDES52406.2021.9497641
A. Yesayan, J. Sallese
In this work, we present a simple compact model for junctionless ion-sensitive FETs (JL ISFET) operating in depletion. The sensitivity dependence on nanowire physical and geometrical parameters are discussed as guidelines for the device optimization. The model validation with COMSOL Multiphysics simulations is presented.
在这项工作中,我们提出了一个简单的紧凑模型,用于无结连接敏感fet (JL ISFET)在耗尽中工作。讨论了纳米线物理和几何参数对灵敏度的依赖性,作为器件优化的指导。利用COMSOL多物理场仿真对模型进行了验证。
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引用次数: 1
Modelling of First- and Second-order Chemical Reactions on ARUZ – Massively-parallel FPGA-based Machine 基于ARUZ -大规模并行fpga的机器上一、二级化学反应的建模
Pub Date : 2021-06-24 DOI: 10.23919/MIXDES52406.2021.9497601
Piotr Amrozik, K. Hałagan, K. Rudnicki
ARUZ (Analizator Rzeczywistych Układów Złożonych, Analyser of Real Complex Systems) is a massively parallel FPGA-based simulator located at BioNanoPark Lodz. This machine has been designed to reflect the Dynamic Lattice Liquid (DLL) algorithm in hardware. In this paper, FPGA implementation details are presented for DLL functionality extension. This extension allows to simulate simple chemical reactions of first and second order realized in a parallel approach.
ARUZ (analyzer Rzeczywistych Układów Złożonych,分析仪of Real Complex Systems)是位于bionanpark Lodz的大规模并行fpga模拟器。这台机器在硬件上体现了动态点阵液体(DLL)算法。本文给出了DLL功能扩展的FPGA实现细节。这个扩展允许模拟一阶和二阶的简单化学反应,以并行的方式实现。
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引用次数: 0
Implementation of Coprocessor for Integer Multiple Precision Arithmetic on Zynq Ultrascale+ MPSoC 整数多精度算法协处理器在Zynq Ultrascale+ MPSoC上的实现
Pub Date : 2021-06-24 DOI: 10.23919/MIXDES52406.2021.9497554
T. Stefański, K. Rudnicki, Wojciech Zebrowski
Recently, we have opened the source code of coprocessor for multiple-precision arithmetic (MPA). In this contribution, the implementation and benchmarking results for this MPA coprocessor are presented on modern Zynq Ultrascale+ multiprocessor system on chip, which combines field-programmable gate array with quad-core ARM Cortex-A53 64-bit central processing unit (CPU). In our benchmark, a single coprocessor can be up to 4.5 times faster than a single CPU core within the same chip emulating MPA using a software library.
最近,我们公开了多精度算术协处理器(MPA)的源代码。本文介绍了该MPA协处理器在现代Zynq Ultrascale+片上多处理器系统上的实现和基准测试结果,该系统结合了现场可编程门阵列和四核ARM Cortex-A53 64位中央处理器(CPU)。在我们的基准测试中,单个协处理器可以比使用软件库模拟MPA的同一芯片中的单个CPU核心快4.5倍。
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引用次数: 0
[Title page] (标题页)
Pub Date : 2021-06-24 DOI: 10.23919/mixdes52406.2021.9497506
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引用次数: 0
A W-band SiGe BiCMOS I/Q Receiver with Tunable Conversion Gain for Radar Applications 一种可调转换增益的w波段SiGe BiCMOS I/Q接收机
Pub Date : 2021-06-24 DOI: 10.23919/MIXDES52406.2021.9497528
M. Kucharski, M. Widlok, P. Bajurko, R. Piesiewicz
This paper presents an 89–102 GHz I/Q receiver (RX) containing an LO frequency multiplying chain (×4) manufactured in SiGe BiCMOS technology. The RX entails a two-stage low-noise amplifier (LNA) followed by a lumped version of Wilkinson power splitter to feed two mixers driven by LO signals shifted by 90 degrees. Quadrature LO signals are generated using a reduced-size branchline coupler. The mixing stage enables conversion gain (CG) tuning in 13.2–26.8 dB range at 94 GHz by means of pMOS transistors biased in triode region. The RX provides 13GHz 3-dB bandwidth with peak CG of 26.8 dB and NF of 11.7 dB consuming 80mA from 3.3V supply. The chip occupies 1.07mm2 silicon area.
本文介绍了一种采用SiGe BiCMOS技术制造的含有LO倍频链(×4)的89-102 GHz I/Q接收机(RX)。RX需要一个两级低噪声放大器(LNA),然后是一个集总版本的威尔金森功率分配器,由LO信号移位90度驱动两个混频器。正交LO信号是使用缩小尺寸的分支耦合器产生的。通过偏置在三极管区域的pMOS晶体管,混合级使转换增益(CG)在94ghz的13.2-26.8 dB范围内调谐。RX提供13GHz 3db带宽,峰值CG为26.8 dB, NF为11.7 dB,从3.3V电源消耗80mA。芯片的硅面积为1.07mm2。
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引用次数: 1
期刊
2021 28th International Conference on Mixed Design of Integrated Circuits and System
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