Pub Date : 2014-09-15DOI: 10.1504/IJMSI.2014.064775
Yong–Il Kim, Jaehyun Yoon, Seung-Boo Jung
In order to investigate effects of Pd layer thickness on the mechanical properties and microstructures of Sn-3.0 Ag-0.5 Cu solder joints, three different Pd layers, i.e., 0.05, 0.1, 0.15 µm, were employed on the electroless nickel immersion gold [ENIG, Ni-P(5 µm )/Au(0.08 µm)] surface finished flame retardant type 4 (FR4) printed circuit board (PCB) substrates. Our studies showed that the addition of Pd layer in ENIG treatment, i.e., ENEPIG, enhanced the bonding strength of solder joints by reducing the formation of intermetallic compounds (IMCs), (Cu, Ni)6Sn5 and (Ni, Cu)3Sn4. The different failure modes were also observed – the crack propagation occurred along the interface between P-rich Ni layer and Cu layer in 0.05 µm Pd specimens while specimens with 0.1 µm and 0.15 µm Pd layers showed the crack propagation proceeded mostly inside solders. In this study the effects of Pd layer thickness in ENEPIG surface finish on the bonding strength of solder joints were investigated by means of drop test and ball shear test, followed by observation of microstructures and interfaces using a scanning electron microscope (SEM) and an energy dispersive spectrometer (EDS).
{"title":"Effects of Pd layer thickness on mechanical properties and microstructures of Sn-3.0 Ag-0.5 Cu solder joints","authors":"Yong–Il Kim, Jaehyun Yoon, Seung-Boo Jung","doi":"10.1504/IJMSI.2014.064775","DOIUrl":"https://doi.org/10.1504/IJMSI.2014.064775","url":null,"abstract":"In order to investigate effects of Pd layer thickness on the mechanical properties and microstructures of Sn-3.0 Ag-0.5 Cu solder joints, three different Pd layers, i.e., 0.05, 0.1, 0.15 µm, were employed on the electroless nickel immersion gold [ENIG, Ni-P(5 µm )/Au(0.08 µm)] surface finished flame retardant type 4 (FR4) printed circuit board (PCB) substrates. Our studies showed that the addition of Pd layer in ENIG treatment, i.e., ENEPIG, enhanced the bonding strength of solder joints by reducing the formation of intermetallic compounds (IMCs), (Cu, Ni)6Sn5 and (Ni, Cu)3Sn4. The different failure modes were also observed – the crack propagation occurred along the interface between P-rich Ni layer and Cu layer in 0.05 µm Pd specimens while specimens with 0.1 µm and 0.15 µm Pd layers showed the crack propagation proceeded mostly inside solders. In this study the effects of Pd layer thickness in ENEPIG surface finish on the bonding strength of solder joints were investigated by means of drop test and ball shear test, followed by observation of microstructures and interfaces using a scanning electron microscope (SEM) and an energy dispersive spectrometer (EDS).","PeriodicalId":39035,"journal":{"name":"International Journal of Materials and Structural Integrity","volume":"112 1","pages":"76"},"PeriodicalIF":0.0,"publicationDate":"2014-09-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1504/IJMSI.2014.064775","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"66767466","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2014-09-15DOI: 10.1504/IJMSI.2014.064776
Ryo Zanma, M. Saka
Electromigration (EM) is a phenomenon of metallic atom diffusion due to high current density and is known to be a serious problem in reliability issues of electronic devices. On the other hand, fabrication method of nano/micro materials such as wire, belt, sphere and tube has been reported by utilising and controlling EM effectively. In this study, new sample patterns to fabricate two aluminium (Al) micro materials simultaneously by utilising EM are examined as the beginning of fabricating a large amount of micro materials. In some cases, two Al micro wires were successfully achieved. Evaluation of sample patterns to apply to fabricate such amount of micro materials is also studied.
{"title":"Multiple Al micro materials fabrication by utilising electromigration","authors":"Ryo Zanma, M. Saka","doi":"10.1504/IJMSI.2014.064776","DOIUrl":"https://doi.org/10.1504/IJMSI.2014.064776","url":null,"abstract":"Electromigration (EM) is a phenomenon of metallic atom diffusion due to high current density and is known to be a serious problem in reliability issues of electronic devices. On the other hand, fabrication method of nano/micro materials such as wire, belt, sphere and tube has been reported by utilising and controlling EM effectively. In this study, new sample patterns to fabricate two aluminium (Al) micro materials simultaneously by utilising EM are examined as the beginning of fabricating a large amount of micro materials. In some cases, two Al micro wires were successfully achieved. Evaluation of sample patterns to apply to fabricate such amount of micro materials is also studied.","PeriodicalId":39035,"journal":{"name":"International Journal of Materials and Structural Integrity","volume":"8 1","pages":"98"},"PeriodicalIF":0.0,"publicationDate":"2014-09-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1504/IJMSI.2014.064776","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"66767527","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2014-09-15DOI: 10.1504/IJMSI.2014.064779
J. Jang, S. Yoo, Hyo-Soo Lee, Chang-Woo Lee, Mok-Soon Kim, Jun-Ki Kim
The effect of reflow peak temperatures from 160°C to 180°C on the mechanical drop performance of Sn-58Bi solder joint was studied. The mechanical drop performance was evaluated through the three point dynamic bending test in which the strain of PCB was step increased until the failure of daisy chain circuit was detected with 50 kHz sampling rate. The wetting behaviour of Sn-58Bi on Cu was investigated by wetting balance tests at various pot temperatures from 150°C to 190°C. The dynamic bending behaviour of solder joint decreased significantly with the decrease of temperatures from 170°C to 160°C. Microstructural observation and ball shear test results revealed that the decrease of joint area on Cu pad affected the deterioration of mechanical drop performance. From wetting balance tests at various pot temperatures, it was considered that the abrupt change in wetting activation energy at temperatures between 165°C and 170°C was responsible for the wetting behaviour on Cu pad and resultantly the mechanical d...
{"title":"Effect of reflow temperature on the mechanical drop performance of Sn-Bi solder joint","authors":"J. Jang, S. Yoo, Hyo-Soo Lee, Chang-Woo Lee, Mok-Soon Kim, Jun-Ki Kim","doi":"10.1504/IJMSI.2014.064779","DOIUrl":"https://doi.org/10.1504/IJMSI.2014.064779","url":null,"abstract":"The effect of reflow peak temperatures from 160°C to 180°C on the mechanical drop performance of Sn-58Bi solder joint was studied. The mechanical drop performance was evaluated through the three point dynamic bending test in which the strain of PCB was step increased until the failure of daisy chain circuit was detected with 50 kHz sampling rate. The wetting behaviour of Sn-58Bi on Cu was investigated by wetting balance tests at various pot temperatures from 150°C to 190°C. The dynamic bending behaviour of solder joint decreased significantly with the decrease of temperatures from 170°C to 160°C. Microstructural observation and ball shear test results revealed that the decrease of joint area on Cu pad affected the deterioration of mechanical drop performance. From wetting balance tests at various pot temperatures, it was considered that the abrupt change in wetting activation energy at temperatures between 165°C and 170°C was responsible for the wetting behaviour on Cu pad and resultantly the mechanical d...","PeriodicalId":39035,"journal":{"name":"International Journal of Materials and Structural Integrity","volume":"8 1","pages":"88"},"PeriodicalIF":0.0,"publicationDate":"2014-09-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1504/IJMSI.2014.064779","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"66767175","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2014-09-15DOI: 10.1504/IJMSI.2014.064780
Xiuwen Yang, Jie Gong, Yu Liu, Xiusheng Tang, Haibiao Fan, Ping Yang
For KOCKS mill, dynamic characteristics of roll system are the main factors influencing the quality of rolled products. In this paper, the rigid-flexible-coupling virtual prototype of roll system is established. Under the limit condition of rolling 25 mm-40Cr bar, dynamic analysis on whole rolling process including idling, biting steel, steady rolling state and throwing steel is executed to obtain the time-domain dynamic characteristic curves of roll system based on rigid-flexible-coupling virtual prototype. In addition, free modal analysis on the roll system is also carried out under pre-stressing force. The research verifies the rationality of the prototype and provides a data platform for manufacturing of physical prototype.
{"title":"Vibration analysis for roll system of KOCKS mill based on ADAMS","authors":"Xiuwen Yang, Jie Gong, Yu Liu, Xiusheng Tang, Haibiao Fan, Ping Yang","doi":"10.1504/IJMSI.2014.064780","DOIUrl":"https://doi.org/10.1504/IJMSI.2014.064780","url":null,"abstract":"For KOCKS mill, dynamic characteristics of roll system are the main factors influencing the quality of rolled products. In this paper, the rigid-flexible-coupling virtual prototype of roll system is established. Under the limit condition of rolling 25 mm-40Cr bar, dynamic analysis on whole rolling process including idling, biting steel, steady rolling state and throwing steel is executed to obtain the time-domain dynamic characteristic curves of roll system based on rigid-flexible-coupling virtual prototype. In addition, free modal analysis on the roll system is also carried out under pre-stressing force. The research verifies the rationality of the prototype and provides a data platform for manufacturing of physical prototype.","PeriodicalId":39035,"journal":{"name":"International Journal of Materials and Structural Integrity","volume":"8 1","pages":"136"},"PeriodicalIF":0.0,"publicationDate":"2014-09-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1504/IJMSI.2014.064780","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"66767184","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2014-09-15DOI: 10.1504/IJMSI.2014.064769
Y. Chu, S. Yi, P. Geng
In the present study, the fatigue life of solder joints of plastic ball grid array packages (PBGA) under thermal cycling condition is evaluated using the finite element method. A unified, viscoplastic constitutive model for solder joints of plastic ball grid array packages is employed to improve accuracy of reliability prediction. The constitutive model is then implemented into the commercial finite element analysis software, ABAQUS, to predict the thermo-mechanical behaviour of solder balls in PBGA package subjected to thermal cycling. Damage parameters are obtained from the FEA results and are used to estimate the thermal fatigue life of solder balls. The Coffin-Manson equation is employed. The predicted thermal fatigue lives are discussed in detail.
{"title":"Thermal fatigue life prediction of solder joints of plastic ball grid array packages","authors":"Y. Chu, S. Yi, P. Geng","doi":"10.1504/IJMSI.2014.064769","DOIUrl":"https://doi.org/10.1504/IJMSI.2014.064769","url":null,"abstract":"In the present study, the fatigue life of solder joints of plastic ball grid array packages (PBGA) under thermal cycling condition is evaluated using the finite element method. A unified, viscoplastic constitutive model for solder joints of plastic ball grid array packages is employed to improve accuracy of reliability prediction. The constitutive model is then implemented into the commercial finite element analysis software, ABAQUS, to predict the thermo-mechanical behaviour of solder balls in PBGA package subjected to thermal cycling. Damage parameters are obtained from the FEA results and are used to estimate the thermal fatigue life of solder balls. The Coffin-Manson equation is employed. The predicted thermal fatigue lives are discussed in detail.","PeriodicalId":39035,"journal":{"name":"International Journal of Materials and Structural Integrity","volume":"8 1","pages":"3"},"PeriodicalIF":0.0,"publicationDate":"2014-09-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1504/IJMSI.2014.064769","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"66767278","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2014-09-15DOI: 10.1504/IJMSI.2014.064771
Y. Ju, H. Yamauchi, H. Oshima, Kensuke Tanaka
Recently, the use of solder containing lead in the interconnection between printed substrate and electric packages has been prohibited since lead may have a bad influence on humans and the environment. Today Sn-Ag-Cu alloys (SnAgCu) are used in general as a substitute of Sn-Pb alloys (SnPb). However, the melting point of SnAgCu is higher than that for SnPb which may induce damages in the substrate and packages. To solve this problem, the reflow of lead-free solder by microwave heating was studied. The microwave heating system worked at 2.45 GHz frequency on TE10 mode. The most suitable heating location in the waveguide and the most suitable microwave power were investigated by measuring the temperature of the substrate and the solder simultaneously. After the solder was heated up to the melting point of 493 K, solder-mounted was achieved. The intermetallic chemical compound between the solder and Cu was observed by SEM and it was also analysed by the cross-section of the solder using EDX.
{"title":"Reflow of lead-free solder by microwave heating","authors":"Y. Ju, H. Yamauchi, H. Oshima, Kensuke Tanaka","doi":"10.1504/IJMSI.2014.064771","DOIUrl":"https://doi.org/10.1504/IJMSI.2014.064771","url":null,"abstract":"Recently, the use of solder containing lead in the interconnection between printed substrate and electric packages has been prohibited since lead may have a bad influence on humans and the environment. Today Sn-Ag-Cu alloys (SnAgCu) are used in general as a substitute of Sn-Pb alloys (SnPb). However, the melting point of SnAgCu is higher than that for SnPb which may induce damages in the substrate and packages. To solve this problem, the reflow of lead-free solder by microwave heating was studied. The microwave heating system worked at 2.45 GHz frequency on TE10 mode. The most suitable heating location in the waveguide and the most suitable microwave power were investigated by measuring the temperature of the substrate and the solder simultaneously. After the solder was heated up to the melting point of 493 K, solder-mounted was achieved. The intermetallic chemical compound between the solder and Cu was observed by SEM and it was also analysed by the cross-section of the solder using EDX.","PeriodicalId":39035,"journal":{"name":"International Journal of Materials and Structural Integrity","volume":"8 1","pages":"32"},"PeriodicalIF":0.0,"publicationDate":"2014-09-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1504/IJMSI.2014.064771","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"66767335","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2014-09-15DOI: 10.1504/IJMSI.2014.064781
Kehan Zeng, Yi Guo
PCB assembly on the sequential pick-and-place machine is a typical NP-hard combinatorial optimisation problem which is a critical bottleneck in electronic product manufacturing industry. In this paper, a two-stage approach is proposed. In the first stage, the distance score with weights selection (DSWS) method is proposed to select a suited set of slots to load feeders. In the second stage, a novel swarm intelligence approach, called the elimination with decay-based swarm intelligence approach (EDSIA) is proposed to solve the problems of assignment of feeders to the selected slots and the placement sequence of the components. In EDSIA, a new population evolution mechanism, based on proposed elimination coefficient and decay factor is proposed to propel the population forwards the global optimum. The numerical results and comparisons illustrate the effectiveness and efficiency of the proposed two-stage approach.
{"title":"A two-stage approach optimising PCB assembly on the sequential pick-and-place machine by a score-based slot selection method and a swarm intelligence approach","authors":"Kehan Zeng, Yi Guo","doi":"10.1504/IJMSI.2014.064781","DOIUrl":"https://doi.org/10.1504/IJMSI.2014.064781","url":null,"abstract":"PCB assembly on the sequential pick-and-place machine is a typical NP-hard combinatorial optimisation problem which is a critical bottleneck in electronic product manufacturing industry. In this paper, a two-stage approach is proposed. In the first stage, the distance score with weights selection (DSWS) method is proposed to select a suited set of slots to load feeders. In the second stage, a novel swarm intelligence approach, called the elimination with decay-based swarm intelligence approach (EDSIA) is proposed to solve the problems of assignment of feeders to the selected slots and the placement sequence of the components. In EDSIA, a new population evolution mechanism, based on proposed elimination coefficient and decay factor is proposed to propel the population forwards the global optimum. The numerical results and comparisons illustrate the effectiveness and efficiency of the proposed two-stage approach.","PeriodicalId":39035,"journal":{"name":"International Journal of Materials and Structural Integrity","volume":"8 1","pages":"185"},"PeriodicalIF":0.0,"publicationDate":"2014-09-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1504/IJMSI.2014.064781","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"66767252","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2014-09-15DOI: 10.1504/IJMSI.2014.064770
K. Nakahira, Hironori Tago, Takuya Sasaki, Ken Suzuki, H. Miura
The local thermal deformation of the chips mounted by area-arrayed fine bumps has increased drastically because of the decrease of the flexural rigidity of the thinned chips. In this paper, the dominant structural factors of the local residual stress in a silicon chip are investigated quantitatively based on the measurement of the local residual stress in a chip using stress sensor chips. The piezoresistive strain gauges were embedded in the sensor chips. The length of each gauge was 2 µm and a unit cell consisted of four gauges with different crystallographic directions. This alignment of strain gauges enables to measure the tensor component of three-dimensional stress fields separately. Test flip chip substrates were made by silicon chip on which the area-arrayed tin/copper bumps were electroplated. The width of a bump was fixed at 200 µm and the bump pitch was varied from 400 µm to 1,000 µm. The measured amplitude of the residual stress increased from about 30 MPa to 250 MPa. It was confirmed that both the material constant of underfill and the alignment structure of fine bumps are the dominant factors of the local deformation and stress of a silicon chip mounted on area-arrayed metallic bumps.
{"title":"Measurement of the local residual stress between fine metallic bumps in 3D flip chip structures","authors":"K. Nakahira, Hironori Tago, Takuya Sasaki, Ken Suzuki, H. Miura","doi":"10.1504/IJMSI.2014.064770","DOIUrl":"https://doi.org/10.1504/IJMSI.2014.064770","url":null,"abstract":"The local thermal deformation of the chips mounted by area-arrayed fine bumps has increased drastically because of the decrease of the flexural rigidity of the thinned chips. In this paper, the dominant structural factors of the local residual stress in a silicon chip are investigated quantitatively based on the measurement of the local residual stress in a chip using stress sensor chips. The piezoresistive strain gauges were embedded in the sensor chips. The length of each gauge was 2 µm and a unit cell consisted of four gauges with different crystallographic directions. This alignment of strain gauges enables to measure the tensor component of three-dimensional stress fields separately. Test flip chip substrates were made by silicon chip on which the area-arrayed tin/copper bumps were electroplated. The width of a bump was fixed at 200 µm and the bump pitch was varied from 400 µm to 1,000 µm. The measured amplitude of the residual stress increased from about 30 MPa to 250 MPa. It was confirmed that both the material constant of underfill and the alignment structure of fine bumps are the dominant factors of the local deformation and stress of a silicon chip mounted on area-arrayed metallic bumps.","PeriodicalId":39035,"journal":{"name":"International Journal of Materials and Structural Integrity","volume":"22 1","pages":"21-31"},"PeriodicalIF":0.0,"publicationDate":"2014-09-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1504/IJMSI.2014.064770","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"66767288","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2014-09-15DOI: 10.1504/IJMSI.2014.064772
A. Yu, J. Jang, Jong-Hyun Lee, Jun-Ki Kim, Mok-Soon Kim
The drop/shock reliability of new quaternary Sn-Ag-Cu-In Pb-free solder alloy with increasing amounts of copper was investigated on the basis of their mechanical properties and microstructures in comparison with ternary Sn-1.2Ag-0.5Cu Pb-free solder alloy and quaternary Sn-1.2Ag-0.5Cu-0.4In Pb-free solder alloy as suggested in a previous work. The results showed that Sn-1.2Ag-0.7Cu-0.4In solder alloy has excellent drop/shock reliability compared to Sn-1.2Ag-0.5Cu and Sn-1.2Ag-0.5Cu-0.4In solder alloys owing to the thin IMC thickness and the increased mechanical strength. It was considered that indium addition restrained the IMC growth and increasing the amount of copper promoted the formation of Cu6Sn5 and Ag3Sn phase, which resulted in an increase in the alloy strength.
{"title":"Microstructure and drop/shock reliability of Sn-Ag-Cu-In solder joints","authors":"A. Yu, J. Jang, Jong-Hyun Lee, Jun-Ki Kim, Mok-Soon Kim","doi":"10.1504/IJMSI.2014.064772","DOIUrl":"https://doi.org/10.1504/IJMSI.2014.064772","url":null,"abstract":"The drop/shock reliability of new quaternary Sn-Ag-Cu-In Pb-free solder alloy with increasing amounts of copper was investigated on the basis of their mechanical properties and microstructures in comparison with ternary Sn-1.2Ag-0.5Cu Pb-free solder alloy and quaternary Sn-1.2Ag-0.5Cu-0.4In Pb-free solder alloy as suggested in a previous work. The results showed that Sn-1.2Ag-0.7Cu-0.4In solder alloy has excellent drop/shock reliability compared to Sn-1.2Ag-0.5Cu and Sn-1.2Ag-0.5Cu-0.4In solder alloys owing to the thin IMC thickness and the increased mechanical strength. It was considered that indium addition restrained the IMC growth and increasing the amount of copper promoted the formation of Cu6Sn5 and Ag3Sn phase, which resulted in an increase in the alloy strength.","PeriodicalId":39035,"journal":{"name":"International Journal of Materials and Structural Integrity","volume":"8 1","pages":"42"},"PeriodicalIF":0.0,"publicationDate":"2014-09-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1504/IJMSI.2014.064772","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"66767351","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2014-09-15DOI: 10.1504/IJMSI.2014.064784
D. Senthilkumar, I. Rajendran
The effect of deep cryogenic treatment on properties of different types of steels was extensively studied. Cryogenic treatment can convert the retained austenite into martensite along with the carbide precipitation and hence enhances the wear resistance when compared to the conventional heat treatment of steels. It also increases the compressive residual stresses in the component, which leads to better fatigue life. However, this study is carried out to reveal the mechanism of deep cryogenic treatment with respect to different materials, pretreatment conditions and properties of steels for the practical application.
{"title":"A research review on deep cryogenic treatment of steels","authors":"D. Senthilkumar, I. Rajendran","doi":"10.1504/IJMSI.2014.064784","DOIUrl":"https://doi.org/10.1504/IJMSI.2014.064784","url":null,"abstract":"The effect of deep cryogenic treatment on properties of different types of steels was extensively studied. Cryogenic treatment can convert the retained austenite into martensite along with the carbide precipitation and hence enhances the wear resistance when compared to the conventional heat treatment of steels. It also increases the compressive residual stresses in the component, which leads to better fatigue life. However, this study is carried out to reveal the mechanism of deep cryogenic treatment with respect to different materials, pretreatment conditions and properties of steels for the practical application.","PeriodicalId":39035,"journal":{"name":"International Journal of Materials and Structural Integrity","volume":"8 1","pages":"169"},"PeriodicalIF":0.0,"publicationDate":"2014-09-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1504/IJMSI.2014.064784","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"66767361","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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